CN111463557A - Integrated integrated electric scanning array antenna based on AIP framework - Google Patents
Integrated integrated electric scanning array antenna based on AIP framework Download PDFInfo
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- CN111463557A CN111463557A CN202010367314.0A CN202010367314A CN111463557A CN 111463557 A CN111463557 A CN 111463557A CN 202010367314 A CN202010367314 A CN 202010367314A CN 111463557 A CN111463557 A CN 111463557A
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- 239000002184 metal Substances 0.000 claims abstract description 31
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- 239000007787 solid Substances 0.000 claims description 3
- 238000002955 isolation Methods 0.000 abstract description 9
- 230000010354 integration Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 239000002356 single layer Substances 0.000 description 5
- 238000009826 distribution Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000010355 oscillation Effects 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 238000004088 simulation Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 238000003491 array Methods 0.000 description 1
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- 238000006243 chemical reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
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Abstract
The invention relates to the technical field of microwave antennas, in particular to an integrated electric scanning array antenna based on an AIP framework, which comprises a metal cover plate and a mother plate, wherein the top of the mother plate is provided with an emitting active module, a receiving radiation unit and an emitting radiation unit, and the bottom of the mother plate is provided with a local oscillator signal source module, a receiving intermediate frequency acquisition module and a digital signal processing module; and a radio frequency strip line, an equal power division radio frequency network and a feed-through circuit are arranged in the motherboard. According to the invention, the receiving radiation unit, the transmitting active module and the receiving active module are arranged on the upper surface of the mother board at the same side, and the local oscillator signal source module, the receiving intermediate frequency acquisition module and the digital signal processing module are arranged on the lower surface of the mother board at the same side, so that the space of the radiation surface of the front antenna is fully utilized, the integrated full-function integration density of the whole electric scanning array surface is realized, and the digital baseband processing and the digital-analog signal space isolation of the radio frequency analog of the array surface are realized.
Description
Technical Field
The invention relates to the technical field of microwave antennas, in particular to an integrated electric scanning array antenna based on an AIP framework.
Background
Transmitting or receiving antennas operating in the wavebands of millimeter waves, centimeter waves, millimeter waves, etc., are collectively referred to as microwave antennas. The microwave is mainly propagated by space wave, and the antenna is higher in erection for increasing the communication distance. Among microwave antennas, parabolic antennas, horn antennas, lens antennas, slot antennas, dielectric antennas, periscope antennas, and the like are widely used. Requirements for antennas operating in the microwave band: (1) the mechanical strength and the application reliability are high; (2) the size and weight of the antenna are small; (3) the antenna is matched with the feeder line and is easy to tune; (4) the antenna is simple and inexpensive to manufacture and assemble.
The electronic scanning array is an antenna which realizes antenna beam pointing in space rotation or scanning by an electronic method, and is divided into a phase scanning array antenna (phased array) and a frequency scanning array antenna (frequency scanning array) according to the method for realizing antenna beam scanning, in China, the frequency scanning array is sometimes brought into the category of the phased array, and the phased array antenna is also called as the phased array antenna.
The existing active phased array antenna, such as a novel one-dimensional electric scanning active phased array antenna disclosed in chinese patent publication No. CN208093751U, is composed of a plurality of antenna sub-arrays; each antenna subarray at least comprises a subarray double-layer cavity, a subarray single-layer cavity, a small cover plate and a large cover plate; the large cover plate is arranged at the bottom of the subarray double-layer cavity; the subarray single-layer cavity is riveted on one side of the top of the subarray double-layer cavity; the small cover plate is arranged at the top of the subarray single-layer cavity; one surface of the subarray single-layer cavity, which is riveted with the subarray double-layer cavity, is provided with a flanging flange, and one surface of the subarray double-layer cavity, which is riveted with the subarray single-layer cavity, is provided with a flanging flange; the flange is provided with a tenon or a mortise; the active phased array antenna realizes the effect that the three layers of thin-wall waveguide cavities can be riveted before welding, so that the welding reliability is improved, but the signal interference between the transceiver module can not be solved.
Therefore, the integrated electric scanning array antenna based on the AIP framework is simple in structure, convenient to use and capable of achieving full-function integration density.
Disclosure of Invention
The invention aims to overcome the defects of the prior art, provides an integrated electric scanning array antenna based on an AIP framework, and realizes the integrated full-function integration density of the whole electric scanning array surface and the digital baseband processing and digital analog signal space isolation of the radio frequency analog array surface of the array surface by arranging a receiving radiation unit, a transmitting active module and a receiving active module on the upper surface of a mother board at the same side and arranging a local oscillator signal source module, a receiving intermediate frequency acquisition module and a digital signal processing module on the lower surface of the mother board at the same side, and fully utilizing the space of the radiation surface of a front antenna.
The purpose of the invention is realized by the following technical scheme:
an integrated electric scanning array antenna based on AIP framework comprises a metal cover plate and a mother plate which are sequentially arranged from top to bottom, wherein the upper surface of the mother plate is a radiation surface, the top of the mother plate is respectively provided with a transmitting active module, a receiving radiation unit and a transmitting radiation unit, the bottom of the mother plate is respectively provided with a local oscillator signal source module, a receiving intermediate frequency acquisition module and a digital signal processing module, the metal cover plate is provided with avoidance cavities corresponding to the transmitting active module and the receiving active module, and the metal cover plate is provided with radiation directors corresponding to the receiving radiation unit and the transmitting radiation unit; the digital signal processing module is connected with the receiving intermediate frequency acquisition module through the feed-through circuit, the transmitting active module is connected with the local oscillator signal source module through the radio frequency strip line, the receiving active module is connected with the local oscillator signal source module through the equal power division radio frequency network, and the receiving intermediate frequency acquisition module is connected with the receiving active module.
Furthermore, the motherboard comprises a first radio frequency functional layer, a second radio frequency functional layer and a low frequency control functional layer which are sequentially arranged from top to bottom, the upper surface of the first radio frequency functional layer is a radiation surface, the transmitting active module, the receiving radiation unit and the transmitting radiation unit are respectively arranged at the top of the first radio frequency functional layer, and the local oscillator signal source module, the receiving intermediate frequency acquisition module and the digital signal processing module are respectively arranged at the bottom of the low frequency control functional layer. Preferably, the lower surface of the low-frequency control function layer is a mounting surface. The emitting active module, the receiving radiation unit and the emitting radiation unit are arranged on the upper surface of the mother board in a concentrated and same-side mode, and the local oscillator signal source module, the receiving intermediate frequency acquisition module, the digital signal processing module and other digital baseband processing modules are arranged on the lower surface of the mother board in a same-side mode, so that digital-analog signal space isolation of the emitting array radio frequency analog and the digital baseband processing is effectively realized.
Further, the radio frequency strip line is integrally arranged on a first radio frequency functional layer, the equal power division radio frequency network is integrally arranged on a second radio frequency functional layer, and the feed-through circuit is integrally arranged on a low-frequency control functional layer. Preferably, the radio frequency stripline is integrally arranged on the upper surface of the first radio frequency functional layer, that is, the radio frequency stripline is located between the radiation surface and the first radio frequency functional layer, the equal power distribution radio frequency network is integrally arranged on the upper surface of the second radio frequency functional layer, and the feed-through line is integrally arranged on the upper surface of the low frequency control functional layer.
Furthermore, a first vertical interconnection via hole, a second vertical interconnection via hole and a third vertical interconnection via hole are respectively arranged in the motherboard, one end of the first vertical interconnection via hole is connected with the local oscillator signal source module, the other end of the first vertical interconnection via hole sequentially passes through the low-frequency control functional layer and the second radio-frequency functional layer to be connected with one end of the equal-power-division radio-frequency network, the other end of the equal power division radio frequency network is connected with one end of a third vertical interconnection through hole, the other end of the third vertical interconnection through hole passes through the first radio frequency functional layer to be connected with the receiving active module, one end of the second vertical interconnecting through hole is connected with the local oscillator signal source module, the other end of the second vertical interconnecting through hole sequentially passes through the low-frequency control functional layer, the second radio-frequency functional layer and the first radio-frequency functional layer, and one end of the radio frequency strip line is connected, and the other end of the radio frequency strip line is respectively connected with the emission active module.
Furthermore, the transmitting active module and the receiving active module are respectively connected with the motherboard through high and low frequency interface pads.
Furthermore, the transmitting active module, the receiving active module, the local oscillator signal source module, the receiving intermediate frequency acquisition module and the digital signal processing module are respectively attached to the motherboard in a standard packaging interface form. Preferably, the transmitting active module, the receiving active module, the local oscillator signal source module, the receiving intermediate frequency acquisition module and the digital signal processing module are respectively attached to the motherboard in a BGA or QFN standard packaging interface form.
Further, the metal cover plate is grounded. Through set up on metal covering plate with the transmission active module, receive the dodging cavity that the active module corresponds, and set up respectively with receiving the radiating element, the radiation director that the transmission radiating element corresponds, on the basis of realizing the energy director to the antenna radiating element, the radio frequency space that has still effectively realized between array face radiating element and the receiving and dispatching module keeps apart, and the radio frequency space that transmits the active module, receives between the active module keeps apart, still provides high mechanical strength's structural support for whole array simultaneously.
Further, the metal cover plate is connected with the motherboard through screw installation.
Furthermore, the metal cover plate is in contact with the grounding radiation surface on the motherboard through screw installation.
Further, the metal cover plate is of a solid metal structure.
The invention has the beneficial effects that: according to the invention, the receiving radiation unit, the transmitting active module and the receiving active module are arranged on the upper surface of the mother board at the same side, and the local oscillator signal source module, the receiving intermediate frequency acquisition module and the digital signal processing module are arranged on the lower surface of the mother board at the same side, so that the space of the radiation surface of the front antenna is fully utilized, the integrated full-function integration density of the whole electric scanning array surface is realized, and the digital baseband processing and the digital-analog signal space isolation of the radio frequency simulation of the array surface are realized; in addition, the arrangement of the metal cover plate realizes radiation guiding, electromagnetic shielding and structural support for the antenna.
Drawings
FIG. 1 is a schematic diagram of an integrated electrically scanned array antenna according to the present invention;
FIG. 2 is a top view of the integrated electrically scanned array antenna of the present invention;
FIG. 3 is a cross-sectional view of an integrated electric scan array antenna of the present invention;
figure 4 is a top view of a first radio frequency functional layer (with radiating surface) according to the present invention;
figure 5 is a top view of a first radio frequency functional layer (with the radiating surface removed) according to the present invention;
FIG. 6 is a top view of a second RF functional layer in accordance with the present invention;
FIG. 7 is a top view of a low frequency control functional layer of the present invention;
in the figure, 1-mother board, 2-metal cover plate, 3-first radio frequency functional layer, 4-second radio frequency functional layer, 5-low frequency control functional layer, 6-transmitting active module, 7-receiving active module, 8-receiving radiation unit, 9-transmitting radiation unit, 10-local oscillator signal source module, 11-receiving intermediate frequency acquisition module, 12-digital signal processing module, 13-avoiding cavity, 14-radiation director, 15-radio frequency strip line, 16-equal power division radio frequency network, 17-feed-through line, 18-first vertical interconnection via, 19-second vertical interconnection via, and 20-third vertical interconnection via-.
Detailed Description
The technical solutions of the present invention are further described in detail below with reference to the accompanying drawings, but the scope of the present invention is not limited to the following.
As shown in fig. 1 to 7, an integrated electronic scanning array antenna based on an AIP framework includes a metal cover plate 2 and a mother plate 1, which are sequentially disposed from top to bottom, wherein an upper surface of the mother plate 1 is a radiation surface, a top of the mother plate 1 is respectively provided with a transmitting active module 6, a receiving active module 7, a receiving radiation unit 8 and a transmitting radiation unit 9, a bottom of the mother plate 1 is respectively provided with a local oscillator signal source module 10, a receiving intermediate frequency acquisition module 11 and a digital signal processing module 12, the metal cover plate 2 is provided with an avoidance cavity 13 corresponding to the transmitting active module 6 and the receiving active module 7, and the metal cover plate 2 is provided with a radiation director 14 corresponding to the receiving radiation unit 8 and the transmitting radiation unit 9; the motherboard 1 is internally embedded with a radio frequency strip line 15, an equal power division radio frequency network 16 and a feed-through circuit 17, the digital signal processing module 12 is connected with the receiving intermediate frequency acquisition module 11 through the feed-through circuit 17, the transmitting active module 6 is connected with the local oscillator signal source module 10 through the radio frequency strip line 15, the receiving active module 7 is connected with the local oscillator signal source module 10 through the equal power division radio frequency network 16, and the receiving intermediate frequency acquisition module 11 is connected with the receiving active module 7.
Specifically, the motherboard 1 includes a first radio frequency functional layer 3, a second radio frequency functional layer 4 and a low frequency control functional layer 5 which are sequentially arranged from top to bottom, the upper surface of the first radio frequency functional layer 3 is a radiation surface, a transmitting active module 6, a receiving active module 7, a receiving radiation unit 8 and a transmitting radiation unit 9 are respectively arranged at the top of the first radio frequency functional layer 3, and a local oscillator signal source module 10, a receiving intermediate frequency acquisition module 11 and a digital signal processing module 12 are respectively arranged at the bottom of the low frequency control functional layer 5. Preferably, the lower surface of the low-frequency control functional layer 5 is a mounting surface. The emitting active module 6, the receiving active module 7, the receiving radiation unit 8 and the emitting radiation unit 9 are arranged on the upper surface of the mother board 1 in a centralized and same-side mode through radio frequency simulation of the whole array surface, and the local oscillation signal source module 10, the receiving intermediate frequency acquisition module 11, the digital signal processing module 12 and other digital baseband processing modules are arranged on the lower surface of the mother board 1 in a same-side mode, so that the space isolation of digital-analog signals processed by the radio frequency simulation and the digital baseband of the array surface is effectively realized.
Specifically, the radio frequency strip line 15 is integrally arranged on the first radio frequency functional layer 3, the equal power division radio frequency network 16 is integrally arranged on the second radio frequency functional layer 4, and the feed-through line 17 is integrally arranged on the low frequency control functional layer 5. Preferably, the radio frequency strip line 15 is integrally disposed on the upper surface of the first radio frequency functional layer 3, that is, the radio frequency strip line 15 is located between the radiation surface and the first radio frequency functional layer 3, the equal power distribution radio frequency network 16 is integrally disposed on the upper surface of the second radio frequency functional layer 4, and the feed-through line 17 is integrally disposed on the upper surface of the low frequency control functional layer 5.
Preferably, the first radio frequency functional layer 3, the second radio frequency functional layer 4 and the low frequency control functional layer 5 are realized by laminating in an RF-PCB process.
Specifically, a first vertical interconnection via 18, a second vertical interconnection via 19 and a third vertical interconnection via 20 are respectively arranged in the motherboard 1, one end of the first vertical interconnection via 18 is connected with the local oscillator signal source module 10, the other end of the first vertical interconnection via 18 sequentially passes through the low frequency control functional layer 5 and the second radio frequency functional layer 4 and is connected with one end of the equal power distribution radio frequency network 16, the other end of the equal power distribution radio frequency network 16 is connected with one end of the third vertical interconnection via 20, the other end of the third vertical interconnection via 20 passes through the first radio frequency functional layer 3 and is connected with the receiving active module 7, one end of the second vertical interconnection via 18 is connected with the local oscillator signal source module 10, the other end of the second vertical interconnection via 19 sequentially passes through the low frequency control functional layer 5, the second radio frequency functional layer 4 and the first radio frequency functional layer 3 and is connected with one end of the radio frequency stripline, the other ends of the radio frequency strip lines 15 are respectively connected with the transmitting active module 6.
Specifically, the transmitting active module 6 and the receiving active module 7 are respectively connected with the motherboard 1 through high and low frequency interface pads.
Specifically, the transmitting active module 6, the receiving active module 7, the local oscillator signal source module 10, the receiving intermediate frequency acquisition module 11, and the digital signal processing module 12 are respectively attached to the motherboard 1 in a standard packaging interface manner. Preferably, the transmitting active module 6, the receiving active module 7, the local oscillator signal source module 10, the receiving intermediate frequency acquisition module 11 and the digital signal processing module 12 are respectively attached to the motherboard 1 in a BGA or QFN standard package interface form.
Specifically, the metal cover plate 2 is grounded. Through set up on metal covering 2 with the active module 6 of transmission, receive the dodge cavity 13 that the active module 7 corresponds, and set up respectively with receiving the radiating element 8, the radiation director 14 that the emission radiating element 9 corresponds, on the basis of realizing the energy director to the antenna radiating element, the radio frequency space isolation between the face radiating element and the receiving and dispatching module has still been realized effectively to the radio frequency space isolation between the active module 6 of transmission, receive the active module 7, still provide high mechanical strength's structural support for whole array simultaneously.
Specifically, the metal cover plate 2 is connected to the motherboard 1 by screwing.
Specifically, the metal cover plate 2 is in contact with the ground radiation surface on the motherboard 1 through screwing.
Specifically, the metal cover plate 2 is a solid metal structure.
When the device is used, the receiving radiation unit 8, the transmitting radiation unit 9 and the radiation director 14 on the metal cover plate are matched to form an antenna radiation unit, the transmitting active module 6 and the receiving active module 7 are arranged on the same side of the mother plate through the layout of sparse array planes, the transmitting active module 6 sends signals, the signals of a feedback party are received through the receiving active module 7, meanwhile, the local oscillation signal source module 10 provides local oscillations required by frequency conversion for the receiving active module 7 through the first vertical interconnection via hole 18, the equal power division radio frequency network 16 and the third vertical interconnection via hole 20, the feedback signals received by the receiving active module 7 are transmitted to the receiving intermediate frequency acquisition module 11 for collection processing, and then are transmitted to the digital signal processing module 12 for further processing of the feedback signals; through set up on metal covering 2 with the transmission active module 6, receive the dodge cavity 13 that the active module 7 corresponds to dodge the surface mounted device of this department, and set up respectively with receiving radiation unit 8, the radiation director 14 that the transmission radiation unit 9 corresponds, on the basis of realizing the energy director to the antenna radiation unit, the radio frequency space isolation between array face radiation unit and the receiving and dispatching module has still been realized effectively to and the radio frequency space isolation between transmission active module 6, the receiving active module 7, still provides high mechanical strength's structural support for whole array simultaneously.
The foregoing is illustrative of the preferred embodiments of this invention, and it is to be understood that the invention is not limited to the precise form disclosed herein and that various other combinations, modifications, and environments may be resorted to, falling within the scope of the concept as disclosed herein, either as described above or as apparent to those skilled in the relevant art. And that modifications and variations may be effected by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An integrated electric scanning array antenna based on AIP framework is characterized by comprising a metal cover plate and a mother plate which are sequentially arranged from top to bottom, wherein the upper surface of the mother plate is a radiation surface, the top of the mother plate is respectively provided with a transmitting active module, a receiving radiation unit and a transmitting radiation unit, the bottom of the mother plate is respectively provided with a local oscillator signal source module, a receiving intermediate frequency acquisition module and a digital signal processing module, the metal cover plate is provided with avoidance cavities corresponding to the transmitting active module and the receiving active module, and the metal cover plate is provided with radiation directors corresponding to the receiving radiation unit and the transmitting radiation unit; the digital signal processing module is connected with the receiving intermediate frequency acquisition module through the feed-through circuit, the transmitting active module is connected with the local oscillator signal source module through the radio frequency strip line, the receiving active module is connected with the local oscillator signal source module through the equal power division radio frequency network, and the receiving intermediate frequency acquisition module is connected with the receiving active module.
2. The integrated electric scanning array antenna based on the AIP framework is characterized in that the motherboard comprises a first radio frequency functional layer, a second radio frequency functional layer and a low frequency control functional layer which are sequentially arranged from top to bottom, the upper surface of the first radio frequency functional layer is a radiation surface, a transmitting active module, a receiving radiation unit and a transmitting radiation unit are respectively arranged on the top of the first radio frequency functional layer, and a local oscillator signal source module, a receiving intermediate frequency acquisition module and a digital signal processing module are respectively arranged on the bottom of the low frequency control functional layer.
3. The AIP-architecture-based integrated electric scanning array antenna according to claim 2, wherein the radio frequency strip line is integrally arranged on a first radio frequency functional layer, the equal power division radio frequency network is integrally arranged on a second radio frequency functional layer, and the feed-through line is integrally arranged on a low frequency control functional layer.
4. The AIP-architecture-based integrated electric scanning array antenna according to claim 3, wherein a first vertical interconnection via, a second vertical interconnection via and a third vertical interconnection via are respectively disposed in the motherboard, one end of the first vertical interconnection via is connected to the local oscillator signal source module, the other end of the first vertical interconnection via sequentially passes through the low frequency control functional layer and the second radio frequency functional layer and is connected to one end of the equal power division radio frequency network, the other end of the equal power division radio frequency network is connected to one end of the third vertical interconnection via, the other end of the third vertical interconnection via passes through the first radio frequency functional layer and is connected to the receiving active module, one end of the second vertical interconnection via is connected to the local oscillator signal source module, and the other end of the second vertical interconnection via sequentially passes through the low frequency control functional layer, the second radio frequency functional layer and the first radio frequency functional layer, and one end of the radio frequency strip line is connected, and the other end of the radio frequency strip line is respectively connected with the emission active module.
5. The AIP-based integrated circuit array antenna according to claim 1, wherein the transmitting active module and the receiving active module are respectively connected to a motherboard through high and low frequency interface pads.
6. The AIP-architecture-based integrated circuit array antenna according to claim 1, wherein the transmitting active module, the receiving active module, the local oscillator signal source module, the receiving intermediate frequency acquisition module and the digital signal processing module are attached to a motherboard in a standard package interface manner.
7. The AIP-based integrated electrically scanned array antenna of claim 1, wherein the metal cover plate is grounded.
8. The AIP-based integrated circuit array antenna according to claim 1, wherein the metal cover plate is connected to the motherboard by screwing.
9. The AIP-based integrated circuit scan array antenna of claim 8, wherein the metal cover plate is screwed to the ground plane on the motherboard.
10. The AIP-based integrated electrically scanned array antenna of claim 1, wherein the metal cover plate is a solid metal structure.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010367314.0A CN111463557A (en) | 2020-04-30 | 2020-04-30 | Integrated integrated electric scanning array antenna based on AIP framework |
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| CN202010367314.0A CN111463557A (en) | 2020-04-30 | 2020-04-30 | Integrated integrated electric scanning array antenna based on AIP framework |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112838366A (en) * | 2020-12-31 | 2021-05-25 | 中国电子科技集团公司第四十三研究所 | Multi-channel surface-mounted T/R assembly |
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| CN109616759A (en) * | 2018-12-06 | 2019-04-12 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Full duplex active phased array filter antenna front |
| CN211907683U (en) * | 2020-04-30 | 2020-11-10 | 成都睿识智能科技有限公司 | Integrated electric scanning array antenna |
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2020
- 2020-04-30 CN CN202010367314.0A patent/CN111463557A/en active Pending
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|---|---|---|---|---|
| US20130249772A1 (en) * | 2012-03-21 | 2013-09-26 | Selex Es S.P.A. | Modular active radiating device for electronically scanned array antennas |
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| CN112838366B (en) * | 2020-12-31 | 2024-02-20 | 中国电子科技集团公司第四十三研究所 | Multichannel surface-mounted T/R assembly |
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