CN111441078A

CN111441078A - Current auxiliary adjusting device for metal electroplating

Info

Publication number: CN111441078A
Application number: CN202010494282.0A
Authority: CN
Inventors: 汪金桥
Original assignee: Yueqing Zhonghui E Commerce Co ltd
Current assignee: Dongguan huanqiao metal products Co.,Ltd.
Priority date: 2020-06-03
Filing date: 2020-06-03
Publication date: 2020-07-24
Anticipated expiration: 2040-06-03
Also published as: CN111441078B

Abstract

The invention relates to the technical field of metal plating, and discloses a current auxiliary adjusting device for metal plating, which comprises a plating tank, wherein plating solution is arranged in the plating tank, a cathode is arranged on the side surface of the plating tank, a part to be plated is arranged at one end of the plating tank close to the cathode, an anode is arranged at one side of the plating tank far away from the cathode, plating metal is arranged at one end of the plating tank close to the anode, a current transformer is arranged on the side surface of the plating tank, a first induction coil is arranged on the side surface of the current transformer, a control box is arranged on the side surface of the first induction coil, the current auxiliary adjusting device for metal plating is used by matching the plating solution and the current transformer, the current transformer and the first induction coil are used in a matching way, when the current in the plating solution changes, the current auxiliary adjusting device can be detected at the first time to adjust the, the current is kept stable.

Description

Current auxiliary adjusting device for metal electroplating

Technical Field

The invention relates to the technical field of metal plating, in particular to a current auxiliary adjusting device for metal plating.

Background

The metal electroplating is a process of plating a thin layer of other metals or alloys on the surface of some metals by using the principle of electrolysis, and is a process of attaching a layer of metal film on the surface of a metal or other material workpiece by using the action of electrolysis, thereby playing roles of preventing metal oxidation (such as corrosion), improving wear resistance, conductivity, light reflection, corrosion resistance (such as copper sulfate and the like), enhancing the appearance and the like. In the metal plating process, the plating effect of the object to be plated is closely related to the magnitude of the current, so that the stability of the current is very important during the plating.

Current metal plating equipment, when electroplating, will wait to plate a good with cladding material metal, set for electroplating time, after electroplating time finishes, metal plating has just ended, at this in-process, does not monitor the electric current in the electroplating bath, and the electric current can be because of the change of plating solution, waits to plate a surface coating's formation, and the reduction of cladding material metal and wait to plate a factor such as generating heat with cladding material metal change, influence the efficiency and the effect of metallic coating, reduce the practical effect of cladding material.

In order to solve the problems, the current auxiliary adjusting device for metal electroplating has the advantages that the electroplating current can be monitored, the current can be automatically adjusted, the stability of the current in electroplating liquid is guaranteed, the electroplating process of a piece to be plated is more stable, and the electroplating effect is better.

Disclosure of Invention

Technical problem to be solved

Aiming at the defects of the prior art, the invention provides the current auxiliary adjusting device for metal electroplating, which has the advantages of monitoring electroplating current, automatically adjusting the current and ensuring the stability of the current in electroplating solution, and solves the problems of unstable current and poor electroplating effect in the electroplating solution of the prior device.

(II) technical scheme

In order to realize the purposes of monitoring the electroplating current, automatically adjusting the current and ensuring the stability of the current in the electroplating solution, the invention provides the following technical scheme: a current auxiliary adjusting device for metal electroplating comprises an electroplating pool, electroplating solution is arranged inside the electroplating pool, a cathode is arranged on the side surface of the electroplating pool, a part to be plated is arranged at one end, close to the cathode, of the electroplating pool, an anode is arranged at one side, far away from the cathode, of the electroplating pool, plating metal is arranged at one end, close to the anode, of the electroplating pool, a converter is arranged on the side surface of the electroplating pool, a first induction coil is arranged on the side surface of the converter, a control box is arranged on the side surface of the first induction coil, a push rod is arranged inside the control box, a first magnet is arranged on the surface of the push rod, an auxiliary spring is arranged on the surface of the push rod, a power supply is arranged inside the control box, a first connecting plate is arranged inside the control box, a first connecting wire is arranged on the side surface of the first connecting plate, a regulating box is, the liquid mixing box is characterized in that a first solution is arranged inside the liquid mixing box, a second solution is arranged inside the liquid mixing box, a liquid inlet is formed in the surface of the liquid mixing box, a second induction coil is arranged inside the liquid mixing box, a baffle is arranged on the surface of the liquid inlet, a second magnet is arranged on the upper portion of the baffle, a sliding groove is formed in the inside of the liquid mixing box, a second connection plate is arranged inside the control box, and a second wiring is arranged on the side face of the second connection plate.

Preferably, the current transformer is connected to the plating solution and the first induction coil through a wire.

Preferably, the first induction coil is opposite to a corresponding magnetic pole of the magnet.

Preferably, the first connecting plate is connected with one end of the power supply through a lead, the first connecting wire is connected with the other end of the power supply through a lead, and the first connecting wire is connected with the second induction coil in the second solution through a lead.

Preferably, the solute contained in the first solution is the same as that in the plating solution and has a lower concentration than that in the plating solution.

Preferably, the solute contained in the second solution is at a higher concentration than that in the plating solution, as in the plating solution.

Preferably, two liquid inlets are arranged in the solution I and the solution II respectively and are communicated with the electroplating pool.

Preferably, the second induction coil has a magnetic pole opposite to the corresponding magnetic pole of the second magnet.

Preferably, the second connection plate is connected with one end of the power supply through a wire, the second connection wire is connected with the other end of the power supply through a wire, and the second connection wire is connected with the second induction coil in the first solution through a wire.

(III) advantageous effects

Compared with the prior art, the invention provides a current auxiliary adjusting device for metal electroplating, which has the following beneficial effects:

1. this adjusting device is assisted to electric current for metal plating uses through the cooperation of plating solution and converter, and the converter uses with first induction coil's cooperation, and when the electric current in the plating solution changed, can detect by the very first time, and timely change to electric current in the plating solution is adjusted, makes the electric current remain stable.

2. This adjusting device is assisted to electric current for metal plating uses through the cooperation between push rod and first access board and the second access board, and the cooperation between second induction coil and first wiring and the second wiring is used, and the baffle uses with the cooperation of solution one and solution two, makes the ion concentration in the plating solution change, keeps the stability of electric current in the plating solution and the speed of electroplating, improves metal plating's effect.

Drawings

FIG. 1 is a schematic top view of the present invention;

FIG. 2 is a front view of the dispensing box of the present invention.

In the figure: 1. an electroplating pool; 2. electroplating solution; 3. a cathode; 4. a part to be plated; 5. an anode; 6. plating metal; 7. a current transformer; 8. a first induction coil; 9. a control box; 10. a push rod; 11. a first magnet; 12. an auxiliary spring; 13. a power source; 14. a first connection plate; 15. a first wiring; 16. a dispensing box; 17. solution one; 18. solution II; 19. a liquid inlet; 20. a second induction coil; 21. a baffle plate; 22. a second magnet; 23. a chute; 24. a second connection plate; 25. a second wiring;

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1-2, a current auxiliary adjusting device for metal electroplating comprises an electroplating tank 1, an electroplating solution 2 is disposed in the electroplating tank 1, a cathode 3 is disposed on a side surface of the electroplating tank 1, a to-be-plated part 4 is disposed at an end of the electroplating tank 1 close to the cathode 3, an anode 5 is disposed at an end of the electroplating tank 1 away from the cathode 3, a plating metal 6 is disposed at an end of the electroplating tank 1 close to the anode 5, a current transformer 7 is disposed on a side surface of the electroplating tank 1, the current transformer 7 is connected to the electroplating solution 2 and a first induction coil 8 through a wire and is used for amplifying current in the electroplating solution 2, a first induction coil 8 is disposed on a side surface of the current transformer 7, the first induction coil 8 has a magnetic pole opposite to a magnetic pole corresponding to a first magnet 11 and can generate an adsorption effect on the first magnet 11, a control box 9 is disposed on a side surface of the, the first switch-on plate 14 and the second switch-on plate 24 are pushed to move, and a first magnet 11 is arranged on the surface of the push rod 10 and is matched with the first induction coil 8 to drive the push rod 10 to move.

An auxiliary spring 12 is arranged on the surface of the push rod 10 and is matched with the first magnet 11 to drive the push rod 10 to move, a power supply 13 is arranged inside the control box 9, a first connecting plate 14 is arranged inside the control box 9, the first connecting plate 14 is connected with one end of the power supply 13 through a lead and is matched with a first wiring 15 to connect an electric loop where the first wiring 15 is arranged, a second induction coil 20 is connected with current, a first wiring 15 is arranged on the side surface of the first connecting plate 14, the first wiring 15 is connected with the other end of the power supply 13 through a lead, the first wiring 15 is connected with a second induction coil 20 in a solution II 18 through a lead, a regulating box 16 is arranged on the surface of the electroplating pool 1 and is used for regulating the concentration of the solution in the electroplating solution 2, a solution I17 is arranged inside the regulating box 16, the dissolved matter in the solution I17 is the same as that in the electroplating solution 2 and has a concentration lower than that in the electroplating solution 2 and is used for reducing the concentration of, the second solution 18 is provided in the dispensing tank 16, and the solute contained in the second solution 18 has a higher concentration than that in the plating liquid 2, as in the plating liquid 2, and is used for increasing the concentration of the solution in the plating liquid 2.

A liquid inlet 19 is arranged on the surface of the regulating box 16, two liquid inlets 19 are arranged and are respectively positioned inside a first solution 17 and a second solution 18 and communicated with the electroplating pool 1, a second induction coil 20 is arranged inside the regulating box 16, the magnetic poles of the second induction coil 20 and the second magnet 22 are opposite and are used for adsorbing the second magnet 22, a baffle 21 is arranged on the surface of the liquid inlet 19 and is used for controlling the first solution 17 and the second solution 18 to enter the electroplating solution 2, the second magnet 22 is arranged on the upper portion of the baffle 21, a sliding groove 23 is formed inside the regulating box 16, a second connection plate 24 is arranged inside the control box 9, the second connection plate 24 is connected with one end of the power supply 13 through a lead and is matched with the second connection wire 25 to connect an electric circuit where the second connection plate is positioned so that the second induction coil 20 is connected with current, a second connection wire 25 is arranged on the side surface of the second connection plate 24, and the second connection wire 25 is connected with the other end of the, the second connection 25 is connected to the second induction coil 20 in the first solution 17 by a wire.

The working principle is that after metal electroplating is started, cations of plating metal 6 in the electroplating pool 1 are reduced on the surface of the piece to be plated 4 to form a plating layer, in the electroplating process, due to the change of the electroplating solution 2, the formation of the plating layer on the surface of the piece to be plated 4, the reduction of the plating metal 6, the influence of factors such as the heating of the piece to be plated 4 and the plating metal 6 and the like, the current in the electroplating solution 2 is changed, the change signal of the current is amplified through the converter 7 when the current in the electroplating solution 2 is changed, and then the current in the first induction coil 8 is changed through a lead.

When the current in the first induction coil 8 is reduced, the magnetic field intensity generated by the first induction coil is also weakened, the adsorption effect on the first magnet 11 is reduced, the push rod 10 moves in the direction away from the first induction coil 8 under the action of the auxiliary spring 12 and then contacts with the first connection plate 14 to push the first connection plate 14 to move, so that the first connection plate 14 contacts with the first connection wire 15, when the first connection plate 14 contacts with the first connection wire 15, the electric loop where the first connection plate is located is closed, the second induction coil 20 in the solution II 18 is connected with current, the second induction coil 20 starts to generate a magnetic field, then adsorption acting force is generated on the magnet II 22, the magnet II 22 drives the baffle plate 21 to move upwards, so that the baffle plate 21 is separated from the liquid inlet 19, the solution II 18 starts to enter the electroplating pool 1, so that the concentration of the electroplating solution 2 is increased, the concentration of ions in the electroplating solution 2 is changed, so that the current is increased, when the current is restored to the original value, the current in the first induction coil 8 is also synchronously recovered, the push rod 10 is also recovered to the original position, the first connection plate 14 is separated from the first connection wire 15, the circuit where the first connection plate is located is disconnected, the current in the second induction coil 20 disappears, the induction magnetic field disappears, the baffle 21 falls down and closes the liquid inlet 19, and the electroplating process in the electroplating pool 1 is recovered to be normal.

When the current in the first induction coil 8 is increased, the magnetic field intensity generated by the first induction coil 8 is also increased, the adsorption effect on the first magnet 11 is increased, the push rod 10 moves towards the first induction coil 8 under the action of the first induction coil 8 and then contacts with the second connection plate 24 to push the second connection plate 24 to move, so that the second connection plate 24 contacts with the second connection wire 25, when the second connection plate 24 contacts with the second connection wire 25, the electric loop where the second connection plate is located is closed, the second induction coil 20 in the solution I17 is connected with the current, the second induction coil 20 starts to generate a magnetic field, then adsorption acting force is generated on the second magnet 22, the second magnet 22 drives the baffle plate 21 to move upwards, so that the baffle plate 21 is separated from the liquid inlet 19, the solution I17 starts to enter the electroplating pool 1, so that the concentration of the electroplating solution 2 is reduced, the concentration of ions in the electroplating solution 2 is changed, so that the current is reduced, when the current is restored to the original value, the current in the first induction coil 8 is also synchronously recovered, the push rod 10 is also recovered to the original position, the second connection plate 24 is separated from the second connection wire 25, the circuit where the second connection plate is located is disconnected, the current in the second induction coil 20 disappears, the induction magnetic field disappears, the baffle 21 falls and closes the liquid inlet 19, and the electroplating process in the electroplating pool 1 is recovered to be normal.

In summary, the current auxiliary adjusting device for metal plating uses the plating solution 2 and the converter 7 in cooperation, and the converter 7 and the first induction coil 8 in cooperation, so that when the current in the plating solution 2 changes, the current auxiliary adjusting device can detect the change of the current in the plating solution 2 at the first time, adjust the change of the current in the plating solution 2 in time, and keep the current stable.

The current auxiliary adjusting device for metal plating is used in cooperation with the first connecting plate 14 and the second connecting plate 24 through the push rod 10, the second induction coil 20, the first connecting wire 15 and the second connecting wire 25, and the baffle plate 21, the first solution 17 and the second solution 18, so that the ion concentration in the plating solution 2 is changed, the stability of current in the plating solution 2 and the plating rate are kept, and the metal plating effect is improved.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a metal is electroplated and is used supplementary adjusting device of electric current, includes electroplating bath (1), its characterized in that: the electroplating bath (2) is arranged in the electroplating pool (1), a cathode (3) is arranged on the side face of the electroplating pool (1), a part (4) to be plated is arranged at one end, close to the cathode (3), of the electroplating pool (1), an anode (5) is arranged on one side, far away from the cathode (3), of the electroplating pool (1), plating metal (6) is arranged at one end, close to the anode (5), of the electroplating pool (1), a current transformer (7) is arranged on the side face of the electroplating pool (1), a first induction coil (8) is arranged on the side face of the current transformer (7), a control box (9) is arranged on the side face of the first induction coil (8), a push rod (10) is arranged in the control box (9), a first magnet (11) is arranged on the surface of the push rod (10), an auxiliary spring (12) is arranged on the surface of the push rod (10), a power supply (13) is arranged, a first connecting plate (14) is arranged in the control box (9), a first wiring (15) is arranged on the side surface of the first connecting plate (14), the surface of the electroplating pool (1) is provided with a regulating box (16), a first solution (17) is arranged in the regulating box (16), a second solution (18) is arranged in the dispensing box (16), a liquid inlet (19) is arranged on the surface of the dispensing box (16), a second induction coil (20) is arranged in the dispensing box (16), a baffle (21) is arranged on the surface of the liquid inlet (19), a second magnet (22) is arranged at the upper part of the baffle plate (21), a sliding groove (23) is arranged inside the dispensing box (16), and a second connection plate (24) is arranged in the control box (9), and a second connection wire (25) is arranged on the side surface of the second connection plate (24).

2. The current auxiliary adjusting device for metal plating according to claim 1, characterized in that: the current transformer (7) is connected with the electroplating solution (2) and the first induction coil (8) through leads.

3. The current auxiliary adjusting device for metal plating according to claim 1, characterized in that: the first induction coil (8) and the first magnet (11) have opposite corresponding magnetic poles.

4. The current auxiliary adjusting device for metal plating according to claim 1, characterized in that: the first connecting plate (14) is connected with one end of a power supply (13) through a lead, the first connecting wire (15) is connected with the other end of the power supply (13) through a lead, and the first connecting wire (15) is connected with the second induction coil (20) in the second solution (18) through a lead.

5. The current auxiliary adjusting device for metal plating according to claim 1, characterized in that: the solute contained in the first solution (17) is the same as that in the plating liquid (2) and has a lower concentration than that in the plating liquid (2).

6. The current auxiliary adjusting device for metal plating according to claim 1, characterized in that: the solute contained in the second solution (18) has the same concentration as that in the plating solution (2) and is higher than that in the plating solution (2).

7. The current auxiliary adjusting device for metal plating according to claim 1, characterized in that: two liquid inlets (19) are respectively positioned inside the first solution (17) and the second solution (18) and communicated with the electroplating pool (1).

8. The current auxiliary adjusting device for metal plating according to claim 1, characterized in that: the second induction coil (20) and the second magnet (22) have opposite corresponding magnetic poles.

9. The current auxiliary adjusting device for metal plating according to claim 1, characterized in that: the second connection plate (24) is connected with one end of the power supply (13) through a lead, the second connection wire (25) is connected with the other end of the power supply (13) through a lead, and the second connection wire (25) is connected with the second induction coil (20) in the first solution (17) through a lead.