CN111579493B - Acoustic sensor based on optical detection - Google Patents

Acoustic sensor based on optical detection Download PDF

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Publication number
CN111579493B
CN111579493B CN202010425125.4A CN202010425125A CN111579493B CN 111579493 B CN111579493 B CN 111579493B CN 202010425125 A CN202010425125 A CN 202010425125A CN 111579493 B CN111579493 B CN 111579493B
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vibrating
acoustic sensor
optical detection
optical
electrode
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CN111579493A (en
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康晓旭
沈若曦
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Shanghai IC R&D Center Co Ltd
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Shanghai IC R&D Center Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/50Transmitters
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04BTRANSMISSION
    • H04B10/00Transmission systems employing electromagnetic waves other than radio-waves, e.g. infrared, visible or ultraviolet light, or employing corpuscular radiation, e.g. quantum communication
    • H04B10/60Receivers
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

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  • Computer Networks & Wireless Communication (AREA)
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  • Life Sciences & Earth Sciences (AREA)
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Abstract

The invention discloses an acoustic sensor based on optical detection, which comprises: the two chips are bonded, the chips comprise a first vibrating membrane arranged on the front surface of the substrate, the first vibrating membrane comprises an optical waveguide device, a first cavity is arranged on the back surface of the substrate, and the bottom of the first cavity reaches the lower surface of the first vibrating membrane; the two chips are bonded by the back surface of the substrate, and a closed cavity is formed between the first vibrating membranes; the two first vibrating membranes absorb sound waves to generate different deformation, so that the optical transmission distance of light in the two optical waveguide devices is changed differently, the transmission time difference or the transmission phase difference of the light in the two optical waveguide devices is changed correspondingly, the deformation degree of the two first vibrating membranes is detected, the strength of acoustic signals is sensed, and the detection sensitivity and the response speed of the sensor are improved.

Description

Acoustic sensor based on optical detection
Technical Field
The invention relates to the technical field of semiconductor integrated circuits and sensors, in particular to an acoustic sensor based on optical detection.
Background
Conventional acoustic detection devices typically use resistance and capacitance changes to detect, which have problems of slow speed and low sensitivity.
Disclosure of Invention
The object of the present invention is to overcome the above-mentioned drawbacks of the prior art and to provide an acoustic sensor based on optical detection.
In order to achieve the above purpose, the technical scheme of the invention is as follows:
an acoustic sensor based on optical detection, comprising: two chips bonded to each other, the chips comprising:
a substrate;
a first diaphragm provided on a front surface of the substrate, the first diaphragm containing an optical waveguide device;
the bottom of the first cavity reaches the lower surface of the first vibrating membrane;
bonding the two chips with the back surfaces of the substrates, and forming a closed cavity consisting of two first cavities between the first vibrating membranes;
the two first vibrating films absorb sound waves to generate different deformation amounts, so that the optical transmission distance of light in the two optical waveguide devices is changed differently, the transmission time difference or the transmission phase difference of the light in the two optical waveguide devices is changed correspondingly, the deformation degree of the two first vibrating films is detected, and the intensity of an acoustic signal is sensed.
Further, the two first diaphragms have pre-deformation amounts that are convexly curved toward each other.
Further, the optical waveguide device is provided with a waveguide channel, the waveguide channel is spiral, and the light receiving end and the light emitting end are respectively arranged at two ends of the waveguide channel outside the spiral.
Further, the waveguide channel is surrounded by a dielectric layer.
Further, the waveguide channel material comprises silicon.
Further, a fixed electrode is further arranged on the first vibrating membrane.
Further, a vibrating electrode is also suspended above the fixed electrode.
Further, a plurality of sound holes for conducting sound waves are distributed on the fixed electrode and the vibrating electrode.
Further, a supporting layer is arranged between the fixed electrode and the vibrating electrode, and a resonant cavity is formed between the fixed electrode and the vibrating electrode.
Further, the fixed electrode and the vibrating electrode are in a flat state.
According to the technical scheme, the optical waveguide device is integrated on the vibration device (the fixed electrode and the vibration electrode) of the traditional acoustic detector, when the vibration device vibrates, the optical waveguide device is stretched, so that the light transmission distance is prolonged or the phase is changed, the light emitting device is arranged on one side of the optical waveguide device, and the light receiving device such as TOF (time of flight) is arranged on the other side of the optical waveguide device, so that the acoustic vibration can be induced by utilizing the optical detection means such as the change of the light transmission distance or the change of the phase, and the detection sensitivity and the response speed of the sensor are improved.
Drawings
FIG. 1 is a schematic diagram of an acoustic sensor based on optical detection according to a preferred embodiment of the present invention.
Fig. 2 is a schematic view of an optical waveguide device according to a preferred embodiment of the present invention.
Detailed Description
The following describes the embodiments of the present invention in further detail with reference to the accompanying drawings.
In the following detailed description of the embodiments of the present invention, the structures of the present invention are not drawn to a general scale, and the structures in the drawings are partially enlarged, deformed, and simplified, so that the present invention should not be construed as being limited thereto.
In the following detailed description of the present invention, please refer to fig. 1, fig. 1 is a schematic diagram of an acoustic sensor based on optical detection according to a preferred embodiment of the present invention. As shown in fig. 1, an acoustic sensor based on optical detection of the present invention comprises two chips 10, 20 back-bonded together.
Please refer to fig. 1. The two chips 10 and 20 have a plurality of structures which are identical and symmetrically arranged, and the two chips 10 and 20 comprise: a substrate 11, 21 and a first diaphragm 12, 22 provided on the front surface of the substrate 11, 21.
The substrates 11 and 21 may be commonly used semiconductor substrates, such as silicon substrates. The first diaphragms 12 and 22 contain optical waveguide devices 13 and 23.
A first cavity 19, 29 is provided on the back side of each substrate 11, 21, the bottom of the first cavity 19, 29 reaching the lower surface of the first diaphragm 12, 22, respectively, i.e. the first diaphragm 12, 22 is in fact suspended from the first cavity 19, 29.
The two chips 10, 20 are bonded with the back surfaces of the respective substrates 11, 21 and the respective first cavities 19, 29 are aligned so that a larger closed cavity 19 and 29 consisting of the two first cavities 19, 29 is formed between the respective first diaphragms 12, 22. Wherein, the upper and lower ends of the closed cavities 19 and 29 are respectively provided with a first vibrating membrane 12 and 22, and the side walls of the closed cavities 19 and 29 are surrounded by the substrates 11 and 21 of the two chips 10 and 20 respectively.
Thus, when one of the first diaphragms 12 or 22 is faced to the direction of the sound source (for example, assuming that the sound source is located above the illustrated sensor device), the two first diaphragms 12, 22 will each absorb sound waves and generate a certain amount of deformation.
The two first diaphragms 12, 22 may be respectively deformed by a predetermined amount, for example, the two first diaphragms 12, 22 may be deformed by an amount protruding toward each other, that is, bent toward the inside of the closed cavities 19 and 29. When the two first diaphragms 12, 22 each absorb sound waves, one first diaphragm 12 located above the drawing will produce a larger bending deformation with respect to the pre-deformation toward the inside of the closed cavities 19 and 29, while the other first diaphragm 22 located below the drawing will produce a compression under pressure toward the lower outer side of the closed cavities 19 and 29, producing a smaller bending deformation with respect to the pre-deformation.
Therefore, the optical transmission distance of the light in the two optical waveguide devices 13, 23 can be changed differently by utilizing the different deformation amounts generated when the two first diaphragms 12, 22 each absorb the acoustic wave, so that the transmission time difference or the transmission phase difference of the light in the two optical waveguide devices 13, 23 is changed correspondingly, and the intensity of the acoustic signal can be perceived by detecting the deformation degree of the two first diaphragms 12, 22.
Please refer to fig. 2 in combination with fig. 1. The optical waveguide devices 13, 23 may have waveguide channels 131, 231 provided therein; the waveguide channels 131, 231 may be of a spiral structure, the optical waveguide devices 13, 23 are provided with light receiving ends and light emitting ends, and the light receiving ends and the light emitting ends are respectively provided on both ends of the waveguide channels 131, 231 outside the spiral structure. When a light emitting device is provided at the light emitting end of the light waveguide device 13, 23 and a light receiving device such as a TOF (time of flight) is provided at the light receiving end, acoustic vibrations can be induced by using optical detection means such as a change in optical transmission distance or a change in phase, thereby improving the detection sensitivity and response speed of the sensor.
As an alternative embodiment, the waveguide channels 131, 231 may be formed of, for example, a silicon material, but is not limited thereto. The waveguide channels 131 and 231 may be surrounded by the dielectric layers 14 and 24 around the waveguide channels 131 and 231, so that the waveguide channels 131 and 231 (optical waveguide devices 13 and 23) and the surrounding dielectric layers 14 and 24 together form the main structure of the first diaphragms 12 and 22, as shown in fig. 1.
Please refer to fig. 1. As a preferred embodiment, a capacitive structure may also be provided on the first diaphragm 12, 22. For example, one fixed electrode 17, 27 may be provided on each side of the first diaphragm 12, 22, i.e. the fixed electrode 17, 27 is provided on the dielectric layer 14, 24 of the first diaphragm 12, 22 and is spaced apart from the waveguide channel 131, 231. At the same time, a vibrating electrode 16, 26 can also be suspended above the fixed electrode 17, 27. Support layers 15, 25 are arranged between the fixed electrodes 17, 27 and the vibrating electrodes 16, 26, the vibrating electrodes 16, 26 arranged in a suspended manner are supported by the support layers 15, 25, and a resonant cavity 18, 28 is formed between the support layers 15, 25, the fixed electrodes 17, 27 and the vibrating electrodes 16, 26. The resonant cavities 18, 28 may be formed by a conventional release process. In this way, a capacitor structure composed of the fixed electrodes 17, 27, the vibrating electrodes 16, 26, and the resonators 18, 28 is formed on the upper and lower sides of the two first diaphragms 12, 22, respectively.
A plurality of sound holes for conducting sound waves are distributed over the stationary electrodes 17, 27 and the vibrating electrodes 16, 26 to ensure that acoustic signals are transmitted to the first diaphragms 12, 22. The first diaphragms 12, 22 may be made of a metal material.
The two capacitor structures can be made flat on the first diaphragms 12 and 22, that is, the fixed electrodes 17 and 27 and the vibrating electrodes 16 and 26 can be made flat by stress adjustment at the time of manufacture. At the same time, a voltage can be applied to the fixed electrodes 17, 27 and the vibrating electrodes 16, 26 by means of a capacitive design, so that the two first diaphragms 12, 22 located inside the two capacitive structures are pre-bent to some extent towards the inside of the closed cavities 19 and 29. When the acoustic wave causes the upper and lower first diaphragms 12, 22 to deform, the deformation thereof causes the two optical waveguide devices 13, 23 to be in a stretched and compressed state, respectively, and by detecting the difference signal intensity, a differential signal can be obtained, so that the intensity of the acoustic signal can be judged.
The foregoing description is only of the preferred embodiments of the present invention, and the embodiments are not intended to limit the scope of the invention, so that all the equivalent structural changes made in the description and drawings of the present invention are included in the scope of the invention.

Claims (10)

1. An acoustic sensor based on optical detection, comprising: two chips bonded to each other, the chips comprising:
a substrate;
a first diaphragm provided on a front surface of the substrate, the first diaphragm containing an optical waveguide device;
the bottom of the first cavity reaches the lower surface of the first vibrating membrane, and the optical waveguide device is suspended on the first cavity;
bonding the two chips with the back surfaces of the substrates, and forming a closed cavity consisting of two first cavities between the first vibrating membranes;
and the two first vibrating films are utilized to absorb sound waves to generate different deformation amounts, so that the transmission time difference or the transmission phase difference of light in the two optical waveguide devices is correspondingly changed, the deformation degree of the two first vibrating films is detected, and the intensity of an acoustic signal is sensed.
2. The optical detection-based acoustic sensor of claim 1, wherein two of the first diaphragms have a pre-deformation amount of protruding bending toward each other.
3. The acoustic sensor based on optical detection according to claim 1, wherein the optical waveguide device is provided with a waveguide channel, the waveguide channel is spiral, and a light receiving end and a light emitting end are respectively provided on both ends of the waveguide channel outside the spiral.
4. An optical detection based acoustic sensor according to claim 3 wherein the waveguide channel is surrounded by a dielectric layer.
5. An optical detection based acoustic sensor according to claim 3 wherein the waveguide channel material comprises silicon.
6. The optical detection-based acoustic sensor of any of claims 1-5, wherein the first diaphragm is further provided with a stationary electrode.
7. The optical detection-based acoustic sensor of claim 6, wherein a vibrating electrode is further suspended above the fixed electrode.
8. The optical detection-based acoustic sensor of claim 7, wherein a plurality of acoustic holes for conducting acoustic waves are distributed on the fixed electrode and the vibrating electrode.
9. The optical detection-based acoustic sensor of claim 7, wherein a support layer is provided between the stationary electrode and the vibrating electrode, and a resonant cavity is formed therebetween.
10. The optical detection-based acoustic sensor of claim 7, 8 or 9, wherein the stationary electrode and the vibrating electrode are in a flat state.
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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009028701A2 (en) * 2007-08-27 2009-03-05 Canon Kabushiki Kaisha Acoustic-wave sensor, acoustic-wave sensor array, and ultrasonic imaging apparatus
CN103528665A (en) * 2013-09-29 2014-01-22 中国电子科技集团公司第二十七研究所 Novel Fabry-Perot interference MEMS (Micro Electro Mechanical System) sound wave sensor
CN110307892A (en) * 2019-07-08 2019-10-08 上海交通大学 It is changed using the optical signalling of biomaterial to realize the method and sonic sensor of acoustic detection
CN110388980A (en) * 2019-07-31 2019-10-29 山东大学 A kind of micro acoustic sensor based on diffraction grating structure
CN110440904A (en) * 2019-08-13 2019-11-12 金华伏安光电科技有限公司 One kind is based on the outer semimetallic acoustic detector of that

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009028701A2 (en) * 2007-08-27 2009-03-05 Canon Kabushiki Kaisha Acoustic-wave sensor, acoustic-wave sensor array, and ultrasonic imaging apparatus
CN103528665A (en) * 2013-09-29 2014-01-22 中国电子科技集团公司第二十七研究所 Novel Fabry-Perot interference MEMS (Micro Electro Mechanical System) sound wave sensor
CN110307892A (en) * 2019-07-08 2019-10-08 上海交通大学 It is changed using the optical signalling of biomaterial to realize the method and sonic sensor of acoustic detection
CN110388980A (en) * 2019-07-31 2019-10-29 山东大学 A kind of micro acoustic sensor based on diffraction grating structure
CN110440904A (en) * 2019-08-13 2019-11-12 金华伏安光电科技有限公司 One kind is based on the outer semimetallic acoustic detector of that

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