CN111448244B - 具有热塑性增韧的线型酚醛基环氧树脂基质的半浸料 - Google Patents

具有热塑性增韧的线型酚醛基环氧树脂基质的半浸料 Download PDF

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Publication number
CN111448244B
CN111448244B CN201880079380.9A CN201880079380A CN111448244B CN 111448244 B CN111448244 B CN 111448244B CN 201880079380 A CN201880079380 A CN 201880079380A CN 111448244 B CN111448244 B CN 111448244B
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China
Prior art keywords
resin
uncured
epoxy resin
particles
uncured resin
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CN201880079380.9A
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English (en)
Chinese (zh)
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CN111448244A (zh
Inventor
K·L·巴伦
G·埃默森
Y-S·王
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Hexcel Corp
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Hexcel Corp
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Priority claimed from US15/839,467 external-priority patent/US10472474B2/en
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Publication of CN111448244A publication Critical patent/CN111448244A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C08J5/241—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres
    • C08J5/243—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs using inorganic fibres using carbon fibres
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C08J2363/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2477/00—Characterised by the use of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2479/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2461/00 - C08J2477/00
    • C08J2479/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08J2479/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors

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  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Health & Medical Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Laminated Bodies (AREA)
CN201880079380.9A 2017-12-12 2018-12-04 具有热塑性增韧的线型酚醛基环氧树脂基质的半浸料 Active CN111448244B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US15/839,467 2017-12-12
US15/839,467 US10472474B2 (en) 2016-06-22 2017-12-12 Semipreg with thermoplastic toughened novolac-based epoxy resin matrix
PCT/US2018/063710 WO2019135844A1 (en) 2017-12-12 2018-12-04 Semipreg with thermoplastic toughened novolac-based epoxy resin matrix

Publications (2)

Publication Number Publication Date
CN111448244A CN111448244A (zh) 2020-07-24
CN111448244B true CN111448244B (zh) 2023-04-07

Family

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Family Applications (1)

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CN201880079380.9A Active CN111448244B (zh) 2017-12-12 2018-12-04 具有热塑性增韧的线型酚醛基环氧树脂基质的半浸料

Country Status (4)

Country Link
EP (1) EP3724260A1 (ja)
JP (1) JP7348181B2 (ja)
CN (1) CN111448244B (ja)
WO (1) WO2019135844A1 (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117069987B (zh) * 2023-10-17 2023-12-29 天津爱思达航天科技股份有限公司 一种碳纤维预浸料及其制备方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379799B1 (en) * 2000-06-29 2002-04-30 Cytec Technology Corp. Low moisture absorption epoxy resin systems with alkylated diamine hardeners
CN104704029A (zh) * 2012-08-26 2015-06-10 赫克赛尔公司 具有聚酰胺粒子的复合材料
CN104781320A (zh) * 2012-12-19 2015-07-15 塞特工业公司 改善断裂韧性的增韧颗粒

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3708458A (en) 1971-03-16 1973-01-02 Upjohn Co Copolyimides of benzophenone tetracarboxylic acid dianhydride and mixture of diisocyanates
US3936426A (en) 1971-12-21 1976-02-03 Phillips Petroleum Company Amorphous, optically clear polyamide from a bis(4-aminocyclohexyl)methane and a phenylindan dicarboxylic acid
US4945154A (en) 1989-07-07 1990-07-31 Hexcel Corporation Densified polyethersulfone
CA2162430A1 (en) 1995-02-01 1996-08-02 Ems-Inventa Ag Transparent, colorless, amorphous polyamides and molded articles
US6399714B1 (en) 2000-09-27 2002-06-04 Michigan Biotechnology Institute Crosslinked polyamide
JP4475880B2 (ja) 2003-03-13 2010-06-09 東邦テナックス株式会社 エポキシ樹脂組成物
JP4668788B2 (ja) 2003-06-09 2011-04-13 株式会社カネカ 変性エポキシ樹脂の製造方法
JP2006233188A (ja) 2005-01-31 2006-09-07 Toray Ind Inc 複合材料用プリプレグ、および複合材料
US8846818B2 (en) 2009-05-29 2014-09-30 Cytec Technology Corp. Engineered cross-linked thermoplastic particles for interlaminar toughening
GB201307898D0 (en) 2012-06-14 2013-06-12 Hexcel Composites Ltd Improvements in composite materials
JP2014145003A (ja) 2013-01-28 2014-08-14 Toray Ind Inc プリプレグおよび繊維強化複合材料
FR3005660B1 (fr) 2013-05-17 2015-04-24 Arkema France Procede de reticulation en surface de particules de polymere
US10280251B2 (en) 2015-03-17 2019-05-07 Toray Industries, Inc. Epoxy resin composition, prepreg, and carbon fiber-reinforced composite material
KR20180044932A (ko) 2015-08-24 2018-05-03 사이텍 인더스트리스 인코포레이티드 복합 재료 및 준안정 입자를 함유하는 수지 조성물

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6379799B1 (en) * 2000-06-29 2002-04-30 Cytec Technology Corp. Low moisture absorption epoxy resin systems with alkylated diamine hardeners
CN104704029A (zh) * 2012-08-26 2015-06-10 赫克赛尔公司 具有聚酰胺粒子的复合材料
CN104781320A (zh) * 2012-12-19 2015-07-15 塞特工业公司 改善断裂韧性的增韧颗粒

Also Published As

Publication number Publication date
JP2021505743A (ja) 2021-02-18
JP7348181B2 (ja) 2023-09-20
CN111448244A (zh) 2020-07-24
EP3724260A1 (en) 2020-10-21
WO2019135844A1 (en) 2019-07-11

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