CN111552361A - Combined heat dissipation device for heat dissipation of computer - Google Patents
Combined heat dissipation device for heat dissipation of computer Download PDFInfo
- Publication number
- CN111552361A CN111552361A CN202010259483.2A CN202010259483A CN111552361A CN 111552361 A CN111552361 A CN 111552361A CN 202010259483 A CN202010259483 A CN 202010259483A CN 111552361 A CN111552361 A CN 111552361A
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- Prior art keywords
- heat dissipation
- computer
- cooling liquid
- liquid guide
- heat
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
- G06F1/203—Cooling means for portable computers, e.g. for laptops
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a combined heat dissipation device for computer heat dissipation, which comprises a fixed substrate and a heat dissipation assembly, wherein the heat dissipation assembly comprises a mounting heat conducting fin connected with a computer device and a plurality of heat dissipation fins fixed on the surface of the mounting heat conducting fin, the circulating cooling liquid guiding pipe is provided with a plurality of circulating cooling liquid guiding pipes in an inverted U-shaped structure, the bottom side of each heat dissipation fin is provided with a plurality of clamping grooves which are correspondingly clamped on the circulating cooling liquid guiding pipe, the fixed substrate is provided with a heat dissipation fan, the air outlet end of the heat dissipation fan is opposite to the heat dissipation fins, the lower side of the fixed substrate is also provided with a water tank, the water tank is connected with a cooling liquefier and a liquid pump which are arranged at the lower end part of the fixed substrate through a first liquid guiding pipe, and the cooling liquefier is. The invention has simple structure, can adopt the combination of water circulation heat absorption and wind dispelling to increase the airflow circulation rate so as to improve the heat dissipation effect, is convenient to operate and has stronger practicability.
Description
Technical Field
The invention relates to the technical field of computers, in particular to a combined heat dissipation device for computer heat dissipation.
Background
The computer is commonly called computer, is an electronic computer for high-speed calculation, can perform numerical calculation and logic calculation, and also has the function of storage and memory. The intelligent electronic device can be operated according to a program, and can automatically process mass data at a high speed. A computer that is composed of a hardware system and a software system and does not have any software installed is called a bare metal.
The computer radiator is one of computer accessories and is also a tool for assisting the heat dissipation of the computer. In the current society, notebook computers are more and more introduced into the public families, and the computers become an indispensable part of people for entertainment, information exchange, work and the like. When a computer is used and operated, a large amount of heat is easily generated to damage computer accessories, and the heat dissipation efficiency of the traditional computer radiator is improved by increasing the current to enable a fan to rotate quickly, so that noise is easily caused and the heat dissipation efficiency is poor.
Disclosure of Invention
The invention aims to provide a combined heat dissipation device for computer heat dissipation, which aims to solve the problem of low heat dissipation efficiency.
In order to achieve the purpose, the invention provides the following technical scheme:
a combined heat dissipation device for computer heat dissipation comprises a fixed substrate and a heat dissipation assembly, wherein the heat dissipation assembly comprises an installation heat conducting fin connected with a computer device and a plurality of heat dissipation fins fixed on the surface of the installation heat conducting fin, the circulating cooling liquid guiding pipe is provided with a plurality of circulating cooling liquid guiding pipes in inverted U-shaped structures, the circulating cooling liquid guiding pipes penetrate through the plurality of heat dissipation fins and are in heat conduction transmission connection with the plurality of heat dissipation fins, the bottom side of each heat dissipation fin is provided with a plurality of clamping grooves which are correspondingly clamped on the circulating cooling liquid guiding pipe, the fixed substrate is provided with a heat dissipation fan, the air outlet end of the heat dissipation fan is opposite to the heat dissipation fins, the lower side of the fixed substrate is also provided with a water tank, the water tank is connected with a cooling liquefier and a liquid pump which are arranged at the lower end part of the fixed substrate through a first, the liquid pump is communicated with the other end of the circulating cooling liquid guide pipe through a second liquid guide pipe.
On the basis of the technical scheme, the invention also provides the following optional technical scheme:
in one alternative: and a heat conducting fin is arranged between the clamping groove and the outer wall of the circulating cooling liquid guide pipe.
In one alternative: the cooling fan downside is provided with the inlet end and the inlet end passes through the air duct and connects in the air inlet cover of setting in the casing outside.
In one alternative: the air duct is detachably connected with the end part of the air inlet end through a spiral connecting sleeve.
In one alternative: the end parts of the plurality of circulating cooling liquid guide pipes are fixedly connected through the fixing plates, second connecting holes are formed in the fixing plates, connecting plates are arranged on the bottom edge sides of the two radiating fins located at the end parts and can be attached to the corresponding fixing plates, and first connecting holes corresponding to the second connecting holes are formed in the connecting plates and are fixed through bolts.
In one alternative: a plurality of air holes are formed in the end faces of the radiating fins.
In one alternative: the end part of the air inlet hood, far away from the air guide pipe, is provided with a connecting flange which can be fastened with the machine shell, and a filter screen capable of filtering dust is arranged in the air inlet hood.
Compared with the prior art, the invention has the following beneficial effects:
the heat that produces through radiator unit with the electric part work of computer inside absorbs, and the liquid pump is inside with the inside water suction circulative cooling drain pipe of water tank, pass through inside the leading-in cooling liquefier of second drain pipe, and water can absorb the heat on the radiating fin and take away and rush into inside the cooling liquefier when passing through, and the cooling liquefier can liquefy steam and pour into the inside storage of water tank into, but the cyclic utilization water resource, and radiator fan can blow outside air to the radiating fin and make the inside circulation of air speed of computer increase, and then can further improve computer radiating efficiency, convenient to use. The invention has simple structure, can adopt the combination of water circulation heat absorption and wind dispelling to increase the airflow circulation rate so as to improve the heat dissipation effect, is convenient to operate and has stronger practicability.
Drawings
FIG. 1 is a schematic structural diagram of the present invention.
Fig. 2 is a schematic structural view of a heat dissipation fin according to the present invention.
FIG. 3 is a schematic view of the installation structure of the circulation cooling catheter of the present invention.
Fig. 4 is a schematic structural view of an intake shroud of the present invention.
Notations for reference numerals: the device comprises a fixed substrate 1, a circulating cooling liquid guide pipe 2, a heat dissipation assembly 3, heat dissipation fins 4, an installation heat conduction sheet 5, a heat dissipation fan 6, a cooling liquefier 7, a liquid pump 8, a water tank 9, a first liquid guide pipe 10, an air inlet end 11, an air guide pipe 12, an air inlet cover 13, a spiral connecting sleeve 14, a second liquid guide pipe 15, an air hole 16, a clamping groove 17, a heat conduction sheet 18, a connecting plate 19, a first connecting hole 20, a fixing plate 21, a second connecting hole 22, a connecting flange 23 and a filter screen 24.
Detailed Description
The present invention will be described in detail with reference to the following embodiments, wherein like or similar elements are designated by like reference numerals throughout the several views, and wherein the shape, thickness or height of the various elements may be expanded or reduced in practice. The examples are given solely for the purpose of illustration and are not intended to limit the scope of the invention. Any obvious modifications or variations can be made to the present invention without departing from the spirit or scope of the present invention.
Example 1
Referring to fig. 1 to 4, in an embodiment of the present invention, a combined heat dissipation apparatus for computer heat dissipation includes a fixed substrate 1 and a heat dissipation assembly 3, the heat dissipation assembly 3 includes a mounting heat conduction fin 5 connected to a computer device and a plurality of heat dissipation fins 4 fixed on a surface of the mounting heat conduction fin 5, a plurality of circulation cooling liquid guide tubes 2 in an inverted U-shaped structure are disposed on the circulation cooling liquid guide tubes 2, the circulation cooling liquid guide tubes 2 penetrate through the plurality of heat dissipation fins 4 and are in heat conduction and transmission connection with the plurality of heat dissipation fins 4, a plurality of clamping grooves 17 are disposed on a bottom side of each heat dissipation fin 4, the clamping grooves 17 are correspondingly clamped on the circulation cooling liquid guide tubes 2, a heat conduction fin 18 is further disposed between the clamping grooves 17 and an outer wall of the circulation cooling liquid guide tube 2 to increase heat exchange efficiency, a heat dissipation fan 6 is disposed on the fixed substrate 1, a water tank 9 is further arranged on the lower side of the fixed substrate 1, the water tank 9 is connected with a cooling liquefier 7 and a liquid pump 8 which are arranged at the lower end of the fixed substrate 1 through a first liquid guide pipe 10, the cooling liquefier 7 is connected to one end of the circulating cooling liquid guide pipe 2 through a second liquid guide pipe 15, and the liquid pump 8 is communicated with the other end of the circulating cooling liquid guide pipe 2 through the second liquid guide pipe 15;
the heat generated by the work of electric devices in the computer is absorbed by the heat dissipation assembly 3, the water in the water tank 9 is pumped into the circulating cooling liquid guide pipe 2 by the liquid pump 8 and then is guided into the cooling liquefier 7 by the second liquid guide pipe 15, the water can absorb the heat on the heat dissipation fins 4 and take away the heat to flush into the cooling liquefier 7 when passing through the liquid guide pipe 2, the cooling liquefier 7 can liquefy hot air and inject the hot air into the water tank 9 for storage, so that the water resource can be recycled, and the heat dissipation fan 6 can blow the external air to the heat dissipation fins 4 to increase the circulation speed of the air in the computer, so that the heat dissipation efficiency of the computer can be further improved, and the use is convenient;
6 downside of radiator fan is provided with inlet end 11 and connects in setting up the inlet hood 13 in the casing outside through air duct 12, air duct 12 and inlet end 11 tip pass through spiral connection cover 14 and can dismantle the connection, the tip passes through fixed plate 21 looks fixed connection between a plurality of circulative cooling catheter 2, has seted up second connecting hole 22 on the fixed plate 21, two 4 bottom avris of radiator fin that are located the tip are provided with connecting plate 19 and connecting plate 19 can paste and attach corresponding fixed plate 21, set up in the first connecting hole 20 that second connecting hole 22 corresponds on connecting plate 19 and pass through the bolt fastening, and then can realize radiator unit 3 can dismantle to fix on circulative cooling catheter 2 and realize the heat transfer, a plurality of gas pockets 16 have been seted up on radiator fin 4 terminal surface.
Example 2
The embodiment of the invention is different from the embodiment 1 in that: the end part of the air inlet hood 13 far away from the air guide pipe 12 is provided with a connecting flange 23 which can be fastened with a machine shell, and a filter screen 24 which can filter dust is arranged in the air inlet hood 13, so that the dust in the air entering the computer is filtered, and the dust is prevented from influencing the work of computer devices.
The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.
Claims (7)
1. A combined heat dissipation device for computer heat dissipation comprises a fixed substrate (1) and a heat dissipation assembly (3), wherein the heat dissipation assembly (3) comprises an installation heat conducting fin (5) connected to a computer device and a plurality of heat dissipation fins (4) fixed on the surface of the installation heat conducting fin (5), and is characterized in that a plurality of circulating cooling liquid guide pipes (2) in an inverted U-shaped structure are arranged on the circulating cooling liquid guide pipes (2), the circulating cooling liquid guide pipes (2) penetrate through the heat dissipation fins (4) and are in heat conduction transmission connection with the heat dissipation fins, a plurality of clamping grooves (17) are arranged on the bottom side of each heat dissipation fin (4), the clamping grooves (17) are correspondingly clamped on the circulating cooling liquid guide pipes (2), a heat dissipation fan (6) is arranged on the fixed substrate (1), the air outlet end of the heat dissipation fan (6) is opposite to the heat dissipation fins (4), a water tank (9) is further arranged on the lower side of the fixed substrate, the water tank (9) is connected with a cooling liquefier (7) and a liquid pump (8) which are arranged at the lower end part of the fixed substrate (1) through a first liquid guide pipe (10), the cooling liquefier (7) is connected to one end of the circulating cooling liquid guide pipe (2) through a second liquid guide pipe (15), and the liquid pump (8) is communicated with the other end of the circulating cooling liquid guide pipe (2) through the second liquid guide pipe (15).
2. The combined heat sink for computer heat dissipation according to claim 1, wherein a heat conducting fin (18) is further disposed between the slot (17) and the outer wall of the circulating cooling liquid guiding tube (2).
3. The combined heat sink for computer heat dissipation according to claim 1, wherein an air inlet (11) is provided at a lower side of the heat dissipation fan (6) and the air inlet (11) is connected to an air inlet cover (13) provided outside the housing through an air duct (12).
4. The combined heat sink for computer heat dissipation according to claim 3, wherein the air duct (12) is detachably connected to the end of the air inlet end (11) by a screw connection sleeve (14).
5. The combined heat sink for computer heat dissipation according to claim 1, wherein the ends of the plurality of circulative cooling liquid guiding tubes (2) are fixedly connected by a fixing plate (21), the fixing plate (21) is provided with a second connecting hole (22), the bottom sides of the two heat dissipating fins (4) at the ends are provided with connecting plates (19), the connecting plates (19) can be attached to the corresponding fixing plates (21), and the connecting plates (19) are provided with first connecting holes (20) corresponding to the second connecting holes (22) and are fixed by bolts.
6. The combined heat sink for computer heat dissipation according to claim 5, wherein the heat dissipation fins (4) have a plurality of air holes (16) formed on the end surface.
7. The combined heat sink for computer heat dissipation according to claim 3, wherein the end of the air inlet hood (13) far away from the air duct (12) is provided with a connecting flange (23) which can be fastened with the casing, and a filter screen (24) capable of filtering dust is arranged inside the air inlet hood (13).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010259483.2A CN111552361A (en) | 2020-04-03 | 2020-04-03 | Combined heat dissipation device for heat dissipation of computer |
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CN202010259483.2A CN111552361A (en) | 2020-04-03 | 2020-04-03 | Combined heat dissipation device for heat dissipation of computer |
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CN111552361A true CN111552361A (en) | 2020-08-18 |
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CN202010259483.2A Pending CN111552361A (en) | 2020-04-03 | 2020-04-03 | Combined heat dissipation device for heat dissipation of computer |
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Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206862164U (en) * | 2016-12-15 | 2018-01-09 | 郑啸洲 | Car heat dissipating double-fuselage that is a kind of dust-proof and being easy to deashing |
CN208999940U (en) * | 2018-12-12 | 2019-06-18 | 南京晓庄学院 | A kind of computer water-cooling system based on double mainboard structures |
CN209496320U (en) * | 2019-04-03 | 2019-10-15 | 朱少亮 | A kind of external cooling device of computer cabinet |
CN209784885U (en) * | 2019-04-25 | 2019-12-13 | 新昌县海商网络科技有限公司 | high-efficient heat dissipation host computer machine case |
-
2020
- 2020-04-03 CN CN202010259483.2A patent/CN111552361A/en active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN206862164U (en) * | 2016-12-15 | 2018-01-09 | 郑啸洲 | Car heat dissipating double-fuselage that is a kind of dust-proof and being easy to deashing |
CN208999940U (en) * | 2018-12-12 | 2019-06-18 | 南京晓庄学院 | A kind of computer water-cooling system based on double mainboard structures |
CN209496320U (en) * | 2019-04-03 | 2019-10-15 | 朱少亮 | A kind of external cooling device of computer cabinet |
CN209784885U (en) * | 2019-04-25 | 2019-12-13 | 新昌县海商网络科技有限公司 | high-efficient heat dissipation host computer machine case |
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Application publication date: 20200818 |
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