CN111430511A

CN111430511A - Light emitting element and method for manufacturing the same

Info

Publication number: CN111430511A
Application number: CN202010122844.9A
Authority: CN
Inventors: 邱柏顺; 郭得山; 杨治政; 黄俊儒; 李建辉; 陈英杰; 林资津
Original assignee: Epistar Corp
Current assignee: Epistar Corp
Priority date: 2014-07-25
Filing date: 2014-07-25
Publication date: 2020-07-17
Also published as: CN105322057B; CN105322057A

Abstract

The invention discloses a light-emitting component and its manufacturing method, its method includes providing a light-emitting diode wafer, including a substrate and a semiconductor lamination located on the substrate, wherein the semiconductor lamination includes a first semiconductor layer, an active layer, a second semiconductor layer, a lower surface facing the substrate and an upper surface opposite to the lower surface; removing the second semiconductor layer and the active layer in partial areas and exposing the first semiconductor layer to form a plurality of platforms; providing a first laser beam to irradiate the semiconductor laminated layer from the upper surface so as to form a plurality of cutting lines on the surfaces of the platforms, wherein the plurality of cutting lines extend downwards from the platforms; cleaning the LED wafer by a wet etching process; forming an electrode on the semiconductor stack; providing a second laser beam to focus the inside of the substrate, and forming one or more coarsening marks in the substrate; and separating the light emitting diode wafer to form a plurality of light emitting diode dies.

Description

Light emitting element and method for manufacturing the same

The present application is a divisional application of the chinese invention patent application (application No. 201410357714.8, application date: 2014: 07/25, title: light emitting element and manufacturing method thereof).

Technical Field

The present invention relates to a light emitting diode and a method for manufacturing the same, and more particularly, to a technology for dividing a light emitting diode wafer.

Background

Light-emitting diodes (L ED) are optoelectronic devices composed of p-type and n-type semiconductors, which emit light through the combination of carriers on the p-n junction, and are widely used in optical displays, traffic lights, data storage devices, communication devices, lighting devices, medical devices, etc. conventional manufacturing processes for light-emitting diodes are to grow a stack of semiconductors on a substrate by an epitaxial technique to form a wafer, and then to perform a dicing process to divide the wafer into a plurality of LED dies.

In the conventional wafer dicing technology, two groups of cutting lines perpendicular to each other are formed on the surface of a light emitting diode wafer, and then a cleaver is used to align the two perpendicular lines for splitting, so that the wafer is split along the cutting lines and separated into a plurality of light emitting diode dies. However, due to the limitation of the cutting technique, if the thickness of the substrate is increased, the yield of the cleavage is not good. In addition, chips or dust generated during the wafer dicing process are easily left on the die, which causes light absorption and results in poor light-emitting effect and reduced brightness of the die.

Disclosure of Invention

In order to solve the above problems, the present invention discloses a method for manufacturing a light emitting device, comprising: providing a light emitting diode chip comprising a substrate and a semiconductor lamination layer positioned on the substrate, wherein the semiconductor lamination layer comprises a first semiconductor layer, an active layer, a second semiconductor layer, a lower surface facing the substrate and an upper surface opposite to the lower surface; removing the second semiconductor layer and the active layer in partial areas and exposing the first semiconductor layer to form a plurality of platforms; providing a first laser beam to irradiate the semiconductor laminated layer from the upper surface so as to form a plurality of cutting lines on the surfaces of the platforms, wherein the plurality of cutting lines extend downwards from the platforms; cleaning the LED wafer by a wet etching process; forming an electrode on the semiconductor stack; providing a second laser beam to focus the inside of the substrate, and forming one or more coarsening marks in the substrate; and separating the light emitting diode wafer to form a plurality of light emitting diode dies.

The invention also discloses a light emitting diode core, comprising: a substrate including an upper surface, a lower surface and a plurality of side surfaces; and a semiconductor lamination layer arranged on the upper surface of the substrate; wherein one of the plurality of side surfaces comprises a first region adjacent to the upper surface and having a first roughness; a second region having one or more roughened traces substantially parallel to the upper or lower surface, wherein the roughened trace or any one of the plurality of roughened traces has a second roughness; and a third region between the first region and the second region or/and the plurality of roughening marks, and having a third roughness; wherein the first roughness is not greater than the second roughness and the third roughness is less than the first roughness.

Drawings

FIGS. 1A to 1F are schematic views of one embodiment of the manufacturing method of the present invention;

FIG. 2 is a schematic view of another embodiment of the manufacturing method of the present invention;

FIG. 3 is a schematic view of another embodiment of the manufacturing method of the present invention;

FIG. 4 is a schematic structural diagram of an embodiment of the present invention;

FIGS. 5A and 5B are scanning electron micrographs of an embodiment of the invention;

FIG. 6 is a schematic structural diagram of another embodiment of the present invention;

fig. 7 is a graph comparing the power of led dies under different thickness substrates measured by the manufacturing method of the present invention.

Description of the symbols

1 wafer

3 light-emitting diode core

10 base plate

20 semiconductor stack

22 first semiconductor layer

24 active layer

26 second semiconductor layer

32 first electrode

34 second electrode

50 second laser beam

60 reflective structure

100 cutting line

101 first surface

102 second surface

103 side surface

200. 210, 220, 230, 240 coarsening mark

250 nick

300 first zone

400 third zone

Detailed Description

Embodiments of the invention will be described in detail and illustrated in the accompanying drawings, wherein like or similar elements may be referred to by like numerals throughout the several views and the description.

In a first embodiment of the method for manufacturing an led die according to the present invention, as shown in fig. 1A, a substrate 10 is provided, which includes a first surface 101 and a second surface 102, and a semiconductor stack 20 is grown on the first surface 101 by an epitaxial process to form a wafer 1. The substrate 10 may be a Sapphire (Sapphire) substrate, a Silicon (Silicon) substrate, a Silicon carbide (SiC) substrate, a gallium nitride (GaN) substrate, or a gallium arsenide (GaAs) substrate. The thickness of the substrate 10 is not less than 150 μm, and preferably, may be between 150 μm and 250 μm. The semiconductor stack 20 includes a first semiconductor layer 22, a second semiconductor layer 26, and an active layer 24 disposed between the first semiconductor layer 22 and the second semiconductor layer 26. Wherein the first semiconductor layer 22 and the second semiconductor layer 26 have different electrical properties. The material of the semiconductor stack 20 includes at least one element selected from the group consisting of aluminum (Al), gallium (Ga), indium (In), nitrogen (N), phosphorus (P), arsenic (As), and silicon (Si), such As a semiconductor compound of AlGaInP, AlN, GaN, AlGaN, InGaN, AlInGaN, or the like. The structure of the active layer 24 may be a Single Heterostructure (SH), a Double Heterostructure (DH), a double-side double heterostructure (DDH), or a multiple quantum well structure (MQW).

Next, as shown in fig. 1B, an etching process is performed to remove a portion of the second semiconductor layer 26 and the active layer 24 and expose the first semiconductor layer 22, so as to form a multi-etching platform 201. Then, a first laser beam is irradiated from a surface of the semiconductor stack 20, and a plurality of scribe lines 100 are formed on the surface of the wafer 1 through a first laser scribing process, wherein the scribe lines 100 penetrate through the semiconductor stack 20 and are scribed to a depth of the substrate 10. Fig. 1C is a top view of the scribe line 100 irradiated by the first laser beam, the scribe line 103 includes a plurality of first scribe lines 103 and a plurality of second scribe lines 104, and the first scribe lines 103 and the second scribe lines 104 may be substantially perpendicular to each other by the arrangement of the plurality of etching platforms 201. Next, as shown in fig. 1D, a current blocking layer (not shown), a current diffusion layer (not shown), a first electrode 32 and a second electrode 34 are formed on the semiconductor stack 20. Next, as shown in fig. 1E, the second laser beam 50 is irradiated from the second surface 102 of the substrate 10 along the cutting line 100, and the second laser beam is focused inside the substrate, so as to form a rough mark 200 corresponding to the cutting line 100 in the substrate 10. The second laser beam may be a Stealth scribing (Stealth scribing) laser, and the roughened mark 200 is a Stealth scribe line. In order to avoid the semiconductor stack 20 from being damaged by the scattering of the laser beam and causing electrical failure, the position where the second laser beam is focused and the roughening mark 200 is formed inside the substrate 10 should be at least 2080 μm away from the semiconductor stack.

After the above steps are completed, an external force is applied to the wafer 1 to separate the wafer 1 into a plurality of led dies 3, as shown in fig. 1F. In the first or second laser cutting process, the wafer or the substrate is prone to generate residues such as dust or debris, and once the residues are attached to the surface or the side surface of the led die, the residues absorb light to cause adverse effects such as poor light-emitting effect of the die and reduced brightness. Therefore, after the first and/or second laser dicing process is performed, a wet etching process may be used to remove the residue from the die surface, and the wet etching solution may be an acidic solution, including but not limited to a phosphoric acid solution, a sulfuric acid solution, or a mixture thereof.

Fig. 2 is another embodiment of a method of manufacturing a light emitting diode die of the present invention. In this embodiment, the thicker substrate 10 is used to increase the light-emitting area and the light-emitting angle of the led die, and the epitaxial growth process, the first laser cutting process, the electrode formation process, and other processes are the same as those in the first embodiment, and thus are not described again. When the thickness of the substrate is increased, the second surface 102 of the substrate 10 may be subjected to the multiple stealth dicing lasers along the above-mentioned scribe line 100 to form multiple different

stealth scribe lines

210 and 220 on the same cross section inside the substrate 10, for example, the multiple stealth dicing lasers may be focused at a deeper depth in the substrate (i.e. at a depth closer to the semiconductor stack), the subsequent stealth dicing lasers may be focused at a shallower depth in the substrate (i.e. at a depth farther from the semiconductor stack), and the multiple stealth dicing lasers may be sequentially focused, or two stealth scribe lines may be formed in one stealth dicing laser, but the embodiment of the present invention is not limited thereto. Next, as described in the previous embodiments, after performing the stealth scribing laser fabrication process multiple times, the wafer is separated into a plurality of led dies by an external force. The invisible cutting lines can guide the crack direction in the subsequent splitting manufacturing process, so that the tube core is not split along the direction of easy cracking of crystal lattices when being separated, but is vertically split downwards along the direction of cutting stress, the oblique splitting distance is reduced, and the cutting yield is improved. The number of times of applying the stealth dicing laser may be determined according to the thickness of the substrate, and the number of times of repetition is not more than (substrate thickness-100) (unit μm) ÷ 50 unconditionally carried to an integer value. For example, when the thickness of the substrate is between 150 μm and 200 μm, the invisible cutting laser manufacturing process can be performed on the substrate no more than twice; when the thickness of the substrate is 200-250 μm, no more than three times of invisible cutting laser manufacturing processes can be carried out on the substrate, and so on. When a thick substrate is adopted, if the times of implementing the invisible cutting laser manufacturing process are insufficient, the cutting yield is poor; if the stealth scribing process is performed for too many times under a specific substrate thickness, the cost is increased, and the laser energy may be scattered to the semiconductor stack layer for many times, which may cause damage to the led die, such as increased leakage current.

In another embodiment of the method for manufacturing the light emitting diode die, the first laser beam is irradiated on the surface of the wafer with the substrate with the thickness not less than 150 μm, and then the invisible cutting laser is applied on the second surface of the substrate for multiple times. In order to prevent the semiconductor stack 20 from being damaged by scattering of the laser beam, the power of the stealth dicing laser applied inside the substrate 10 at a depth close to the semiconductor stack 20 may be smaller than the power of the stealth dicing laser applied at another depth farther from the semiconductor stack 20, and the dicing speed may be greater than the dicing speed of the laser applied at another depth farther from the semiconductor stack 20. That is, the stealth dicing laser implemented inside the substrate 10 near the semiconductor stack 20 may employ laser specifications of low power and high dicing speed, and in a preferred embodiment, the power of the stealth dicing laser may be between 0.05 and 0.15W (watts) and the dicing speed may be between 400 and 1000mm/sec (millimeters/second).

Fig. 3 is another embodiment of a method of manufacturing a light emitting diode die of the present invention. In the present embodiment, after the stealth scribing laser process is performed, the reflective structure 60 is formed on the second surface 102 of the substrate 10 to reflect the light from the semiconductor stack 20, so as to improve the light extraction efficiency of the die, and then the die separation process is performed. The material of the reflective structure 60 may be a metal material, including but not limited to copper (Cu), aluminum (Al), tin(Sn), gold (Au), silver (Ag), lead (Pb), titanium (Ti), nickel (Ni), platinum (Pt), tungsten (W), or an alloy thereof. The reflective structure 60 may also be a Distributed Bragg Reflector (DBR) comprising at least two or more materials having different refractive indices that are alternately stacked. The bragg reflective structure may be an insulating material or a conductive material, and the insulating material includes, but is not limited to, Polyimide (PI), benzocyclobutene (BCB), Perfluorocyclobutane (PFCB), magnesium oxide (MgO), Su8, Epoxy (Epoxy), Acrylic Resin (Acrylic Resin), cyclic olefin Polymer (COC), polymethyl methacrylate (PMMA), polyethylene terephthalate (PET), Polycarbonate (PC), Polyetherimide (Polyetherimide), Fluorocarbon Polymer (Fluorocarbon Polymer), Glass (Glass), aluminum oxide (Al)₂O₃) Magnesium oxide (MgO), silicon oxide (SiO)_x) Titanium oxide (TiO)₂) Tantalum oxide (Ta)₂O₅) Silicon nitride (SiN)_x) Spin-on glass (SOG) or Tetraethoxysilane (TEOS). The conductive material includes, but is not limited to, Indium Tin Oxide (ITO), indium oxide (InO), tin oxide (SnO), Cadmium Tin Oxide (CTO), Antimony Tin Oxide (ATO), Aluminum Zinc Oxide (AZO), Zinc Tin Oxide (ZTO), Gallium Zinc Oxide (GZO), aluminum gallium arsenide (AlGaAs), gallium nitride (GaN), gallium phosphide (GaP), or Indium Zinc Oxide (IZO). The reflective structure 60 may also be an omni-directional reflector (ODR) formed by a dielectric layer and a metal layer.

FIG. 4 is a schematic view of a light emitting diode die formed by a method according to the present invention. The led die includes a substrate 10 having a first surface 101, a second surface 102, and a plurality of side surfaces 103, and a semiconductor stack 20 disposed on the first surface 101 of the substrate 10. The substrate thickness is not less than 150 μm, preferably between 150 μm and 250 μm. The side surfaces 103 have a first region 300, a second region 200 comprising one or more roughening scratches 210/220 substantially parallel to the first surface 101 or the second surface 102, and a third region 400 between the first region 300 and the second region 200 or/and between the roughening scratches 200. The first region 300 is formed by dicing the substrate 10 to a depth through a first laser dicing process, is located on the substrate side surface 103 near the semiconductor stack 20, and has a first surface Roughness (RMS). The one or more rough marks 210/220 in the second region 200 are formed by performing one or more second laser cutting processes, i.e., invisible cutting lines, and the rough mark 210/220 has a second surface roughness. The third region 400 is a substrate cleavage plane having a third surface roughness. In a preferred embodiment, the first surface Roughness (RMS) of the first region 300 is not greater than 1 μm, the second surface Roughness (RMS) of the rough mark 210/220 in the second region 200 is between 1 μm and 5 μm, and the surface Roughness (RMS) of the third region 400 is less than the first surface roughness and the second surface roughness. In addition, the second surface 102 of the substrate 10 may include a reflective structure (not shown) to improve the overall die light extraction efficiency.

Specifically, fig. 5A is an electron microscope scanning image of a led die formed by a manufacturing method according to the present invention, the substrate side surface has a first region 300, a second region 200 including a plurality of roughening traces 210/220/230, and a third region 400 near the semiconductor stack, and fig. 5B is a partial enlarged view of the roughening traces 200 in fig. 5A, each of which is composed of a plurality of stripe-shaped traces 250 substantially perpendicular to the first surface or the second surface of the substrate 10. In a preferred embodiment, the width of the single or multiple roughening scratches 200 (i.e. the length of the scratches 250) on the side surface of the substrate 10 is less than 60 μm, and the distance from the semiconductor stack 20 is not less than 80 μm, but the embodiment is not limited thereto.

FIG. 6 is a schematic diagram of a light emitting diode die formed by another method according to the present invention. The surface 103 of the substrate 10 near the semiconductor stack 20 has a first roughened surface 230, and the surface of the substrate farther away from the semiconductor stack has a second roughened surface 240. The difference from the schematic structure of the led die shown in fig. 4 is that, since the invisible cutting laser process performed in the substrate 10 near the semiconductor stack 20 adopts a laser specification with low power and high cutting speed, the pitch of the first rough scratches 230 is greater than the pitch of the second rough scratches 240.

Fig. 7 is a graph comparing Power (Power) measured under different dicing process conditions for led dies using substrates of different thicknesses according to the method of the present invention. The group A is a laser cutting technology which only adopts the surface of the semiconductor lamination to irradiate, namely, only adopts a first laser cutting manufacturing process, the group B is a technology which adopts first laser cutting and is matched with single invisible cutting laser, the group C is a technology which adopts first laser cutting and is matched with twice invisible cutting laser, and the group D is a technology which adopts first laser cutting and is matched with three times of invisible cutting laser. In this experiment, a wafer of 150 μm substrate was subjected to a first laser dicing technique, and the led die obtained after the force separation was used as a control, that is, the measured power value was determined to be 100%. Compared with the control group, the power value measured by the LED tube core obtained by each group of cutting manufacturing process conditions can be improved by more than 0.7% under each substrate thickness by the experimental group matched with the invisible cutting laser, and can be improved by about 4% when the substrate thickness is 250 micrometers. After the light emitting diode of the 200 μm substrate is subjected to laser cutting and is matched with three times of invisible cutting lasers, the measured power is reduced, and the electrical property abnormality of the semiconductor lamination caused by the invisible cutting lasers for many times is estimated.

The substrate with the thickness not less than 150 mu m is used in the invention, so that more light-emitting areas and light-emitting angles can be obtained, and the laser cutting manufacturing process is matched with the single or multiple invisible laser cutting manufacturing processes to improve the cutting yield. In addition, the coarsening marks on the side surface of the substrate can adjust the surface form of the side of the tube core, thereby avoiding the internal total reflection effect caused by a smooth surface, improving the light emitting and scattering effects of the side surface of the tube core and achieving the purpose of improving the overall light emitting efficiency of the light emitting diode tube core.

The foregoing embodiments are merely illustrative of the principles and utilities of the present application and are not intended to limit the application. Any person skilled in the art to which this application belongs can modify and change the above-mentioned embodiments without departing from the technical principle and spirit of this application. Therefore, the protection scope of the claims of the present application shall be subject to the appended claims.

Claims

1. A method for manufacturing a light emitting device includes:

providing a light emitting diode wafer, comprising a substrate and a semiconductor lamination layer positioned on the substrate, wherein the semiconductor lamination layer comprises a first semiconductor layer, an active layer, a second semiconductor layer, a lower surface facing the substrate and an upper surface opposite to the lower surface;

removing part of the second semiconductor layer and the active layer and exposing the first semiconductor layer to form a plurality of platforms;

providing a first laser beam to irradiate the semiconductor laminated layer from the upper surface so as to form a plurality of cutting lines on the surfaces of the platforms, wherein the plurality of cutting lines extend downwards from the platforms;

cleaning the LED wafer by wet etching process;

forming an electrode on the semiconductor stack;

providing a second laser beam to focus the inside of the substrate, and forming one or more coarsening marks in the substrate; and

the light emitting diode wafer is separated to form a plurality of light emitting diode dies.

2. The method of claim 1, wherein the second laser beam is a Stealth scribing (Stealth scribing) laser beam, which is irradiated in the substrate a plurality of times to form the plurality of rough marks on the same cross section of the substrate.

3. The method according to claim 2, wherein the number of times of irradiation of the invisible-cutting laser beam onto the substrate depends on the thickness of the substrate, the thickness of the substrate is not less than 150 μm, and the number of times of irradiation is not more than (substrate thickness-100) (unit μm) ÷ 50 unconditionally carries to an integer.

4. The method according to claim 2, wherein the stealth scribe laser beam irradiated in the substrate for a plurality of times comprises:

providing a first stealth dicing laser beam having a first energy and a first dicing speed; and

providing a second stealth dicing laser beam having a second energy and a second dicing speed in the substrate,

the first invisible cutting laser beam is closer to the semiconductor lamination than the second invisible cutting laser beam in position in the substrate, the first energy is smaller than the second energy, and the first cutting speed is higher than the second cutting speed.

5. The method of claim 4, wherein the power of the first stealth dicing laser beam is between 0.05 and 0.15W (Watt), and/or the first dicing speed is between 400 and 1000mm/sec (mm/s).

6. The method according to claim 1, wherein the second laser beam is focused to a position within the substrate at a distance of not less than 80 μm from the semiconductor stack.

7. The method according to claim 1, wherein the width of the one or more rough marks in the thickness direction of the substrate is less than 60 μm.

8. The method according to claim 1, wherein the roughness of the one or more rough marks is between 1 μm and 5 μm.

9. The manufacturing method of a light emitting element according to claim 1, wherein the thickness of the substrate is not less than 150 μm.

10. The method according to claim 1, wherein the plurality of scribe lines penetrate the semiconductor stack and are cut to a depth in the substrate.