CN111444900A

CN111444900A - Electronic device

Info

Publication number: CN111444900A
Application number: CN202010432356.8A
Authority: CN
Inventors: 刘彦铭; 王冠渊; 林东毅
Original assignee: Egis Technology Inc
Current assignee: Egis Technology Inc
Priority date: 2019-12-16
Filing date: 2020-05-20
Publication date: 2020-07-24
Also published as: TWM602662U; WO2021120512A1; CN211857498U; TW202125320A

Abstract

The invention provides an electronic device which comprises a frame body, a display panel, a bottom plate and a fingerprint sensing module. The frame body is provided with a first top surface and a first bottom surface. The display panel is configured on the first top surface of the frame body and provides an illuminating light beam to the finger to reflect the sensing light beam. The bottom plate is arranged on the frame body and is provided with a second top surface and a second bottom surface which are parallel to each other. The fingerprint sensing module is configured on the second top surface of the bottom plate and receives the sensing light beam.

Description

Electronic device

Technical Field

The present disclosure relates to electronic devices, and particularly to an electronic device with fingerprint recognition function.

Background

As portable electronic devices (e.g., smartphones or tablet computers) move toward large screen fractions or full screens. In the process of manufacturing the electronic device comprising the optical fingerprint sensing module, the steel plate for bearing the fingerprint sensing module is required to be processed in a special shape, then the middle frame in the electronic device is processed, and the two components are assembled in the subsequent process. However, this method results in the steel plate having an outer shape that is matched with the middle frame structure, which increases the manufacturing cost. Moreover, the number of machining times is large, and the assembly tolerance is increased, so that the assembly yield and quality are reduced.

Disclosure of Invention

The invention provides an electronic device, which can reduce the processing procedure of a frame body and a bottom plate in the electronic device and reduce the assembly tolerance required to be controlled when the electronic device is assembled.

In view of the above, in the electronic device of the present invention, the bottom plate for carrying the fingerprint sensing module is a flat plate, and the bottom plate is disposed on the frame. Therefore, the bottom plate can be directly connected to the bottom surface of the frame body without additional processing. Therefore, the processing procedure of the frame body and the bottom plate in the electronic device can be reduced, and the assembly tolerance required to be controlled during the assembly of the electronic device is further reduced.

In order to make the aforementioned and other features and advantages of the invention more comprehensible, embodiments accompanied with figures are described in detail below.

Drawings

FIG. 1 is a diagram of an electronic device according to an embodiment of the invention;

FIG. 2 is an assembly diagram of the electronic device of FIG. 1;

FIG. 3 is a diagram of an electronic device according to another embodiment of the invention;

FIG. 4 is a diagram of an electronic device according to another embodiment of the invention;

FIG. 5 is a diagram of an electronic device according to another embodiment of the invention;

FIG. 6 is an assembled view of the electronic device of FIG. 5;

fig. 7 is a schematic view of an electronic device according to another embodiment of the invention.

Description of reference numerals:

10: a finger;

100, 100A, 100B, 100C, 100D: an electronic device;

110, 110A, 110B: a frame body;

112: a first top surface;

113: a side surface;

114: a first bottom surface;

116: a groove;

120: a display panel;

130, 130A: a base plate;

132: a second top surface;

134: a second bottom surface;

140, 140A: a fingerprint sensing module;

142: a circuit board;

144: a sensing component;

146: an elastic connecting member;

148, 148A: a filter layer;

150: an adhesive member;

d1: a horizontal direction;

d2: a vertical direction;

l1 lighting beam;

l2 sensing the light beam;

s: and (5) connecting the surface.

Detailed Description

The following detailed description of embodiments of the invention refers to the accompanying drawings. It is to be understood that the drawings are for purposes of illustration and explanation and not limitation. For clarity, components may not be shown to scale. In addition, some components and/or reference numerals may be omitted from some of the drawings. In the description and drawings, the same or similar reference numerals are used to designate the same or similar components. When a component is referred to as being "disposed on" or "connected" …, it can be "directly on" or "directly connected" … or intervening components may also be present, unless expressly stated otherwise. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments if applicable without further recitation.

Fig. 1 is a schematic diagram of an electronic device according to an embodiment of the invention, please refer to fig. 1, which provides an electronic device 100 including a frame 110, a display panel 120, a bottom plate 130 and a fingerprint sensing module 140. the electronic device 100 has a fingerprint identification function and is suitable for a user to perform fingerprint sensing by pressing the display panel 120. specifically, the display panel 120 transmits an illumination beam L1 to a finger 10 of the user to reflect and generate a sensing beam L2. the electronic device 100 receives the sensing beam L2 to perform fingerprint sensing.

The frame 110 has a first top surface 112 and a first bottom surface 114. Specifically, the frame 110 is, for example, a middle frame (middle frame) of the electronic device 100, and is used for carrying, separating and fixing electronic components in the electronic device 100. In various embodiments, the frame 110 may be a structural stiffener (stiffener) additionally disposed in the electronic device 100, but the invention is not limited thereto.

The display panel 120 is disposed on the first top surface 112 of the frame 110, and provides an illumination light beam L1 to the finger 10 to reflect a sensing light beam L2. the display panel 120 is, for example, an organic light-emitting diode (O L ED) display panel.

The bottom plate 130 has a second top surface 132 and a second bottom surface 134 parallel to each other. The bottom plate 130 is, for example, a steel plate, and is used for carrying the fingerprint sensing module 140. In other words, compared to the conventional bottom plate shape, the bottom plate 130 of the present embodiment is a flat plate, i.e., the thickness of the bottom plate 130 is the same in the horizontal direction D1. In other words, in the present embodiment, the bottom plate 130 does not need to be additionally processed. The base plate 130 is disposed on the frame 110. Specifically, the housing 110 has a connection surface S, and the bottom plate 130 is connected to the connection surface S. In the embodiment, a portion of the first bottom surface 114 of the frame 110 is the connecting surface S, but the invention is not limited thereto.

The fingerprint sensing module 140 is disposed on the second top surface 132 of the base plate 130 and receives a sensing beam L2. in detail, the fingerprint sensing module 140 includes a circuit board 142, a sensing element 144 and a resilient connecting member 146. the circuit board 142 is connected to the display panel 120 through the resilient connecting member 146. the sensing element 144 is, for example, an image sensing chip such as a Complementary Metal Oxide Semiconductor (CMOS) or a Charge Coupled Device (CCD), and the resilient connecting member 146 is, for example, a resilient element having a foam structure such as foam.

More specifically, the fingerprint sensing module 140 further includes a filter layer 148 disposed on the circuit board 142 to cover the sensing element 144. The filter layer 148 is, for example, an infrared light cut filter for filtering infrared light, thereby improving the optical sensing quality. However, in other embodiments, the filter layer 148 may be a filter for filtering other visible light bands or invisible light bands. In addition, the present embodiment does not limit the type or form of the fingerprint sensing module 140, and the detailed structure and implementation thereof can be taught, suggested and described sufficiently by those skilled in the art, and thus will not be described herein again.

Fig. 2 is an assembly diagram of the electronic device of fig. 1. Please refer to fig. 1 and fig. 2. In the process of assembling the electronic device 100, the display panel 120 is first disposed on the frame 110, the fingerprint sensing module 140 is disposed on the bottom plate 130, and finally the fingerprint sensing module 140 is extended into the frame 110 to connect the second top surface 132 of the bottom plate 130 with the first bottom surface 114 of the frame 110. In detail, the electronic device 100 further includes an adhesive 150 connected between the frame 110 and the bottom plate 130. In the embodiment, the adhesive 150 is, for example, a curing adhesive, but the invention is not limited thereto. Since the bottom plate 130 does not need to be additionally processed, it can be directly connected to the first bottom surface 114 of the frame 110, as shown in fig. 1. Therefore, the manufacturing process of the frame 110 and the bottom plate 130 can be reduced, and the assembly tolerance of the electronic device 100 that needs to be controlled during assembly can be reduced.

Fig. 3 is a schematic view of an electronic device according to another embodiment of the invention. Please refer to fig. 3. The electronic device 100A of the present embodiment is similar to the electronic device 100 shown in fig. 1. The difference between the two is that in the present embodiment, the frame body 110A has a groove 116, which extends from the first bottom surface 114 to the first top surface 112, and the connection surface S is located in the groove 116. Specifically, the base plate 130 is connected to the connection surface S in the groove 116 by the adhesive 150. As a result, the thickness of the entire electronic device 100A can be further thinned. The present embodiment does not limit the type or form of the groove 116, and the detailed structure and implementation thereof can be taught, suggested and described sufficiently by those skilled in the art, and thus will not be described herein again.

Fig. 4 is a schematic view of an electronic device according to another embodiment of the invention. Please refer to fig. 4. The electronic device 100B of the present embodiment is similar to the electronic device 100A shown in fig. 3. The difference between the two is that in the present embodiment, the fingerprint sensing module 140A is an embedded infrared filter module. Specifically, the filter layer 148A is directly formed on the upper surface of the sensing element 144, as shown in fig. 4. Thus, the structure of the fingerprint sensing module 140A can be simplified, and the fingerprint sensing module can be further applied to different requirements.

Fig. 5 is a schematic view of an electronic device according to another embodiment of the invention. Please refer to fig. 5. The electronic device 100C of the present embodiment is similar to the electronic device 100 shown in fig. 1. The difference between the two is that in the present embodiment, the connection surface S of the frame body 110B is, for example, an oblique plane inclined to the first bottom surface 114, and extends from the first bottom surface 114 toward the side surface 113 of the frame body 110B, and the bottom plate 130A is connected to the connection surface S. Specifically, the bottom plate 130A is connected to the connection surface S of the housing 110B by the adhesive 150. The present embodiment does not limit the type or form of the connecting surface S, and the detailed structure and implementation thereof can be taught, suggested and described sufficiently by those skilled in the art, and therefore will not be described herein again.

Fig. 6 is an assembly diagram of the electronic device of fig. 5. Please refer to fig. 5 and fig. 6. In addition, in the embodiment, the first bottom surface 114 of the frame 110B is coplanar with the second bottom surface 134 of the bottom plate 130A, and the bottom plate 130A is aligned with the circuit board 142 of the fingerprint sensing module 140 in the vertical direction D2. Therefore, when the electronic device 100A is assembled, the fingerprint sensing module 140 can be cut and assembled on the bottom plate 130A, the assembly can be assembled in the basket space of the frame 110B, and the adhesive 150 (for example, the adhesive is dispensed on the connecting surface S) can be provided after the assembly is completed for connection and fixation. Thus, the thickness of the entire electronic device 100C can be further reduced, and the assembly difficulty can be simplified, thereby improving the yield of the electronic device 100C.

Fig. 7 is a schematic view of an electronic device according to another embodiment of the invention. Please refer to fig. 7. The electronic device 100D of the present embodiment is similar to the electronic device 100C shown in fig. 5. The difference between the two is that in the present embodiment, the fingerprint sensing module 140A is an embedded infrared filter module. Specifically, the filter layer 148A is directly formed on the upper surface of the sensing element 144, as shown in fig. 7. Thus, the structure of the fingerprint sensing module 140A can be simplified, and the fingerprint sensing module can be further applied to different requirements.

In summary, in the electronic device of the present invention, the bottom plate for carrying the fingerprint sensing module is a flat plate, and the bottom plate is disposed on the frame. Therefore, the bottom plate can be directly connected to the bottom surface of the frame body without additional processing. Therefore, the processing procedure of the frame body and the bottom plate in the electronic device can be reduced, and the assembly tolerance required to be controlled during the assembly of the electronic device is further reduced.

Although the present invention has been described with reference to the above embodiments, it should be understood that various changes and modifications can be made therein by those skilled in the art without departing from the spirit and scope of the invention.

Claims

1. An electronic device, comprising:

a frame body having a first top surface and a first bottom surface;

the display panel is arranged on the first top surface of the frame body and provides an illuminating light beam to the finger to reflect a sensing light beam;

a bottom plate disposed on the frame body and having a second top surface and a second bottom surface parallel to each other; and

the fingerprint sensing module is configured on the second top surface of the bottom plate and receives the sensing light beam.

2. The electronic device of claim 1, wherein the thickness of the bottom plate is the same in the horizontal direction.

3. The electronic device of claim 1, further comprising:

and the adhesion piece is connected between the frame body and the bottom plate.

4. The electronic device of claim 3, wherein the adhesive is a curing adhesive.

5. The electronic device of claim 1, wherein the frame has a connection surface, and the base plate is connected to the connection surface.

6. The electronic device of claim 5, wherein the frame has a recess extending from the first bottom surface toward the first top surface, and the connecting surface is located in the recess.

7. The electronic device according to claim 5, wherein the connecting surface of the frame body is inclined to the first bottom surface.

8. The electronic device of claim 1, wherein the first bottom surface of the frame is coplanar with the second bottom surface of the chassis.

9. The electronic device of claim 1, wherein the backplane is vertically aligned with a circuit board of the fingerprint sensing module.

10. The electronic device of claim 1, wherein the fingerprint sensing module comprises a circuit board, a sensing assembly and an elastic connector, and the circuit board is connected to the display panel through the elastic connector.