CN111521156B - Small-size intelligent tilt angle sensor - Google Patents

Small-size intelligent tilt angle sensor Download PDF

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CN111521156B
CN111521156B CN202010601700.1A CN202010601700A CN111521156B CN 111521156 B CN111521156 B CN 111521156B CN 202010601700 A CN202010601700 A CN 202010601700A CN 111521156 B CN111521156 B CN 111521156B
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cavity
sensor chip
chip
main control
acceleration sensor
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CN111521156A (en
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吕阳
郑良广
赵呈锐
周峰
杨玉钊
吴明明
李昌书
王刚义
李哲
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Ningbo CRRC Times Transducer Technology Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C9/00Measuring inclination, e.g. by clinometers, by levels
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01CMEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
    • G01C9/00Measuring inclination, e.g. by clinometers, by levels
    • G01C9/02Details
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01PMEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/18Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration in two or more dimensions

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  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Radar, Positioning & Navigation (AREA)
  • Remote Sensing (AREA)
  • Gyroscopes (AREA)

Abstract

The invention provides a small intelligent tilt angle sensor, belonging to the technical field of sensors, comprising: the device comprises a shell, a first cavity and a second cavity are arranged in the shell, a level meter is arranged in the first cavity, an auxiliary control board, a power supply board and a main control board are arranged in the second cavity, wherein a gyroscope chip, a temperature sensor chip and a vertical acceleration sensor chip are arranged on the auxiliary control board, a CPU and a horizontal acceleration sensor chip are arranged on the main control board, and an acquisition module, a calculation module and a diagnosis module are arranged on the CPU; the first cover plate is connected with the shell, wherein an observation window is arranged on the first cover plate; the second cover plate is connected with the shell; and the connector is arranged on the shell, and is connected with the power panel and the main control panel through wires. The invention has the advantages of small volume, light weight, convenient installation and maintenance, stable anti-interference effect and low failure rate.

Description

Small-size intelligent tilt angle sensor
Technical Field
The invention belongs to the technical field of sensors, relates to a tilt angle sensor, and particularly relates to a small intelligent tilt angle sensor.
Background
The tamping cars which are used in large quantities by the railway department in China adjust the height, direction and other parameters of the steel rail in the railway construction and maintenance process, thereby improving the smoothness of the railway and ensuring the safe operation of the train. The height difference between two rails (also called the superelevation of the rails) is an important control quantity in the tamping operation process.
The existing tamping car measures the ultrahigh quantity of a steel rail through an electronic pendulum type inclination angle sensor, the sensor detects the change of an inclination angle by adopting a gravity pendulum, senses the swinging angle of the pendulum through a potentiometer, and overcomes the interference of vibration on measurement through damping oil. The sensor has the advantages of simple principle, high measurement precision, good vibration resistance and the like, but has the following defects in the long-term use process:
firstly, the sensor is large in size and heavy in weight, so that the sensor is inconvenient to install and maintain;
secondly, the damping oil needs to be replaced regularly by the sensor, so that a stable anti-interference effect is ensured;
thirdly, the product structure of the sensor is complex, and the failure rate is high.
Disclosure of Invention
The invention aims to solve the problems in the prior art and provides a sensor which is small in size, light in weight, convenient to install and maintain, stable in anti-interference effect and low in failure rate.
The purpose of the invention can be realized by the following technical scheme: a miniature, intelligent tilt sensor, comprising:
a shell, a concave cavity is arranged in the shell, the concave cavity is divided into two cavities by a partition plate, the two cavities are respectively a first cavity and a second cavity, a level gauge is arranged in the first cavity, an auxiliary control board, a power supply board and a main control board are arranged in the second cavity,
the auxiliary control board is provided with a gyroscope chip, a temperature sensor chip, a vertical acceleration sensor chip, a main control board is provided with a CPU and a horizontal acceleration sensor chip, wherein the CPU is provided with an acquisition module for acquiring voltage values corresponding to the horizontal acceleration sensor chip, the vertical acceleration sensor chip, the gyroscope chip and the temperature sensor chip, a conversion module for converting the voltage values into acceleration, a calculation module for calculating an inclination angle value and a diagnosis module for judging whether the horizontal acceleration sensor chip and the gyroscope chip have faults or not;
the first cover plate is positioned above the first cavity and connected with the shell through a fastener, wherein an observation window is arranged on the first cover plate and corresponds to the position of the level gauge;
the second cover plate is positioned above the second cavity and is connected with the shell through a fastener;
and the connector is arranged on the shell, and is connected with the power panel and the main control panel through wires.
In the above-mentioned small-size intelligent tilt sensor, the both ends of spirit level are installed in the first cavity through the fastener.
In the above-mentioned small-sized intelligent tilt sensor, a transparent plate is further installed in the first cavity, wherein the transparent plate is located between the first cover plate and the level gauge.
In the above-mentioned small-size intelligent tilt sensor, the power strip and the main control board are stacked from top to bottom, and there is the clearance between power strip and the main control board, and install power strip and main control board in the diapire of second cavity through the fastener, assist the lateral wall that the control board was installed in the second cavity, wherein, assist and have the clearance between control board and the second cavity lateral wall, there is the clearance between main control board and the second cavity diapire.
In the small intelligent tilt angle sensor, the power panel is separated from the main control panel through the first sleeve, and the auxiliary control panel is separated from the side wall of the second cavity through the second sleeve.
In the above-mentioned small-size intelligent tilt sensor, the connector is installed on the casing through the rubber pad, wherein, carry out the encapsulating in the connector and handle.
In the above-mentioned small-size intelligent tilt sensor, the quantity of connector is two, and two connectors set up side by side, wherein, two connectors all link to each other with power strip and main control board.
In the above-mentioned small-size intelligent tilt sensor, the gyroscope chip and the temperature sensor chip are integrally arranged to form a gyroscope assembly, or the gyroscope chip and the temperature sensor chip are separately arranged.
Compared with the prior art, the invention has the beneficial effects that:
(1) the small intelligent tilt angle sensor adopts the double filters of the Butterworth filter and the Kalman filter, ensures high-precision and stable measurement of the tilt angle of the sensor in a strong vibration environment, and simultaneously avoids the problem that the hardware requirement of the FIR filter is higher;
(2) whether the current sensor installation position is in a horizontal state or not can be quickly known through the observation window on the first cover plate under the condition that the first cavity is not opened, and the fastener installed on the level meter not only serves as a fixing part of the level meter, but also can serve as the leveling of the initial state (during installation) of the level meter, so that the reliability of the detection data of the subsequent vertical acceleration sensor chip and the horizontal acceleration sensor chip is ensured;
(3) through the additional arrangement of the transparent plate, on one hand, the level gauge is protected, the level gauge is prevented from being damaged, on the other hand, a clamping form is formed between the transparent plate and the bottom wall of the first cavity, the limit of the level gauge in the vertical direction is realized, the mounting position of the sensor is guaranteed not to deviate or turn even in a severe working environment, and the reliability of data detection of the vertical acceleration sensor chip and the horizontal acceleration sensor chip is further improved;
(4) a gap is formed between the power panel and the main control panel, a gap is formed between the main control panel and the bottom wall of the second cavity, and a gap is formed between the auxiliary control panel and the side wall of the second cavity, so that the insulation and voltage resistance of the sensor are ensured, and the service life of the sensor is prolonged;
(5) a gap is formed between the power panel and the main control panel through the first sleeve, a gap is formed between the auxiliary control panel and the side wall of the second cavity through the second sleeve, and the sleeves have certain strength, so that the insulation and voltage resistance of the sensor are ensured, and the service life of the sensor is further prolonged;
(6) the waterproof performance of the sensor is improved through rubber pad and glue filling treatment;
(7) the cascade networking of a plurality of sensors is realized, and the use scene of the sensors is enlarged.
Drawings
Fig. 1 is a schematic structural diagram of a small intelligent tilt sensor according to the present invention.
Fig. 2 is a schematic structural diagram of another view angle of the tilt sensor shown in fig. 1.
Fig. 3 is a cross-sectional view a-a of the tilt sensor shown in fig. 2.
Fig. 4 is a cross-sectional view B-B of the tilt sensor shown in fig. 2.
Fig. 5 is a schematic view of a partial structure of a small intelligent tilt sensor according to the present invention.
Fig. 6 is a functional block diagram of a small intelligent tilt sensor of the present invention.
Fig. 7 is a schematic diagram of a small intelligent tilt sensor of the present invention.
In the figure, 100, the housing; 110. a partition plate; 120. a first cavity; 130. a second cavity; 140. a first cover plate; 141. an observation window; 150. a second cover plate; 160. a connector; 170. a transparent plate; 180. a first sleeve; 190. a second sleeve; 200. a level gauge; 300. an auxiliary control board; 310. a gyroscope chip; 320. a temperature sensor chip; 330. a vertical acceleration sensor chip; 400. a power panel; 500. a main control board; 510. a CPU; 520. a horizontal acceleration sensor chip; 530. an acquisition module; 540. a conversion module; 550. a calculation module; 560. a diagnostic module.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
As shown in fig. 1 to 5, the present invention provides a small-sized intelligent tilt sensor, which includes: the housing 100 is internally provided with a cavity, the cavity is divided into two independent cavities by a partition plate 110, the two cavities are respectively a first cavity 120 and a second cavity 130, a level gauge 200 is installed in the first cavity 120, an auxiliary control board 300, a power board 400 and a main control board 500 are installed in the second cavity 130, wherein a gyroscope chip 310 and a temperature sensor chip 320 and a vertical acceleration sensor chip 330 are installed on the auxiliary control board 300, a CPU510 (i.e. a micro control unit, a processor) and a horizontal acceleration sensor chip 520 are installed on the main control board 500, wherein an acquisition module 530 for acquiring voltage values corresponding to the horizontal acceleration sensor chip 520, the vertical acceleration sensor chip 330, the gyroscope chip 310 and the temperature sensor chip 320, a conversion module 540 for converting the voltage values into acceleration, a calculation module 550 for calculating an inclination angle value are installed on the CPU510, and a diagnosis module 560 for judging whether there is a failure in the horizontal acceleration sensor chip 520 and the gyro chip 310;
a first cover plate 140 located above the first cavity 120 for sealing the first cavity 120, and the first cover plate 140 is connected to the housing 100 by a fastener, wherein the first cover plate 140 is provided with a viewing window 141 corresponding to the position of the level gauge 200;
a second cover plate 150 located above the second cavity 130 for sealing the second cavity 130, wherein the second cover plate 150 is connected to the housing 100 through a fastener;
and at least one connector 160 mounted on the housing 100, wherein the connector 160 is connected to the power board 400 and the main control board 500 by a wire.
The small intelligent tilt angle sensor provided by the invention has the advantages of small volume, light weight and convenience in installation and maintenance, wherein the gyroscope chip 310, the vertical acceleration sensor chip 330 and the horizontal acceleration sensor chip 520 which are internally provided with the temperature sensor chip 320 are used for improving the detection precision and ensuring the use reliability of the sensor, in addition, the level gauge 200 does not depend on electricity, so that the sensor can be detected whether to be installed stably without power-on leveling in the installation process, and the operation is convenient and reliable.
In this embodiment, the tilt sensor in the present invention further has functions of power-on self-test, timing diagnosis and trigger diagnosis, where the power-on self-test means that after the sensor is powered on, a self-test control signal is sent to the acceleration sensor chip and the gyroscope chip 310 to check whether the acquisition of the corresponding chip is normal, and to detect whether the acquisition of the power board 400 is abnormal. The timing diagnosis refers to timing self-test of the sensor, and during the operation, validity of data is also detected, for example, whether a difference between a horizontal tilt angle in the horizontal acceleration sensor chip 520 and a horizontal tilt angle in the vertical acceleration sensor chip 330 is too large, whether an angular velocity of the gyro chip 310 is too large, and whether a tilt angle value exceeds a maximum value. The trigger type diagnosis means that the upper computer sends a self-checking command to the sensor when needed, and the sensor interrupts measurement to execute self-checking.
Further preferably, the gyroscope chip 310 and the temperature sensor chip 320 are integrally disposed to form a gyroscope assembly, or the gyroscope chip 310 and the temperature sensor chip 320 are separately disposed.
Preferably, as shown in fig. 1-5, the two ends of the level 200 are mounted within the first cavity 120 by fasteners.
In this embodiment, through the observation window 141 on the first cover plate 140, it can be quickly known whether the current sensor mounting position is in a horizontal state without opening the first cavity 120, and the fastener mounted on the level gauge 200 not only serves as a fixing component of the level gauge 200, but also serves as leveling in the initial state (mounting time) of the level gauge 200, so as to ensure the reliability of the subsequent detection data of the vertical acceleration sensor chip 330 and the horizontal acceleration sensor chip 520.
Further preferably, a transparent plate 170 is further mounted within the first chamber 120, wherein the transparent plate 170 is positioned between the first cover plate 140 and the level 200.
In this embodiment, through addding transparent plate 170, on the one hand forms the protection to spirit level 200, avoids spirit level 200 to take place to damage, forms "centre gripping" form between on the other hand and the diapire of first cavity 120, realizes that spirit level 200 is spacing on the vertical direction, guarantees that the sensor is even in abominable operational environment, and its mounted position still does not take place skew, turn to, and then improves vertical acceleration sensor chip 330 and horizontal acceleration sensor chip 520 data detection's reliability.
Preferably, as shown in fig. 1 to 5, the power board 400 and the main control board 500 are stacked up and down, a gap exists between the power board 400 and the main control board 500, the power board 400 and the main control board 500 are mounted on the bottom wall of the second cavity 130 through a fastener, the auxiliary control board 300 is mounted on the side wall of the second cavity 130, a gap exists between the auxiliary control board 300 and the side wall of the second cavity 130, and a gap exists between the main control board 500 and the bottom wall of the second cavity 130.
In this embodiment, a gap is formed between the power board 400 and the main control board 500, a gap is formed between the main control board 500 and the bottom wall of the second cavity 130, and a gap is formed between the auxiliary control board 300 and the side wall of the second cavity 130, so that the insulation and voltage resistance of the sensor are ensured, and the service life of the sensor is further prolonged.
Further preferably, the power board 400 is separated from the main control board 500 by a first sleeve 180, and the auxiliary control board 300 is separated from the sidewall of the second cavity 130 by a second sleeve 190.
In this embodiment, a gap exists between the power board 400 and the main control board 500 through the first sleeve 180, a gap exists between the auxiliary control board 300 and the sidewall of the second cavity 130 through the second sleeve 190, and the sleeves have a certain strength, so as to ensure the insulation and voltage resistance of the sensor, and further prolong the service life of the sensor.
Preferably, as shown in fig. 1 to 5, the connector 160 is mounted on the housing 100 through a rubber pad, so as to improve the waterproof performance of the sensor, and further preferably, a potting process is performed in the connector 160, so as to further improve the waterproof performance of the sensor.
Further preferably, the number of the connectors 160 is two, and the two connectors 160 are arranged side by side, wherein the two connectors 160 are connected to the power board 400 and the main control board 500, so that the cascade networking of the plurality of sensors is realized, and the use scene of the sensors is enlarged.
The present invention also provides a method for acquiring a small-sized intelligent tilt sensor, as shown in fig. 6 and 7, including:
step S1: gather the voltage value that each chip corresponds, wherein, include: acquiring a voltage value V by the horizontal acceleration sensor chip 520x1And VyObtaining the voltage value V by the vertical acceleration sensor chip 330x2And VzThe voltage value obtained by the gyroscope chip 310 is VGAnd acquiring a voltage value V through the temperature sensor chip 320T
Step S2: converting the voltage value into an acceleration in a preset manner according to the voltage value obtained in step S1, wherein the voltage values V obtained by the horizontal acceleration sensor chip 520 and the vertical acceleration sensor chip 330 are respectivelyx1、Vx2And VyRespectively and correspondingly converted into horizontal acceleration Ax1、Ax2And AyThe voltage value V obtained by the vertical acceleration sensor chip 330zConversion into vertical acceleration AzThe voltage value V obtained by the gyroscope chip 310GAnd the voltage value V acquired by the temperature sensor chip 320TConverted into gyroscope angular velocity omegaG
Step S3: the inclination angle value θ is calculated from the acceleration obtained in step S2 by the equation θ arcsin (a/G)x1、θyAnd thetax2And passing through the Butterworth filter pair thetax1And thetax2Filtering to obtain theta'x1And θ'x2
Step S4: the inclination value θ 'obtained according to step S3'x1And θ'x2And the gyro angular velocity Ω obtained according to step S2GSelf-checking is carried out to obtain theta'xAnd Δ θ'x
Step S5: through Kalman filter pair theta'xx、Δθ′xxFiltering to obtain final dip angle thetaxAnd acquires it.
Further preferably, step S2 includes:
step S21: according to the preset stored zero voltage pair Vx1、Vx2、Vy、Vz、VGAnd VTCorrection treatment is carried out to obtain corresponding V'x1、V′x2、V′y、V′z、V′GAnd V'T
Step S22: acquiring a corresponding temperature value T according to a preset temperature and sensor chip voltage calibration curve;
step S23: acquiring corresponding horizontal transverse acceleration A according to preset temperature, a sensor chip voltage calibration curve and a sensor temperature drift coefficientx1、Ax2Horizontal longitudinal acceleration AyVertical acceleration AzAnd gyroscope angular velocity omegaG
Further preferably, step S3 includes:
step S31: passing A through an average filteryObtaining longitudinal acceleration A 'after filtering'yAnd the gravity acceleration G, since these two values do not need to respond quickly, average filtering can be performed for a long time;
step S32: calculating the corresponding inclination angle theta according to a formula theta as arcsin (A/G)x1、θy、θx2Wherein, thetax1,θx2Indicating horizontal inclination angle, thetayRepresenting a pitch angle;
step S33: pass Butterworth filter pair thetax1、θx2Filtering to obtain corresponding horizontal inclination angle theta'x1、θ′x2Thereby eliminating high frequency interference.
Further preferably, step S4 includes:
step S41: if theta'x1And θ'x2Is less than or equal to a preset difference value, an average value theta 'is obtained'x(ii) a If theta'x1And θ'x2When the difference value is larger than the preset difference value, acquiring the fault of the acceleration sensor chip;
step S42: if the angular velocity omega of the gyroscopeGIs less than or equal toAt the time of a preset value, the angular velocity change value delta theta 'is obtained by performing integration processing through an integration filter'xIf the angular velocity omega of the gyroscopeGIf the value is greater than the preset value, the failure of the gyroscope chip 310 is obtained.
Further preferably, a self-test is performed according to the step S41 to obtain a fault signal of the acceleration sensor chip, where the method includes:
step S411: judging whether one horizontal transverse acceleration is normal or not, if so, acquiring an inclination angle corresponding to the horizontal transverse acceleration, and taking the inclination angle as theta'xOutputting, if the horizontal transverse acceleration is abnormal, continuously judging whether the other horizontal transverse acceleration is normal;
step S412: if the other horizontal transverse acceleration is normal, acquiring a dip angle corresponding to the horizontal transverse acceleration, and taking the dip angle as theta'xAnd outputs, acquires a fault signal if the other horizontal lateral acceleration is not normal, and uploads the fault signal to the CPU 510.
Further preferably, the obtaining of the horizontal acceleration chip fault according to S42 includes:
step S421: if the self-checking is normal, obtaining a corresponding angular speed change value delta theta'xxIf the self-test is not normal, a fault signal is acquired and uploaded to the CPU 510:
the small intelligent tilt sensor provided by the invention adopts a double filter of a Butterworth filter and a Kalman filter, ensures high-precision and stable measurement of the tilt angle of the sensor in a strong vibration environment, and simultaneously avoids the problem that the hardware requirement of an FIR filter is higher.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.

Claims (5)

1. A small-sized intelligent tilt sensor, comprising:
a shell, a concave cavity is arranged in the shell, the concave cavity is divided into two cavities by a partition plate, the two cavities are respectively a first cavity and a second cavity, a level gauge is arranged in the first cavity, an auxiliary control board, a power supply board and a main control board are arranged in the second cavity,
the auxiliary control board is provided with a gyroscope chip, a temperature sensor chip, a vertical acceleration sensor chip, a main control board is provided with a CPU and a horizontal acceleration sensor chip, wherein the CPU is provided with an acquisition module for acquiring voltage values corresponding to the horizontal acceleration sensor chip, the vertical acceleration sensor chip, the gyroscope chip and the temperature sensor chip, a conversion module for converting the voltage values into acceleration, a calculation module for calculating an inclination angle value and a diagnosis module for judging whether the horizontal acceleration sensor chip and the gyroscope chip have faults or not;
the first cover plate is positioned above the first cavity and connected with the shell through a fastener, wherein an observation window is arranged on the first cover plate and corresponds to the position of the level gauge;
the second cover plate is positioned above the second cavity and is connected with the shell through a fastener;
the connector is arranged on the shell, and is connected with the power panel and the main control panel through wires;
the power panel and the main control panel are arranged in an upper-lower stacked mode, a gap is reserved between the power panel and the main control panel, the power panel and the main control panel are installed on the bottom wall of the second cavity through fasteners, and the auxiliary control panel is installed on the side wall of the second cavity;
the power panel is separated from the main control panel through a first sleeve, and the auxiliary control panel is separated from the side wall of the second cavity through a second sleeve;
a transparent plate is further installed in the first cavity, wherein the transparent plate is located between the first cover plate and the level gauge;
through small-size intelligent tilt sensor, its step of detecting the inclination includes:
step S1: gather the voltage value that each chip corresponds, wherein, include: acquiring voltage value through horizontal acceleration sensor chip
Figure 637844DEST_PATH_IMAGE002
And
Figure 335411DEST_PATH_IMAGE004
obtaining a voltage value by a vertical acceleration sensor chip
Figure 646306DEST_PATH_IMAGE006
And
Figure 572674DEST_PATH_IMAGE008
obtaining voltage value by gyroscope chip
Figure 996833DEST_PATH_IMAGE010
And acquiring a voltage value by the temperature sensor chip
Figure 84875DEST_PATH_IMAGE012
Step S2: converting the voltage values into accelerations in a preset manner according to the voltage values obtained in step S1, wherein the voltage values obtained by the horizontal acceleration sensor chip and the vertical acceleration sensor chip are respectively
Figure DEST_PATH_IMAGE013
Figure 127972DEST_PATH_IMAGE006
And
Figure 328009DEST_PATH_IMAGE004
respectively correspondingly converted into horizontal acceleration
Figure DEST_PATH_IMAGE017
Figure 118111DEST_PATH_IMAGE019
And
Figure 419910DEST_PATH_IMAGE021
voltage value obtained by the vertical acceleration sensor chip
Figure 688081DEST_PATH_IMAGE008
Conversion to vertical acceleration
Figure 742624DEST_PATH_IMAGE023
The voltage value obtained by the gyroscope chip
Figure 438048DEST_PATH_IMAGE010
And a voltage value obtained by the temperature sensor chip
Figure 460099DEST_PATH_IMAGE012
Converted into angular velocity of gyroscope
Figure DEST_PATH_IMAGE025
Step S3: according to the respective accelerations obtained in step S2, by the formula
Figure DEST_PATH_IMAGE027
Calculating to obtain a tilt angle value
Figure DEST_PATH_IMAGE029
Figure DEST_PATH_IMAGE031
And
Figure DEST_PATH_IMAGE033
and passing through the Butterworth filter pair
Figure 141747DEST_PATH_IMAGE034
And
Figure DEST_PATH_IMAGE035
filtering to obtain
Figure DEST_PATH_IMAGE037
And
Figure DEST_PATH_IMAGE039
wherein, in the step (A),
Figure DEST_PATH_IMAGE041
represents the acceleration of gravity;
step S4: the inclination angle value obtained according to step S3
Figure 40345DEST_PATH_IMAGE037
And
Figure 906670DEST_PATH_IMAGE039
and the gyro angular velocity obtained according to step S2
Figure 901171DEST_PATH_IMAGE025
Performing self-inspection to obtain
Figure DEST_PATH_IMAGE043
And
Figure DEST_PATH_IMAGE045
wherein, in the step (A),
Figure 540838DEST_PATH_IMAGE046
representing the horizontal inclination angle after self-inspection;
Figure 304394DEST_PATH_IMAGE045
representing the angular speed change value after self-test;
step S5: through Kalman filter pair
Figure 607200DEST_PATH_IMAGE046
Figure 88996DEST_PATH_IMAGE045
Filtering to obtain the final inclination angle
Figure DEST_PATH_IMAGE048
And outputs it.
2. The miniature intelligent tilt sensor of claim 1, wherein the two ends of the level are mounted in the first cavity by fasteners.
3. The miniature intelligent tilt sensor of claim 1, wherein the connector is mounted to the housing by a rubber gasket, wherein a potting process is performed within the connector.
4. The small intelligent tilt sensor according to claim 1, wherein the number of the connectors is two, and the two connectors are arranged side by side, wherein the two connectors are connected to the power panel and the main control panel.
5. The small intelligent tilt sensor according to claim 1, wherein the gyroscope chip and the temperature sensor chip are integrally disposed to form a gyroscope assembly, or the gyroscope chip and the temperature sensor chip are separately disposed.
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