CN111430095A - Configurable chip common-mode inductor and manufacturing method thereof - Google Patents
Configurable chip common-mode inductor and manufacturing method thereof Download PDFInfo
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- CN111430095A CN111430095A CN202010347171.7A CN202010347171A CN111430095A CN 111430095 A CN111430095 A CN 111430095A CN 202010347171 A CN202010347171 A CN 202010347171A CN 111430095 A CN111430095 A CN 111430095A
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- shaped winding
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 16
- 238000004804 winding Methods 0.000 claims abstract description 89
- 239000004593 Epoxy Substances 0.000 claims abstract description 40
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 17
- 239000003822 epoxy resin Substances 0.000 claims abstract description 10
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 10
- 239000004033 plastic Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 238000010292 electrical insulation Methods 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 239000003292 glue Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 230000002265 prevention Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000000696 magnetic material Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000002991 molded plastic Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/04—Fixed inductances of the signal type with magnetic core
- H01F17/06—Fixed inductances of the signal type with magnetic core with core substantially closed in itself, e.g. toroid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/02—Casings
- H01F27/022—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/24—Magnetic cores
- H01F27/26—Fastening parts of the core together; Fastening or mounting the core on casing or support
- H01F27/266—Fastening or mounting the core on casing or support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/30—Fastening or clamping coils, windings, or parts thereof together; Fastening or mounting coils or windings on core, casing, or other support
- H01F27/306—Fastening or mounting coils or windings on core, casing or other support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The invention discloses a configurable chip common mode inductor which comprises a shell, a magnetic iron core, an epoxy PCB connecting cover plate and a bottom epoxy resin layer, wherein a groove body is arranged in the shell, a U-shaped winding is arranged at the axis position of the groove body, a circular gap is formed between the groove body and the U-shaped winding, the magnetic iron core is arranged in the circular gap, four mounting grooves are symmetrically formed in the top ends of two side walls of the shell, SMT (surface mount technology) surface mount terminals are mounted on the mounting grooves, the epoxy PCB connecting cover plate is fixed on a supporting seat through welding so as to seal the magnetic iron core and the U-shaped winding in the shell, and the bottom epoxy resin layer is mounted at the top end of the shell so as to seal the whole shell into a square structure. The structure can effectively reduce the labor cost, improve the efficiency of the manufacturing process, and meanwhile, the welding terminal is convenient for the SMT welding process of customers.
Description
Technical Field
The invention relates to the technical field of inductor manufacturing, in particular to a configurable chip common-mode inductor and a manufacturing method thereof.
Background
When the electronic device or the electronic system is in a normal working state, the electronic device or the electronic system is an object to be interfered by electromagnetic interference and is an external interference source. Therefore, the electromagnetic interference generated to the environment in the normal operation process of the electronic device or the electronic system cannot exceed a certain limit, and the standards of the U.S. FCC standard, the international CISPR22 standard, the chinese GB9254 and the like all have relevant limits on the common-mode conducted interference and radiation of the information technology device. In order to eliminate the interference signals and various induced interferences inputted on the signal line, a filter circuit must be arranged reasonably to filter the common mode and the series mode interferences, and the common mode inductor is a very important component in the filter circuit.
At present, the traditional common mode inductor magnetic core is generally manufactured by insulating the surface of a magnetic material, then directly winding a coil on the magnetic material, and assembling the wound magnetic core with an additional plastic shell or a fixed bottom plate for application. In addition, a novel method is also provided at present to customize the coil winding by directly using the PCB, but due to the higher cost of the manufacturing material, especially when a large current is applied, the design of the thickness of the copper foil of the PCB is very limited, and the cost becomes very expensive, so that the copper foil can be used by only a few customers, and thus, the labor cost and the material cost become 'soft ribs' of the design of the traditional common mode inductor and the PCB winding type common mode inductor.
Disclosure of Invention
The invention aims to provide a configurable chip common mode inductor, which is characterized in that an independent U-shaped winding and an SMT surface mount terminal are designed, then the U-shaped winding, the SMT surface mount terminal and a plastic shell are molded by injection, and the molded plastic shell is provided with the winding and the terminal, so that the manual winding and mechanical automatic winding processes are avoided, and the surface mount mounting mode is also realized.
In order to achieve the purpose, the invention provides the following technical scheme: a configurable paster common mode inductor comprises a shell, a magnetic iron core, an epoxy PCB connecting cover plate and a bottom epoxy resin layer, wherein the shell is a plastic box body with a square structure, a groove body is arranged in the shell, a U-shaped winding is arranged at the axis position of the groove body, a circular ring-shaped gap is formed between the groove body and the U-shaped winding, the magnetic iron core is arranged in the circular ring-shaped gap, the height of the magnetic iron core is consistent with that of the U-shaped winding, four mounting grooves are symmetrically formed in the top ends of two side walls of the shell, SMT (surface mount technology) surface mounting terminals are mounted on the mounting grooves, the epoxy PCB connecting cover plate is fixed on a supporting seat through welding so as to seal the magnetic iron core and the U-shaped winding in the shell, wiring used for connecting the winding function and providing electrical insulation and supporting and fixing the magnetic iron core function is arranged in the epoxy PCB connecting cover plate, and the PCB connecting cover plate, meanwhile, the U-shaped winding and the SMT surface mounting terminal are welded together; the bottom epoxy resin layer is arranged at the top end of the shell, and the whole shell is sealed to form a square structure.
Furthermore, the U-shaped winding is formed by combining a plurality of U-shaped bare copper wires.
Further, the slot position is of a cylindrical oval or runway-shaped structure.
Furthermore, the U-shaped winding and the wiring terminal are injection molded together with the plastic shell.
Another object of the present invention is to provide a method for manufacturing a configurable common-mode inductor, comprising the following steps:
1) designing an independent U-shaped winding and an SMT surface mounting terminal, then carrying out injection molding on the U-shaped winding and the SMT surface mounting terminal together with a plastic shell, designing a slot position in the plastic shell, and combining a circular magnetic iron core and the shell with the U-shaped winding;
2) designing an epoxy PCB connecting cover plate, arranging wiring in the epoxy PCB connecting cover plate to obtain common mode inductors with different design requirements, wherein the wiring design of the epoxy PCB connecting cover plate comprises the function of implementing multi-turn series connection or multi-turn parallel connection of windings;
3) directly covering an epoxy PCB connecting cover plate on a magnetic iron core in a shell assembled in front, then welding the epoxy PCB connecting cover plate on the magnetic iron core through a tin furnace, welding and communicating the PCB connecting cover plate with a U-shaped winding, and simultaneously welding a PCB outgoing line and an SMT surface mounting terminal together;
4) a layer of epoxy resin is laid on the epoxy PCB connecting cover plate in a glue pouring mode, and the epoxy resin provides protection, electrical insulation and waterproof functions for welding points.
Further, in the step 1), the U-shaped winding is designed by a bare copper wire, or by a circular enameled wire, a flat enameled wire, or a copper bar.
Further, in step 1), the housing may be designed with slots of different shapes, such as cylindrical, oval or "race track" type slots.
Further, in step 2), the wiring design of the epoxy PCB connection cover plate includes implementing a winding multi-turn series or multi-turn parallel function, including but not limited to the following three:
the series connection structure is used for connecting the four U-shaped windings in series, and the winding number of the common mode inductor is 4;
the series-parallel structure is characterized in that two groups of U-shaped windings are connected in parallel and then connected in series two by two, and the number of winding turns of the common mode inductor is 2;
the parallel structure is characterized in that four groups of U-shaped windings are connected in parallel to enhance the current capability of common mode current, and the winding number of the common mode inductor is 1.
Compared with the prior art, the invention has the following beneficial effects:
through the design of the plastic shell structure with the U-shaped winding and the terminals, the magnetic core can be directly packaged to provide insulating property, the plastic shell can be designed with different shapes of groove positions, not only can be designed with a circular magnetic core groove position, but also can be designed with an oval or runway groove position, and meanwhile, the structure can effectively reduce the labor cost, improve the manufacturing process efficiency, and meanwhile, the plastic shell structure is provided with welding terminals to facilitate the SMT welding process of customers.
Drawings
Fig. 1 is an exploded view of a configurable common-mode chip inductor according to the present invention;
FIG. 2 is an assembled schematic view of the housing shown in FIG. 1;
fig. 3 is a circuit connection diagram of the epoxy PCB connection cover plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 and 2, a common mode inductor capable of being configured with a chip includes a housing 1, a magnetic core 2, an epoxy PCB connection cover plate 3 and a bottom epoxy resin layer 4, where the housing 1 is a plastic box with a square structure, a slot 11 is formed inside the housing 1, a U-shaped winding 12 is arranged at an axis of the slot 11, the U-shaped winding 12 is formed by designing and combining a plurality of U-shaped bare copper wires 121, the U-shaped winding 12 is used as a partial winding of the common mode inductor, and the U-shaped winding 12 may also be made of a circular enameled wire, a flat enameled wire or a copper bar as required; the shell 1 can be designed with groove positions of different shapes, not only a circular magnetic core groove position, but also an elliptical or runway groove position, and in the invention, a cylindrical groove body 11 structure is adopted; an annular gap is formed between the groove body 11 and the U-shaped winding 12, the magnetic iron core 2 is arranged in the annular gap, the height of the magnetic iron core 2 is consistent with that of the U-shaped winding 12, the magnetic iron core 2 is used for generating inductance of common mode inductance, four mounting grooves 13 are symmetrically formed in the top ends of two side walls of the shell 1, an SMT surface mounting terminal 5 is mounted on each mounting groove 13, the SMT surface mounting terminal 5 is convenient for customers to produce, production efficiency is improved, the epoxy PCB connecting cover plate 3 is fixed on the supporting seat 14 through welding so as to seal the magnetic iron core 2 and the U-shaped winding 12 in the shell 1, wiring is arranged inside the epoxy PCB connecting cover plate 3 and used for connecting winding functions, providing electrical insulation and supporting and fixing the magnetic iron core functions, and the wiring in the epoxy PCB connecting cover plate 3 electrically connects the PCB connecting cover plate 3 with the U-shaped winding 12 through a welding, meanwhile, the U-shaped winding 12 and the SMT surface mounting terminal 5 are welded together; bottom epoxy layer 4 installs on the top of casing 1, seals whole casing 1 and forms a square structure, and the potting compound spreads one deck epoxy on epoxy PCB connects apron 4, provides protection and electrical insulation function for the welding point.
As a further improvement of the invention, the U-shaped winding 12 and the wiring terminal are injection molded together with the plastic shell 1, and the injection molding has the advantages of omitting a winding process, being convenient to produce and low in cost, and flexibly configuring the number of winding turns according to the requirements of customers.
Based on the structural characteristics, the U-shaped winding 12 and the wiring terminal are integrally injection-molded with the plastic shell 1, the plastic shell is provided with the winding and the terminal after molding, the manual winding and mechanical automatic winding processes are avoided, the magnetic core insulation treatment process is also avoided, the surface mounting installation mode is also realized, the manual labor cost can be reduced, the manufacturing process efficiency is improved, and meanwhile, the welding terminal is provided, so that the SMT welding process is convenient for customers.
Based on the configurable paster common mode inductor provided by the above, the manufacturing method comprises the following steps:
1) designing an independent U-shaped winding 12 and an SMT surface mounting terminal 5, then carrying out injection molding on the U-shaped winding 12 and the SMT surface mounting terminal 5 together with a plastic shell 1, designing a slot position 11 in the plastic shell 1, and combining a circular magnetic iron core 2 and the shell 1 with the U-shaped winding 12;
2) an epoxy PCB is designed to be connected with the cover plate 3, wiring is arranged in the epoxy PCB to be connected with the cover plate 3, common mode inductors with different design requirements are obtained, wiring design of the epoxy PCB to be connected with the cover plate 3 comprises the following three functions of implementing multi-turn series connection or multi-turn parallel connection of windings, and the design is not limited to the following three types:
as shown in fig. 3A, in the series structure, four U-shaped windings 12 are connected in series, and the winding number of the common mode inductor is 4;
as shown in fig. 3B, the two groups of U-shaped windings 12 are connected in parallel and then connected in series, and the number of winding turns of the common mode inductor is 2;
as shown in fig. 3C, the four groups of U-shaped windings 12 are connected in parallel to enhance the current capability of the common mode current, and the winding number of the common mode inductor is 1;
3) directly covering an epoxy PCB connecting cover plate on the magnetic iron core in the shell 1 assembled in front, then welding the epoxy PCB connecting cover plate on the magnetic iron core in the shell through a tin furnace, welding and communicating the PCB connecting cover plate with the U-shaped winding 12, and simultaneously welding the PCB leading-out wire with the SMT surface mount terminal 5 together;
4) a layer of epoxy resin is laid on the epoxy PCB connecting cover plate 4 in a glue pouring mode, and the functions of protection, electrical insulation and water prevention are provided for welding points.
In the step 1), the U-shaped winding 12 can be designed not only with a bare copper wire, but also with a circular enameled wire, a flat enameled wire, or a copper bar.
In the step 1), the casing 1 can be designed with groove positions of different shapes, such as cylindrical, elliptical or 'runway' groove positions, so that the winding process and the magnetic core insulation treatment process are avoided.
Based on the manufacturing method, related wiring is designed on the epoxy PCB connecting cover plate, the epoxy PCB connecting cover plate and the U-shaped winding can be communicated to form a series winding or a parallel winding, and the welding design is more beneficial to improving the automation yield and the performance reliability of products.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Claims (8)
1. The utility model provides a can dispose paster common mode inductance, includes casing (1), magnetic core (2), epoxy PCB connection cover plate (3) and bottom epoxy layer (4), its characterized in that: the casing (1) is a plastic box body with a square structure, a groove body (11) is arranged in the casing (1), a U-shaped winding (12) is arranged at the axis position of the groove body (11), a circular annular gap is formed between the groove body (11) and the U-shaped winding (12), the magnetic iron core (2) is arranged in the circular annular gap, the height of the magnetic iron core (2) is consistent with that of the U-shaped winding (12), four mounting grooves (13) are symmetrically formed in the top ends of two side walls of the casing (1), SMT terminals (5) are mounted on the mounting grooves (13), the epoxy PCB connecting cover plate (3) is fixed on the supporting seat (14) in a welding manner, so that the magnetic iron core (2) and the U-shaped winding (12) are sealed in the casing (1), and wiring for connecting the winding function and providing the electric insulation and supporting and fixing magnetic iron core functions is arranged in the epoxy PCB connecting cover plate (3), the PCB connecting cover plate (3) and the U-shaped winding (12) are electrically connected through wiring in the epoxy PCB connecting cover plate (3) in a welding mode, and meanwhile, the U-shaped winding (12) and the SMT surface mounting terminal (5) are welded together; the bottom epoxy resin layer (4) is installed at the top end of the shell (1) and seals the whole shell (1) to form a square structure.
2. The configurable patch common mode inductor according to claim 1, wherein: the U-shaped winding (12) is formed by combining a plurality of U-shaped bare copper wires (121).
3. The configurable patch common mode inductor according to claim 1, wherein: the slot position (11) is of a cylindrical oval or runway-shaped structure.
4. The configurable patch common mode inductor according to claim 1, wherein: the U-shaped winding (12) and the wiring terminal are formed with the plastic shell (1) in an injection molding mode.
5. The method for manufacturing the configurable patch common mode inductor according to any one of claims 1 to 4, wherein: the method comprises the following steps:
1) designing an independent U-shaped winding (12) and an SMT surface mounting terminal (5), then carrying out injection molding on the U-shaped winding and the SMT surface mounting terminal together with a plastic shell (1), designing a slot position (11) in the plastic shell (1), and combining a circular magnetic iron core (2) and the shell (1) with the U-shaped winding (12);
2) designing an epoxy PCB connecting cover plate (3), arranging wiring in the epoxy PCB connecting cover plate (3) to obtain common mode inductors with different design requirements, wherein the wiring design of the epoxy PCB connecting cover plate (3) comprises the function of implementing multi-turn series connection or multi-turn parallel connection of windings;
3) directly covering an epoxy PCB connecting cover plate on a magnetic iron core in a shell (1) assembled in front, then welding the epoxy PCB connecting cover plate on the magnetic iron core in a tin furnace, welding and communicating the PCB connecting cover plate with a U-shaped winding (12), and simultaneously welding a PCB outgoing line with an SMT surface mount terminal (5);
4) a layer of epoxy resin is laid on the epoxy PCB connecting cover plate (4) in a glue pouring mode, and the functions of protection, electrical insulation and water prevention are provided for welding points.
6. The method for manufacturing the configurable common-mode chip inductor according to claim 5, wherein: in the step 1), the U-shaped winding (12) is designed by a bare copper wire, or can be designed by a round enameled wire, a flat enameled wire and a copper bar.
7. The method for manufacturing the configurable common-mode chip inductor according to claim 5, wherein: in step 1), the housing (1) may be designed with slots of different shapes, such as cylindrical, elliptical or "race track" type slots.
8. The method for manufacturing the configurable common-mode chip inductor according to claim 5, wherein: in the step 2), the wiring design of the epoxy PCB connecting cover plate (3) comprises the implementation of winding multi-turn series connection or multi-turn parallel connection functions, including but not limited to the following three functions:
the series connection structure is characterized in that four U-shaped windings (12) are connected in series, and the number of winding turns of the common mode inductor is 4;
the series-parallel structure is characterized in that two groups of U-shaped windings (12) are connected in parallel and then connected in series two by two, and the number of winding turns of the common mode inductor is 2;
the parallel structure is characterized in that four groups of U-shaped windings (12) are connected in parallel to enhance the current capability of common mode current, and the winding number of the common mode inductor is 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010347171.7A CN111430095A (en) | 2020-04-28 | 2020-04-28 | Configurable chip common-mode inductor and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010347171.7A CN111430095A (en) | 2020-04-28 | 2020-04-28 | Configurable chip common-mode inductor and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN111430095A true CN111430095A (en) | 2020-07-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010347171.7A Pending CN111430095A (en) | 2020-04-28 | 2020-04-28 | Configurable chip common-mode inductor and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112185670A (en) * | 2020-09-25 | 2021-01-05 | 横店集团东磁股份有限公司 | Common mode inductor and preparation method thereof |
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2020
- 2020-04-28 CN CN202010347171.7A patent/CN111430095A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112185670A (en) * | 2020-09-25 | 2021-01-05 | 横店集团东磁股份有限公司 | Common mode inductor and preparation method thereof |
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