CN111487162A - Device for measuring liquid viscosity coefficient by capillary method - Google Patents
Device for measuring liquid viscosity coefficient by capillary method Download PDFInfo
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- CN111487162A CN111487162A CN202010405882.5A CN202010405882A CN111487162A CN 111487162 A CN111487162 A CN 111487162A CN 202010405882 A CN202010405882 A CN 202010405882A CN 111487162 A CN111487162 A CN 111487162A
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- 239000007788 liquid Substances 0.000 title claims abstract description 133
- 238000000034 method Methods 0.000 title claims abstract description 34
- 230000001939 inductive effect Effects 0.000 claims abstract description 39
- 238000010438 heat treatment Methods 0.000 claims abstract description 38
- 239000004065 semiconductor Substances 0.000 claims description 50
- 238000005057 refrigeration Methods 0.000 claims description 35
- 238000001816 cooling Methods 0.000 claims description 24
- 238000006243 chemical reaction Methods 0.000 claims description 11
- 238000002955 isolation Methods 0.000 claims description 9
- 238000001802 infusion Methods 0.000 claims description 7
- 238000004321 preservation Methods 0.000 claims description 7
- 230000017525 heat dissipation Effects 0.000 claims description 6
- 230000005855 radiation Effects 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 4
- 239000011521 glass Substances 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 7
- 238000010586 diagram Methods 0.000 description 9
- 230000006698 induction Effects 0.000 description 7
- 239000012071 phase Substances 0.000 description 7
- 238000002474 experimental method Methods 0.000 description 5
- 239000004973 liquid crystal related substance Substances 0.000 description 5
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- 238000009413 insulation Methods 0.000 description 2
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- 230000001419 dependent effect Effects 0.000 description 1
- 230000001976 improved effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
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- 239000007790 solid phase Substances 0.000 description 1
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- G01N11/00—Investigating flow properties of materials, e.g. viscosity, plasticity; Analysing materials by determining flow properties
- G01N11/02—Investigating flow properties of materials, e.g. viscosity, plasticity; Analysing materials by determining flow properties by measuring flow of the material
- G01N11/04—Investigating flow properties of materials, e.g. viscosity, plasticity; Analysing materials by determining flow properties by measuring flow of the material through a restricted passage, e.g. tube, aperture
- G01N11/06—Investigating flow properties of materials, e.g. viscosity, plasticity; Analysing materials by determining flow properties by measuring flow of the material through a restricted passage, e.g. tube, aperture by timing the outflow of a known quantity
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- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/20—Control of temperature characterised by the use of electric means with sensing elements having variation of electric or magnetic properties with change of temperature
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Abstract
The invention relates to a device for measuring liquid viscosity coefficient by using a capillary method, which comprises a heat-insulating outer cover body, a measuring system and a temperature control system; the measuring system comprises a first liquid tank, a second liquid tank and a liquid pump, wherein a first inductive switch is arranged on the side wall of the first liquid tank, the bottom of the first liquid tank is communicated with a first liquid conveying pipe, a first electromagnetic valve is arranged on the first liquid conveying pipe, the tail end of the first liquid conveying pipe is fixedly connected with a horizontally arranged capillary pipe, a vertically arranged measuring cylinder is arranged below the tail end of the capillary pipe, a second inductive switch and a third inductive switch are arranged on the side wall of the measuring cylinder, liquid in the measuring cylinder can enter the second liquid tank, and the liquid pump is respectively connected with the first liquid tank and the second liquid tank through pipelines; the second inductive switch, the third inductive switch and the temperature sensor are electrically connected with the single chip microcomputer, and the single chip microcomputer is electrically connected with the first heating module, the second heating module, the first refrigerating module and the second refrigerating module. The invention can measure the viscosity coefficients of the liquid at different temperatures, and has small measurement error.
Description
Technical Field
The invention belongs to the technical field of physical coefficient measuring devices, and particularly relates to a device for measuring liquid viscosity coefficient by using a capillary method.
Background
The determination of the viscosity coefficient of the liquid is one of the important thermal experiments in the course of college physics experiments. There are many ways to determine the viscosity coefficient of a liquid, such as: (1) capillary method using Poiseul's law; (2) a rotating cylinder method utilizing Newton's law of viscosity; (3) a falling sphere method using stokes' formula; (4) the viscosity coefficient was determined by observing the damped vibrations.
The experimental principle of measuring the viscosity coefficient by using the capillary method is that liquid flows through a capillary, the flow V of the liquid flowing through the cross section area of the capillary within a certain time t is measured, and the viscosity coefficient η representing the viscosity of the liquid is obtained according to a Poiseul formula, wherein the formula is as follows:
d is the diameter of the capillary tube measured by a reading microscope, the length l of the capillary tube is a fixed value, so that the viscosity coefficient η of the liquid can be obtained by measuring the time t, the flow rate V of the liquid and the pressure difference deltap at two ends of the capillary tube by using the experimental device of the capillary tube method.
Experiments show that the flow form of the fluid depends on the Reynolds number Re, and for a straight pipe with a smooth inner wall, when Re is less than 1000, the fluid belongs to laminar flow; when Re is greater than 1000, it is turbulent. The reynolds number Re is proportional to the diameter of the capillary, the fluid density and the average flow rate, and inversely proportional to the viscosity of the fluid. The Poiseuille formula is applicable to the situation that liquid makes laminar flow motion in a capillary. For different liquids, when the viscosity coefficients are calculated by using a Poiseuille formula, capillaries with different inner diameters are applied to meet the condition of laminar flow motion. Furthermore, the viscosity of the liquid is temperature dependent, and the viscosity of the liquid decreases almost exponentially with increasing temperature.
At present, instruments for measuring the viscosity coefficient of a liquid by a capillary method on the market are basically absent, and even if such instruments are available, the viscosity of the liquid at room temperature can be generally measured.
Therefore, based on the problems, the device for measuring the viscosity coefficient of the liquid can measure the viscosity coefficient of the liquid at different temperatures by using the capillary method, and has important practical significance.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a liquid viscosity coefficient measuring device which can measure the viscosity coefficients of liquids at different temperatures by using a capillary method and has small measurement error.
The technical problem to be solved by the invention is realized by adopting the following technical scheme:
the device for measuring the liquid viscosity coefficient by using the capillary method comprises a temperature control system, a heat-preservation outer cover body and a measuring system positioned in the heat-preservation outer cover body; the measuring system comprises a first liquid tank, a second liquid tank and a liquid pump, wherein a first inductive switch is arranged on the side wall of the first liquid tank, the bottom of the first liquid tank is communicated with a first liquid conveying pipe, the first liquid conveying pipe is provided with a first electromagnetic valve, the tail end of the first transfusion tube is fixedly connected with a capillary tube which is horizontally arranged, a measuring cylinder which is vertically arranged is arranged below the tail end of the capillary tube, the liquid in the first liquid tank can enter the capillary through the tail end of the first liquid conveying pipe and finally flows into the measuring cylinder, a second inductive switch and a third inductive switch are arranged on the side wall of the measuring cylinder, the tail end of the measuring cylinder is communicated with a second infusion tube, a second electromagnetic valve is arranged on the second infusion tube, the liquid in the measuring cylinder can enter the second liquid tank through the tail end of the second infusion tube, the liquid pump is respectively connected with the first liquid tank and the second liquid tank through pipelines, so that liquid in the second liquid tank can enter the first liquid tank through the liquid pump;
the temperature control system comprises a single chip microcomputer, a first heating module, a second heating module, a first refrigerating module, a second refrigerating module and a temperature sensor, wherein the temperature sensor is located inside the heat-preservation outer cover body, a second inductive switch, a third inductive switch and the temperature sensor are electrically connected with the single chip microcomputer, and the single chip microcomputer is electrically connected with the first heating module, the second heating module, the first refrigerating module and the second refrigerating module and can control the work of the first heating module, the second heating module, the first refrigerating module and the second refrigerating module.
Further, first module of heating includes first PTC hot plate and first heat conduction fan, first heat conduction fan is installed first PTC hot plate one side, the second module of heating includes second PTC hot plate and second heat conduction fan, second heat conduction fan is installed second PTC hot plate one side, the singlechip with first PTC hot plate, first heat conduction fan, second PTC hot plate, second heat conduction fan are all connected and can be controlled its work electrically.
Further, the first refrigeration module comprises a first semiconductor refrigeration sheet, a third semiconductor refrigeration sheet, a first cold guide fan, a third cold guide fan, a first cooling fan and a third cooling fan; the first cold guide fan is arranged at the cold end of the first semiconductor refrigeration piece, and the first heat radiation fan is arranged at the hot end of the first semiconductor refrigeration piece; the third cold guide fan is arranged at the cold end of the third semiconductor refrigerating sheet, and the third heat radiation fan is arranged at the hot end of the third semiconductor refrigerating sheet; the single chip microcomputer is connected with a first solid-state relay through an isolation and level conversion circuit, the first solid-state relay is connected with a first direct-current power supply, and the first direct-current power supply is connected with a first semiconductor refrigerating sheet, a third semiconductor refrigerating sheet, a first cold guide fan, a third cold guide fan, a first cooling fan and a third cooling fan;
the second refrigeration module comprises a second semiconductor refrigeration piece, a fourth semiconductor refrigeration piece, a second cold guide fan, a fourth cold guide fan, a second heat dissipation fan and a fourth heat dissipation fan; the second cold guide fan is arranged at the cold end of the second semiconductor refrigerating sheet, and the second heat radiation fan is arranged at the hot end of the second semiconductor refrigerating sheet; the fourth cold guide fan is arranged at the cold end of the fourth semiconductor refrigerating sheet, and the fourth heat radiating fan is arranged at the hot end of the fourth semiconductor refrigerating sheet; the single chip microcomputer is connected with a second solid-state relay through an isolation and level conversion circuit, the second solid-state relay is connected with a second direct-current power supply, and the second direct-current power supply is connected with a second semiconductor refrigerating sheet, a fourth semiconductor refrigerating sheet, a second cold guide fan, a fourth cold guide fan, a second cooling fan and a fourth cooling fan.
Furthermore, the first inductive switch is connected with a third solid-state relay through an isolation and level conversion circuit, the third solid-state relay is connected with the liquid pump, and the liquid pump and the third solid-state relay are both connected with the power supply.
Furthermore, the first heating module and the second heating module, and the first refrigerating module and the second refrigerating module are symmetrically arranged on two sides of the measuring system.
Further, the intelligent control system also comprises a display screen and an input module, wherein the display screen and the input module are electrically connected with the single chip microcomputer.
Further, the first infusion tube is a plastic hose.
Furthermore, the heat-insulation outer cover body is provided with a switchable heat-insulation glass door.
Furthermore, the first inductive switch, the second inductive switch and the third inductive switch are all float-type metal inductive switches.
The invention has the advantages and positive effects that:
the temperature control system is added, so that the viscosity coefficients of the liquid at different temperatures can be measured, the temperature control is realized by adopting the single chip microcomputer module, the method is advanced, and the precision is high; in order to realize stable cooling, the semiconductor refrigerating sheet adopts hierarchical control, so that energy is saved; in addition, the capillary tubes with different inner diameters can be replaced to measure the viscosity of different liquids; the liquid pump can be used for recycling the liquid to be tested in the system, and multiple experiments can be carried out under the same experiment condition; the metal inductive switch and the single chip microcomputer are adopted to realize automatic measurement, so that the efficiency is improved, and the experimental error is reduced.
Drawings
The technical solutions of the present invention will be described in further detail below with reference to the accompanying drawings and examples, but it should be understood that these drawings are designed for illustrative purposes only and thus do not limit the scope of the present invention. Furthermore, unless otherwise indicated, the drawings are intended to be illustrative of the structural configurations described herein and are not necessarily drawn to scale.
FIG. 1 is a schematic structural diagram of an apparatus for measuring viscosity index of a liquid by a capillary method according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a control circuit of a single chip microcomputer of the device for measuring the liquid viscosity coefficient by using a capillary method according to the embodiment of the invention;
FIG. 3 is a schematic diagram of a circuit connection structure of a temperature control system of an apparatus for measuring viscosity coefficient of a liquid by a capillary method according to an embodiment of the present invention;
FIG. 4 is a schematic diagram of a circuit connection structure of an apparatus for measuring liquid viscosity coefficient by a capillary method for maintaining a constant liquid level in a first liquid tank according to an embodiment of the present invention;
Detailed Description
First, it should be noted that the specific structures, features, advantages, etc. of the present invention will be specifically described below by way of example, but all the descriptions are for illustrative purposes only and should not be construed as limiting the present invention in any way. Furthermore, any single feature described or implicit in any embodiment or any single feature shown or implicit in any drawing may still be combined or subtracted between any of the features (or equivalents thereof) to obtain still further embodiments of the invention that may not be directly mentioned herein. In addition, for the sake of simplicity, the same or similar features may be indicated in only one place in the same drawing.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or the orientations or positional relationships that the products of the present invention are conventionally placed in use, and are only used for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention. It should be noted that the embodiments and features of the embodiments in the present application may be combined with each other without conflict.
The present invention will be described in detail with reference to fig. 1 to 4.
Fig. 1 is a schematic structural diagram of a device for measuring a liquid viscosity coefficient by using a capillary method according to an embodiment of the present invention, fig. 2 is a schematic structural diagram of a circuit control circuit of a device for measuring a liquid viscosity coefficient by using a capillary method according to an embodiment of the present invention, fig. 3 is a schematic structural diagram of a circuit connection structure of a temperature control system of a device for measuring a liquid viscosity coefficient by using a capillary method according to an embodiment of the present invention, fig. 4 is a schematic structural diagram of a circuit connection structure of a device for measuring a liquid viscosity coefficient by using a capillary method according to an embodiment of the present invention, fig. 1-4 is a schematic structural diagram of a circuit connection structure of a device for measuring a liquid viscosity coefficient by using a capillary method according to an embodiment of the present invention, the device for measuring a liquid viscosity coefficient by using a capillary method according to an embodiment of the present invention includes a temperature control system, a heat-insulating outer cover B and a measurement system a located inside the heat-insulating outer cover B, the measurement system a includes a first liquid tank W1, a second liquid tank W2 and a liquid pump SB, a first inductive switch J1 is provided on a side wall of the first liquid tank W1, a bottom of the first liquid tank W1 is connected to a first liquid transfer tube R, a first liquid transfer tube 36r 1, a first liquid transfer tube is provided with a first liquid transfer tube 36r 1, a second liquid tank W cylinder 3659r cylinder 363636363636363636363636 2, a second liquid transfer tube 3636363636363636363636363636363636363636363636363680 is provided with a fixed with a second liquid pump, a second liquid metering cylinder 36363636363636363636363636363636363636363636363636363636363636363636;
the temperature control system comprises a single chip microcomputer U1, a first heating module ZR1, a second heating module ZR2, a first refrigerating module Z L1, a second refrigerating module Z L2 and a temperature sensor CW, wherein the temperature sensor CW is located inside a heat-preservation outer cover body B, a second inductive switch J2, a third inductive switch J3 and the temperature sensor CW are electrically connected with the single chip microcomputer U1, and the single chip microcomputer U1 is electrically connected with the first heating module ZR1, the second heating module ZR2, the first refrigerating module Z L1 and the second refrigerating module Z L2 and can control the work of the first heating module, the second refrigerating module Z L and the temperature sensor CW.
In the embodiment, an implementation structure of a temperature rising part in a temperature control module is shown as 302 in fig. 3, a first heating module ZR1 includes a first PTC heating plate 1 and a first heat conduction fan 2, the first heat conduction fan 2 is installed on one side of the first PTC heating plate 1, a second heating module ZR2 includes a second PTC heating plate 3 and a second heat conduction fan 4, the second heat conduction fan 4 is installed on one side of the second PTC heating plate 3, the single-chip microcomputer U1 is electrically connected with the first PTC heating plate 1, the first heat conduction fan 2, the second PTC heating plate 3 and the second heat conduction fan 4 and can control the operation thereof, an input end of a digital potentiometer 5 is connected with a control signal Z1 output from an I/O port of a single-chip microcomputer, an output end is connected with a control terminal of a solid-state voltage regulator 6 and a control terminal of a solid-state voltage regulator 7, one output end of the solid-state 6 is connected with the first PTC heating plate 1, the other output end of the solid-state heat conduction fan 6 is connected with a live wire 220V live wire, the other output end of the solid-state PTC heating plate 6 is connected with a live wire 220V live wire, the zero wire 220V, the zero wire, the output end of the solid-state fan 220V-phase control circuit, the zero wire 220 is connected with a solid-phase control circuit according to a common-phase control signal input terminal of a common-phase control circuit P-line control circuit P-temperature regulator P-switch, a single-phase control circuit P-switch circuit, a single-phase switch circuit P-switch circuit, a single-phase switch circuit, a single-switch circuit, a single-circuit switch circuit, a single-circuit switch circuit is connected with a single-circuit, a single-circuit switch circuit, a single-switch circuit, a single-circuit switch circuit, a single-circuit switch circuit, a single-circuit switch circuit, a single-switch.
In this embodiment, a cooling portion in a temperature control module is implemented as a portion 303 in fig. 3, the first refrigeration module Z L1 includes a first semiconductor chilling plate 9, a third semiconductor chilling plate 10, a first cold-conducting fan 11, a third cold-conducting fan 12, a first cooling fan 13, and a third cooling fan 14, the first cold-conducting fan 11 is installed at a cold end of the first semiconductor chilling plate 9, the first cooling fan 13 is installed at a hot end of the first semiconductor chilling plate 9, the third cold-conducting fan 12 is installed at a cold end of the third semiconductor chilling plate 10, the third cold-conducting fan 14 is installed at a hot end of the third semiconductor chilling plate 10, the single chip microcomputer U1 is connected with a first solid-state relay 15 through an isolation and level conversion circuit, the first solid-state relay 15 is connected with a first dc power supply 16, and the first dc power supply 16 is connected with the first semiconductor chilling plate 9, the third semiconductor chilling plate 10, the first cold-conducting fan 11, the third cold-conducting fan 12, the first cooling fan 13, and the third cooling fan 14;
the second refrigeration module Z L comprises a second semiconductor refrigeration piece 17, a fourth semiconductor refrigeration piece 18, a second cold-conducting fan 19, a fourth cold-conducting fan 20, a second cooling fan 21 and a fourth cooling fan 22, the second cold-conducting fan 19 is installed at the cold end of the second semiconductor refrigeration piece 17, the second cooling fan 21 is installed at the hot end of the second semiconductor refrigeration piece 17, the fourth cold-conducting fan 20 is installed at the cold end of the fourth semiconductor refrigeration piece 19, the fourth cooling fan 22 is installed at the hot end of the fourth semiconductor refrigeration piece 19, the singlechip U1 is connected with the second solid-state relay 23 through an isolation and level conversion circuit, the second solid-state relay 23 is connected with the second direct current power supply 24, the second direct current power supply 24 is connected with the second semiconductor refrigeration piece 17, the fourth semiconductor refrigeration piece 19, the second cold-conducting fan 19, the fourth cold-conducting fan 20, the second cooling fan 21 and the fourth cooling fan 22, the first refrigeration module Z L, the second refrigeration module Z2 is specifically implemented as a solid-state refrigeration piece, the first refrigeration piece, the second refrigeration piece is connected with the second semiconductor refrigeration piece, the second refrigeration piece, the refrigeration piece, the refrigeration.
In this embodiment, it is considered that the first inductive switch, the second inductive switch, and the third inductive switch all use float-type metal inductive switches, the first inductive switch J1 is connected to the third solid-state relay 25 through an isolation and level conversion circuit, the third solid-state relay 25 is connected to the liquid pump SB, and the liquid pump SB and the third solid-state relay 25 are both connected to the power supply, in this embodiment, a circuit structure for maintaining the liquid level of the first liquid tank W1 constant is shown in fig. 4, the dc output end of the first inductive switch J1 is connected to the input end of the module U0, the third solid-state relay 25 uses a single-phase dc control ac solid-state relay, the output end of the module U0 is connected to the control end of the third solid-state relay 25, one end of the ac output end of the third solid-state relay 25 is connected to the ac220V neutral line, the other end of the liquid pump SB power supply is connected to one end of the liquid pump SB power supply, the other end of the liquid pump SB power supply is connected to the ac220V live line, when the float B25 deviates from the first inductive switch J3 inductive range, the first inductive switch J1 is disconnected, the inductive switch J0, the solid-state relay is switched on, the solid-state relay is switched to the solid-state relay U9625, the solid-state relay B switch T9 is switched to the solid-state relay B9, the liquid pump SB, the float-state relay B9 is switched to the solid-state relay B switch, the float-state relay B9 is switched to the solid-state relay B9 is switched to the solid-state relay B9, the float-state relay B19 is switched to the float-state relay B9.
And, in order to make the temperature increase or decrease more uniform, it may be considered that the first and second heating modules ZR1 and ZR2 and the first and second cooling modules Z L1 and Z L2 are symmetrically installed at both sides of the measuring system.
In addition, the intelligent control system also comprises a display screen U4 and an input module U5, wherein the display screen U4 and the input module U5 are electrically connected with the single chip microcomputer U1; as shown in the 203 part of fig. 2, the temperature sensor CW is connected with the I/O port of the single chip microcomputer U0, the ambient temperature measured by the temperature sensor CW is displayed on the display screen U4, and the logic control program used by the temperature sensor CW for measuring the experimental ambient temperature and displaying the experimental ambient temperature on the display screen U4 is a general program; the temperature setting circuit structure is shown as part 202 in fig. 2, an input module U5 for setting temperature is connected with an I/O port of a singlechip U1, the temperature setting range is 5-50 ℃, the set experimental environment temperature is displayed on a display screen U4, and a logic control program used for setting temperature and displaying the temperature on the display screen U4 is a general program.
It is considered that the first infusion tube is a plastic hose, and when air exists in the capillary tube M and the liquid in the capillary tube M flows smoothly, the first infusion tube R1 is squeezed to be eliminated.
It can be considered that when different liquid is measured by using capillaries with different inner diameters, the capillaries with the same outer diameter and different inner diameters are adopted, so that the capillaries can be conveniently connected with the plastic hose R.
The heat-insulating outer cover body is provided with a switchable heat-insulating glass door (not shown in the figure), so that the experimental process can be visually seen, and capillaries with different inner diameters can be replaced.
For example, in this embodiment, a circuit structure for measuring a liquid flow rate V and a used time T is shown in a portion 201 in fig. 2, a volumetric difference between measuring cylinders corresponding to positions where induction switches J2 and J2 are fixed is a flow rate to be measured, a direct current output end of a second induction switch J2 is connected to an input end of a module U2, an output end of the module U2 is connected to an I/O port of the single chip U2, a direct current output end of a third induction switch J2 is connected to an input end of the module U2, an output end of the module U2 is connected to the I/O port of the single chip U2, when a float B2 moves to an induction range of the second induction switch J2, the third induction switch J2 is turned on, a state change signal is isolated by the module U2, the state change signal is input to the I/O port of the single chip U2 after the common level conversion, the U2 starts the timing, when the float B2 moves to the third induction switch J2, the state change signal is input to the I/O port of the single chip U2 after the common level conversion, a time display circuit is a time display screen display circuit for displaying a time T2, a time display screen for displaying a liquid crystal display screen for displaying a time T2, wherein a time display screen for an optical display unit for displaying a liquid crystal display unit P used by an optical display screen for displaying a liquid crystal display unit P used by an optical display unit P7 is used by an optical display screen for displaying a TFT U2, a liquid crystal display screen for displaying a liquid crystal display unit P7.
In the specific measurement, the workflow is as follows:
1. calculating the Reynolds number under the experimental condition, selecting capillaries with different inner diameters, 2, starting up, enabling a liquid pump to work, keeping the liquid level in a first liquid tank W1 constant, 3, setting the experimental environment temperature through a key, detecting the temperature of a system through a temperature sensor CW, enabling a temperature control system to work, stabilizing the system temperature at a set value, 4, opening a first electromagnetic valve F1, closing a second electromagnetic valve F2, enabling the liquid to be detected to flow through the capillary M and be stored in a measuring cylinder L, detecting the upper line and the lower line of the liquid level through proximity switches J2 and J3, recording the flow V and the used time t by a single chip microcomputer, displaying the flow V on a display screen U4, 6, closing F1, opening F2, collecting the liquid to be detected in L to W2, 7, shutting down, stopping the liquid pump, and repeating the operation steps when the measurement is repeated.
The present invention has been described in detail with reference to the above examples, but the description is only for the preferred examples of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (9)
1. Utilize capillary method to measure device of liquid viscosity coefficient, its characterized in that: the temperature control device comprises a temperature control system, a heat preservation outer cover body and a measuring system positioned in the heat preservation outer cover body; the measuring system comprises a first liquid tank, a second liquid tank and a liquid pump, wherein a first inductive switch is arranged on the side wall of the first liquid tank, the bottom of the first liquid tank is communicated with a first liquid conveying pipe, a first electromagnetic valve is arranged on the first liquid conveying pipe, the tail end of the first liquid conveying pipe is fixedly connected with a horizontally arranged capillary pipe, a vertically arranged measuring cylinder is arranged below the tail end of the capillary pipe, a second inductive switch and a third inductive switch are arranged on the side wall of the measuring cylinder, the tail end of the measuring cylinder is communicated with a second liquid conveying pipe, a second electromagnetic valve is arranged on the second liquid conveying pipe, liquid in the measuring cylinder can enter the second liquid tank through the tail end of the second liquid conveying pipe, and the liquid pump is respectively connected with the first liquid tank and the second liquid tank through pipelines, so that the liquid in the second liquid tank;
the temperature control system comprises a single chip microcomputer, a first heating module, a second heating module, a first refrigerating module, a second refrigerating module and a temperature sensor, wherein the temperature sensor is located inside the heat-preservation outer cover body, a second inductive switch, a third inductive switch and the temperature sensor are electrically connected with the single chip microcomputer, and the single chip microcomputer is electrically connected with the first heating module, the second heating module, the first refrigerating module and the second refrigerating module and can control the work of the first heating module, the second heating module, the first refrigerating module and the second refrigerating module.
2. The apparatus for measuring viscosity of liquid by capillary method as claimed in claim 1, wherein: first heating module includes first PTC hot plate and first heat conduction fan, first heat conduction fan is installed first PTC hot plate one side, the second heating module includes second PTC hot plate and second heat conduction fan, second heat conduction fan is installed second PTC hot plate one side, the singlechip with first PTC hot plate, first heat conduction fan, second PTC hot plate, the equal electricity of second heat conduction fan are connected and steerable its work.
3. The apparatus for measuring viscosity coefficient of liquid by capillary method according to claim 1 or 2, wherein: the first refrigeration module comprises a first semiconductor refrigeration piece, a third semiconductor refrigeration piece, a first cold guide fan, a third cold guide fan, a first heat dissipation fan and a third heat dissipation fan; the first cold guide fan is arranged at the cold end of the first semiconductor refrigeration piece, and the first heat radiation fan is arranged at the hot end of the first semiconductor refrigeration piece; the third cold guide fan is arranged at the cold end of the third semiconductor refrigerating sheet, and the third heat radiation fan is arranged at the hot end of the third semiconductor refrigerating sheet; the single chip microcomputer is connected with a first solid-state relay through an isolation and level conversion circuit, the first solid-state relay is connected with a first direct-current power supply, and the first direct-current power supply is connected with a first semiconductor refrigerating sheet, a third semiconductor refrigerating sheet, a first cold guide fan, a third cold guide fan, a first cooling fan and a third cooling fan;
the second refrigeration module comprises a second semiconductor refrigeration piece, a fourth semiconductor refrigeration piece, a second cold guide fan, a fourth cold guide fan, a second heat dissipation fan and a fourth heat dissipation fan; the second cold guide fan is arranged at the cold end of the second semiconductor refrigerating sheet, and the second heat radiation fan is arranged at the hot end of the second semiconductor refrigerating sheet; the fourth cold guide fan is arranged at the cold end of the fourth semiconductor refrigerating sheet, and the fourth heat radiating fan is arranged at the hot end of the fourth semiconductor refrigerating sheet; the single chip microcomputer is connected with a second solid-state relay through an isolation and level conversion circuit, the second solid-state relay is connected with a second direct-current power supply, and the second direct-current power supply is connected with a second semiconductor refrigerating sheet, a fourth semiconductor refrigerating sheet, a second cold guide fan, a fourth cold guide fan, a second cooling fan and a fourth cooling fan.
4. The apparatus for measuring viscosity of liquid by capillary method as claimed in claim 1, wherein: the first inductive switch is connected with a third solid-state relay through an isolation and level conversion circuit, the third solid-state relay is connected with the liquid pump, and the liquid pump and the third solid-state relay are both connected with the power supply.
5. The apparatus for measuring viscosity of liquid by capillary method as claimed in claim 3, wherein: the first heating module and the second heating module, and the first refrigerating module and the second refrigerating module are symmetrically arranged on two sides of the measuring system.
6. The apparatus for measuring viscosity of liquid by capillary method as claimed in claim 1, wherein: the display screen and the input module are electrically connected with the single chip microcomputer.
7. The apparatus for measuring viscosity of liquid by capillary method as claimed in claim 1, wherein: the first infusion tube is a plastic hose.
8. The apparatus for measuring viscosity of liquid by capillary method as claimed in claim 1, wherein: the heat-insulating outer cover body is provided with a switchable heat-insulating glass door.
9. The apparatus for measuring viscosity of liquid by capillary method as claimed in claim 1, wherein: the first inductive switch, the second inductive switch and the third inductive switch are all float type metal inductive switches.
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