CN111487011B - Pressure chip baking method and device and readable storage medium - Google Patents

Pressure chip baking method and device and readable storage medium Download PDF

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CN111487011B
CN111487011B CN202010329755.1A CN202010329755A CN111487011B CN 111487011 B CN111487011 B CN 111487011B CN 202010329755 A CN202010329755 A CN 202010329755A CN 111487011 B CN111487011 B CN 111487011B
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baking
pressure chip
parameter
value
current
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CN111487011A (en
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孙延娥
付博
方华斌
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Goertek Microelectronics Inc
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L27/00Testing or calibrating of apparatus for measuring fluid pressure
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2829Testing of circuits in sensor or actuator systems
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/282Testing of electronic circuits specially adapted for particular applications not provided for elsewhere
    • G01R31/2831Testing of materials or semi-finished products, e.g. semiconductor wafers or substrates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2855Environmental, reliability or burn-in testing
    • G01R31/2872Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
    • G01R31/2874Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
    • G01R31/2875Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating

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  • Health & Medical Sciences (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Measuring Fluid Pressure (AREA)

Abstract

The invention provides a baking method and equipment of a pressure chip and a readable storage medium, wherein the baking method of the pressure chip comprises the steps of obtaining the current baking parameter of the pressure chip, obtaining the change value corresponding to the current baking parameter according to the mapping relation between the preset baking parameter and the change value of the pressure chip, wherein the change value is the difference value between the precision value of the pressure chip before baking and the precision value after baking, and determining that the pressure chip is in a stable state when the change value corresponding to the current baking parameter is in a preset range, namely the technical scheme provided by the invention can obtain the change value corresponding to the current baking parameter to be in the preset range by obtaining the current baking parameter and the mapping relation between the preset baking parameter and the change value of the pressure chip to determine that the pressure chip is in the stable state, thereby speeding up the recovery time and production cycle of the pressure chip.

Description

Pressure chip baking method and device and readable storage medium
Technical Field
The invention relates to the field of air pressure sensors, in particular to a baking method and baking equipment of a pressure chip and a readable storage medium.
Background
At present, the demand for miniaturized waterproof barometers on smart devices is increasing. In the actual manufacturing process of the waterproof barometer, the pressure chip used in the waterproof barometer is sensitive to temperature, so that the sensitive membrane of the pressure chip is in an unnatural state with a tight or loose membrane, at the moment, the pressure chip is generally restored to a stable natural state from the unnatural state by a normal-temperature standing mode, but when the method is adopted, the restoration time of the pressure chip is longer, and the production cycle of the pressure chip is further influenced.
Disclosure of Invention
The invention mainly aims to provide a baking method and baking equipment for a pressure chip and a readable storage medium, and aims to solve the problem that the production cycle of the pressure chip is influenced because the recovery time of the pressure chip recovering to a stable natural state in a normal-temperature standing mode is long.
In order to achieve the above object, the present invention provides a baking method of a pressure chip, including:
acquiring current baking parameters of the pressure chip, wherein the current baking parameters comprise current baking temperature and current baking time corresponding to the current baking temperature;
obtaining a change value corresponding to the current baking parameter according to a mapping relation between a preset baking parameter and the change value of the pressure chip, wherein the change value is a difference value between a precision value of the pressure chip before baking and a precision value of the pressure chip after baking;
and when the variation value corresponding to the current baking parameter is within a preset range, determining that the pressure chip is in a stable state.
Optionally, the mapping relationship is a mapping function, and the method includes a step of obtaining a mapping relationship between a preset baking parameter and a variation value of the pressure chip, including:
acquiring a first precision value of the pressure chip before baking and a second precision value of the pressure chip after baking according to each baking parameter;
acquiring a difference value between each first precision value and the corresponding second precision value to obtain the variation value corresponding to each baking parameter;
and determining the mapping function according to the baking parameters and the variation values corresponding to the baking parameters.
Optionally, the step of determining the mapping function according to the preset baking parameter and the variation value of the pressure chip includes:
inputting each baking parameter and the variation value corresponding to the baking parameter into the preset mapping function to obtain a function expression corresponding to each pressure chip;
acquiring a coefficient value of the mapping function according to the function expression corresponding to each baking parameter;
and updating the preset mapping function according to the coefficient value to obtain the mapping function between the preset baking parameter and the change value of the pressure chip.
Optionally, the step of inputting each baking parameter and a variation value corresponding to the baking parameter into the preset mapping function to obtain a function expression corresponding to each pressure chip includes:
normalizing each baking temperature in the preset baking parameters;
and inputting each baking temperature and the corresponding baking time after normalization treatment into the preset mapping function so as to obtain a function expression corresponding to each pressure chip.
Optionally, the step of normalizing each baking temperature in the preset baking parameters includes:
acquiring a maximum temperature value and a minimum temperature value in the multiple groups of baking temperatures;
obtaining a temperature difference value according to the maximum temperature value and the minimum temperature value;
and carrying out normalization processing on each baking temperature according to the temperature difference value.
Optionally, after the step of obtaining the variation value corresponding to the current baking parameter according to a mapping relationship between a preset baking parameter and the variation value of the pressure chip, the baking method of the pressure chip further includes:
and outputting abnormal prompt information when the variation value corresponding to the current baking parameter exceeds a preset range.
Optionally, the baking method of the pressure chip further includes:
and when the pressure chip is detected to be baked, executing the step of acquiring the current baking parameters of the pressure chip.
In addition, in order to achieve the above object, the present invention further provides a pressure chip baking apparatus, which includes a memory, a processor, and a pressure chip baking program stored on the memory and operable on the processor, wherein the pressure chip baking program, when executed by the processor, implements the steps of the above pressure chip baking method.
In addition, to achieve the above object, the present invention further provides a readable storage medium, which stores therein a baking program of a pressure chip, the baking program of the pressure chip, when executed by a processor, implementing the steps of the baking method of the pressure chip as described above.
The invention provides a baking method and equipment of a pressure chip and a readable storage medium, wherein the baking method of the pressure chip comprises the steps of obtaining the current baking parameter of the pressure chip, obtaining the change value corresponding to the current baking parameter according to the mapping relation between the preset baking parameter and the change value of the pressure chip, wherein the change value is the difference value between the precision value of the pressure chip before baking and the precision value after baking, and determining that the pressure chip is in a stable state when the change value corresponding to the current baking parameter is in a preset range, namely the technical scheme provided by the invention can obtain the change value corresponding to the current baking parameter to be in the preset range by obtaining the current baking parameter and the mapping relation between the preset baking parameter and the change value of the pressure chip to determine that the pressure chip is in the stable state, thereby speeding up the recovery time and production cycle of the pressure chip.
Drawings
In order to more clearly illustrate the embodiments or exemplary technical solutions of the present invention, the drawings used in the embodiments or exemplary descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a hardware operating environment of a baking device related to a pressure chip according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart illustrating a baking method for a pressure chip according to a first embodiment of the present invention;
FIG. 3 is a flowchart illustrating a baking method for a pressure chip according to a second embodiment of the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The main solution of the invention is: acquiring current baking parameters of the pressure chip, wherein the current baking parameters comprise current baking temperature and current baking time corresponding to the current baking temperature; obtaining a change value corresponding to the current baking parameter according to a mapping relation between a preset baking parameter and the change value of the pressure chip, wherein the change value is a difference value between a precision value of the pressure chip before baking and a precision value of the pressure chip after baking; and when the variation value corresponding to the current baking parameter is within a preset range, determining that the pressure chip is in a stable state.
In this embodiment, the manufacturing process of the existing waterproof barometer generally includes a glue filling process, that is, in the manufacturing process of the waterproof barometer, the waterproof barometer needs to be subjected to certain high-temperature treatment to cure glue in the glue filling process. However, after the waterproof barometer is cured at a high temperature, the pressure chip used in the waterproof barometer is sensitive to the temperature, that is, the step of curing at a high temperature may affect the sensitive film of the pressure chip to a certain extent, for example, the film of the sensitive film of the pressure chip is tight or loose, and at this time, the sensitive film of the pressure chip is in an unnatural state.
At this time, since the pressure chip needs to be calibrated after high-temperature treatment, if the pressure chip is calibrated by taking an unnatural state as a reference, the performance of the pressure chip is changed due to the recovery of the tension or the relaxation of the diaphragm; in other words, in order to prevent the performance of the pressure chip from changing due to the calibration of the pressure chip based on the unnatural state, the pressure chip needs to be restored from the unnatural state to the stable state, and in the prior art, the pressure chip is generally restored from the unnatural state to the stable natural state by standing at normal temperature.
Based on the above, the present invention provides a solution, obtaining current baking parameters of a pressure chip, wherein the current baking parameters include a current baking temperature and a current baking time corresponding to the current baking temperature; obtaining a change value corresponding to the current baking parameter according to a mapping relation between a preset baking parameter and the change value of the pressure chip, wherein the change value is a difference value between a precision value of the pressure chip before baking and a precision value of the pressure chip after baking; and when the change value corresponding to the current baking parameter is within a preset range, determining that the pressure chip is in a stable state, namely determining that the pressure chip is in the stable state by acquiring the current baking parameter and obtaining the change value corresponding to the current baking parameter within the preset range according to the mapping relation between the preset baking parameter and the change value of the pressure chip, so as to accelerate the recovery time and the production cycle of the pressure chip.
As shown in fig. 1, fig. 1 is a schematic diagram of a hardware operating environment of a baking device of a pressure chip according to an embodiment of the present invention.
As shown in fig. 1, the pressure chip baking apparatus may include: a processor 1001, such as a CPU, a memory 1005, and a communication bus 1002. Wherein a communication bus 1002 is used to enable connective communication between these components. The memory 1005 may alternatively be a memory device separate from the processor 1001 described above.
Those skilled in the art will appreciate that the configuration of the pressure chip toasting device shown in fig. 1 does not constitute a limitation of the pressure chip toasting device and may include more or less components than those shown, or some components in combination, or a different arrangement of components.
As shown in fig. 1, a memory 1005, which is a kind of computer storage medium, may include therein a baking program of the pressure chip.
In the baking apparatus for pressure chip shown in fig. 1, the processor 1001 may be configured to call a baking program for pressure chip stored in the memory 1005, and perform the following operations:
acquiring current baking parameters of the pressure chip, wherein the current baking parameters comprise current baking temperature and current baking time corresponding to the current baking temperature;
obtaining a change value corresponding to the current baking parameter according to a mapping relation between a preset baking parameter and the change value of the pressure chip, wherein the change value is a difference value between a precision value of the pressure chip before baking and a precision value of the pressure chip after baking;
and when the variation value corresponding to the current baking parameter is within a preset range, determining that the pressure chip is in a stable state.
Further, the processor 1001 may call the baking program of the pressure chip stored in the memory 1005, and also perform the following operations:
acquiring a first precision value of the pressure chip before baking and a second precision value of the pressure chip after baking according to each baking parameter;
acquiring a difference value between each first precision value and the corresponding second precision value to obtain the variation value corresponding to each baking parameter;
and determining the mapping function according to the baking parameters and the variation values corresponding to the baking parameters.
Further, the processor 1001 may call the baking program of the pressure chip stored in the memory 1005, and also perform the following operations:
inputting each baking parameter and the variation value corresponding to the baking parameter into the preset mapping function to obtain a function expression corresponding to each pressure chip;
acquiring a coefficient value of the mapping function according to the function expression corresponding to each baking parameter;
and updating the preset mapping function according to the coefficient value to obtain the mapping function between the preset baking parameter and the change value of the pressure chip.
Further, the processor 1001 may call the baking program of the pressure chip stored in the memory 1005, and also perform the following operations:
normalizing each baking temperature in the preset baking parameters;
and inputting each baking temperature and the corresponding baking time after normalization treatment into the preset mapping function so as to obtain a function expression corresponding to each pressure chip.
Further, the processor 1001 may call the baking program of the pressure chip stored in the memory 1005, and also perform the following operations:
acquiring a maximum temperature value and a minimum temperature value in the multiple groups of baking temperatures;
obtaining a temperature difference value according to the maximum temperature value and the minimum temperature value;
and carrying out normalization processing on each baking temperature according to the temperature difference value.
Further, the processor 1001 may call the baking program of the pressure chip stored in the memory 1005, and also perform the following operations:
and outputting abnormal prompt information when the variation value corresponding to the current baking parameter exceeds a preset range.
Further, the processor 1001 may call the baking program of the pressure chip stored in the memory 1005, and also perform the following operations:
and when the pressure chip is detected to be baked, executing the step of acquiring the current baking parameters of the pressure chip.
Referring to fig. 2 to 3, the present invention provides a baking method of a pressure chip.
As shown in fig. 2, fig. 2 is a schematic flow chart of a baking method of a pressure chip according to a first embodiment of the present invention.
The embodiment provides a baking method of a pressure chip, which comprises the following steps:
s10, obtaining current baking parameters of the pressure chip, wherein the current baking parameters comprise a current baking temperature and current baking time corresponding to the current baking temperature;
s20, obtaining a change value corresponding to the current baking parameter according to a mapping relation between a preset baking parameter and the change value of the pressure chip, wherein the change value is a difference value between a precision value of the pressure chip before baking and a precision value of the pressure chip after baking;
and S30, when the variation value corresponding to the current baking parameter is within a preset range, determining that the pressure chip is in a stable state.
In an embodiment, a current baking parameter of a pressure chip is obtained, wherein the current baking parameter includes a current baking temperature and a current baking time corresponding to the current baking temperature. For example, the current baking temperature may be 100 ℃, and the baking time corresponding to the current baking temperature of 100 ℃ may be 2 hours, but in other embodiments, the current baking temperature and the corresponding baking time may be set to other values, which is not limited herein.
It is understood that the current baking temperature and the current baking time may be set by a user or a terminal of the baking apparatus, which is not limited herein.
Further, the pressure chip is sensitive to the temperature, that is, if the baking temperature is too high, the membrane of the sensitive film of the pressure chip still has a stretched or relaxed unnatural state, so that the performance and recovery time of the pressure chip are affected; if the baking temperature is too low, the pressure chip may not be restored similarly to the normal-temperature standing treatment. That is, after the current baking parameters of the pressure chip are obtained, it is necessary to determine whether the baking temperature in the current baking parameters can restore the pressure chip to the stable state.
Specifically, according to a mapping relationship between a preset baking parameter and a change value of the pressure chip, a change value corresponding to the current baking parameter is obtained, that is, the obtained current baking parameter value is mapped to the mapping relationship, so as to obtain the change value of the pressure chip. The change value is used for measuring the recovery effect of the pressure chip after the pressure chip is baked under the current baking parameters, wherein the recovery effect comprises the recovery time of the pressure chip and the current state of the pressure chip.
In an embodiment, if the pressure chip is determined to be in a stable state when the variation value corresponding to the current baking parameter is within a preset range, that is, when the pressure chip is baked by the current baking parameter, the pressure chip can be restored to a natural state from an unnatural state.
Optionally, the preset range is-30 Pa to 30 Pa. Of course, in other embodiments, the preset range may be selected to be other values according to the type of the pressure chip, and is not limited herein.
Further, if the variation value corresponding to the current baking parameter exceeds the preset range, an abnormal prompt message is output, for example, information that the pressure chip is still in an unnatural state is output, that is, when the pressure chip is baked by the current baking parameter, the pressure chip cannot be quickly restored to a stable state, and at this time, the baking temperature in the current baking parameter may be too low or the baking time may be too short.
In addition, when the variation value corresponding to the current baking parameter is within a preset range, the current baking parameter is determined to enable the pressure chip to be recovered to a stable state, and at the moment, the pressure chip is baked according to the current baking parameter, so that the recovery time of the pressure chip is shortened on the premise that the pressure chip can be recovered to the stable state, and the production cycle of the pressure chip is further shortened.
Further, when it is detected that the pressure chip baking is completed, the step S10 is executed, that is, the current baking parameters of the pressure chip are obtained.
In the embodiment of the invention, the baking method of the pressure chip comprises the steps of obtaining the current baking parameters of the pressure chip, and obtaining a variation value corresponding to the current baking parameter according to a mapping relation between a preset baking parameter and the variation value of the pressure chip, wherein the variation value is the difference value between the precision value of the pressure chip before baking and the precision value of the pressure chip after baking, so as to determine that the pressure chip is in a stable state when the variation value corresponding to the current baking parameter is in a preset range, the technical scheme provided by the invention can obtain the current baking parameter and obtain the change value corresponding to the current baking parameter in the preset range according to the mapping relation between the preset baking parameter and the change value of the pressure chip so as to determine that the pressure chip is in the stable state, thereby accelerating the recovery time and the production cycle of the pressure chip.
Further, referring to fig. 3, a second embodiment of the present invention is proposed based on the first embodiment, in which the mapping relationship is a mapping function, and the method includes a step of obtaining a mapping relationship between a preset baking parameter and a variation value of the pressure chip, including:
s40, acquiring a first precision value of the pressure chip before baking and a second precision value of the pressure chip after baking according to each baking parameter;
s50, obtaining a difference value between each first precision value and the corresponding second precision value to obtain the variation value corresponding to each baking parameter;
s60, determining the mapping function according to each baking parameter and the variation value corresponding to the baking parameter.
In an embodiment, a pressure chip is selected and tested to obtain a first precision value of the pressure chip, that is, the first precision value of the pressure chip before baking according to each baking parameter. It can be understood that the first precision value of the pressure chip before baking according to each baking parameter is the first precision value before baking processing is performed on each pressure chip according to each baking parameter in the preset baking parameters, wherein the first precision value is used for representing the performance of the pressure chip before baking.
Optionally, the selected pressure chip is a calibrated pressure chip, and the number of the pressure chips may be multiple, which is not limited herein.
Further, before obtaining a second precision value of the pressure chip after baking according to each baking parameter, the pressure chip performs baking according to each baking parameter, and tests each pressure chip after baking to obtain the second precision value of the pressure chip, that is, the second precision value of the pressure chip after baking according to each baking parameter is obtained, wherein the second precision value is used for representing the performance of the pressure chip after baking.
Further, after the step of obtaining a first precision value of the pressure chip before baking according to each baking parameter and before the step of obtaining a second precision value of the pressure chip after baking according to each baking parameter, the method further comprises the step of performing high-temperature curing on the pressure chip. The manufacturing process of the waterproof barometer comprises a glue filling process, namely glue needs to be cured after the glue filling process, namely the glue is cured by performing high-temperature curing on the pressure chip, wherein the high-temperature curing condition can be selected to be 150 ℃/5h, or the high-temperature curing condition can be set to be other conditions according to the type of the glue, and the manufacturing process is not limited herein.
Specifically, the preset baking parameters may be multiple groups, in this embodiment, the baking temperature in the preset baking parameters may be selected from 120 ℃/100 ℃/80 ℃/40 ℃, and the baking time in the preset baking parameters is selected from 4h/3h/2h/1 h. The method comprises the following specific steps:
the preset baking parameter is 120 ℃/3 h;
the preset baking parameter is 100 ℃/3 h;
the preset baking parameter is 80 ℃/4 h;
the preset baking parameter is 40 ℃/4 h;
the preset baking parameters are 120 ℃/2h and 100 ℃/2 h;
the preset baking parameters are 120 ℃/2h and 80 ℃/2 h;
the preset baking parameters are 120 ℃/3h and 40 ℃/1 h;
the preset baking parameters are 120 ℃/3h, 80 ℃/1h and 40 ℃/1 h;
the preset baking parameters are 100 ℃/3h and 80 ℃/1 h;
the preset baking parameters are 100 ℃/3h, 80 ℃/1h and 40 ℃/1 h.
Further, after a second precision value of the pressure chip baked according to each baking parameter is obtained, the variation value corresponding to each baking parameter is obtained according to a difference value between each obtained first precision value and the corresponding second precision value. The change value of each pressure chip is used for determining the recovery effect of the pressure chip after baking, namely, the performance of the pressure chip before baking and the performance of the pressure chip after baking are compared to judge whether the pressure chip can be recovered to a stable state or not. At this time, after the variation value of each pressure chip is obtained, the mapping function is determined according to the preset baking parameter and the variation value of the pressure chip.
Specifically, each baking parameter and the variation value corresponding to the baking parameter are input into the preset mapping function to obtain a function expression corresponding to each pressure chip, where the function expression has a plurality of coefficients, that is, at this time, a coefficient value of the mapping function is obtained according to the function expression corresponding to each baking parameter; and after the coefficient value is obtained, updating the preset mapping function according to the coefficient value to obtain the mapping function between the preset baking parameter and the change value of the pressure chip.
Further, since the preset baking parameters include a plurality of baking temperatures and corresponding baking times, in order to facilitate calculation, when the preset baking parameters are input into the preset mapping function, normalization processing needs to be performed on each baking temperature in the preset baking parameters, and then each baking temperature and the corresponding baking time after normalization processing are input into the preset mapping function, so as to obtain a function expression corresponding to each pressure chip.
Specifically, the step of normalizing the baking temperature in the multiple sets of baking parameters includes:
acquiring a maximum temperature value and a minimum temperature value in the multiple groups of baking temperatures;
obtaining a temperature difference value according to the maximum temperature value and the minimum temperature value;
and carrying out normalization processing on each baking temperature according to the temperature difference value.
For example, the baking temperature in the preset baking parameters is 120 ℃/100 ℃/80 ℃/40 ℃, the maximum temperature value and the minimum temperature value are 120 ℃ and 40 ℃ respectively, at this time, the temperature difference value is 80 ℃, after the temperature difference value determined by the maximum temperature value and the minimum temperature value is obtained, normalization processing can be performed on each baking temperature in the preset baking parameters according to a formula T/Tx, where T is each baking temperature in the preset baking parameters, Tx is the temperature difference value, the value corresponding to the baking temperature after the normalization processing at 120 ℃ is 1.5, the value corresponding to the baking temperature after the normalization processing at 100 ℃ is 1.25, the value corresponding to the baking temperature after the normalization processing at 8 ℃ is 1, and the value corresponding to the baking temperature after the normalization processing at 40 ℃ is 0.5.
In this embodiment, the function expressions of each of the pressure chips are different, and taking the pressure chip as an MEMS chip as an example, the function expression of the mapping function is:
Y=a1*x1*1.5+a2*x2*1.25+a3*x3*1+a4*x4*0.5+a12*x1*x2*1.5*1.25+a13*x1*x3*
1.5*1+a14*x1*x4*1.5*0.5+a134*x1*x3*x4*1.5*1*0.5+a23*x2*x3*1.25*1+a234*x2*x3*x4*1.25*1*0.5;
wherein 1.5, 1.25, 1, 0.5 in the function table respectively correspond to the normalized values at 120 deg.C, 100 deg.C, 80 deg.C, and 40 deg.C, and x is1、x2、x3、x4Respectively corresponding to baking time of 120 deg.C, 100 deg.C, 80 deg.C, and 40 deg.C, for example, the above x is determined at the preset baking parameters of 100 deg.C/2 h, 80 deg.C/1 h, and 40 deg.C/1 h1、x2、x3、x4Respectively 0, 2, 1 and 1; in addition, a1、a2、a3、a4、a12、a13、a14、a134、a23、a234Representative are the coefficients of the functional expression.
Inputting all the preset baking parameters and the corresponding change values Y into the function expressions of the mapping function to obtain ten equations, namely calculating the coefficient values of the ten function expressions to further obtain the mapping function Y ═ f (x)1,x2,x3,x4)。
That is, in this embodiment, after the mapping function is obtained, whether the current baking parameter can enable the pressure chip to be recovered to the stable state can be directly calculated.
The invention also provides baking equipment of the pressure chip, and the baking method of the pressure chip comprises the following steps: the baking program of the pressure chip is stored on the memory and can run on the processor, and when being executed by the processor, the baking program of the pressure chip realizes the steps of the baking method of the pressure chip according to the above embodiment.
The present invention further provides a readable storage medium, which stores a baking program of a pressure chip, wherein the baking program of the pressure chip is executed by a processor to implement the steps of the baking method of the pressure chip according to any one of the above embodiments.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be substantially or partially embodied in the form of a software product, where the computer software product is stored in a storage medium (e.g., ROM/RAM, magnetic disk, optical disk), and includes several instructions for enabling a terminal device (e.g., a mobile phone, a computer, a cloud server, or a network device) to execute the method of the embodiments of the present invention.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (8)

1. The baking method of the pressure chip is characterized by comprising the following steps:
acquiring a first precision value of the pressure chip before baking according to each baking parameter;
carrying out high-temperature curing treatment on the pressure chip;
acquiring a second precision value of the processed pressure chip after being baked according to each baking parameter;
acquiring a difference value between each first precision value and the corresponding second precision value to obtain a variation value corresponding to each baking parameter;
determining a mapping function according to each baking parameter and the variation value corresponding to the baking parameter;
acquiring current baking parameters of the pressure chip, wherein the current baking parameters comprise current baking temperature and current baking time corresponding to the current baking temperature;
determining a variation value corresponding to the current baking parameter according to the mapping function, wherein the variation value is a difference value between a precision value of the pressure chip before baking and a precision value of the pressure chip after baking;
and when the variation value corresponding to the current baking parameter is within a preset range, determining that the pressure chip is in a stable state.
2. The method for baking a pressure chip as claimed in claim 1, wherein the step of determining a mapping function according to the variation value of each baking parameter corresponding to the baking parameter comprises:
inputting each baking parameter and the variation value corresponding to the baking parameter into a preset mapping function so as to obtain a function expression corresponding to each pressure chip;
acquiring a coefficient value of the mapping function according to the function expression corresponding to each baking parameter;
and updating the preset mapping function according to the coefficient value to obtain the mapping function between the baking parameter and the change value of the pressure chip.
3. The method for baking the pressure chips as claimed in claim 2, wherein the baking parameters include a plurality of baking temperatures and corresponding baking times, and the step of inputting each baking parameter and the variation value corresponding to the baking parameter into a preset mapping function to obtain the function expression corresponding to each of the pressure chips comprises:
normalizing each baking temperature in the baking parameters;
and inputting each baking temperature and the corresponding baking time after normalization treatment into the preset mapping function so as to obtain a function expression corresponding to each pressure chip.
4. The method of claim 3, wherein the step of normalizing each baking temperature of the baking parameters comprises:
acquiring a maximum temperature value and a minimum temperature value in the multiple groups of baking temperatures;
obtaining a temperature difference value according to the maximum temperature value and the minimum temperature value;
and carrying out normalization processing on each baking temperature according to the temperature difference value.
5. The pressure chip baking method of claim 1, wherein after the step of determining the variation value corresponding to the current baking parameter according to the mapping function, the pressure chip baking method further comprises:
and outputting abnormal prompt information when the variation value corresponding to the current baking parameter exceeds a preset range.
6. The pressure chip baking method of claim 1, further comprising:
and when the pressure chip is detected to be baked, executing the step of acquiring the current baking parameters of the pressure chip.
7. A baking device for pressure chips is characterized by comprising a memory, a processor and a baking program for the pressure chips, wherein the baking program for the pressure chips is stored on the memory and can run on the processor, and when being executed by the processor, the baking method for the pressure chips is realized according to any one of the claims 1-6.
8. A readable storage medium, wherein a pressure chip baking program is stored on the readable storage medium, and when executed by a processor, the method for baking a pressure chip according to any one of claims 1 to 6 is implemented.
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