CN111509024B - Display panel, display device and manufacturing method of display panel - Google Patents
Display panel, display device and manufacturing method of display panel Download PDFInfo
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- CN111509024B CN111509024B CN202010372287.6A CN202010372287A CN111509024B CN 111509024 B CN111509024 B CN 111509024B CN 202010372287 A CN202010372287 A CN 202010372287A CN 111509024 B CN111509024 B CN 111509024B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 26
- 238000002955 isolation Methods 0.000 claims abstract description 56
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 239000011248 coating agent Substances 0.000 claims description 50
- 238000000576 coating method Methods 0.000 claims description 50
- 229920002120 photoresistant polymer Polymers 0.000 claims description 24
- 238000005530 etching Methods 0.000 claims description 23
- 239000000463 material Substances 0.000 claims description 18
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 claims description 16
- 238000000034 method Methods 0.000 claims description 13
- 230000001681 protective effect Effects 0.000 claims description 11
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 8
- VZGDMQKNWNREIO-UHFFFAOYSA-N tetrachloromethane Chemical compound ClC(Cl)(Cl)Cl VZGDMQKNWNREIO-UHFFFAOYSA-N 0.000 claims description 8
- 239000007788 liquid Substances 0.000 claims description 6
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 5
- 238000000059 patterning Methods 0.000 claims description 5
- 125000000217 alkyl group Chemical group 0.000 claims description 4
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 claims description 4
- 229940092714 benzenesulfonic acid Drugs 0.000 claims description 4
- 239000012046 mixed solvent Substances 0.000 claims description 4
- 238000001039 wet etching Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 9
- 239000011148 porous material Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 43
- 239000002923 metal particle Substances 0.000 description 6
- 239000011253 protective coating Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 239000011368 organic material Substances 0.000 description 4
- 238000000926 separation method Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000008020 evaporation Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/1201—Manufacture or treatment
Abstract
The invention discloses a display panel, a display device and a manufacturing method of the display panel, so as to improve the display effect of the display panel. The display panel comprises a display area and a non-display area, wherein an opening is arranged in the non-display area; the display panel includes: a substrate; the isolation column is arranged in the non-display area and surrounds the open pore, and is spaced from the flat layer; and the light-emitting layer is arranged on one side of the flat layer and the isolation column, which is away from the substrate.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel, a display device, and a method for manufacturing the display panel.
Background
Organic Light-Emitting Diode (OLED) display devices have been listed as a next generation display technology with great development prospects due to their advantages of thinness, lightness, wide viewing angle, active Light emission, continuous and adjustable Light emission color, low cost, fast response speed, low energy consumption, low driving voltage, wide operating temperature range, simple production process, high Light emission efficiency, flexible display, and the like.
The OLED display panel mainly faces the full-face screen and develops in a narrower frame direction, and in order to further improve the aperture ratio of the display panel, one current scheme is to open a hole in an Active Area (AA Area) of the display panel, which is used for setting a camera, a sensor, or a key of a display device. Because the open mask plate is generally adopted to carry out full vapor deposition on the AA area of the display panel when the electroluminescent layer of the display panel is formed, if holes are formed in the AA area, the isolation column is needed to isolate the luminescent layer between the AA area and the holes so as to prevent water vapor and oxygen from being transmitted to the AA area along the luminescent layer, and the display of the display panel is invalid.
In the prior art, isolation columns made of the same material are formed together when source and drain electrodes are formed, and silver particles are precipitated due to the fact that the exposed isolation columns react with materials for forming anode layers later, and the situation that dark spots are bad in a display panel can be caused by the aggregation of the silver particles around openings, so that the display effect of the display panel is affected.
Disclosure of Invention
The embodiment of the invention aims to provide a display panel, a display device and a manufacturing method of the display panel.
The embodiment of the invention provides a display panel, which comprises a display area and a non-display area, wherein an opening is arranged in the non-display area; the display panel includes:
a substrate;
the isolation column is arranged in the non-display area and surrounds the open pore, and the isolation column is spaced from the flat layer;
the light-emitting layer is arranged on one side of the flat layer, which is away from the substrate, of the isolation column.
Preferably, the display panel further comprises an anode layer located at a side of the flat layer facing away from the substrate, and the anode layer is located in the display area.
Preferably, the display panel further includes a thin film transistor layer structure located on a side of the flat layer and the isolation column, which is close to the substrate.
According to the display panel provided by the embodiment of the invention, the isolation column is formed by adopting the organic material, so that the light-emitting layers of the display area and the non-display area can be reliably isolated, and compared with the prior art, the situation that metal particles are gathered around the non-display area can not be generated, so that the risk of occurrence of a dark spot bad phenomenon of the display panel can be reduced, and the display effect of the display panel is improved.
The embodiment of the invention also provides a display device which comprises the display panel. The display device has good display effect.
The embodiment of the invention also provides a manufacturing method of the display panel, wherein the display panel comprises a display area and a non-display area, and the non-display area is internally provided with an area to be perforated; the manufacturing method comprises the following steps:
forming a flat layer and isolation columns which are made of the same material as the flat layer on the substrate, wherein the flat layer is positioned in the display area, the isolation columns are positioned in the non-display area and are arranged around the area to be perforated, and the isolation columns are spaced from the flat layer;
and forming a light-emitting layer on one side of the flat layer and one side of the isolation column, which is away from the substrate.
Specifically, forming a flat layer and isolation columns made of the same material as the flat layer on the substrate specifically includes:
forming a first layer of coating film on the substrate;
sequentially forming a second layer of coating and a photoresist coating on one side of the first layer of coating away from the substrate;
exposing the photoresist coating film through a mask plate, so that the photoresist coating film is completely exposed in the area except the flat layer and the isolation column;
developing the exposed photoresist coating, etching the second layer coating by using the developed photoresist coating to form a protection coating corresponding to the flat layer and the isolation column, and removing the residual photoresist coating on the protection coating;
and etching the first layer of coating film by taking the protection coating film as a mask to form the flat layer and the isolation column.
Optionally, the material of the second layer of film includes indium tin oxide, and after the flat layer and the isolation column are formed, the manufacturing method further includes:
the protective overcoat is patterned by a patterning process to form an anode layer, the anode layer being located within the display region.
Optionally, etching the first layer of film with the protective film as a mask specifically includes:
and wet etching the first layer coating film by using N-methyl pyrrolidone, dimethyl sulfoxide or a mixed solvent of N-methyl pyrrolidone and dimethyl sulfoxide as etching liquid.
Optionally, etching the first layer of film with the protective film as a mask specifically includes:
and wet etching is carried out on the first layer of coating film by using carbon tetrachloride or alkyl chain benzene sulfonic acid as etching liquid.
Optionally, the second layer of film is made of indium zinc oxide, and after the flat layer and the isolation column are formed, the manufacturing method further includes:
and etching to remove the flat layer and the protective coating on the surface of the isolation column.
According to the manufacturing method of the display panel provided by the embodiment of the invention, the isolation column is formed by adopting the organic material, so that the light-emitting layers of the display area and the non-display area can be reliably isolated, and compared with the prior art, the situation that metal particles are gathered around the non-display area can not be generated, so that the risk of occurrence of bad dark spots of the display panel can be reduced, and the display effect of the display panel can be improved.
Drawings
Fig. 1 is a front view of a display panel according to an embodiment of the present invention;
fig. 2 is a schematic diagram of a partial structure of a display panel according to an embodiment of the present invention;
FIG. 3 is a flowchart of a method for manufacturing a display panel according to an embodiment of the present invention;
FIG. 4 is a flowchart showing the steps of step 101 in FIG. 3;
fig. 5 is a schematic diagram of a manufacturing process of a display panel according to an embodiment of the invention;
FIG. 6 is a schematic diagram of a manufacturing process of step 1014 in FIG. 4;
fig. 7 is a schematic diagram of another manufacturing process of step 1014 in fig. 4.
Reference numerals:
100-display panel 10-display area 20-non-display area 21-aperture 30-substrate
40-isolation column 50-first layer of film 60-flat layer 70-second layer of film
80-photoresist coating film 71-protective coating film 72-anode layer 90-mask plate
Detailed Description
In order to improve the display effect of a display panel, the embodiment of the invention provides a manufacturing method of the display panel, the display panel and a display device. The present invention will be further described in detail with reference to the following examples, in order to make the objects, technical solutions and advantages of the present invention more apparent.
As shown in fig. 1 and fig. 2, a display panel 100 provided in an embodiment of the present invention includes a display area 10 and a non-display area 20, wherein an opening 21 is provided in the non-display area 20; the display panel 100 includes:
a substrate 30;
the flat layer 60 and the isolation column 40 with the same material as the flat layer 60 are arranged on the substrate 30, the flat layer 60 is positioned in the display area 10, the isolation column is positioned in the non-display area 20 and surrounds the opening 21, and the isolation column 40 is spaced from the flat layer 60;
and a light emitting layer disposed on a side of the planarization layer 60 and the isolation column 40 facing away from the substrate 10.
When the light-emitting layer of the OLED display panel is formed, the light-emitting layer comprises a plurality of process layers, wherein all layers except for the corresponding film layer formed by the light-emitting material, which is formed by adopting a high-precision metal mask plate for evaporation, are formed by adopting an open mask plate for overall evaporation of an AA area of the display panel. As shown in fig. 1, in the display panel 100, an opening is provided in the AA area of the display panel 100, and a camera, a sensor, or a key of the display device may be disposed in the opening, where the opening is the non-display area 20 in the embodiment of the present invention. In order to prevent water vapor and oxygen from being transmitted to the display area 10 along the light emitting layer, the display panel 100 is provided with a separation column 40 around the non-display area 20 to separate the light emitting layers of the display area 10 and the non-display area 20, and in the prior art, the separation column 40 is generally formed by using a source-drain layer of a thin film transistor, that is, the separation column 40 is made of a metal material, so that metal particles are separated out from the separation column 40 under the condition of being exposed, and the metal particles gather around the non-display area 20 to cause the display panel 100 to have a dark spot defect.
In the display panel provided by the embodiment of the invention, the isolation column 40 is formed by adopting an organic material, so that the light-emitting layers of the display area 10 and the non-display area 20 can be reliably isolated, and compared with the prior art, the situation that metal particles are gathered around the non-display area 20 can not be generated in the scheme, so that the risk of occurrence of a dark spot bad phenomenon of the display panel 100 can be reduced, and the display effect of the display panel 100 can be improved.
In general, in addition to the above-mentioned light-emitting layer, the structure of the display panel may further include an anode layer 72 disposed between the flat layer 60 and the light-emitting layer, and the anode layer 72 is not disposed on the spacer 40 in order to avoid oxidation due to exposure, in this embodiment, the anode layer 72 is only formed in the display area 10.
It will be appreciated that the display panel may further include a thin film transistor layer structure disposed on a side of the flat layer adjacent to the substrate, and the specific structure, material, etc. of the thin film transistor layer structure are similar to those in the prior art, which will not be repeated herein.
Referring to fig. 3 together, the embodiment of the present application further provides a method for manufacturing a display panel, where the display panel 100 includes a display area 10 and a non-display area 20, and the non-display area 20 has an area to be perforated; the manufacturing method comprises the following steps:
step 101, forming a flat layer 60 and isolation columns 40 with the same material as the flat layer 60 on the substrate 30, wherein the flat layer 60 is positioned in the display area 10, the isolation columns 40 are positioned in the non-display area 20 and are arranged around the area to be perforated, and the isolation columns 40 are spaced from the flat layer 60;
step 102, forming a light emitting layer on the flat layer 60 and the side of the isolation column 40 away from the substrate 30.
According to the manufacturing method of the display panel provided by the embodiment of the invention, the isolation column 40 is formed by adopting an organic material, so that the light-emitting layers of the display area 10 and the non-display area 20 can be reliably isolated, and compared with the prior art, the situation that metal particles are gathered around the non-display area 20 can not be generated, so that the risk of occurrence of bad dark spots of the display panel 100 can be reduced, and the display effect of the display panel 100 can be improved.
It will be appreciated that the openings in the non-display area may be formed after the formation of the respective layer structure of the display panel, and then the respective layer structure of the area to be opened may be removed.
Referring to fig. 4 and 5 together, in an embodiment of the present invention, in order to simplify the manufacturing process of the display panel, the isolation pillars and the flat layer may be formed simultaneously by the same process, specifically, the flat layer and the isolation pillars made of the same material as the flat layer are formed on the substrate, which specifically includes:
step 1011, forming a first layer of coating film 50 on the substrate 30;
step 1012, sequentially forming a second layer of coating 70 and a photoresist coating 80 on the side of the first layer of coating 50 away from the substrate 30;
step 1013, exposing the photoresist coating film 80 through a mask plate, so that the photoresist coating film 80 is completely exposed to the areas except the flat layer 60 and the isolation columns 40;
step 1014, developing the exposed photoresist coating film 80, etching the second coating film 70 by using the developed photoresist coating film 80 to form a protective coating film 71 corresponding to the flat layer 60 and the isolation column 40, and removing the residual photoresist coating film 80 on the protective coating film 71;
step 1015, etching the first layer of film 50 with the protective film 71 as a mask to form the planarization layer 60 and the isolation pillars 40.
Since the material of the planarization layer 60 is relatively similar to that of the photoresist, if the photoresist is used as a protection mask to etch the planarization layer 60, the photoresist may be etched away together, thereby affecting the accuracy of the patterns of the planarization layer 60 and the isolation pillars 40 that are finally formed. In the embodiment of the invention, the second layer coating 70 with different materials is arranged on the first layer coating 50, and the first layer coating 50 is etched by taking the protective coating 71 formed after the second layer coating 70 is etched as a mask, so that the problems can be avoided, the accuracy of the patterns of the flat layer 60 and the isolation column 40 can be improved, and the quality of the display panel can be further improved.
The specific material of the second layer of film is not limited, for example, in one embodiment of the present invention, the material of the second layer of film includes indium tin oxide, and in this case, referring to fig. 5 and 6 together, after forming the planarization layer 60 and the isolation column 40, the manufacturing method further includes:
the protective overcoat 71 is patterned by a patterning process to form an anode layer 72.
In the structure of the OLED display panel, at least the anode layer 72 is generally further included between the flat layer 60 and the light emitting layer, and since the anode layer 72 formed after the flat layer 60 is generally made of indium tin oxide, the second layer coating 70 is made of indium tin oxide, which not only can function as a protection mask when forming the flat layer 60 and the spacers 40, but also can be used to form the anode layer 72, thereby simplifying the manufacturing process of the display panel. It should be noted that, in this step, the patterning process for forming the anode layer 72 is similar to the patterning process for forming the isolation column 40, and will not be repeated here.
In the foregoing embodiment, when the first layer film 50 is etched to form the flat layer 60 and the isolation pillars 40, the etching solution may be an organic single solvent with strong solubility, such as N-methylpyrrolidone or dimethyl sulfoxide, or a mixed solvent of N-methylpyrrolidone and dimethyl sulfoxide, which is not particularly limited in the present invention. In specific implementation, referring to fig. 6, the etching the first layer of the film 50 with the protective film 71 as a mask includes:
the first layer film 50 is wet etched using N-methylpyrrolidone, dimethylsulfoxide, or a mixed solvent of N-methylpyrrolidone and dimethylsulfoxide as an etching liquid.
Of course, the etching solution may also be a photoresist stripping solution commonly used in photoresist, such as carbon tetrachloride or alkyl chain benzene sulfonic acid, and at this time, the etching of the first layer of film 50 with the protective film as a mask specifically includes:
the first layer film 50 is wet etched using carbon tetrachloride or alkyl chain benzene sulfonic acid as an etching liquid.
In another embodiment of the present invention, the second layer of film may be made of an indium zinc oxide material, and in this case, referring to fig. 7, after forming the planarization layer 60 and the isolation pillars 40, the manufacturing method further includes:
the protective coating 71 on the surface of the planarization layer 60 and the isolation column 40 is etched away.
In this embodiment, when the first layer film 50 is etched to form the flat layer 60 and the isolation pillars 40, the etching may be performed by a dry etching process, and in a specific implementation, the etching of the first layer film 50 with the protective film 71 as a mask specifically includes: the first coating film 50 is dry etched.
The embodiment of the invention also provides a display device which comprises the display panel of the scheme. The display device has good display effect.
It will be apparent to those skilled in the art that various modifications and variations can be made to the present invention without departing from the spirit or scope of the invention. Thus, it is intended that the present invention also include such modifications and alterations insofar as they come within the scope of the appended claims or the equivalents thereof.
Claims (3)
1. The manufacturing method of the display panel comprises a display area and a non-display area, wherein the non-display area is internally provided with an area to be perforated; the manufacturing method is characterized by comprising the following steps:
forming a flat layer and isolation columns which are made of the same material as the flat layer on a substrate, wherein the flat layer is positioned in the display area, the isolation columns are positioned in the non-display area and are arranged around the area to be perforated, and the isolation columns are spaced from the flat layer;
forming a light-emitting layer on one side of the flat layer and one side of the isolation column, which is away from the substrate;
forming a flat layer and isolation columns with the same material as the flat layer on the substrate, wherein the isolation columns specifically comprise:
forming a first layer of coating film on the substrate;
sequentially forming a second layer of coating and a photoresist coating on one side of the first layer of coating away from the substrate;
exposing the photoresist coating film through a mask plate, so that the photoresist coating film is completely exposed in the area except the flat layer and the isolation column;
developing the exposed photoresist coating, etching the second layer coating by using the developed photoresist coating to form a protection coating corresponding to the flat layer and the isolation column, and removing the residual photoresist coating on the protection coating;
etching the first layer of coating film by taking the protection coating film as a mask to form the flat layer and the isolation column;
the material of the second layer coating comprises indium tin oxide, and after the flat layer and the isolation column are formed, the manufacturing method further comprises the following steps:
the protective overcoat is patterned by a patterning process to form an anode layer, the anode layer being located within the display region.
2. The method of claim 1, wherein etching the first layer of film with the protective film as a mask, specifically comprises:
and wet etching the first layer coating film by using N-methyl pyrrolidone, dimethyl sulfoxide or a mixed solvent of N-methyl pyrrolidone and dimethyl sulfoxide as etching liquid.
3. The method of claim 1, wherein etching the first layer of film with the protective film as a mask, specifically comprises:
and wet etching is carried out on the first layer of coating film by using carbon tetrachloride or alkyl chain benzene sulfonic acid as etching liquid.
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| CN202010372287.6A CN111509024B (en) | 2020-05-06 | 2020-05-06 | Display panel, display device and manufacturing method of display panel |
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| CN202010372287.6A CN111509024B (en) | 2020-05-06 | 2020-05-06 | Display panel, display device and manufacturing method of display panel |
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