CN111527570B - Light-transmitting conductive film, method for producing same, light-controlling film, and light-controlling member - Google Patents
Light-transmitting conductive film, method for producing same, light-controlling film, and light-controlling member Download PDFInfo
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- CN111527570B CN111527570B CN201880084061.7A CN201880084061A CN111527570B CN 111527570 B CN111527570 B CN 111527570B CN 201880084061 A CN201880084061 A CN 201880084061A CN 111527570 B CN111527570 B CN 111527570B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
- B32B7/023—Optical properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/02—Physical, chemical or physicochemical properties
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- E—FIXED CONSTRUCTIONS
- E06—DOORS, WINDOWS, SHUTTERS, OR ROLLER BLINDS IN GENERAL; LADDERS
- E06B—FIXED OR MOVABLE CLOSURES FOR OPENINGS IN BUILDINGS, VEHICLES, FENCES OR LIKE ENCLOSURES IN GENERAL, e.g. DOORS, WINDOWS, BLINDS, GATES
- E06B9/00—Screening or protective devices for wall or similar openings, with or without operating or securing mechanisms; Closures of similar construction
- E06B9/24—Screens or other constructions affording protection against light, especially against sunshine; Similar screens for privacy or appearance; Slat blinds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
Abstract
The light-transmitting conductive film is a light-transmitting conductive film extending in a 1 st direction and a 2 nd direction orthogonal to the 1 st direction, and includes a base film and a light-transmitting conductive layer. When the light-transmitting conductive film is subjected to a thermomechanical analysis step of raising the temperature from 20 ℃ to 160 ℃ and then lowering the temperature to 20 ℃, both the dimensional change before and after the analysis step in the 1 st direction and the dimensional change before and after the analysis step in the 2 nd direction show swelling.
Description
Technical Field
The present invention relates to a light-transmitting conductive film, a method for producing the same, and a light control film and a light control member provided with the same.
Background
In recent years, demand for light control devices such as smart windows has increased in order to reduce air conditioning loads and improve design. Light control devices are used in various applications such as window glass, partitions, and inner panels of buildings and vehicles.
As a light control film used in a light control device, for example, patent document 1 proposes a film including: 2 transparent conductive resin substrates, and a light control layer sandwiched between the 2 transparent conductive resin substrates (see, for example, patent document 1).
The light control film of patent document 1 can adjust light by adjusting absorption and scattering of light passing through the light control layer by applying an electric field. As the transparent conductive resin substrate of such a light control film, a film in which a transparent electrode made of indium tin composite oxide (ITO) is laminated on a support substrate such as a polyester film is used.
Documents of the prior art
Patent literature
Patent document 1: WO2008/075773
Disclosure of Invention
Problems to be solved by the invention
The light control film may be bonded to a large glass (e.g., 1 to 10 m)2Window glass of (d) and the like. Specifically, a light control film having substantially the same size as the glass is disposed on the glass with a thermosetting or hot-melt adhesive or the like, and the light control film is bonded to the glass by heat curing or heat melting.
However, the light control film after bonding may shrink due to heating compared to the state before heating. As a result, a portion where the light control film is not bonded is generated on the glass (particularly, the outer peripheral end portion). The non-bonded portion becomes more conspicuous as the area of the target glass becomes larger.
The invention provides a light-transmitting conductive film capable of being adhered to the whole surface of an object, a manufacturing method thereof, a light-adjusting film and a light-adjusting member.
Means for solving the problems
The present invention [1] includes a light-transmitting conductive film extending in a 1 st direction and a 2 nd direction orthogonal to the 1 st direction, and includes a base film and a light-transmitting conductive layer, wherein when the light-transmitting conductive film is subjected to a thermomechanical analysis step of raising the temperature from 20 ℃ to 160 ℃ and then lowering the temperature to 20 ℃, both the dimensional change before and after the analysis step in the 1 st direction and the dimensional change before and after the analysis step in the 2 nd direction show swelling.
The invention [2] includes the light-transmitting conductive film according to [1], wherein when the light-transmitting conductive film is subjected to a heating step of raising the temperature from 20 ℃ to 150 ℃ and then lowering the temperature to 20 ℃ in accordance with JIS C2151, both the dimensional change before and after the heating step in the 1 st direction and the dimensional change before and after the heating step in the 2 nd direction show shrinkage, and both the absolute value of the dimensional change rate before and after the heating step in the 1 st direction and the absolute value of the dimensional change rate before and after the heating step in the 2 nd direction are less than 0.35%.
The invention [3] is the light-transmitting conductive film according to [1] or [2], wherein the base film is a film subjected to heat treatment in an atmospheric environment.
The invention [4] comprises the light-transmitting conductive film according to any one of [1] to [3], wherein the base film is a polyester film.
The present invention [5] includes a light control film comprising a 1 st translucent conductive film, a light control functional layer, and a 2 nd translucent conductive film in this order, wherein the 1 st translucent conductive film and/or the 2 nd translucent conductive film is the translucent conductive film according to any one of [1] to [4 ].
The present invention [6] includes a light control member comprising a protective member and the light control film of [5] bonded to the protective member.
The present invention [7] includes a method for producing a light-transmissive conductive film according to any one of [1] to [4], including: a step of heating the base film in an atmospheric environment, and a step of subsequently providing a light-transmitting conductive layer on the base film in a state where the base film is cooled to 5 ℃ or lower.
ADVANTAGEOUS EFFECTS OF INVENTION
The light-transmitting conductive film exhibits expansion in both a dimensional change in the 1 st direction and a dimensional change in the 2 nd direction when subjected to a thermomechanical analysis step at 20 ℃ to 160 ℃ to 20 ℃.
Therefore, even when the light-transmissive conductive film of the present invention is bonded to an object by heating, the light-transmissive conductive film expands as compared with the state before heating. Therefore, the surface of the end portion of the object can be prevented from being exposed, and the transparent conductive film can be bonded to the entire surface of the object.
Further, by cutting the end portion of the light-transmissive conductive film that protrudes from the end portion of the object due to the expansion, the light-transmissive conductive film having the same size as the object can be attached to the object. Further, the end portion thereof can be effectively used as a wiring providing region.
The light control film of the present invention is provided with the light-transmitting conductive film of the present invention, and can be bonded to the entire surface of an object.
The light control member of the present invention has a light control film adhered to the entire surface of the protective member, and thus can have a light control function on the entire surface of the protective member.
The manufacturing method of the present invention can obtain a light-transmitting conductive film that can be bonded to the entire surface of an object.
Drawings
Fig. 1 a-B show one embodiment of the light-transmissive conductive film of the present invention, fig. 1a shows a cross-sectional view, and fig. 1B shows a perspective view.
Fig. 2 is a perspective view showing a process of manufacturing the light-transmissive conductive film shown in a of fig. 1.
Fig. 3 is a cross-sectional view of a light control film including the translucent conductive film shown in fig. 1 a.
Fig. 4 a-E are process diagrams of manufacturing a light control member using the light control film shown in fig. 3, in which fig. 4 a shows a step of preparing a protective member, fig. 4B shows a step of providing a thermosetting adhesive layer on the protective member, fig. 4C shows a step of disposing the light control film on the thermosetting adhesive layer, fig. 4D shows a step of heat-curing the thermosetting adhesive layer, and fig. 4E shows a step of cutting the light control film.
Detailed Description
In fig. 1a, the paper thickness direction is the front-rear direction (1 st direction), the side of the paper surface closer to the reader is the front side (one side in the 1 st direction), and the back side of the paper surface is the rear side (the other side in the 1 st direction). In fig. 1a, the left-right direction on the paper surface is the left-right direction (width direction, 2 nd direction orthogonal to the 1 st direction), the left side on the paper surface is the left side (2 nd direction side), and the right side on the paper surface is the right side (2 nd direction side). In fig. 1a, the vertical direction of the drawing is the vertical direction (thickness direction, 3 rd direction orthogonal to 1 st direction and 2 nd direction), the upper side of the drawing is the upper side (thickness direction side, 3 rd direction side), and the lower side of the drawing is the lower side (thickness direction side, 3 rd direction side). Specifically, directional arrows in the drawings shall control.
< one embodiment >
1. Light-transmitting conductive film
The translucent conductive film 1 according to an embodiment of the present invention is, for example, a film used for a light control film, a light control member, a light control device, and the like (that is, a light control translucent conductive film) as an example of a light control element. As shown in fig. 1, the light-transmitting conductive film 1 has a film shape (including a sheet shape) having a predetermined thickness, extends in a predetermined direction (front-back direction and left-right direction, i.e., a plane direction) perpendicular to the vertical direction (thickness direction), and has a flat upper surface (one surface in the thickness direction) and a flat lower surface (the other surface in the thickness direction). The light-transmissive conductive film 1 is not a part of the light control film 4 (see fig. 3 described later), the light control member 6 (see E of fig. 4 described later), the light control device (described later), and the like, that is, the light control film 4. That is, the light-transmissive conductive film 1 is a member for manufacturing the light control film 4 and the like, and is an industrially applicable device that circulates by itself without including the light control functional layer 5 and the like.
Specifically, the light-transmitting conductive film 1 includes a base film 2 and a light-transmitting conductive layer 3 in this order. That is, the light-transmissive conductive film 1 includes a base film 2 and a light-transmissive conductive layer 3 disposed on the upper side of the base film 2. The light-transmitting conductive film 1 is preferably composed of only the base film 2 and the light-transmitting conductive layer 3. Each layer is described in detail below.
2. Base film
The base film 2 is the lowermost layer of the light-transmissive conductive film 1, and is a support material for ensuring the mechanical strength of the light-transmissive conductive film 1. The base film 2 is a light-transmitting and flexible support material. The substrate film 2 supports the light-transmissive conductive layer 3.
The base film 2 has a film shape (including a sheet shape).
The base film 2 is, for example, a polymer film. Examples of the material of the polymer film include: examples of the resin include polyester resins such as polyethylene terephthalate (PET), polybutylene terephthalate, and polyethylene naphthalate, for example, (meth) acrylic resins (acrylic resins and/or methacrylic resins) such as methacrylic acid esters, olefin resins such as polyethylene, polypropylene, and cycloolefin polymers, for example, polycarbonate resins, polyether sulfone resins, polyarylate resins, melamine resins, polyamide resins, polyimide resins, cellulose resins, polystyrene resins, and norbornene resins. These polymer films may be used alone or in combination of 2 or more. The base film 2 is preferably a polyester film made of a polyester resin, and more preferably a polyethylene terephthalate film, from the viewpoints of light transmittance, heat resistance, mechanical strength, and the like.
The base film 2 is preferably a stretched film, and more preferably a biaxially stretched film, from the viewpoint of further excellent heat resistance and mechanical strength.
The base film 2 is preferably a film subjected to heat treatment in an atmospheric environment as described later, and more preferably a biaxially stretched film subjected to heat treatment in an atmospheric environment. When such a base film 2 is used, stress existing inside the base film 2 is relaxed, and therefore, when the light-transmissive conductive film 1 is bonded to an object by heating, shrinkage of the light-transmissive conductive film 1 can be prevented.
The base film 2 has a total light transmittance (JIS K-7105) of, for example, 80% or more, preferably 85% or more, and further, 100% or less, preferably 95% or less.
The haze (JIS K-7105) of the base film 2 is, for example, 2.0% or less, preferably 1.8% or less, more preferably 1.5% or less, further preferably 1.2% or less, and is, for example, 0.1% or more.
The thickness of the base film 2 is, for example, 2 μm or more, preferably 50 μm or more, more preferably 100 μm or more, and is, for example, 300 μm or less, preferably 250 μm or less. If the thickness of the base film 2 is not less than the lower limit, more moisture contained in the polymer film can be added to the light-transmissive conductive layer 3 when the light-transmissive conductive layer 3 is formed, and thus crystallization of the light-transmissive conductive layer 3 can be suppressed. Therefore, the amorphousness of the transparent conductive layer 3 can be maintained. Further, if the thickness of the base film 2 is not less than the lower limit, the strength of the light-transmissive conductive film 1 is excellent.
The thickness of the base thin film 2 can be measured, for example, using a film thickness meter.
The lower surface of the base film 2 may be provided with a spacer or the like.
3. Light-transmitting conductive layer
The light-transmitting conductive layer 3 is a transparent conductive layer that can be patterned by etching in a subsequent step as necessary.
The light-transmitting conductive layer 3 has a thin film shape (including a sheet shape), and is disposed on the entire upper surface of the base film 2 so as to be in contact with the upper surface of the base film 2.
Examples of the material of the light-transmitting conductive layer 3 include metal oxides containing at least 1 metal selected from the group consisting of In, Sn, Zn, Ga, Sb, Ti, Si, Zr, Mg, Al, Au, Ag, Cu, Pd, and W. The metal oxide may be further doped with a metal atom shown in the above group as necessary.
Examples of the transparent conductive layer 3 include: for example, indium-based conductive oxides such as indium tin composite oxide (ITO), and antimony-based conductive oxides such as antimony tin composite oxide (ATO). The light-transmitting conductive layer 3 contains an indium-based conductive oxide, and more preferably contains an indium tin composite oxide (ITO) from the viewpoint of ensuring excellent conductivity and light-transmitting property. That is, the light-transmitting conductive layer 3 is preferably an indium-based conductive oxide layer, and more preferably an ITO layer.
When ITO is used as the material of the light-transmitting conductive layer 3, tin oxide (SnO)2) The content relative to tin oxide and indium oxide (In)2O3) The total amount of (b) is, for example, 0.5% by mass or more, preferably 3% by mass or more, more preferably 8% by mass or more, and further preferably more than 10% by mass, and is, for example, 25% by mass or less, preferably 15% by mass or less, and more preferably 13% by mass or less. When the content of the tin oxide is not less than the lower limit, excellent conductivity of the light-transmitting conductive layer 3 can be achieved and crystallization can be reliably suppressed. When the content of the tin oxide is not more than the upper limit, stability of light transmittance and conductivity can be improved.
The "ITO" In the present specification may contain an additional component other than the above as long as it is a composite oxide containing at least indium (In) and tin (Sn). Examples of the additional component include metal elements other than In and Sn, and specifically include Zn, Ga, Sb, Ti, Si, Zr, Mg, Al, Au, Ag, Cu, Pd, W, Fe, Pb, Ni, Nb, Cr, Ga, and the like.
The light-transmitting conductive layer 3 may be either crystalline or amorphous (amorphous), and is preferably amorphous, and more specifically, is preferably an amorphous ITO layer. The light-transmitting conductive layer 3 is amorphous, and therefore has excellent processability because of its excellent crack resistance and scratch resistance. That is, when the translucent conductive film 1 is bonded to an object to be bonded (for example, a protective member such as glass described later) and processed, the occurrence of cracks or damages in the translucent conductive film 1 can be suppressed. Therefore, the appearance and the characteristics of the bonded transparent conductive film 1 can be maintained satisfactorily.
The light-transmitting conductive layer 3 can be determined to be amorphous or crystalline, for example, as follows: when the light-transmitting conductive layer 3 is an ITO layer, it is immersed in hydrochloric acid (concentration 5 mass%) at 20 ℃ for 15 minutes, washed with water, dried, and measured for the resistance between terminals between about 15 mm. In this specification, the light-transmitting conductive layer is determined to be amorphous when the resistance between terminals between 15mm of the light-transmitting conductive layer is 10k Ω or more after the light-transmitting conductive film 1 is immersed in hydrochloric acid (20 ℃ C., concentration: 5% by mass) and washed with water and dried.
The surface resistance value of the light-transmitting conductive layer 3 is, for example, 1 Ω/□ or more, preferably 10 Ω/□ or more, and is, for example, 200 Ω/□ or less, preferably 100 Ω/□ or less, and more preferably 85 Ω/□ or less. If the surface resistance value of the transparent conductive layer 3 is in the above range, favorable electric driving can be achieved even when the light control device is used as a large-sized light control device.
The transparent conductive layer 3 has a resistivity value of, for example, 6 × 10-4Omega cm or less, preferably 5.5X 10-4Omega cm or less, more preferably 5X 10-4Omega cm or less, more preferably 4.8X 10-4Omega cm or less, and 3X 10 or less-4Omega cm or more, preferably 3.5X 10-4Omega cm or more, more preferably 4.0X 10-4Omega cm or more. If the resistivity value of the transparent conductive layer 3 is not more than the upper limit, favorable electric driving can be achieved even when the device is used as a large-sized light control device. Further, if the resistivity value is equal to or higher than the lower limit, the amorphousness of the transparent conductive layer 3 can be more reliably maintained.
The thickness of the light-transmitting conductive layer 3 is, for example, 10nm or more, preferably 30nm or more, more preferably 50nm or more, and is, for example, 200nm or less, preferably 150nm or less, more preferably 100nm or less. The thickness of the light-transmitting conductive layer 3 can be measured by, for example, cross-sectional observation using a transmission electron microscope.
4. Method for manufacturing light-transmitting conductive film
Hereinafter, a method for producing the light-transmissive conductive film 1 will be described.
The method for manufacturing the light-transmissive conductive film 1 includes, for example: a pre-heating step of heating the base film 2 in an atmospheric environment, and a conductive layer disposing step of subsequently providing the transparent conductive layer 3 on the base film 2 in a state where the base film 2 is cooled to 5 ℃ or lower. The method for manufacturing the light-transmissive conductive film 1 is preferably performed in a roll-to-roll manner with reference to fig. 2.
In the pre-heating step, first, the base film 2 is prepared. For example, in the case of the roll-to-roll system, the base film 2 is used which is long in the conveyance direction (for example, the 1 st direction) and wound in a roll shape.
From the viewpoint of mechanical strength, heat resistance, and light transmittance, it is preferable to prepare a biaxial stretched base film 2.
Next, the base film 2 is heated in an atmospheric environment. That is, the base film 2 is heated before the translucent conductive layer 3 is provided. The heating of the base film 2 is preferably performed in a roll-to-roll manner, and for example, the base film 2 wound in a long roll is unwound in an atmospheric environment, conveyed while being heated, and then wound again in a long roll.
By this heat treatment, stress inherent in the base film 2 can be released, and heat shrinkage at the time of bonding the light-transmissive conductive film 1 can be suppressed. In particular, since a strong internal stress is applied to the biaxially stretched film by stretching during the production thereof, the heat shrinkage of the biaxially stretched film as the base film 2 can be more reliably suppressed.
In addition, by heating in an atmospheric environment, wrinkles and damage occurring on the base film 2 can be suppressed, and the appearance of the light-transmissive conductive film 1 can be maintained well, as compared with heating in a vacuum. That is, when the rolled base material film 2 is unwound from the roll or wound up, air can be trapped between the laminated base material films 2, and therefore, adhesion and friction of the base material film 2 can be suppressed, and wrinkles and damage can be suppressed. Further, when the base film 2 is conveyed, air can be also made to be interposed between the conveying roller (e.g., a guide roller) and the base film 2, and therefore excessive adhesion to the conveying roller can be suppressed, and wrinkles and damage can be suppressed. These suppressions are particularly effective for the appearance of the dimming device, which is often used in a large area.
The heating temperature is, for example, 100 ℃ or more, preferably 130 ℃ or more, more preferably 150 ℃ or more, and is, for example, 220 ℃ or less, preferably 200 ℃ or less, more preferably 180 ℃ or less. The heating temperature is a set temperature of a heating device (e.g., an IR heater, a heating roller) for heating the base material film 2.
The heating time is, for example, 0.3 minutes or more, preferably 0.5 minutes or more, more preferably 1 minute or more, and is, for example, 10 minutes or less, preferably 5 minutes or less. When the heating time is not more than the upper limit, generation of excessive precipitates (oligomers and the like) from the base material film 2 can be suppressed, and a decrease in transparency and an increase in haze of the base material film 2 can be suppressed. When the heating time is not less than the lower limit, the residual stress of the base film 2 can be sufficiently released, and the heat shrinkage at the time of bonding the light-transmissive conductive film 1 can be more reliably suppressed.
In the conductive layer disposing step, the transparent conductive layer 3 is formed on the upper surface of the base film 2, for example, by dry process.
Examples of the dry method include a vacuum deposition method, a sputtering method, and an ion plating method. Sputtering is preferably used.
In the sputtering method, a target and an adherend (base material thin film 2) are arranged to face each other in a chamber (film forming chamber) of a vacuum apparatus, and a voltage is applied while supplying a gas to accelerate gas ions and irradiate the target, thereby ejecting a target material from a target surface and laminating the target material on the adherend surface.
Examples of the sputtering method include a diode sputtering method, an ECR (electron cyclotron resonance) sputtering method, a magnetron sputtering method, and an ion beam sputtering method. A magnetron sputtering method is preferably used.
The power source used in the sputtering method may be any of a Direct Current (DC) power source, an alternating current intermediate frequency (AC/MF) power source, a high frequency (RF) power source, and a high frequency power source on which a DC power source is superimposed, for example.
As the target, the metal oxide constituting the light-transmitting conductive layer 3 can be mentioned. For example, when ITO is used as the material of the light-transmissive conductive layer 3, a target made of ITO is used. Tin oxide (SnO) in target2) The content of tin oxide and indium oxide (In)2O3) The total amount of (b) is, for example, 0.5% by mass or more, preferably 3% by mass or more, more preferably 8% by mass or more, and further preferably more than 10% by mass, and is, for example, 25% by mass or less, preferably 15% by mass or less, and more preferably 13% by mass or less.
The sputtering is preferably performed under vacuum, and the pressure is, for example, 1.0Pa or less, preferably 0.5Pa or less, more preferably 0.2Pa or less, and further, for example, 0.01Pa or more.
Examples of the gas to be introduced during sputtering include inert gases such as Ar. In this method, a reactive gas such as oxygen is used in combination. The ratio of the flow rate of the reactive gas to the flow rate of the inert gas (flow rate of the reactive gas (sccm)/flow rate of the inert gas (sccm)) is, for example, 0.1/100 to 5/100.
The temperature of the base film 2 when the light-transmitting conductive layer 3 is formed is 5 ℃ or lower, preferably less than 0 ℃, more preferably-3 ℃ or lower, and is, for example, -40 ℃ or higher, preferably-20 ℃ or higher. When the temperature of the base film 2 exceeds the upper limit, the base film 2 is stretched in the conveyance direction by the tension in the conveyance direction, and stress remains in the base film 2 of the obtained light-transmissive conductive film 1. As a result, there is a concern that heat shrinkage may occur when the light-transmissive conductive film 1 is bonded to an object.
When cooling the base film 2, for example, the lower surface of the base film 2 is brought into contact with a cooling device (e.g., a cooling roll) or the like.
In the roll-to-roll system, for example, a film forming roll or a roll may be cooled to form a cooling roll. The temperature of the base film 2 is set to a set temperature of a cooling device.
The atmosphere (inside the chamber) during sputtering preferably contains water, and the ratio of the moisture gas to the sputtering gas pressure (total pressure) (partial pressure (Pa) of the moisture gas/sputtering gas pressure (Pa)) is, for example, 0.006 or more, preferably 0.008 or more, more preferably 0.01 or more, and is, for example, 0.3 or less, preferably 0.1 or less, more preferably 0.07 or less, and further preferably 0.05 or less. When the water content is in the above range, the light-transmissive conductive layer 3 can contain a very small amount of water, and crystallization of the light-transmissive conductive layer 3 can be suppressed.
Thus, a light-transmitting conductive film 1 including a base film 2 and a light-transmitting conductive layer 3 was obtained. The transparent conductive layer 3 is amorphous.
The total thickness of the obtained light-transmitting conductive film 1 is, for example, 2 μm or more, preferably 20 μm or more, and is, for example, 300 μm or less, preferably 200 μm or less.
When the light-transmissive conductive film 1 is subjected to a thermomechanical analysis step (the analysis step; hereinafter also referred to simply as "TMA") of raising the temperature from 20 ℃ to 160 ℃ and then lowering the temperature to 20 ℃, both the dimensional change before and after TMA in the front-back direction (1 st direction) and the dimensional change before and after TMA in the left-right direction (2 nd direction) show swelling.
Specifically, the length in the front-back direction at 20 ℃ before TMA was applied was L1And the length in the front-rear direction at 20 ℃ after TMA application is L1' the length in the left-right direction at 20 ℃ before TMA is applied is L2L represents the length in the left-right direction at 20 ℃ after TMA2' time, the rate of change in dimension in the front-rear direction Δ L1And a rate of change in dimension Δ L in the left-right direction2And the in-plane dimensional change rate R are represented by the following formulae.
ΔL1＝{(L1′-L1)/L1}×100(％)
ΔL2＝{(L2′-L2)/L2}×100(％)
R＝{(ΔL1)2+(ΔL2)2}1/2(％)
Further, "the dimensional change before and after TMA in the front-back direction (1 st direction) shows swelling" means that the dimensional change rate Δ L is1The positive value is displayed, and the "dimensional change before and after TMA in the left-right direction (2 nd direction) shows swelling" means that the dimensional change rate Δ L2A positive value is displayed.
In TMA, the load applied to the light-transmissive conductive film 1 was 19.6mN, and the size of the light-transmissive conductive film 1 (measurement sample) during measurement was 20mm in the long side (direction in which the load was applied) and 3mm in the short side. Other conditions are in the examples.
In the case of the roll-to-roll system, for example, the transport direction (MD direction) in which the base film 2 is transported is defined as a front-back direction (1 st direction), and a direction (TD direction) orthogonal to the transport direction is defined as a left-right direction (2 nd direction) (see fig. 2).
Rate of change in dimension Δ L1For example, more than 0%, preferably 0.10% or more, and further, for example, 0.50% or less.
Rate of change in dimension Δ L2For example, it is more than 0%, preferably 0.10% or more, and for example, 0.50% or less.
The in-plane dimensional change rate R is, for example, 0.55% or less, preferably 0.50% or less, more preferably 0.40% or less, and still more preferably 0.30% or less.
When the light-transmitting conductive film 1 is subjected to a heating step of raising the temperature from 20 ℃ (room temperature) to 150 ℃ and then lowering the temperature to 20 ℃ (room temperature) in accordance with JIS C2151, the dimensional change rate Δ M before and after heating in the front-rear direction is determined as1Absolute value of (D) and a dimensional change rate [ Delta ] M before and after heating in the left-right direction2At least one of the absolute values of (a) is less than 0.35%, preferably 0.30% or less, more preferably 0.20% or less. Further, Δ M is preferable1Absolute value of and Δ M2Both absolute values of (a) are less than 0.35%, preferably 0.30% or less, more preferably 0.20% or less.
The method according to JIS C2151 is a method of heating the light-transmissive conductive film 1 in a state where a load such as a tensile load is not applied to the light-transmissive conductive film 1.
Specifically, the length in the longitudinal direction at 20 ℃ before the heating step is set to M1And M represents the length in the front-back direction at 20 ℃ after the heating step1' the length in the left-right direction at 20 ℃ before the heating step is defined as M2And M represents the length in the left-right direction at 20 ℃ after the heating step2' time, the rate of change in dimension Δ M in the front-rear direction1And a dimensional change rate DeltaM in the left-right direction2Represented by the following formula.
ΔM1＝{(M1′-M1)/M1}×100(％)
ΔM2＝{(M2′-M2)/M2}×100(％)
Rate of change of dimension Δ M1For example, more than-0.35%, preferably-0.30% or more, more preferably-0.25%The content is, for example, less than 0.35%, preferably 0.30% or less, and more preferably 0.20% or less.
Rate of change of dimension Δ M2For example, more than-0.35%, preferably-0.20% or more, more preferably-0.10% or more, and further, for example, less than 0.35%, preferably 0.20% or less, more preferably 0.10% or less.
It is preferable that at least one of the dimensional change before and after the heating step in the front-back direction and the dimensional change before and after the heating step in the left-right direction (direction 2) shows shrinkage. Shrinkage was observed both before and after the heating step in the front-back direction and before and after the heating step in the left-right direction (direction 2).
The phrase "dimensional change before and after the heating step in the front-back direction shows shrinkage" means that the dimensional change rate Δ M is1A negative value is displayed. "shrinkage is shown by dimensional change before and after the heating step in the left-right direction" means that the dimensional change rate Δ M2A negative value is displayed.
The haze (JIS K-7105) of the light-transmitting conductive film 1 is, for example, 2.0% or less, preferably 1.8% or less, more preferably 1.5% or less, further preferably 1.2% or less, and is, for example, 0.1% or more. When the haze of the light-transmitting conductive film 1 is within the above range, it can be suitably used as a light-controlling light-transmitting conductive film.
The transparent conductive film 1 may be etched as necessary to pattern the transparent conductive layer 3 into a predetermined shape.
5. Method for manufacturing light modulation film
Hereinafter, a method for producing the light control film 4 using the light transmissive conductive film 1 will be described with reference to fig. 3.
The method for manufacturing the light control film 4 includes, for example: a step of manufacturing 2 light transmissive conductive films 1, and a subsequent step of sandwiching the dimming function layer 5 by the 2 light transmissive conductive films 1.
First, 2 light-transmissive conductive films 1 are manufactured. Note that, 2 light-transmissive conductive films 1 may be prepared by cutting 1 light-transmissive conductive film 1.
The 2 transparent conductive films 1 are a 1 st transparent conductive film 1A and a 2 nd transparent conductive film 1B.
Next, the light control function layer 5 is formed on the upper surface (front surface) of the light transmissive conductive layer 3 in the 1 st light transmissive conductive film 1A, for example, by a wet process.
For example, a liquid crystal composition or a solution thereof is applied to the upper surface of the light-transmissive conductive layer 3 in the 1 st light-transmissive conductive film 1A to form a coating film. The liquid crystal composition is not limited as long as it can be used for light control purposes, and known liquid crystal compositions, for example, liquid crystal dispersion resins described in japanese patent application laid-open No. 8-194209, can be cited.
Next, the 2 nd transparent conductive film 1B is laminated on the upper surface of the coating film so that the transparent conductive layer 3 of the 2 nd transparent conductive film 1B is in contact with the coating film. Thus, the coating film is sandwiched between the 2 light-transmissive conductive films 1, i.e., the 1 st light-transmissive conductive film 1A and the 2 nd light-transmissive conductive film 1B.
Thereafter, the coating film is subjected to appropriate treatment (for example, heat drying treatment or photocuring treatment) as necessary to form the light control functional layer 5. The light control function layer 5 is disposed between the translucent conductive layer 3 of the 1 st translucent conductive film 1A and the translucent conductive layer 3 of the 2 nd translucent conductive film 1B.
Thus, a light control film 4 including the 1 st translucent conductive film 1A, the light control functional layer 5, and the 2 nd translucent conductive film 1B in this order was obtained.
6. Method for manufacturing light-adjusting member
Hereinafter, a method of manufacturing the light control member 6 using the light control film 4 will be described with reference to fig. 4 a to E.
The method of manufacturing the light control member 6 includes, for example: the method for manufacturing the light control film includes a step of forming a thermosetting adhesive layer 8 on the protective member 7, a step of disposing the light control film 4 on the thermosetting adhesive layer 8, a step of heat-curing the thermosetting adhesive layer 8, and a step of cutting the light control film 4.
First, as shown in a of fig. 4, the protection member 7 is prepared. The protective member 7 is an object to which the light control film 4 is to be bonded, and examples thereof include a window glass, a partition wall, and an inner panel. Specifically, the protective member 7 is a hard transparent plate having appropriate mechanical strength and thickness, and examples thereof include a glass plate, a reinforced plastic plate (for example, polycarbonate resin), and the like.
Next, as shown in fig. 4B, a thermosetting adhesive layer 8 is formed on the protective member 7. For example, a liquid thermosetting adhesive composition is applied to the entire upper surface (front surface) of the protective member 7.
Examples of the thermosetting adhesive composition include epoxy thermosetting adhesive compositions and acrylic thermosetting adhesive compositions. The thermosetting adhesive composition is not limited to the above examples, and any resin may be used as long as it can maintain the adhesion between the light control film 4 and the protective member 7 after thermosetting.
Examples of the coating method include a method using an applicator, potting, casting, spin coating, and roll coating.
Next, as shown in fig. 4C, the light control film 4 is disposed on the thermosetting adhesive layer 8. That is, the light control film 4 is disposed on the upper surface of the protective member 7 via the thermosetting adhesive layer 8.
At this time, the light control film 4 is arranged to have substantially the same size as the protection member 7. Specifically, the light control film 4 is cut to have substantially the same size as the protection member 7 (the same length in the front-rear direction and the same length in the left-right direction), and then the light control film 4 is disposed on the upper surface of the thermosetting adhesive layer 8 so that the outer peripheral edge of the protection member 7 and the outer peripheral edge of the light control film 4 coincide with each other when projected in the vertical direction.
Next, as shown in D of fig. 4, the thermosetting adhesive layer 8 is heat cured.
The heating temperature is, for example, 80 ℃ or higher, preferably 100 ℃ or higher, and is, for example, 180 ℃ or lower, preferably 160 ℃ or lower.
The heating time is, for example, 5 minutes or more, preferably 20 minutes or more, more preferably 30 minutes or more, and further, for example, 600 minutes or less, preferably 300 minutes or less.
The heat curing may be performed in an atmospheric environment or a vacuum environment, and a moderate pressure may be applied.
Thereafter, the light control film 4 bonded to the protective member 7 is cooled to room temperature (5 to 35 ℃).
Thereby, the thermosetting adhesive layer 8 is thermally cured to form an adhesive layer 8 a. As a result, the light control film 4 is bonded (fixed) to the protective member 7 via the adhesive layer 8 a.
Then, the light transmissive conductive film 1 and further the light control film 4 expand laterally in the planar direction (the front-rear direction and the left-right direction), and the end portion (the protruding portion 9) of the light control film 4 protrudes laterally in the planar direction from the edge of the protective member 7. That is, the outer peripheral edge of the light control film 4 is located outward of the outer peripheral edge of the protective member 7.
Next, as indicated by a broken line in fig. 4D, the light control film 4 is cut. That is, the end of the light control film 4 is cut in the vertical direction, and the protrusion 9 of the light control film 4 is removed.
As a result, as shown in E of fig. 4, the light control member 6 including the protective member 7, the adhesive layer 8a provided on the upper surface thereof, and the light control film 4 disposed on the upper surface of the adhesive layer 8a was obtained.
In the light control member 6, the protection member 7 and the light control film 4 have substantially the same size. That is, when projected in the vertical direction, the outer peripheral edge of the protective member 7 coincides with the outer peripheral edge of the light control film 4.
The light control member 6 is used as, for example, an electrically driven light control device (not shown) by mounting a wiring (not shown), a power supply (not shown), and a control device (not shown). Examples of the electric drive type include an electric field drive type and a current drive type. For example, in the case of an electric field drive type light control device, a voltage is applied to the transparent conductive layer 3 in the 1 st transparent conductive film 1A and the transparent conductive layer 3 in the 2 nd transparent conductive film 1B through wiring and a power supply, and an electric field is generated therebetween. Then, by controlling the electric field based on the control device, the dimming function layer 5 located therebetween is brought into an oriented state or an irregular state, thereby transmitting or blocking (or scattering) light.
The light-transmitting conductive film 1 and the light-controlling film 4 show swelling in both the front-back direction dimensional change and the left-right direction dimensional change when subjected to a thermomechanical analysis process (TMA) of 20 ℃ to 160 ℃ to 20 ℃. Therefore, when the protective member 7 (object) is bonded by heating, expansion occurs in comparison with the state before heating. Therefore, the surface of the end portion of the protective member 7 can be prevented from being exposed, and the transparent conductive film 1 can be reliably bonded to the entire surface of the protective member 7.
The mechanism is not yet clear, but it is presumed that expansion and contraction of the light-transmissive conductive film 1 show the same behavior in the case where the light-transmissive conductive film 1 is bonded to the protective member 7 by heating with the thermosetting adhesive and in the case where TMA is applied to the light-transmissive conductive film 1 and heated by applying a tensile load.
Further, by cutting the protruding portions 9 of the light transmissive conductive film 1 and the light control film 4 after the bonding, the light transmissive conductive film 1 and the light control film 4 having substantially the same size as the protective member 7 can be bonded.
The light control member 6 using the light control film 4 has a light control function over the entire surface (particularly, the end portion) of the protective member 7 because the light control film 4 is bonded to the entire surface of the protective member 7.
7. Modification example
In the embodiment shown in fig. 1, the light-transmissive conductive layer 3 is directly disposed on the upper surface of the base film 2, but for example, although not shown, a functional layer may be provided on the upper surface and/or the lower surface of the base film 2.
That is, for example, the light-transmissive conductive film 1 may include: a base film 2, a functional layer disposed on the upper surface of the base film 2, and a light-transmitting conductive layer 3 disposed on the upper surface of the functional layer. Further, for example, the light-transmissive conductive film 1 may include: a base film 2, a light-transmissive conductive layer 3 disposed on the upper surface of the base film 2, and a functional layer disposed on the lower surface of the base film 2. For example, the functional layer and the light-transmitting conductive layer 3 may be provided in this order on the upper and lower sides of the base film 2.
The functional layer may be an easy adhesion layer, an undercoat layer, a hard coat layer, or the like. The easy-adhesion layer is a layer provided to improve adhesion between the base film 2 and the light-transmissive conductive layer 3. The undercoat layer is a layer provided for adjusting the reflectance and the optical hue of the light-transmissive conductive film 1. The hard coat layer is a layer provided to improve the scratch resistance of the light-transmissive conductive film 1. These functional layers may be used alone in 1 kind or in combination of 2 or more kinds.
In the embodiment shown in E of fig. 4, the light control member 6 having the adhesive layer 8a and the light control film 4 on the upper surface of the protective member 7 is shown, but for example, although not shown, the adhesive layer 8a and the protective member 7 may be further provided on the upper surface of the light control film 4 in this order.
In the method of manufacturing the light control member, the end portion 9 of the light control film 4 located outside the outer peripheral edge of the protective member 7 is cut as indicated by the broken line D in fig. 4, but a part of the end portion 9 may be left in an arbitrary size without being cut. A part of the end portion 9 can be used as, for example, a region (wiring installation region) where a wiring for connecting the light-transmissive conductive layer 3 in the 1 st light-transmissive conductive film 1A (or the 2 nd light-transmissive conductive film 1B) to a power supply is provided.
Further, before the light control film 4 is attached to the protective member 7, a wiring may be arranged in advance on the outer peripheral portion of the light transmissive conductive layer 3 of the light control film 4.
In the method of manufacturing the light control member 6 in fig. 4 a to E, the light control film 4 is bonded to the protective member 7 using the thermosetting adhesive layer 8, but the adhesive layer is not limited to the thermosetting adhesive layer as long as it can be adhered by heating. For example, although not shown, the light control film 4 may be bonded to the protective member 7 using a hot-melt adhesive. That is, the method of manufacturing the light adjusting member 6 may include, for example: the method for manufacturing the light control film includes a step of forming a hot-melt adhesive layer on the protective member 7, a step of disposing the light control film 4 on the hot-melt adhesive layer, a step of heating and melting the hot-melt adhesive layer, and a step of cutting the light control film 4.
As a method for forming the hot-melt adhesive layer, for example, a sheet made of a hot-melt adhesive composition is laminated on the entire upper surface of the protective member 7.
Examples of the hot-melt adhesive composition include: and thermoplastic resin compositions such as ethylene vinyl acetate compositions, polyolefin compositions, polyamide compositions, polyester compositions, polypropylene compositions, and polyurethane compositions. These may be used alone in 1 kind, or may be used in combination of 2 or more kinds. Such a hot-melt adhesive composition is used, for example, as a hot-melt adhesive.
The heating temperature of the heat-fusible adhesive layer is, for example, the same as the heating temperature of the heat-curable adhesive layer 8.
< other embodiments >
In the above-described embodiment, the light control light transmissive conductive film is exemplified as the light transmissive conductive film 1, but the light transmissive conductive film may be applied to applications other than light control, for example.
Specifically, a light-transmitting conductive film is disposed in an optical device such as an image display device (LCD, organic EL). The light-transmitting conductive film is preferably used as a substrate for a touch panel. Examples of the form of the touch panel include various forms such as an optical form, an ultrasonic form, a capacitance form, and a resistance film form, and particularly, the touch panel is suitably used for a capacitance form.
Examples
The present invention will be described in detail below with reference to examples, but the present invention is not limited to the examples within the scope not departing from the gist thereof, and various modifications and changes can be made based on the technical idea of the present invention. In addition, specific numerical values such as the blending ratio (content ratio), the physical property value, and the parameter used in the following description may be replaced with the upper limit (numerical value defined as "lower" or "smaller") or the lower limit (numerical value defined as "upper" or "higher" of the above-mentioned description such as the blending ratio (content ratio), the physical property value, and the parameter corresponding thereto, described in the above-mentioned "embodiment".
Example 1
As a light-transmitting base film, a polyethylene terephthalate (PET) film (188 μm thick biaxially stretched film) which was long in the 1 st direction (conveyance direction, MD) was prepared.
The PET film was heated (pre-heated) by a roll-to-roll method at 170 ℃ for 1 minute under the atmosphere.
Subsequently, the heated PET film was set in a roll-to-roll sputtering apparatus, and a light-transmitting conductive layer made of amorphous ITO having a thickness of 65nm was formed by a DC magnetron sputtering method. The temperature of the PET film was set to-5 ℃ as a sputtering condition. Ar and O are introduced into the atmosphere during sputtering2In a vacuum atmosphere (flow ratio Ar: O) of 0.2Pa2100: 3.3) the water content (moisture gas/total pressure) thereof was set to 0.05. As the target, a sintered body of 12 mass% of tin oxide and 88 mass% of indium oxide was used.
Comparative example 1
A light-transmitting conductive film was produced in the same manner as in example 1, except that the PET film was not heated before the application.
Comparative example 2
The thickness of the PET film was 50 μm, the temperature of the PET film during sputtering was 0 ℃, and Ar and O were introduced into the atmosphere during sputtering2In a vacuum atmosphere (flow ratio Ar: O) of 0.4Pa2100: 3.0), a light-transmitting conductive thin film was produced in the same manner as in example 1, except that a sintered body of 10 mass% of tin oxide and 90 mass% of indium oxide was used as a target, and the thickness of the light-transmitting conductive layer was set to 25 nm.
Comparative example 3
A light-transmitting conductive film was produced in the same manner as in comparative example 2, except that the temperature of the PET film during sputtering was 140 ℃, the water content was 0.005, and after the formation of the light-transmitting conductive layer, post-heating was performed under atmospheric conditions at 170 ℃ for 2 minutes.
(evaluation)
(1) Thickness of
The thickness of the PET film (base film) was measured using a film thickness meter (manufactured by Kawasaki corporation, device name "Digital gauge DG-205"). The thickness of the ITO layer (light-transmitting conductive layer) was measured by cross-sectional observation using a transmission electron microscope (manufactured by hitachi corporation, device name "HF-2000").
(2) Determination of dimensional changes based on thermomechanical analysis (TMA)
The light-transmitting conductive films of examples and comparative examples were cut into strips each having a long side of 20mm and a short side of 3mm, and the strips were used as measurement samples. In the measurement of the dimensional change in the MD direction (1 st direction), the cutting is performed so that the MD direction is a long side and the TD direction (a direction orthogonal to the MD direction, the 2 nd direction) is a short side, and in the measurement of the dimensional change in the TD direction, the cutting is performed so that the TD direction is a long side and the MD direction is a short side. Thus, a measurement sample for measuring dimensional changes in each direction was prepared.
The measurement sample was set in a thermomechanical analyzer ("TMA/SS 71000" manufactured by SII Technology inc.), and dimensional change rates were measured in the MD direction and the TD direction when the temperature was raised from 20 ℃ to 160 ℃ and then lowered to 20 ℃.
That is, the MD length at 20 ℃ before temperature rise is L1And the MD direction length at 20 ℃ after temperature rise is taken as L1', consisting of { (L)1′-L1)/L1The dimensional change rate Δ L in the MD direction was calculated by the equation of } × 100 (%) "1(%). The length in the TD direction at 20 ℃ before temperature rise is L2And the length in the TD direction at 20 ℃ after the temperature rise is L2', consisting of { (L)2′-L2)/L2The dimensional change rate Δ L in the TD direction was calculated by the equation of } × 100 (%) "2(%). Further, the composition is represented by "{ (Δ L)1)2+(ΔL2)2}1/2"the in-plane dimensional change rate R of the entire measurement sample was calculated.
The conditions for the thermomechanical analysis are as follows.
Measurement mode: drawing method
Loading: 19.6mN
Temperature rise rate: 10 ℃/min
And (3) measuring atmosphere: air (flow 200ml/min)
Distance between the clamps: 10mm
(3) Measurement of dimensional Change Rate according to JIS C2151
The light-transmitting conductive films of examples and comparative examples were cut into 10cm in the MD (1 st direction) and 10cm in the TD (direction orthogonal to the MD, 2 nd direction) to prepare samples. The temperature at this time was 20 ℃.
The sample was heated in a hot air oven at 150 ℃ for 30 minutes based on JIS C2151, and then cooled to 20 ℃. The dimensional change rate after the high-temperature treatment was measured for each of the MD direction and the TD direction.
That is, the length in the MD direction at 20 ℃ before temperature rise is M1And the MD length at 20 ℃ after the temperature rise is set as M1', consisting of { (M)1′-M1)/M1The dimensional change rate Δ M in the MD direction was calculated by the equation of } × 100 (%) "1(%). The length in the TD direction at 20 ℃ before temperature rise is M2M represents the length in the TD direction at 20 ℃ after the temperature rise2', consisting of { (M)2′-M2)/M2The dimensional change rate Δ M in the TD direction was calculated by the equation of } × 100 (%) "2(％)。
(4) Test for adhesion to glass
A thermosetting resin (acrylic adhesive) was applied to the entire surface of a commercially available glass plate (length in the front-rear direction 30cm × length in the left-right direction 25 cm). Next, the light-transmitting conductive films of examples and comparative examples having the same dimensions as those of the glass plate were prepared, and each light-transmitting conductive film was placed on the upper surface of the thermosetting adhesive so that the peripheral edge of the glass plate and the peripheral edge of the light-transmitting conductive film were aligned, followed by heating at 150 ℃ for 60 minutes in an atmospheric environment. Thus, the light-transmitting conductive film is bonded to the glass plate.
The glass was evaluated to be good when a light-transmitting conductive film was also bonded to the outer peripheral end portion of the glass. On the other hand, the portion where the translucent conductive film was not adhered was observed in the outer peripheral end portion of the glass plate and evaluated as x.
It is understood that in example 1, the translucent conductive film to be bonded slightly swells in the vertical and horizontal directions compared to the glass plate, and therefore, by cutting the end portions of the swollen film, the translucent conductive film having the same size as the glass plate can be bonded to the entire glass plate.
On the other hand, in each comparative example, the bonded transparent conductive film was shrunk by heating at the time of bonding, and the transparent conductive film could not be bonded to the outer peripheral end portion of the glass plate.
(5) Amorphous state
The light-transmitting conductive films of examples and comparative examples were heated at 80 ℃ for 20 hours in an atmospheric environment. Thereafter, the heated light-transmitting conductive film was immersed in hydrochloric acid (concentration: 5% by mass) for 15 minutes, washed with water and dried, and the resistance between two terminals between about 15mm of each conductive layer was measured. When the inter-terminal resistance between 15mm and 15mm exceeded 10 k.OMEGA., the film was judged to be amorphous and evaluated to be good. When the crystal quality did not exceed 10 k.OMEGA., it was judged as crystal quality and evaluated as X. The results are shown in Table 1.
(6) Appearance of the product
The surfaces of the light-transmitting conductive films of the examples and comparative examples were visually observed. The film surface was evaluated as excellent in no wrinkles or stripes at all, the film surface was evaluated as good in a level at which wrinkles or stripes were slightly observed but no obstacle was generated in the light control device, the film surface was evaluated as Δ in a level at which slightly large wrinkles or stripes were observed but no large obstacle was generated in the light control device, and the film surface was evaluated as x in a level at which wrinkles or stripes were observed but no obstacle was generated in the light control device. The results are shown in Table 1.
TABLE 1
[ TABLE 1]
The present invention is provided as an exemplary embodiment of the present invention, but this is merely an example and is not to be construed as limiting. Variations of the invention that are obvious to those skilled in the art are intended to be encompassed by the foregoing claims.
Industrial applicability
The light-transmitting conductive film of the present invention can be applied to various industrial products, and is suitably used for, for example, a light control film provided in a light control member, a substrate for a touch panel provided in an image display device, and the like.
Description of the reference numerals
1 light-transmitting conductive film
2 base film
3 light-transmitting conductive layer
4 light modulation film
5 dimming function layer
6 light modulation component
7 protective member
Claims (7)
1. A light-transmitting conductive film, which is characterized in that the light-transmitting conductive film extends along a 1 st direction and a 2 nd direction orthogonal to the 1 st direction,
it is provided with: a base film, and a light-transmitting conductive layer,
when the light-transmitting conductive film is subjected to a thermomechanical analysis step of raising the temperature from 20 ℃ to 160 ℃ and then lowering the temperature to 20 ℃,
the dimensional change before and after the analysis step in the 1 st direction and the dimensional change before and after the analysis step in the 2 nd direction both show swelling.
2. The light-transmitting conductive film according to claim 1, wherein when the light-transmitting conductive film is subjected to a heating step of raising the temperature from 20 ℃ to 150 ℃ and then lowering the temperature to 20 ℃ in accordance with JIS C2151,
the dimensional change before and after the heating step in the 1 st direction and the dimensional change before and after the heating step in the 2 nd direction both show shrinkage, and,
an absolute value of a dimensional change rate before and after the heating step in the 1 st direction and an absolute value of a dimensional change rate before and after the heating step in the 2 nd direction are both less than 0.35%.
3. The light-transmissive conductive film according to claim 1 or 2, wherein the base film is a film subjected to a heat treatment in an atmospheric environment.
4. The light-transmitting conductive film according to claim 1 or 2, wherein the base film is a polyester film.
5. A light control film, comprising in order: a 1 st light transmissive conductive film, a dimming function layer and a 2 nd light transmissive conductive film,
the 1 st light transmissive conductive film and/or the 2 nd light transmissive conductive film is the light transmissive conductive film according to any one of claims 1 to 4.
6. A light control member is characterized by comprising:
a protective member, and
the light control film of claim 5 attached to the protective member.
7. A method for producing a light-transmitting conductive film according to any one of claims 1 to 4, comprising:
a step of heating the base film in the atmospheric environment, and
and then, a step of forming a light-transmitting conductive layer on the base film in a state where the base film is cooled to 5 ℃ or lower.
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| PCT/JP2018/041344 WO2019130841A1 (en) | 2017-12-28 | 2018-11-07 | Light-transmissive electrically conductive film, method for manufacturing same, light control film, and light control member |
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- 2018-11-07 CN CN201880084061.7A patent/CN111527570B/en active Active
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- 2018-11-07 WO PCT/JP2018/041344 patent/WO2019130841A1/en active Application Filing
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111527570A (en) | 2020-08-11 |
| TWI788464B (en) | 2023-01-01 |
| KR102633881B1 (en) | 2024-02-05 |
| WO2019130841A1 (en) | 2019-07-04 |
| TW201930966A (en) | 2019-08-01 |
| JP7264807B2 (en) | 2023-04-25 |
| JPWO2019130841A1 (en) | 2020-11-19 |
| KR20200103635A (en) | 2020-09-02 |
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