CN111548145A - Injection molding method of microwave dielectric ceramic filter and ceramic filter thereof - Google Patents

Injection molding method of microwave dielectric ceramic filter and ceramic filter thereof Download PDF

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CN111548145A
CN111548145A CN202010480386.6A CN202010480386A CN111548145A CN 111548145 A CN111548145 A CN 111548145A CN 202010480386 A CN202010480386 A CN 202010480386A CN 111548145 A CN111548145 A CN 111548145A
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张保林
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Abstract

The invention discloses an injection molding method of a microwave dielectric ceramic filter, which comprises the following steps: the method comprises the following steps: carrying out banburying and granulation on 100 parts by weight of TMCCS powder and 10-30 parts by weight of organic binder to obtain an injection molding material; wherein the TMCCS powder consists of TiO with specific weight percentage2、Mg(OH)2、CaCo3、CaTiO3、SiO2Mixing to form; step two: performing injection molding on the injection molding material to obtain a blank body; step three: carrying out thermal degreasing treatment on the blank; step four: sintering the hot degreased blank at high temperature to obtain the final productA ceramic filter body. The invention adopts TiO2、Mg(OH)2、CaCo3、CaTiO3、SiO2The main material is used as a main material, and the main material and an organic binder are mixed and banburied to obtain the injection molding material with more stable comprehensive performance, shrinkage error within 0.2 percent and green density within 3 +/-0.1 g/cm3The density of the sintered product is more than or equal to 5.0g/cm3And the high-precision runner mold which is designed by self is combined, so that the size parameters of the degreased and sintered product are free from processing, the production efficiency and the production quality are improved, and the production cost is reduced.

Description

Injection molding method of microwave dielectric ceramic filter and ceramic filter thereof
Technical Field
The invention relates to the technical field of dielectric filters, in particular to an injection molding method of a microwave dielectric ceramic filter and the ceramic filter.
Background
The dielectric filter is a basic microwave element, is widely applied to modern communications such as mobile communication, satellite communication, military radar, global positioning system, Bluetooth technology, wireless local area network and the like, and is a key basic device of the modern communication technology. The dielectric filter applied to the microwave circuit needs to meet the following dielectric property requirements besides the necessary mechanical strength: (1) the microwave dielectric material has relatively high dielectric constant r under microwave frequency, and r is generally required to be more than 19 so as to facilitate miniaturization and integration of microwave devices; (2) the dielectric loss is extremely low under the microwave resonance frequency, namely the quality factor (Q multiplied by f) is very high, so that the excellent frequency selection characteristic is ensured, and the insertion loss of the device under the high frequency is reduced; (3) a temperature coefficient (τ f) of the resonant frequency close to zero to ensure a high stability of the resonant frequency of the device in a temperature variation environment.
At present, the dielectric filter is mainly composed of MgO, CaO and SiO2、Nd2O3、Sm2O3And TiO2The dielectric filter is prepared by the process, wherein the dielectric constant r of the material is 19.5 +/-0.2, f × Q is more than or equal to 52000GHz, τ f (-40 ℃ -25 ℃)) is 5-13 ppm/° C, τ f (25 ℃ -110 ℃)) is-5-0 ppm/° C, the dielectric property is poor, the dielectric filter is mainly formed by a dry pressing method, and the dry pressing method is mainly based on the principle that the dielectric ceramic powder is added with a binder for granulation and is sintered after being pressed and formed by a mould, so that the dielectric property of the dielectric filter is affected by pressure loss caused by internal and external friction between particles and mould walls in the pressing and forming process, and the dielectric filter has the defects that (1) the density distribution of green bodies and sintered samples is not uniform, the uniformity of the density affects the dielectric property of the dielectric filter and further affects the working performance of the filter, and (2) the dielectric filter is limited by the pressing mode, most of the dielectric filter is columnar (or similar), not all shapes and sizes can be prepared by the dry pressing method, for example, the filter with complicated shape is difficult to realize, the large filter can not be prepared by pressing, because the low density and the length-diameter ratio is easy to cause the poor, and the low-diameter ratio of the filter, the.
Disclosure of Invention
The invention provides an injection molding method of a microwave dielectric ceramic filter and the ceramic filter thereof aiming at the defects in the prior art, and aims to solve the technical problems that the microwave dielectric ceramic filter in the technical background has low dielectric property, high dielectric loss, poor stability of resonant frequency in a temperature change environment, secondary processing and forming and the like.
In order to achieve the purpose, the invention adopts the following technical scheme:
an injection molding method of a microwave dielectric ceramic filter comprises the following steps:
the method comprises the following steps: carrying out banburying and granulation on 100 parts by weight of TMCCS powder and 10-30 parts by weight of organic binder to obtain an injection molding material; wherein the TMCCS powder consists of TiO with specific weight percentage2、Mg(OH)2、CaCo3、CaTiO3、SiO2Mixing to form;
step two: performing injection molding on the injection molding material to obtain a blank body;
step three: carrying out thermal degreasing treatment on the blank;
step four: and sintering the blank subjected to thermal degreasing at high temperature to obtain the ceramic filter main body.
As a preferred scheme, the TMCCS powder comprises the following components in percentage by weight:
Figure BDA0002517135900000021
as a preferable scheme, the organic binder is formed by mixing the following components in percentage by weight:
Figure BDA0002517135900000031
as a preferable scheme, in the first step, during banburying and granulation, the temperature of the banburying granulator is firstly raised to 200 ℃ at 100-.
As a preferable scheme, in the second step, the injection molding material is subjected to injection molding by an injection molding machine and a high-precision mold to obtain a blank, the injection molding temperature is controlled at 120-180 ℃, the injection molding pressure is controlled at 30-60Mpa, the molding injection speed is 25-40mm/s, and the injection molding time is 30-50 s.
As a preferred scheme, in the third step, the thermal degreasing process comprises moving the injection molded blank into a degreasing kiln, heating to 100 ℃ at a heating rate of 2 ℃/min, preserving heat for 2 hours, heating to 180 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 6 hours, heating to 260 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 20 hours, heating to 300 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 14 hours, heating to 360 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4 hours, heating to 500 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4-6 hours, cooling to 300 ℃ at a cooling rate of 1.5 ℃/min, and then moving out of the degreasing kiln.
As a preferable scheme, in the fourth step, the high-temperature sintering process is to move the blank after thermal degreasing into a high-temperature sintering kiln, heat up to 650 ℃ at a heating rate of 5 ℃/min, heat up to 850 ℃ at a heating rate of 1 ℃/min, heat up to 1000 ℃ at a heating rate of 1 ℃/min, heat up to 1200 ℃ at a heating rate of 0.5 ℃/min, heat up to 1360 ℃ at a heating rate of 0.5 ℃/min, preserve heat for 2-3 hours, finally cool down to 1100 ℃ at a cooling rate of 1.5 ℃/min, and move out of the high-temperature sintering kiln.
A microwave dielectric ceramic filter comprises a ceramic filter main body, wherein the microwave dielectric ceramic filter main body is formed in one step by the microwave dielectric ceramic filter injection molding method, and the size parameters do not need subsequent processing.
Compared with the prior art, the invention has obvious advantages and beneficial effects, particularly: 1. by using TiO2、Mg(OH)2、CaCo3、CaTiO3、SiO2As a main material, and the main material and an organic binder are mixed and banburied to obtain the injection molding material with more stable comprehensive performance, shrinkage error within 0.2 percent and green density within3±0.1g/cm3The density of the sintered product is more than or equal to 5.0g/cm3The size parameters of the product after degreasing and sintering can be processed-free by combining a self-designed high-precision runner mold, the production efficiency and the production quality of the microwave dielectric ceramic filter are improved, and the production cost of an enterprise is reduced; 2. by using TiO2、Mg(OH)2、CaCo3、CaTiO3、SiO2As a main body material, the powder material has higher formula performance consistency, the dielectric constant r of the material is 21 +/-0.5, the f × Q is more than or equal to 62000GHz (the highest can be more than or equal to 82000GHz), tau f is more than 0 and less than or equal to 3 ppm/DEG C (-40-25 ℃), and tau f is more than or equal to-3 and less than 0 ppm/DEG C (25-110 ℃), so that the dielectric property of the microwave dielectric ceramic filter is improved, the dielectric loss is reduced, and the stability of the resonant frequency in the environment with temperature change is improved.
To more clearly illustrate the structural features and technical means of the present invention and the specific objects and functions attained thereby, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments:
drawings
FIG. 1 is a schematic flow chart of an embodiment of the present invention.
Detailed Description
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the positions or elements referred to must have specific orientations, be constructed and operated in specific orientations, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood as appropriate by those of ordinary skill in the art.
As shown in fig. 1, a method for injection molding a microwave dielectric ceramic filter includes the following steps:
step one 100: carrying out banburying and granulation on 100 parts by weight of TMCCS powder and 10-30 parts by weight of organic binder to obtain an injection molding material; wherein the TMCCS powder comprises the following components in percentage by weight: 30-50% TiO210-40% of Mg (OH)21-30% of CaCo31-30% of CaTiO30.1-7.9% of SiO2(ii) a The organic binder is formed by mixing the following components in percentage by weight: 2-12% of EVA, 20-50% of polymethyl methacrylate, 10-30% of polystyrene, 4-20% of stearic acid, 2-10% of oleic acid and 10-30% of paraffin; an organic matter auxiliary agent system is formed in the middle of the injection molding material through mixing, the system can ensure the green strength of the ceramic filter product after molding, and the material strength and density of the degreased and sintered product are uniform, so that the product consistency is improved.
Specifically, during banburying and granulation, the temperature of the banburying granulator is firstly raised to 200 ℃ of 100-.
Step two 200: and (3) performing injection molding on the injection molding material to obtain a blank, wherein the injection molding temperature is controlled to be 120-180 ℃, the injection molding pressure is controlled to be 30-60Mpa, the molding injection speed is 25-40mm/s, and the injection molding time is 30-50 s.
Step three 300: carrying out thermal degreasing treatment on the blank; specifically, the thermal degreasing process comprises the steps of moving an injection molded blank into a degreasing kiln, heating to 100 ℃ at a heating rate of 2 ℃/min, preserving heat for 2 hours, heating to 180 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 6 hours, heating to 260 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 20 hours, heating to 300 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 14 hours, heating to 360 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4 hours, heating to 500 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4-6 hours, cooling to 300 ℃ at a cooling rate of 1.5 ℃/min, and moving out of the degreasing kiln.
Step four 400: sintering the blank subjected to thermal degreasing at high temperature to obtain a ceramic filter main body; specifically, the high-temperature sintering process comprises the steps of moving the blank body after thermal degreasing into a high-temperature sintering kiln, heating to 650 ℃ at a heating rate of 5 ℃/min, heating to 850 ℃ at a heating rate of 1 ℃/min, heating to 1000 ℃ at a heating rate of 1 ℃/min, heating to 1200 ℃ at a heating rate of 0.5 ℃/min, heating to 1360 ℃ at a heating rate of 0.5 ℃/min, preserving heat for 2-3 hours, cooling to 1100 ℃ at a cooling rate of 1.5 ℃/min, and moving out of the high-temperature sintering kiln.
The invention also provides a microwave dielectric ceramic filter, which comprises a ceramic filter main body, wherein the microwave dielectric ceramic filter main body is formed in one step by the microwave dielectric ceramic filter injection molding method, and the size parameters do not need subsequent processing.
The following describes the forming process of the microwave dielectric ceramic filter and the performance parameters of the finished filter according to the present invention with reference to several specific examples.
Example one
The microwave dielectric ceramic filter prepared by the injection molding process is realized by the following steps:
(1) carrying out banburying and granulation on 100 parts by weight of TMCCS powder and 10 parts by weight of organic binder to obtain an injection molding material; wherein the TMCCS powder comprises the following components in percentage by weight: 30% TiO240% of Mg (OH)21% of CaCo325% of CaTiO34% of SiO2(ii) a The organic binder is formed by mixing the following components in percentage by weight: 2% of EVA, 50% of polymethyl methacrylate, 30% of polystyrene, 4% of stearic acid, 4% of oleic acid and 10% of paraffin; during banburying and granulation, firstly heating the temperature of the banburying granulator to 100 ℃, then alternately adding TMCCS powder and the binder into a banburying bin of the banburying granulator in 2 stages for banburying for 100min, and then granulating and cooling to obtain granulesAnd (3) injecting materials with the particle diameter of not more than 4 mm.
(2) And (3) performing injection molding on the injection molding material to obtain a blank, wherein the injection molding temperature is controlled at 120 ℃, the injection molding pressure is controlled at 30Mpa, the molding injection speed is 25mm/s, and the injection molding time is 30 s.
(3) Carrying out thermal degreasing treatment on the blank; specifically, the thermal degreasing process comprises the steps of moving an injection molded blank into a degreasing kiln, heating to 100 ℃ at a heating rate of 2 ℃/min, preserving heat for 2 hours, heating to 180 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 6 hours, heating to 260 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 20 hours, heating to 300 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 14 hours, heating to 360 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4 hours, heating to 500 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4 hours, cooling to 300 ℃ at a cooling rate of 1.5 ℃/min, and moving out of the degreasing kiln.
(4) Sintering the blank subjected to thermal degreasing at high temperature to obtain a ceramic filter main body; the high-temperature sintering process comprises the steps of moving the blank body after thermal degreasing into a high-temperature sintering kiln, heating to 650 ℃ at the heating rate of 5 ℃/min, heating to 850 ℃ at the heating rate of 1 ℃/min, heating to 1000 ℃ at the heating rate of 1 ℃/min, heating to 1200 ℃ at the heating rate of 0.5 ℃/min, heating to 1360 ℃ at the heating rate of 0.5 ℃/min, preserving heat for 2 hours, cooling to 1100 ℃ at the cooling rate of 1.5 ℃/min, and moving out of the high-temperature sintering kiln.
Example two
The microwave dielectric ceramic filter prepared by the injection molding process is realized by the following steps:
(1) carrying out banburying and granulation on 100 parts by weight of TMCCS powder and 30 parts by weight of organic binder to obtain an injection molding material; wherein the TMCCS powder comprises the following components in percentage by weight: 50% TiO210% of Mg (OH)22.1% of CaCo330% of CaTiO37.9% SiO2(ii) a The organic binder is formed by mixing the following components in percentage by weight: 12% of EVA, 20% of polymethyl methacrylate, 18% of polystyrene and 10% of hard materialFatty acid, 10% oleic acid, 30% paraffin; and during banburying and granulation, firstly heating the temperature of the banburying granulator to 150 ℃, then alternately adding TMCCS powder and the binder into a banburying bin of the banburying granulator in 4 stages for banburying for 260min, and then granulating and cooling to obtain the injection material with the particle diameter of not more than 4 mm.
(2) And (3) performing injection molding on the injection molding material to obtain a blank, wherein the injection molding temperature is controlled at 150 ℃, the injection molding pressure is controlled at 45Mpa, the molding injection speed is 40mm/s, and the injection molding time is 40 s.
(3) Carrying out thermal degreasing treatment on the blank; specifically, the thermal degreasing process comprises the steps of moving an injection molded blank into a degreasing kiln, heating to 100 ℃ at a heating rate of 2 ℃/min, preserving heat for 2 hours, heating to 180 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 6 hours, heating to 260 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 20 hours, heating to 300 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 14 hours, heating to 360 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4 hours, heating to 500 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 6 hours, cooling to 300 ℃ at a cooling rate of 1.5 ℃/min, and moving out of the degreasing kiln.
(4) Sintering the blank subjected to thermal degreasing at high temperature to obtain a ceramic filter main body; the high-temperature sintering process comprises the steps of moving the blank body after thermal degreasing into a high-temperature sintering kiln, heating to 650 ℃ at the heating rate of 5 ℃/min, heating to 850 ℃ at the heating rate of 1 ℃/min, heating to 1000 ℃ at the heating rate of 1 ℃/min, heating to 1200 ℃ at the heating rate of 0.5 ℃/min, heating to 1360 ℃ at the heating rate of 0.5 ℃/min, preserving heat for 2.5 hours, cooling to 1100 ℃ at the cooling rate of 1.5 ℃/min, and moving out of the high-temperature sintering kiln.
EXAMPLE III
The microwave dielectric ceramic filter prepared by the injection molding process is realized by the following steps:
(1) carrying out banburying and granulation on 100 parts by weight of TMCCS powder and 20 parts by weight of organic binder to obtain an injection molding material; wherein the TMCCS powder comprises the following components in percentage by weight: 38.9% TiO230% of Mg (OH)230% of CaCo31% of CaTiO30.1% of SiO2(ii) a The organic binder is formed by mixing the following components in percentage by weight: 10% of EVA, 48% of polymethyl methacrylate, 10% of polystyrene, 20% of stearic acid, 2% of oleic acid and 10% of paraffin; during banburying and granulation, the temperature of the banburying granulator is firstly raised to 200 ℃, then TMCCS powder and the binder are alternately added into a banburying bin of the banburying granulator in 3 stages for banburying for 200min, and then granulation and cooling are carried out to obtain the injection material with the particle diameter not larger than 4 mm.
(2) And (3) performing injection molding on the injection molding material to obtain a blank, wherein the injection molding temperature is controlled at 180 ℃, the injection molding pressure is controlled at 60Mpa, the molding injection speed is 30mm/s, and the injection molding time is 50 s.
(3) Carrying out thermal degreasing treatment on the blank; specifically, the thermal degreasing process comprises the steps of moving an injection molded blank into a degreasing kiln, heating to 100 ℃ at a heating rate of 2 ℃/min, preserving heat for 2 hours, heating to 180 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 6 hours, heating to 260 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 20 hours, heating to 300 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 14 hours, heating to 360 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4 hours, heating to 500 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 5 hours, cooling to 300 ℃ at a cooling rate of 1.5 ℃/min, and moving out of the degreasing kiln.
(4) Sintering the blank subjected to thermal degreasing at high temperature to obtain a ceramic filter main body; the high-temperature sintering process comprises the steps of moving the blank body after thermal degreasing into a high-temperature sintering kiln, heating to 650 ℃ at the heating rate of 5 ℃/min, heating to 850 ℃ at the heating rate of 1 ℃/min, heating to 1000 ℃ at the heating rate of 1 ℃/min, heating to 1200 ℃ at the heating rate of 0.5 ℃/min, heating to 1360 ℃ at the heating rate of 0.5 ℃/min, preserving heat for 3 hours, cooling to 1100 ℃ at the cooling rate of 1.5 ℃/min, and moving out of the high-temperature sintering kiln.
The following table is a comparison table of main parameters of the microwave dielectric ceramic filter prepared in the above embodiment and the microwave dielectric ceramic filter prepared by the existing material forming process.
Figure BDA0002517135900000101
As can be seen from the table above, the microwave dielectric ceramic filter prepared by the injection molding method of the microwave dielectric ceramic filter provided by the invention has the advantages of larger dielectric constant, higher quality factor, closer zero temperature drift system, higher precision of the geometric dimension of the product prepared and molded, and no need of secondary processing on the geometric dimension.
In conclusion, the invention adopts TiO2、Mg(OH)2、CaCo3、CaTiO3、SiO2The main material is used as a main material, and the main material and an organic binder are mixed and banburied to obtain the injection molding material with more stable comprehensive performance, shrinkage error within 0.2 percent and green density within 3 +/-0.1 g/cm3The density of the sintered product is more than or equal to 5.0g/cm3The size parameters of the product after degreasing and sintering can be processed-free by combining a self-designed high-precision runner mold, the production efficiency and the production quality of the microwave dielectric ceramic filter are improved, and the production cost of an enterprise is reduced; by using TiO2、Mg(OH)2、CaCo3、CaTiO3、SiO2As a main body material, the powder material has higher formula performance consistency, the dielectric constant r of the material is 21 +/-0.5, the f × Q is more than or equal to 62000GHz (the highest can be more than or equal to 82000GHz), tau f is more than 0 and less than or equal to 3 ppm/DEG C (-40-25 ℃), and tau f is more than or equal to-3 and less than 0 ppm/DEG C (25-110 ℃), so that the dielectric property of the microwave dielectric ceramic filter is improved, the dielectric loss is reduced, and the stability of the resonant frequency in the environment with temperature change is improved.
The above description is only for the preferred embodiment of the present invention and is not intended to limit the present invention, so that any modifications, equivalents, improvements, etc. made to the above embodiment according to the present invention are within the scope of the present invention.

Claims (8)

1. An injection molding method of a microwave dielectric ceramic filter is characterized by comprising the following steps:
the method comprises the following steps: carrying out banburying and granulation on 100 parts by weight of TMCCS powder and 10-30 parts by weight of organic binder to obtain an injection molding material; wherein the TMCCS powder consists of TiO with specific weight percentage2、Mg(OH)2、CaCo3、CaTiO3、SiO2Mixing to form;
step two: performing injection molding on the injection molding material to obtain a blank body;
step three: carrying out thermal degreasing treatment on the blank;
step four: and sintering the blank subjected to thermal degreasing at high temperature to obtain the ceramic filter main body.
2. The injection molding method of the microwave dielectric ceramic filter according to claim 1, wherein the TMCCS powder comprises the following components in percentage by weight:
Figure FDA0002517135890000011
3. an injection molding method for a microwave dielectric ceramic filter according to claim 1, wherein the organic binder is formed by mixing the following components in percentage by weight:
Figure FDA0002517135890000012
Figure FDA0002517135890000021
4. the injection molding method of the microwave dielectric ceramic filter according to claim 1, wherein in the first step, during the banburying and the granulation, the temperature of the banburying granulator is firstly raised to 100-.
5. The injection molding method of the microwave dielectric ceramic filter as claimed in claim 1, wherein in the second step, the injection molding material is injection molded by an injection molding machine and a high precision mold to obtain a green body, the injection molding temperature is controlled at 120-.
6. The injection molding method of the microwave dielectric ceramic filter according to claim 1, wherein in the third step, the thermal degreasing process comprises moving the injection molded blank into a degreasing kiln, heating to 100 ℃ at a heating rate of 2 ℃/min, preserving heat for 2 hours, heating to 180 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 6 hours, heating to 260 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 20 hours, heating to 300 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 14 hours, heating to 360 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4 hours, heating to 500 ℃ at a heating rate of 1.5 ℃/min, preserving heat for 4-6 hours, cooling to 300 ℃ at a cooling rate of 1.5 ℃/min, and moving out of the degreasing kiln.
7. The injection molding method of the microwave dielectric ceramic filter according to claim 1, wherein in the fourth step, the high-temperature sintering process is to move the blank after thermal degreasing into a high-temperature sintering kiln, heat up to 650 ℃ at a heating rate of 5 ℃/min, heat up to 850 ℃ at a heating rate of 1 ℃/min, heat up to 1000 ℃ at a heating rate of 1 ℃/min, heat up to 1200 ℃ at a heating rate of 0.5 ℃/min, heat up to 1360 ℃ at a heating rate of 0.5 ℃/min, preserve heat for 2-3 hours, finally cool down to 1100 ℃ at a cooling rate of 1.5 ℃/min, and move out of the high-temperature sintering kiln.
8. A ceramic filter comprising a ceramic filter body formed in one piece by the injection molding method for a microwave dielectric ceramic filter according to any one of claims 1 to 7.
CN202010480386.6A 2020-05-30 2020-05-30 Injection molding method of microwave dielectric ceramic filter and ceramic filter thereof Pending CN111548145A (en)

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