CN111524669A - Manufacturing method suitable for surface insulation treatment of laminated ceramic product - Google Patents
Manufacturing method suitable for surface insulation treatment of laminated ceramic product Download PDFInfo
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- CN111524669A CN111524669A CN202010347152.4A CN202010347152A CN111524669A CN 111524669 A CN111524669 A CN 111524669A CN 202010347152 A CN202010347152 A CN 202010347152A CN 111524669 A CN111524669 A CN 111524669A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
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- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
- H01C17/075—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thin film techniques
Abstract
The invention relates to the technical field of manufacturing of laminated ceramic wafer elements, and aims to provide a manufacturing method suitable for surface insulation treatment of a laminated ceramic product, which comprises the following steps: s1, preparing an insulating treatment liquid; s2, preparing reinforced insulating powder; s3, immersing the laminated ceramic semiconductor product in the insulating treatment liquid for 5-35min, S4, drying the product which is prepared in the S3 step and is soaked with the insulating treatment liquid on the surface, wherein the temperature is 105-120 ℃, and the drying time is 30-60 min; s5, uniformly adhering a layer of reinforced insulating powder on the surface of the dried laminated ceramic semiconductor product; s6, heating the semi-finished product prepared in the step S5 for the first time; s7, soaking the semi-finished product subjected to primary heating in the step S6 in secondary insulating treatment liquid for 3-8 min; s8, carrying out secondary heating treatment on the semi-finished product obtained in the step S7, and forming an insulating layer outside the laminated ceramic semiconductor product. The preparation process is stable, and the prepared insulating coating has the advantages of uniform coating, lasting insulating property and high efficiency.
Description
Technical Field
The invention relates to the technical field of manufacturing of laminated ceramic wafer elements, in particular to a manufacturing method suitable for surface insulation treatment of laminated ceramic products.
Background
As shown in fig. 1, the stacked ceramic chip component includes a body 1, the body 1 includes an inner electrode 3 and a dielectric layer 2 stacked on each other, terminal electrodes 6 disposed at two ends of the body 1, a nickel plating layer 4 and a tin plating layer 5 sequentially plated on outer surfaces of the terminal electrodes 6, and an insulating layer 7 covering outer edge surfaces between the terminal electrodes 6 of the body 1. The varistor element is mainly manufactured by a lamination technology, so that the requirements of modern electronic products on lightness, thinness, shortness and smallness are met. The prior laminated ceramic varistor is the most widely applied zinc oxide ceramic system varistor, and although the insulation property of the ceramic dielectric material is quite good, the surface of the element still has insufficient insulation resistance when the element is required to be used under high pressure. Therefore, it is generally necessary to improve the insulating properties of the surface of the element by using a vitreous substance as a coating.
Us 5,614,074 and 5,757,263 disclose techniques for protecting a zinc oxide varistor body by first immersing the zinc oxide varistor body in a phosphate solution to form a zinc phosphate coating to protect the zinc oxide varistor body, and then, the zinc phosphate coating is heat treated (typically 600 to 800 c) to strengthen the zinc phosphate coating structure to protect the zinc oxide varistor body from plating with metals such as nickel or tin during the electroplating process.
Although this prior art scheme can form zinc phosphate tectorial membrane outside zinc oxide varistor body, because in the electroplating process, zinc oxide body need be soaked in the acid plating solution, and zinc phosphate tectorial membrane can be corroded by the plating solution with faster speed under the acid condition to can't reach the effect of effective protection zinc oxide varistor body.
Korean patent No. 2002-.
This prior art scheme, there is the marginal part of wafer can not fully coat, and the shortcoming of coating thickness difference.
Disclosure of Invention
The invention aims to provide a manufacturing method suitable for surface insulation treatment of a laminated ceramic product, which has the advantages of uniform coating, and lasting and efficient coating insulation performance.
The technical purpose of the invention is realized by the following technical scheme:
a manufacturing method suitable for surface insulation treatment of a laminated ceramic product comprises the following steps:
s1, preparing an insulation treatment liquid required by the surface insulation treatment of the laminated ceramic product;
s2, preparing reinforced insulating powder;
s3, immersing the laminated ceramic semiconductor product body in the insulation treatment liquid prepared in the step S1 for 5-35 min;
s4, drying the laminated ceramic semiconductor product body with the surface soaked with the insulation treatment liquid prepared in the step S3 to remove the moisture in the insulation treatment liquid, wherein the drying temperature is 105-120 ℃, and the drying time is 30-60 min;
s5, uniformly adhering a layer of reinforced insulating powder on the surface of the laminated ceramic semiconductor product body dried in the step S4;
s6, heating the semi-finished product prepared in the step S5 for the first time;
s7, soaking the semi-finished product subjected to primary heating in the step S6 in secondary insulating treatment liquid for 3-8 min;
and S8, carrying out secondary heating treatment on the semi-finished product obtained in the step S7 to finish forming an insulating layer outside the laminated ceramic semiconductor product and simultaneously finish forming the terminal electrode of the laminated ceramic semiconductor product body, and then sequentially electroplating a nickel plating layer and a tin plating layer on the terminal electrode of the laminated ceramic semiconductor product body.
By adopting the technical scheme, the laminated ceramic product body is soaked in the insulating treatment liquid, so that the insulating treatment liquid is coated on the surface of the laminated ceramic product body to form a layer of uniform and compact adsorption film, moisture in the formed adsorption film is removed by drying, the adsorption and bonding effects of the adsorption film on the reinforced insulating powder are further improved, and meanwhile, moisture is removed by drying, so that moisture pores formed on the surface of the adsorption film can be effectively reduced, and the bonding uniformity of the reinforced insulating powder is further improved; the adsorption film adsorbed with the reinforced insulating powder can be primarily solidified by one-time heating, so that the bonding fastness of the reinforced insulating powder and the adsorption film is increased; through the secondary infiltration insulating treatment fluid, the surface of the adsorption film adsorbed with the enhanced insulating powder on the first layer can be coated with a layer of insulating treatment fluid film again, and secondary heating is performed, so that an insulating layer with uniform thickness and higher insulating performance is formed, and meanwhile, the enhanced insulating powder is coated and solidified through two layers of insulating treatment fluid films, so that the loss rate of the enhanced insulating powder is effectively reduced, and the insulating durability of the insulating layer is prolonged.
Further, the insulation treatment fluid comprises the following components in parts by weight: 5-20 parts of silane coupling agent, 3-15 parts of nano glass powder and 60-90 parts of deionized water.
By adopting the technical scheme, the nano-glass powder has very large specific surface area and stronger adsorption performance, the siloxy group of the silane coupling agent has reactivity to inorganic matters, the organic functional group of the silane coupling agent has reactivity or compatibility to organic matters, and when the silane coupling agent is between an inorganic interface and an organic interface, a bonding layer of an organic matrix-the silane coupling agent-an inorganic matrix can be formed. Therefore, the silane coupling agent can play a role in bridging to bond and fix the reinforced insulating powder on the outer surface of the laminated ceramic product.
Further, the silane coupling agent comprises one or more of 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane and lauryltrimethylsilane.
By adopting the technical scheme, the insulating treatment fluid can be prepared by adopting one or more silane coupling agents according to different requirements, so that the adaptability of the insulating treatment fluid is improved.
Further, the nano-glass powder is one or two of boron zinc glass and aluminum zinc silicon glass.
By adopting the technical scheme, the aluminum-zinc-silicon glass has lower expansibility and is alkali-resistant and high-temperature and high-pressure resistant, the high-temperature and high-pressure resistant performance of the insulating layer is effectively improved, and the stability and the durability of the insulating layer are also obviously improved; the boron-zinc glass has high thermal stability, good light resistance and excellent packaging isolation, and can effectively improve the insulating sealing property of the insulating layer, thereby improving the insulating durability of the insulating layer.
Furthermore, the particle size range of the nano-scale glass powder is 10-50 nm.
By adopting the technical scheme, the glass powder with the grain diameter of 10-50nm can be better dispersed and mixed with the silane coupling agent, and the homogeneity of the insulating treatment liquid is improved, so that the uniformity and the stability of the insulating property of the insulating layer are improved.
Further, the reinforced insulating powder comprises the following components in parts by weight: 15-55 parts of SiO25-15 parts of ZnO and 10-35 parts of B2O315-30 parts of Bi2O35-15 parts of Al2O3And 1-3 parts of CaO.
By adopting the technical scheme, the reinforced insulation powder with high insulativity and good insulation durability is prepared.
Further, the preparation method of the reinforced insulating powder comprises the following steps:
s1, preparing materials: preparing the components in corresponding parts by weight according to the mixture ratio;
s2, dispersing and mixing: adding the components prepared in the step S1 into a high-speed mixer for dispersing and mixing for 5-10 min;
s3, wet ball milling: adding the mixed material obtained in the step S2 into a ball mill for ball milling, wherein the ball milling solvent is deionized water, and the ball milling time is 3-8 h;
s4, melting: melting the mixture subjected to ball milling in the step S3 at 950-1300 ℃ for 40-90min to obtain a molten glass body;
s5, quenching-ball milling: quenching the molten glass body obtained in the step S4 in water, and then ball-milling for 6-11h to obtain the reinforced insulating powder with the particle size of 30-150 nm.
By adopting the technical scheme, the components can be fully and uniformly mixed by dispersion and mixing, the mixed powder with finer granularity and more uniform mixing is further obtained by wet ball milling, the components which are uniformly mixed can be finally melted and reacted to form a glass state mixture by high-temperature melting, the glass body can be uniformly cooled by quenching, the stress is uniformly distributed, and finally the reinforced insulating powder with the required granularity is obtained by ball milling.
Further, the primary heating temperature in the step S6 is 550-650 ℃, and the heating time is 3-5 h.
Through adopting above-mentioned technical scheme, can be with the adsorption film initial set that first layer insulating treatment fluid formed to with the preliminary thermosetting in first layer insulating treatment fluid adsorption film of the reinforcing insulating powder of bonding absorption.
Further, the secondary heating temperature in the step S8 is 500-600 ℃, and the heating time is 3-5 h.
By adopting the technical scheme, the insulating treatment liquid film coated by secondary infiltration is thermally cured and wrapped on the outer layer of the reinforced insulating powder to form a compact and uniform insulating layer.
In conclusion, the invention has the following beneficial effects:
1. soaking the laminated ceramic product in an insulating treatment liquid to enable the insulating treatment liquid to cover the surface of the laminated ceramic product to form a uniform and compact adsorption film, removing moisture in the formed adsorption film through drying, further improving the adsorption bonding effect of the adsorption film on the reinforced insulating powder, and meanwhile, removing moisture through drying can effectively reduce moisture pores formed on the surface of the adsorption film, thereby further improving the bonding uniformity of the reinforced insulating powder;
2. the adsorption film adsorbed with the reinforced insulation powder can be preliminarily solidified through one-time heating, so that the bonding fastness of the reinforced insulation powder and the adsorption film is increased; the surface of the adsorption film adsorbed with the enhanced insulation powder can be coated with a layer of insulation treatment liquid film again by soaking the insulation treatment liquid for the second time, and the insulation layer with uniform thickness and higher insulation performance is formed by secondary heating;
3. the silane coupling agent is selected to prepare the insulating treatment liquid, the siloxy of the silane coupling agent has the reaction characteristic to inorganic matters and the organic functional group of the silane coupling agent has the reactivity or compatibility to organic matters, when the silane coupling agent is between an inorganic interface and an organic interface, a bonding layer of an organic matrix-the silane coupling agent-an inorganic matrix can be formed, and the silane coupling agent can play a role of bridging to more firmly bond and fix the reinforced insulating powder on the outer surface of the laminated ceramic product.
Drawings
FIG. 1 is a process flow chart of a manufacturing method suitable for surface insulation treatment of a laminated ceramic product according to an embodiment;
FIG. 2 is a schematic diagram illustrating the positional relationship between the insulating layer and the outer peripheral surface of the ceramic product in the embodiment.
In the figure, 1, a body; 2. a dielectric layer; 3. an inner electrode; 4. a nickel plating layer; 5. tin plating; 6. a terminal electrode; 7. an insulating layer.
Detailed Description
The present invention will be described in further detail with reference to specific examples.
Preparation examples 1 to 4 of insulating treatment liquids
Preparation: according to the proportion of each preparation example in the table 1, adding the silane coupling agent and the nano-scale glass powder with corresponding weights into deionized water respectively, stirring and mixing by adopting ultrasonic waves, and stirring and mixing for 40min to obtain the corresponding insulation treatment fluid.
TABLE 1 PREPARATION EXAMPLES 1-4 raw material compounding ratio of insulating treatment liquid
Preparation examples 5 to 9 of reinforced insulating powder
Preparation example 5: 15kg of SiO2、5kg ZnO、10kg B2O3、15kg Bi2O3、5kg Al2O31kg of CaO was dispersed and mixed in a high-speed mixer to give 5miAnd n, adding the dispersed and mixed materials into a ball mill, selecting deionized water as a ball milling solvent, carrying out ball milling for 3h, then melting the ball-milled mixture for 40min at 950 ℃ to obtain a molten glass body, quenching the molten glass body in water, and carrying out ball milling for 6h to obtain the reinforced insulating powder with the particle size of 30-150 nm.
TABLE 2 preparation examples 5-9 raw material ratios of reinforced insulating powder
Preparation example 6: 23kg of SiO2、7kg ZnO、15kg B2O3、18kg Bi2O3、7kg Al2O3Adding 1.5kg of CaO into a high-speed mixer for dispersing and mixing for 6min, adding the dispersed and mixed materials into a ball mill, selecting deionized water as a ball milling solvent, carrying out ball milling for 5h, melting the ball-milled mixture at 1050 ℃ for 55min to obtain a molten glass body, quenching the molten glass body in water, and carrying out ball milling for 8h to obtain the reinforced insulating powder with the particle size of 30-150 nm.
Preparation example 7: 40kg of SiO2、9kg ZnO、22kg B2O3、22kg Bi2O3、9kg Al2O3Adding 2kg of CaO into a high-speed mixer for dispersing and mixing for 7min, adding the dispersed and mixed materials into a ball mill, selecting deionized water as a ball milling solvent, carrying out ball milling for 6h, then melting the ball-milled mixture for 70min at 1150 ℃ to obtain a molten glass body, quenching the molten glass body in water, and then carrying out ball milling for 9h to obtain the reinforced insulating powder with the particle size of 30-150 nm.
Preparation example 8: 48kg of SiO2、12kg ZnO、28kg B2O3、26kg Bi2O3、12kg Al2O3Adding 2.5kg of CaO into a high-speed mixer for dispersing and mixing for 8min, adding the dispersed and mixed materials into a ball mill, selecting deionized water as a ball milling solvent, carrying out ball milling for 7h, melting the ball-milled mixture for 80min at 1250 ℃ to obtain a molten glass body, quenching the molten glass body in water, and then carrying out ball millingGrinding for 10h to obtain the reinforced insulating powder with the grain diameter of 30-150 nm.
Preparation example 9: 55kg of SiO2、15kg ZnO、35kg B2O3、30kg Bi2O3、15kg Al2O3Adding 3kg of CaO into a high-speed mixer for dispersing and mixing for 10min, adding the dispersed and mixed materials into a ball mill, selecting deionized water as a ball milling solvent, carrying out ball milling for 8h, then melting the ball-milled mixture for 90min at 1300 ℃ to obtain a molten glass body, quenching the molten glass body in water, and then carrying out ball milling for 11h to obtain the reinforced insulating powder with the particle size of 30-150 nm.
Examples
Example 1: a manufacturing method suitable for surface insulation treatment of a laminated ceramic product comprises the following steps:
s1, immersing the laminated ceramic semiconductor product body 1 in the insulation treatment liquid prepared in the preparation example 1 for 5 min;
s2, drying the laminated ceramic semiconductor product body 1 which is prepared in the step S1 and has the surface soaked with the insulation processing liquid to remove the moisture in the insulation processing liquid, wherein the drying temperature is 105 ℃, and the drying time is 30 min;
s3, uniformly adhering a layer of reinforced insulation powder prepared in preparation example 5 on the surface of the laminated ceramic semiconductor product body 1 dried in the step S2;
s4, carrying out primary heating on the semi-finished product prepared in the step S3, wherein the primary heating temperature is 550 ℃, and the heating time is 3 hours;
s5, soaking the semi-finished product subjected to primary heating in the step S4 in secondary insulating treatment liquid for 3 min;
and S6, carrying out secondary heating treatment on the semi-finished product obtained in the step S5, wherein the secondary heating temperature is 500 ℃, the heating time is 3 hours, the insulating layer 7 is formed outside the laminated ceramic semiconductor product, meanwhile, the forming of the terminal electrode 6 of the laminated ceramic semiconductor product body 1 is completed, and then, the nickel plating layer 4 and the tin plating layer 5 are sequentially electroplated on the terminal electrode 6 of the laminated ceramic semiconductor product body 1.
Example 2: a manufacturing method suitable for surface insulation treatment of a laminated ceramic product comprises the following steps:
s1, immersing the laminated ceramic semiconductor product body 1 in the insulation treatment liquid prepared in the preparation example 2 for 10 min;
s2, drying the laminated ceramic semiconductor product body 1 which is prepared in the step S1 and has the surface soaked with the insulation processing liquid to remove the moisture in the insulation processing liquid, wherein the drying temperature is 110 ℃, and the drying time is 40 min;
s3, uniformly adhering a layer of reinforced insulation powder prepared in preparation example 6 on the surface of the laminated ceramic semiconductor product body 1 dried in the step S2;
s4, heating the semi-finished product prepared in the step S3 for one time, wherein the temperature of the heating for one time is 580 ℃, and the heating time is 3 hours;
s5, soaking the semi-finished product subjected to primary heating in the step S4 in secondary insulating treatment liquid for 3 min;
and S6, carrying out secondary heating treatment on the semi-finished product obtained in the step S5, wherein the secondary heating temperature is 520 ℃, the heating time is 3 hours, the insulating layer 7 is formed outside the laminated ceramic semiconductor product, meanwhile, the forming of the terminal electrode 6 of the laminated ceramic semiconductor product body 1 is completed, and then, the nickel plating layer 4 and the tin plating layer 5 are sequentially electroplated on the terminal electrode 6 of the laminated ceramic semiconductor product body 1.
Example 3: a manufacturing method suitable for surface insulation treatment of a laminated ceramic product comprises the following steps:
s1, immersing the laminated ceramic semiconductor product body 1 in the insulation treatment liquid prepared in the preparation example 3 for 15 min;
s2, drying the laminated ceramic semiconductor product body 1 which is prepared in the step S1 and has the surface soaked with the insulation processing liquid to remove the moisture in the insulation processing liquid, wherein the drying temperature is 110 ℃, and the drying time is 40 min;
s3, uniformly adhering a layer of reinforced insulation powder prepared in preparation example 7 on the surface of the laminated ceramic semiconductor product body 1 dried in the step S2;
s4, carrying out primary heating on the semi-finished product prepared in the step S3, wherein the primary heating temperature is 600 ℃, and the heating time is 4 hours;
s5, soaking the semi-finished product subjected to primary heating in the step S4 in secondary insulating treatment liquid for 5 min;
and S6, carrying out secondary heating treatment on the semi-finished product obtained in the step S5, wherein the secondary heating temperature is 540 ℃, and the heating time is 3.5 hours, so that the insulating layer 7 is formed outside the laminated ceramic semiconductor product, the forming of the terminal electrode 6 of the laminated ceramic semiconductor product body 1 is completed, and then the nickel plating layer 4 and the tin plating layer 5 are sequentially electroplated on the terminal electrode 6 of the laminated ceramic semiconductor product body 1.
Example 4: a manufacturing method suitable for surface insulation treatment of a laminated ceramic product comprises the following steps:
s1, immersing the laminated ceramic semiconductor product body 1 in the insulation treatment liquid prepared in the preparation example 4 for 25 min;
s2, drying the laminated ceramic semiconductor product body 1 which is prepared in the step S1 and has the surface soaked with the insulation processing liquid to remove the moisture in the insulation processing liquid, wherein the drying temperature is 115 ℃, and the drying time is 50 min;
s3, uniformly adhering a layer of reinforced insulation powder prepared in the preparation example 8 on the surface of the laminated ceramic semiconductor product body 1 dried in the step S2;
s4, carrying out primary heating on the semi-finished product prepared in the step S3, wherein the primary heating temperature is 620 ℃, and the heating time is 4.5 hours;
s5, soaking the semi-finished product subjected to primary heating in the step S4 in secondary insulating treatment liquid for 7 min;
and S6, carrying out secondary heating treatment on the semi-finished product obtained in the step S5, wherein the secondary heating temperature is 580 ℃, the heating time is 4 hours, the insulating layer 7 is formed outside the laminated ceramic semiconductor product, meanwhile, the forming of the terminal electrode 6 of the laminated ceramic semiconductor product body 1 is completed, and then, the nickel plating layer 4 and the tin plating layer 5 are sequentially electroplated on the terminal electrode 6 of the laminated ceramic semiconductor product body 1.
Example 5: a manufacturing method suitable for surface insulation treatment of a laminated ceramic product comprises the following steps:
s1, immersing the laminated ceramic semiconductor product in the insulating treatment liquid prepared in the preparation example 1 for 35 min;
s2, drying the laminated ceramic semiconductor product body 1 which is prepared in the step S1 and has the surface soaked with the insulation processing liquid to remove the moisture in the insulation processing liquid, wherein the drying temperature is 120 ℃, and the drying time is 60 min;
s3, uniformly adhering a layer of reinforced insulation powder prepared in preparation example 9 on the surface of the laminated ceramic semiconductor product body 1 dried in the step S2;
s4, carrying out primary heating on the semi-finished product prepared in the step S3, wherein the primary heating temperature is 650 ℃, and the heating time is 5 hours;
s5, soaking the semi-finished product subjected to primary heating in the step S4 in secondary insulating treatment liquid for 8 min;
and S6, carrying out secondary heating treatment on the semi-finished product obtained in the step S5, wherein the secondary heating temperature is 600 ℃, the heating time is 5 hours, the insulating layer 7 is formed outside the laminated ceramic semiconductor product, meanwhile, the forming of the terminal electrode 6 of the laminated ceramic semiconductor product body 1 is completed, and then, the nickel plating layer 4 and the tin plating layer 5 are sequentially electroplated on the terminal electrode 6 of the laminated ceramic semiconductor product body 1.
The present embodiment is only for explaining the present invention, and it is not limited to the present invention, and those skilled in the art can make modifications of the present embodiment without inventive contribution as needed after reading the present specification, but all of them are protected by patent law within the scope of the claims of the present invention.
Claims (9)
1. A manufacturing method suitable for surface insulation treatment of a laminated ceramic product is characterized by comprising the following steps:
s1, preparing an insulation treatment liquid required by the surface insulation treatment of the laminated ceramic product body (1);
s2, preparing reinforced insulating powder;
s3, immersing the laminated ceramic semiconductor product body (1) in the insulating treatment liquid prepared in the step S1 for 5-35 min;
s4, drying the laminated ceramic semiconductor product body (1) with the surface soaked with the insulation treatment liquid prepared in the step S3 to remove the moisture in the insulation treatment liquid, wherein the drying temperature is 105-120 ℃, and the drying time is 30-60 min;
s5, uniformly adhering a layer of reinforced insulation powder on the surface of the laminated ceramic semiconductor product body (1) dried in the step S4;
s6, heating the semi-finished product prepared in the step S5 for the first time;
s7, soaking the semi-finished product subjected to primary heating in the step S6 in secondary insulating treatment liquid for 3-8 min;
and S8, carrying out secondary heating treatment on the semi-finished product obtained in the step S7 to finish forming an insulating layer (7) outside the laminated ceramic semiconductor product and simultaneously finish forming the terminal electrode (6) of the laminated ceramic semiconductor product body (1), and then sequentially electroplating the nickel plating layer (4) and the tin plating layer (5) on the terminal electrode (6) of the laminated ceramic semiconductor product body (1).
2. The manufacturing method suitable for surface insulation treatment of the laminated ceramic product according to claim 1, wherein the insulation treatment liquid comprises the following components in parts by weight: 5-20 parts of silane coupling agent, 3-15 parts of nano glass powder and 60-90 parts of deionized water.
3. The method for manufacturing a surface insulation coating suitable for laminated ceramic products as claimed in claim 2, wherein: the silane coupling agent comprises one or more of 2- (3, 4-epoxycyclohexyl) ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane and lauryl trimethylsilane.
4. The method for manufacturing a surface insulation coating suitable for laminated ceramic products as claimed in claim 2, wherein: the nano-scale glass powder is one or two of boron-zinc glass and aluminum-zinc-silicon glass.
5. The method for manufacturing a surface insulation coating suitable for laminated ceramic products as claimed in claim 2, wherein: the particle size range of the nano-scale glass powder is 10-50 nm.
6. The manufacturing method suitable for surface insulation treatment of the laminated ceramic product according to claim 1, wherein the reinforced insulation powder comprises the following components in parts by weight: 15-55 parts of SiO25-15 parts of ZnO and 10-35 parts of B2O315-30 parts of Bi2O35-15 parts of Al2O3And 1-3 parts of CaO.
7. The manufacturing method suitable for surface insulation treatment of the laminated ceramic product according to claim 6, wherein the preparation method of the reinforced insulation powder comprises the following steps:
s1, preparing materials: preparing the components in corresponding parts by weight according to the mixture ratio;
s2, dispersing and mixing: adding the components prepared in the step S1 into a high-speed mixer for dispersing and mixing for 5-10 min;
s3, wet ball milling: adding the mixed material obtained in the step S2 into a ball mill for ball milling, wherein the ball milling solvent is deionized water, and the ball milling time is 3-8 h;
s4, melting: melting the mixture subjected to ball milling in the step S3 at 950-1300 ℃ for 40-90min to obtain a molten glass body;
s5, quenching-ball milling: quenching the molten glass body obtained in the step S4 in water, and then ball-milling for 6-11h to obtain the reinforced insulating powder with the particle size of 30-150 nm.
8. The method for manufacturing a surface insulation coating suitable for laminated ceramic products as claimed in claim 1, wherein: the primary heating temperature in the step S6 is 550-650 ℃, and the heating time is 3-5 h.
9. The method for manufacturing a surface insulation coating suitable for laminated ceramic products as claimed in claim 1, wherein: the secondary heating temperature in the step S8 is 500-600 ℃, and the heating time is 3-5 h.
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