CN111463336B - Preparation method of LED lamp - Google Patents
Preparation method of LED lamp Download PDFInfo
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- CN111463336B CN111463336B CN202010389862.3A CN202010389862A CN111463336B CN 111463336 B CN111463336 B CN 111463336B CN 202010389862 A CN202010389862 A CN 202010389862A CN 111463336 B CN111463336 B CN 111463336B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000004020 conductor Substances 0.000 claims abstract description 54
- 239000011324 bead Substances 0.000 claims abstract description 32
- 238000004806 packaging method and process Methods 0.000 claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 229910052751 metal Inorganic materials 0.000 claims description 21
- 239000002184 metal Substances 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 6
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 4
- 229910021484 silicon-nickel alloy Inorganic materials 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 claims 2
- 239000012790 adhesive layer Substances 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 229910001120 nichrome Inorganic materials 0.000 description 5
- 238000009529 body temperature measurement Methods 0.000 description 4
- 238000012544 monitoring process Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- DBUTVDSHVUGWOZ-UHFFFAOYSA-N [Si].[Ni].[Cr].[Ni] Chemical compound [Si].[Ni].[Cr].[Ni] DBUTVDSHVUGWOZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/647—Heat extraction or cooling elements the elements conducting electric current to or from the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The invention provides a preparation method of an LED lamp, which comprises the following steps: a1, providing an LED bracket which is provided with a first electrode for fixing an LED chip, wherein the first electrode is an electrode sheet which is spliced by a first conductor and a second conductor in a side-by-side mode and can generate thermoelectromotive force in a closed loop; a2, fixing the LED chip on the first electrode of the LED bracket; a3, providing a packaging substrate, a driving power supply and a temperature processor, wherein a first electrode pad and a second electrode pad of the packaging substrate are respectively electrically connected with the driving power supply, and a third electrode pad and a fourth electrode pad of the packaging substrate are connected with the temperature processor; the P electrode of the LED chip is electrically connected with the first electrode pad, and the N electrode of the LED chip is electrically connected with the second electrode pad; and the first pin part of the LED lamp bead is electrically connected with the third electrode pad, and the second pin part is electrically connected with the fourth electrode pad.
Description
Technical Field
The invention relates to the field of LED lighting, in particular to a preparation method of an LED lamp.
Background
The LED supports in the current market are more in variety and model, and most of the LED supports are packaged by supports with two metal electrodes. Or three or more metal electrodes in the form of thermoelectric separation. And during die bonding, fixing the LED chip on a corresponding metal bracket, and then performing a series of processes such as wire bonding, dispensing, baking, screening and packaging to obtain the finished product of the LED lamp bead.
However, since the LED lamp bead is sensitive to temperature, for example, for a chip with a size of about 10 mils by 30 mils, the brightness of the LED lamp bead will decrease by 1% for every 4.73 ℃ rise in the whole lamp temperature under the condition of using 100mA of current. As the current is increased, the sensitivity to temperature is further increased, and the brightness is also decreased, so that it is an extremely important subject for the temperature tracking of LED.
For the temperature detection of the LED lamp in the prior art, an external thermal sensor (such as a thermistor, a thermocouple, etc.) is generally used to contact the surface of the LED lamp bead or the package substrate to monitor the heat of the LED chip, such as the LED lighting lamp with temperature feedback disclosed in chinese utility model patent application No. 202679739. However, since the LED chip is the heat source, the heat generated by the LED chip as the heat source is transferred outward, and the farther the distance is, the lower the temperature is, and even if temperature compensation is performed, the true temperature of the LED chip cannot be accurately reflected; moreover, after the temperature of the LED chip changes, the outside (the surface of the LED lamp bead or the package substrate) often needs a certain time to react out, and the time difference of transmission is large, so that timely monitoring cannot be realized.
Disclosure of Invention
Therefore, the invention provides the preparation method of the LED lamp, the prepared LED lamp can accurately monitor the heating temperature of the LED chip, and the layout structure is simple.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
a preparation method of an LED lamp comprises the following steps:
a1, providing an LED bracket, wherein the LED bracket comprises an insulated bracket body, the surface of the bracket body is provided with a die bonding area, the die bonding area of the bracket body is provided with a first electrode for fixing an LED chip, and the first electrode is an electrode slice which is spliced by a first conductor and a second conductor in a side-by-side mode and can generate thermoelectromotive force in a closed loop; the first conductor extends to the bottom surface or the side surface of the bracket body and is exposed to form a first lead part, and the second conductor extends to the bottom surface or the side surface of the bracket body and is exposed to form a second lead part;
a2, providing an LED chip, and fixing the LED chip on a first electrode of an LED bracket to obtain an LED lamp bead;
a3, providing a packaging substrate, wherein the packaging group comprises a first electrode pad, a second electrode pad, a third electrode pad and a fourth electrode pad which are arranged at intervals, the first electrode pad and the second electrode pad are respectively and electrically connected with a driving power supply, and the third electrode pad and the fourth electrode pad are connected with the temperature processor; the P electrode of the LED chip of the LED lamp bead is electrically connected with the first electrode pad, and the N electrode of the LED chip of the LED lamp bead is electrically connected with the second electrode pad so as to form a power supply loop of the LED chip; the first pin part of the LED lamp bead is electrically connected with the third electrode pad, the second pin part is electrically connected with the fourth electrode pad, and therefore the first conductor and the second conductor of the first electrode are in a closed loop.
Preferably, the first conductor is made of nichrome, and the second conductor is made of nickel-silicon alloy.
Preferably, the first conductor is made of nichrome, and the second conductor is made of cupronickel.
Preferably, the first conductor is made of copper, and the second conductor is made of a copper-nickel alloy.
Preferably, in step a1, the die bonding region of the support body is further provided with a second electrode and a third electrode, which are positive and negative electrodes, the second electrode extends to the bottom surface or the side surface of the support body and is exposed to form a third lead portion, and the third electrode extends to the bottom surface or the side surface of the support body and is exposed to form a fourth lead portion; in step a2, the P electrode of the LED chip is electrically connected to the second electrode through a metal bonding wire, and the N electrode thereof is electrically connected to the third electrode through another metal bonding wire; in step a3, a third lead portion of the LED lamp bead is electrically connected to the first electrode pad, and a fourth lead portion is electrically connected to the second electrode pad, thereby forming a power supply loop of the LED chip.
Preferably, in step a1, the die bonding region of the stent body is further provided with a second electrode, the first electrode is further used as a positive electrode for connecting with a driving power supply, the second electrode is used as a negative electrode with opposite polarity, and the second electrode extends to the bottom surface or the side surface of the stent body and is exposed to form a third lead part; in step a2, the P electrode of the LED chip is electrically connected to the first electrode through a metal bonding wire, and the N electrode thereof is electrically connected to the second electrode through another metal bonding wire; in step a3, the first lead part or the second lead part of the first electrode of the LED lamp bead is electrically connected to the first electrode pad, and the third lead part is electrically connected to the second electrode pad, thereby forming a power supply loop of the LED chip.
Further preferably, a step a4 is further included, in which a controller is provided, an output terminal of the temperature processor is connected to an input terminal of the controller, and an output terminal of the controller is connected to an input terminal of the driving power supply.
Through the technical scheme provided by the invention, the method has the following beneficial effects:
according to the LED lamp prepared by the method, the first electrode for directly fixing the LED chip is set to be the thermal electrode capable of generating thermal electromotive force, so that the temperature of the LED chip is directly received, the thermal electromotive force is generated in a loop, the generated thermal electromotive force is converted into temperature, the temperature of the LED chip can be timely and accurately monitored, the follow-up control on the temperature of the LED chip is facilitated, and the service life of the LED chip is ensured to be long.
Meanwhile, the structure for monitoring the temperature of the LED chip is integrated, so that the structural layout is simplified, and the light path of the LED chip is not influenced.
Drawings
Fig. 1 is a flow chart of a method for manufacturing an LED lamp according to a first embodiment;
FIG. 2 is a schematic structural diagram of an LED support according to a first embodiment;
FIG. 3 is a top view of the first electrode according to the first embodiment;
FIG. 4 is a schematic structural diagram of an LED lamp bead in the first embodiment;
fig. 5 is a schematic structural diagram of the LED lamp according to the first embodiment after the LED lamp bead is hidden;
fig. 6 is a schematic structural diagram of an LED lamp according to a first embodiment.
FIG. 7 is a schematic structural view of an LED holder according to a second embodiment;
fig. 8 is a schematic structural view of an LED lamp bead in the second embodiment;
fig. 9 is a schematic structural diagram of the LED lamp according to the second embodiment after the LED lamp beads are hidden;
fig. 10 is a schematic structural view of an LED lamp according to a second embodiment.
Detailed Description
To further illustrate the various embodiments, the invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. Those skilled in the art will appreciate still other possible embodiments and advantages of the present invention with reference to these figures. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.
The invention will now be further described with reference to the accompanying drawings and detailed description.
Example one
Referring to fig. 1, a method for manufacturing an LED lamp includes the following steps:
a1, providing an LED support, which is shown in fig. 2 and 3 and includes an insulating support body, wherein the surface of the support body has a die bonding region, the die bonding region of the support body is provided with a first electrode for fixing an LED chip, and the first electrode is an electrode sheet formed by splicing a first conductor and a second conductor in a side-by-side manner and capable of generating thermoelectromotive force in a closed loop; the first conductor extends to and is exposed from a bottom surface (or a side surface in other embodiments) of the bracket body to form a first lead part, and the second conductor extends to and is exposed from a bottom surface (or a side surface in other embodiments) of the bracket body to form a second lead part.
Specifically, the die attach region in this step is further provided with a second electrode, the first electrode 11 is used for both fixing the LED chip and connecting the driving power source (as a positive electrode connected to the positive electrode of the driving power source in this embodiment), and the second electrode 12 is used as a negative electrode connected to the driving power source and having a polarity opposite to that of the first electrode 11. Of course, in other embodiments, the first electrode 11 may be a negative electrode, and the second electrode 12 may be a positive electrode. The second electrode 12 is a metal electrode sheet conventional in the art.
The second electrode 12 extends toward the bottom surface (or the side surface in other embodiments) of the holder body 101 and is exposed to form a third lead portion 121.
Specifically, the bracket body 101 is made of plastic, a reflecting bowl 1011 is formed on the surface thereof, and the bottom surface of the reflecting bowl 1011 is a die bonding area. Adopt the structure of reflection bowl cup 1011, the encapsulation of the follow-up encapsulation of being convenient for is glued, and the cup wall of reflection bowl cup 1011 can reflect the light that the LED chip sent, improves the light yield. Of course, in other embodiments, the structure of the reflection bowl 1011 may not be needed, and the surface of the rack body 101 is directly a flat surface.
More specifically, the first conductor 111 is nichrome, and the second conductor 112 is nickel-silicon alloy. The first conductor 111 and the second conductor 112 are arranged side by side, i.e. in the same plane, and are fixedly connected by means of arc welding. Specifically, the arc welding mode is adopted, the technology is mature, the cost is low, and mass production can be realized. Of course, in other embodiments, other processes may be used to fixedly connect the first conductor 111 and the second conductor 112, as long as the thermoelectric force can be generated in the closed loop.
Step a2, referring to fig. 4, providing an LED chip, and fixing the LED chip on the first electrode of the LED support to obtain an LED lamp bead.
Specifically, the LED chip 21 is fixed by conventional die bonding, i.e., by silver paste or solder paste, on the first electrode 11. The P electrode of the LED chip 21 fixed on the first electrode 11 is electrically connected to the first electrode 11 through a metal bonding wire, and the N electrode of the LED chip is electrically connected to the second electrode 12 through another metal bonding wire, so as to form an electrical connection with the first electrode 11 and the second electrode 12 of the LED support 10.
Still further, step a2 further includes filling the packaging adhesive layer 22, where the packaging adhesive layer 22 is filled in the reflective bowl 1011 and covers the LED chip 21 and the metal bonding wires to realize the sealing, so as to isolate and protect the LED chip 21 and the metal bonding wires. More specifically, the LED chip 21 is a blue LED chip, and the encapsulation adhesive layer 22 is a fluorescent adhesive layer, so as to form an LED lamp bead emitting white light. Of course, in other embodiments, the structure of the encapsulating adhesive layer 22 may not be required.
Step a3, with continued reference to fig. 5 and 6, providing a package substrate 31, a driving power supply 33, and a temperature processor 32, where at least one package group is disposed on the package substrate 31, as shown in fig. 5, a group of package groups is taken as an example in the illustration, and the package group includes a first electrode pad 311, a second electrode pad 312, a third electrode pad 313, and a fourth electrode pad 314 disposed at intervals, that is, the first electrode pad 311, the second electrode pad 312, the third electrode pad 313, and the fourth electrode pad 314 are insulated from each other. The first electrode pad 311 and the second electrode pad 312 are electrically connected to the driving power source 33, specifically, in this embodiment, the first electrode pad 311 is electrically connected to a positive electrode of the driving power source 33, and the second electrode pad 312 is electrically connected to a negative electrode of the driving power source 33. The third electrode pad 313 and the fourth electrode pad 314 are connected to the temperature processor 32, and specifically, the third electrode pad 313 and the fourth electrode pad 314 are respectively connected to the temperature processor 32 through a temperature signal line 352.
Specifically, the first pin portion 1111 (any one pin portion of the first electrode 11, or the second pin portion 1121 in other embodiments) of the first electrode 11 of the LED lamp bead 20 is electrically connected to the first electrode pad 311, and the third pin portion 121 is electrically connected to the second electrode pad 312, so as to form a power supply loop of the LED chip 21.
The first pin portion 1111 of the first electrode 11 of the LED lamp bead 20 is electrically connected to the third electrode pad 313, and the second pin portion 1121 thereof is electrically connected to the fourth electrode pad 314, so that the first conductor 111 and the second conductor 112 of the first electrode 11 are in a closed loop; the closed loop is a closed loop of a thermocouple, and as long as the temperatures at two junctions of the first conductor 111 and the second conductor 112 are different (one end is at T, called working end or hot end, and the other end is at T0, called free end or cold end), a thermal electromotive force is generated in the loop.
After the power supply is connected, the driving power supply 33 drives the LED chip 21 of the LED lamp bead 20 to emit light, and meanwhile, the LED chip 21 can also generate heat and radiate outwards. The heat conductivity of the support body 101 and the packaging adhesive layer 22 in direct contact with the LED chip 21 is poor, and most of the heat is transferred to the first electrode 11 in direct contact with the LED chip 21 at the first time, so that the temperature of the first electrode 11 can most reflect the actual temperature of the LED chip. After the first electrode 11 is heated, the closed loop in which the first conductor 111 and the second conductor 112 are located generates a thermal electromotive force, and the temperature processor 32 obtains the temperature value of the first electrode 11 according to the corresponding relationship between the generated thermal electromotive force and the temperature, the temperature measuring principle is the same as that of the existing thermocouple, and the temperature processor 32 can adopt a thermocouple thermometer in the prior art.
In this scheme, the first electrode 11 that will be used for the directly fixed LED chip 21 sets to the hot electrode to directly receive the temperature of LED chip 21 and make return circuit (temperature measurement return circuit) produce the thermoelectromotive force, convert the thermoelectromotive force that produces into the temperature again, and then can be timely, accurate monitoring LED chip 21's temperature, the follow-up management and control to LED chip 21 temperature of being convenient for, thereby guarantee that LED chip 21's life is permanent. Meanwhile, the structure for monitoring the temperature of the LED chip 21 is integrated, so that the structural layout is simplified, and the light path of the LED chip 21 is not influenced.
In this embodiment, the first electrode 11 is also used as a positive electrode for connecting with the driving power supply 33, i.e. an improvement on the basis of the original LED support with only two electrodes, and the power supply circuit and the temperature measurement circuit of the LED chip 21 are independent and do not affect each other.
Specifically, in this embodiment, the material of the first conductor 111 is nichrome, and the second conductor 112 is nickel-silicon alloy. The resistance temperature coefficient of the nickel-chromium-nickel-silicon is small, the conductivity is high, the specific heat is small, the thermoelectric potential generated in temperature measurement is large, and the thermoelectric potential and the temperature are in a linear or nearly linear single-value function relationship, so that the requirement of the scheme can be well met. Meanwhile, the material has the characteristics of good material reproducibility, high mechanical strength, simple manufacturing process, low price and the like.
Specifically, in this embodiment, the first electrode pad 311 is electrically connected to the positive electrode of the driving power supply 33, and the second electrode pad 312 is electrically connected to the negative electrode of the driving power supply 33; specifically, the first electrode pad 311 and the second electrode pad 312 are electrically connected to the driving power supply 33 through the power supply line 351. Of course, in other embodiments, the first electrode pad 311 may be electrically connected to the negative electrode of the driving power source 33, and the second electrode pad 312 may be electrically connected to the positive electrode of the driving power source 33. As long as when assembling LED lamp pearl 20, LED lamp pearl 20 anodal with be connected as anodal pad, LED lamp pearl 20 negative pole with be connected as the pad of negative pole can.
Further, in this embodiment, the first electrode pad 311, the second electrode pad 312, the third electrode pad 313 and the fourth electrode pad 314 are all copper foil layers, and the copper foil layers have good electrical conductivity and low cost. Meanwhile, when other metal materials (such as aluminum of the third electrode pad 313 and the fourth electrode pad 314 and the temperature signal line 352 in this embodiment) are connected to the temperature measuring circuit, as long as the temperatures of the two junctions are the same, the generated thermal electromotive force will remain unchanged, i.e., will not be affected by the connection of other metals to the circuit, and therefore, the arrangement of the copper foil layers of the third electrode pad 313 and the fourth electrode pad 314 and the temperature signal line 352 will not affect the temperature testing accuracy. The electrode pads (third electrode pad 313 and fourth electrode pad 314) and the connected temperature signal line 352 are used as extension lines.
Still further, in this embodiment, a step a4 is further included, where a controller 34 is provided, an output end of the temperature processor 32 is connected to an input end of the controller 34 to output temperature information to the controller 34, an output end of the controller 34 is connected to an input end of the driving power supply 33, the controller 34 controls an output current of the driving power supply 33 according to a real-time temperature of the LED chip 21, and if the temperature exceeds a certain threshold, the driving power supply 33 is controlled to reduce the output current to the LED lamp bead 20. The type and control mode of the controller 34 are the prior art, and for example, the structure and the like in the LED lighting fixture with temperature feedback disclosed in chinese utility model patent application No. 202679739 are adopted, and detailed description thereof is omitted here. Of course, in other embodiments, the configuration of the controller 34 may not be required.
Still further, in this embodiment, a plurality of groups of package groups are disposed on the package substrate 31, a plurality of LED beads 20 are also disposed on the plurality of groups of package groups, and the LED beads 20 are preferably disposed in series, and have the same current, so as to facilitate uniform control. Of course, in other embodiments, parallel or series-parallel may be used.
Example two
The preparation method of the LED lamp provided in this embodiment is substantially the same as the preparation method of the first embodiment, except that:
in step a1, referring to fig. 7, the die bonding region of the holder body 101 is provided with a second electrode 12 and a third electrode 13 as positive and negative electrodes, the second electrode 12 extends and exposes toward the bottom surface (or the side surface in other embodiments) of the holder body 101 to form a third lead portion 121, and the third electrode 13 extends and exposes toward the bottom surface (or the side surface in other embodiments) of the holder body 101 to form a fourth lead portion 131. And the first electrode 11 serves only as an electrode for fixing the LED chip 21.
Meanwhile, the first conductor 111 of the first electrode 11 is nichrome, and the second conductor 112 is cupronickel. When the first conductor 111 and the second conductor 112 are brought into contact with each other, a thermoelectromotive force can be generated even in a closed circuit.
In step a2, with reference to fig. 8, the LED chip 21 is fixed on the first electrode 11 by die bonding, the P electrode of the LED chip is electrically connected to the second electrode 12 through a metal bonding wire, and the N electrode of the LED chip is electrically connected to the third electrode 13 through another metal bonding wire.
In step a3, with reference to fig. 9 and 10, the third pin portion 121 of the LED lamp bead 20 is electrically connected to the first electrode pad 311, and the fourth pin portion 131 is electrically connected to the second electrode pad 312, so as to form a power supply loop of the LED chip 21. The first lead portion 1111 of the LED lamp bead 20 is electrically connected to the third electrode pad 313, and the second lead portion 1121 is electrically connected to the fourth electrode pad 314, so that the first conductor 111 and the second conductor 121 of the first electrode 11 are in a closed loop. In this way, the power supply loop and the temperature measurement loop of the LED chip 21 are physically completely isolated.
The LED lamp prepared by the method for preparing an LED lamp provided in this embodiment can also achieve the same technical effects as those of the first embodiment.
Of course, in other embodiments, the materials of the first conductor 111 and the second conductor 112 of the first electrode 11 are not limited to the above, and the material of the first conductor 111 may be copper, and the second conductor 112 may be a copper-nickel alloy or the like, as long as the thermoelectromotive force can be generated in the closed circuit.
The number of the electrodes on the LED holder 10 is not limited to this, and a plurality of sets of electrode sets (each set of electrode sets includes the first electrode 11 and the second electrode 12 in the first embodiment, or includes the first electrode 11, the second electrode 12, and the third electrode 13 in the second embodiment, etc.) may be disposed on the holder body 101. Alternatively, the holder body 10 may be directly and individually provided with a first electrode 11 capable of generating a thermal electromotive force, and in the subsequent package, the P electrode of the LED chip 21 may be electrically connected to the first electrode pad 311, which is a positive electrode, on the package substrate 31 through a metal bonding wire, and the N electrode thereof may be electrically connected to the second electrode pad 312, which is a negative electrode, on the package substrate 31 through a metal bonding wire.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (7)
1. A preparation method of an LED lamp is characterized by comprising the following steps:
a1, providing an LED bracket, wherein the LED bracket comprises an insulated bracket body, the surface of the bracket body is provided with a die bonding area, the die bonding area of the bracket body is provided with a first electrode for fixing an LED chip, and the first electrode is an electrode slice which is spliced by a first conductor and a second conductor in a side-by-side mode and can generate thermoelectromotive force in a closed loop; the first conductor extends to the bottom surface or the side surface of the bracket body and is exposed to form a first lead part, and the second conductor extends to the bottom surface or the side surface of the bracket body and is exposed to form a second lead part;
a2, providing an LED chip, and fixing the LED chip on a first electrode of an LED bracket to obtain an LED lamp bead;
a3, providing a packaging substrate, a driving power supply and a temperature processor, wherein at least one packaging group is arranged on the packaging substrate, the packaging group comprises a first electrode pad, a second electrode pad, a third electrode pad and a fourth electrode pad which are arranged at intervals, the first electrode pad and the second electrode pad are respectively and electrically connected with the driving power supply, and the third electrode pad and the fourth electrode pad are connected with the temperature processor; the P electrode of the LED chip of the LED lamp bead is electrically connected with the first electrode pad, and the N electrode of the LED chip of the LED lamp bead is electrically connected with the second electrode pad so as to form a power supply loop of the LED chip; the first pin part of the LED lamp bead is electrically connected with the third electrode pad, the second pin part is electrically connected with the fourth electrode pad, and therefore the first conductor and the second conductor of the first electrode are in a closed loop.
2. The method for manufacturing an LED lamp according to claim 1, wherein: the first conductor is made of nickel-chromium alloy, and the second conductor is made of nickel-silicon alloy.
3. The method for manufacturing an LED lamp according to claim 1, wherein: the first conductor is made of nickel-chromium alloy, and the second conductor is made of copper-nickel alloy.
4. The method for manufacturing an LED lamp according to claim 1, wherein: the first conductor is made of copper, and the second conductor is made of copper-nickel alloy.
5. The method for manufacturing an LED lamp according to claim 1, wherein: in the step a1, the die bonding region of the support body is further provided with a second electrode and a third electrode as a positive electrode and a negative electrode, the second electrode extends to the bottom surface or the side surface of the support body and is exposed to form a third lead part, and the third electrode extends to the bottom surface or the side surface of the support body and is exposed to form a fourth lead part; in step a2, the P electrode of the LED chip is electrically connected to the second electrode through a metal bonding wire, and the N electrode thereof is electrically connected to the third electrode through another metal bonding wire; in step a3, a third lead portion of the LED lamp bead is electrically connected to the first electrode pad, and a fourth lead portion is electrically connected to the second electrode pad, thereby forming a power supply loop of the LED chip.
6. The method for manufacturing an LED lamp according to claim 1, wherein: in the step a1, a second electrode is further disposed in the die bonding region of the bracket body, the first electrode is further used as a positive electrode for connecting with a driving power supply, the second electrode is used as a negative electrode with opposite polarity, and the second electrode extends to the bottom surface or the side surface of the bracket body and is exposed to form a third lead part; in step a2, the P electrode of the LED chip is electrically connected to the first electrode through a metal bonding wire, and the N electrode thereof is electrically connected to the second electrode through another metal bonding wire; in step a3, the first lead part or the second lead part of the first electrode of the LED lamp bead is electrically connected to the first electrode pad, and the third lead part is electrically connected to the second electrode pad, thereby forming a power supply loop of the LED chip.
7. The method for manufacturing an LED lamp according to claim 1, wherein: step A4 is further included, a controller is provided, the output end of the temperature processor is connected with the input end of the controller, and the output end of the controller is connected with the input end of the driving power supply.
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