CN111429816A - L ED module packaging method and L ED module - Google Patents
L ED module packaging method and L ED module Download PDFInfo
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- CN111429816A CN111429816A CN202010352225.9A CN202010352225A CN111429816A CN 111429816 A CN111429816 A CN 111429816A CN 202010352225 A CN202010352225 A CN 202010352225A CN 111429816 A CN111429816 A CN 111429816A
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The invention provides a L ED module packaging method and a L ED module, wherein the method comprises the steps of sequentially stacking a circuit board provided with L ED lamp beads, a solid light-transmitting adhesive layer and a light-transmitting film, wherein one side of the circuit board provided with L ED lamp beads faces the light-transmitting adhesive layer, pressing the stacked circuit board, the light-transmitting adhesive layer and the light-transmitting film under a preset temperature environment to obtain a L ED module, and trimming the L ED module according to product requirements after the light-transmitting adhesive layer is re-solidified, wherein the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer, the preset temperature is higher than that of the light-transmitting adhesive layer and lower than that of the light-transmitting film, and the L ED module comprises the circuit board, the light-transmitting adhesive layer and the light-transmitting film, and the melting point of the light-transmitting adhesive layer is lower than that of the light-transmitting film.
Description
Technical Field
The invention relates to the technical field of display modules, in particular to an L ED module packaging method and a L ED module.
Background
With the continuous development of the light emitting diode display industry, the light emitting diode device is changed from the original DIP structure to the chip structure at a high speed, the light emitting device with the chip structure has the advantages of light weight, smaller size, automatic installation, large light emitting angle, uniform color, less attenuation and the like, and is more and more accepted by people; if the mechanical strength, reliability, moisture resistance, impact resistance, temperature change resistance, weather resistance and global planarization of the product are to be improved under the condition of not changing the overall structure of the product, the product cannot crack, deform and yellow under different climatic conditions, and particularly, a small-spacing high-density light-emitting diode display screen has no better solution in the industry at present.
In the existing manufacturing of light emitting diode display modules or display screens, products with a P L CC4 structure or products with an IMD structure (such as 3528,2121,1010, 4-in-1 and other specifications) are mounted on a circuit board through an SMT (surface mount technology), single bodies are independently arranged on the circuit board, gaps exist among the products, the large gap is dozens of millimeters, and the small gap is a few millimeters, and in the process of mounting, the P L CC4 or the IMD structure is adopted at high temperature (the temperature is higher than 200 degrees), so that the device is a device composed of different materials, the heat expansion and cold contraction are different, gaps are easily generated among the materials, moisture in air is easily caused to continuously permeate into the light emitting diode through the gaps during use by customers, and the moisture entering the light emitting diode at the later stage is used to damage the internal structure of the light emitting diode, such as colloid burst, delamination, silver colloid separation, short circuit, positive and negative poles, electrochemical reaction and the like, and the problems are directly expressed as non-light emission, brightness crosstalk, short circuit, particularly serious short circuit and the problem of moist and the like, and the problem is more obvious and the problem of uneven season is expressed.
After the light emitting diodes are attached to the circuit board and assembled into an L ED display screen, gaps exist among the single light sources, so that the problems of dust accumulation, moisture accumulation, sweat accumulation and pollution after being touched by hands and the like are more likely to occur, particularly, after the dust accumulation and the moisture accumulation reach a certain time, the influence on the product is fatal, and the safety problem (metal pins are exposed outside) is easily caused.
In addition, the L ED electronic short-distance touch commercial display intelligent terminal focuses more on man-machine interaction, like a single light-emitting component, the surface with the unevenness is not suitable for man-machine interaction, and a circuit is exposed and has potential safety hazards.
The display screen composed of the light emitting diodes is used for performing the performance renting, the service environment of a client is very bad in mode and service time, lamp beads are easy to damage and knock off in the process of carrying and installation, the screen detached in rainy days can be directly placed into an aviation box after moisture is removed, the storage time of each time is different, the screen can be placed in a warehouse one month or stored in the warehouse for half a year, moisture in the air is accumulated and adsorbed, when the display screen is used next time, the temperature in the light emitting diodes reaches about 100 ℃ only by lighting the display screen, the moisture permeating into a lamp body is vaporized, and then huge stress is released, so that the internal structure of the light emitting diodes is damaged, and the defects such as glue explosion, delamination, wire breaking, short circuit and the like are overcome.
At present, the L ED module is encapsulated by coating glue on a release film/release paper which is tiled, then clamping the circuit board with L ED lamp beads by a clamp, pressing the circuit board downwards on the glue, then curing at high temperature, and finally removing the release film/release paper.
In the packaging method, a large number of electronic elements are arranged on the back surface (the surface back to L ED lamp beads) of the circuit board, the circuit board is difficult to ensure the level when the circuit board is clamped by a clamp, and the circuit board is easy to bend and deform under the action of gravity to ensure the level due to the distribution of L ED lamp beads and the electronic elements, so that the intervals between the release film/release paper and the circuit board are not uniform, namely the thickness of the formed adhesive layer is not uniform, and the product quality is influenced.
In addition, in the existing packaging method, epoxy resin or silica gel materials are generally adopted for packaging, and the epoxy resin or silica gel materials have various advantages, such as strong waterproof and moistureproof capabilities of the epoxy resin, but poor ultraviolet resistance, and severe yellowing phenomenon can be caused when the epoxy resin or the silica gel materials are irradiated under a 2000mW ultraviolet lamp for 72H; in addition, the stress is large, and severe quality damage is easily caused to products under high-temperature and low-temperature circulation; the problems of yellowing and stress can be solved by packaging with the silica gel material, but the oxygen permeability and the air permeability caused by the molecular structure of the silica gel are very poor, and water vapor can easily permeate into the silica gel material, so that the silica gel material cannot achieve the moisture-proof capability. In addition, regardless of the scheme of adopting the two materials, high-temperature curing is required after packaging, the curing time is long, and a large amount of harmful gas is released, so the defects of high cost, low production efficiency and the like exist, large-scale production cannot be realized, and the environment is easily polluted.
Disclosure of Invention
To solve at least one of the above problems of the prior art, it is an object of the present invention to provide an L ED module packaging method and a L ED module.
In order to achieve the purpose, the invention adopts the following technical scheme:
an L ED module packaging method includes the steps:
sequentially stacking a circuit board provided with L ED lamp beads, a solid light-transmitting adhesive layer and a light-transmitting film, wherein one surface of the circuit board provided with L ED lamp beads faces the light-transmitting adhesive layer;
pressing the circuit board, the light-transmitting adhesive layer and the light-transmitting film which are stacked under a preset temperature environment to obtain an L ED module;
after the light-transmitting adhesive layer is solidified again, trimming the L ED module according to the product requirement;
the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer;
the preset temperature is higher than the melting point of the light-transmitting glue layer and lower than the melting point of the light-transmitting film.
In some embodiments, when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the circuit board, the light-transmitting adhesive layer and the light-transmitting film are sequentially stacked in the first fixing clamp from bottom to top, so that the side of the circuit board, which is provided with L ED lamp beads, faces upwards;
when pressing, the first upper pressing die is used for pressing the light-transmitting film downwards.
In other embodiments, when the circuit board, the light-transmitting adhesive layer and the light-transmitting film are stacked, the light-transmitting film, the light-transmitting adhesive layer and the circuit board are sequentially stacked in the second fixing clamp from bottom to top, so that the surface of the circuit board, which is provided with L ED lamp beads, faces downwards;
when pressing, the second upper pressing die is used for pressing the circuit board downwards.
In the L ED module packaging method, before pressure is applied, the fixing clamp and the workpiece are placed in a vacuum box, and the vacuum box is vacuumized.
In the L ED module packaging method, patterns are pressed on the light-transmitting film during pressing, and/or the patterns are sprayed or printed on the light-transmitting film after the light-transmitting adhesive layer is solidified again.
In the L ED module packaging method, the pressure is kept for a preset time when the pressure is applied, wherein the preset time is 1-60 minutes.
An L ED module comprises a circuit board with L ED lamp beads on the upper surface, a light-transmitting adhesive layer covering the upper surface of the circuit board, and a light-transmitting film covering the upper surface of the light-transmitting adhesive layer, wherein the melting point of the light-transmitting adhesive layer is lower than that of the light-transmitting film.
In the L ED module, the transparent adhesive layer is an elastomer with (C2H4) x. (C4H6O2) y as a base material.
In the L ED module, the light-transmitting film is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film.
In the L ED module, the light-transmitting glue layer and/or the light-transmitting film contain a blue-light preventing agent;
and/or a blue light prevention layer is arranged between the light-transmitting adhesive layer and the light-transmitting film;
and/or the upper surface of the light-transmitting film is provided with a blue-light-proof layer.
Has the advantages that:
the L ED module packaging method and the L ED module provided by the invention have the following advantages that the L ED module is obtained by laminating the circuit board, the solid light-transmitting adhesive layer and the light-transmitting film, melting the light-transmitting adhesive layer at high temperature and pressing the circuit board, the light-transmitting adhesive layer and the light-transmitting film downwards, and the method comprises the following steps:
1. the thickness of the glue layer can be ensured to be uniform at all positions;
2. compared with the prior art, the control of the thickness of the glue layer is more convenient, and the process is simpler;
3. after packaging, the subsequent processing can be carried out only by cooling and solidifying the light-transmitting adhesive layer, and compared with the prior art in which high-temperature solidification needs to be carried out for a long time, the required time is less, the energy consumption is less, so that the production efficiency is higher, the cost is lower, and the large-scale production is easier to realize;
4. compared with the mode of using glue to make the glue layer in the prior art, the solid light-transmitting glue layer is heated to be molten and then pressed into the glue layer, so that less harmful gas is released, and the glue layer is more environment-friendly.
Drawings
Fig. 1 is a flowchart illustrating an L ED module packaging method according to an embodiment of the present invention.
Fig. 2 is a flowchart of another L ED module packaging method according to an embodiment of the present invention.
Fig. 3 is a flowchart of a third L ED module packaging method according to an embodiment of the present invention.
Fig. 4 is a schematic structural view of the first fixing jig.
Fig. 5 is a flowchart of an L ED module packaging method according to a second embodiment of the present invention.
Fig. 6 is a flowchart of another L ED module packaging method according to the second embodiment of the present invention.
Fig. 7 is a flowchart illustrating a third L ED module packaging method according to the second embodiment of the present invention.
Fig. 8 is a schematic structural view of a second fixing jig.
FIG. 9 is a flowchart of an L ED module packaging method provided by the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features.
Referring to fig. 9, the L ED module packaging method provided by the invention includes the steps of sequentially stacking a circuit board provided with L ED lamp beads, a solid light-transmitting adhesive layer and a light-transmitting film, wherein the surface of the circuit board provided with L ED lamp beads faces the light-transmitting adhesive layer, pressing the stacked circuit board, the light-transmitting adhesive layer and the light-transmitting film at a preset temperature environment to obtain a L ED module, and trimming the L ED module according to product requirements after the light-transmitting adhesive layer is re-solidified;
the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer;
the preset temperature is higher than the melting point of the light-transmitting glue layer and lower than the melting point of the light-transmitting film.
The L ED module is obtained by the packaging method, the uniformity of the thickness of the glue layer can be ensured, the control of the thickness of the glue layer is more convenient, the process is simpler, and the subsequent processing and production efficiency is higher and the cost is lower only by cooling and solidifying the light-transmitting glue layer after packaging.
The packaging method of the L ED module is described in detail below by way of example one and example two.
Example one
The L ED module packaging method provided by the embodiment comprises the following steps:
sequentially stacking a circuit board 2 provided with L ED lamp beads 2.2, a solid light-transmitting adhesive layer 3 and a light-transmitting film 4, wherein the surface of the circuit board 2 provided with L ED lamp beads 2.2 faces the light-transmitting adhesive layer 3;
pressing the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 which are stacked in a preset temperature environment to obtain an L ED module;
after the light-transmitting adhesive layer 3 is re-solidified (cooled to be lower than the melting point, the light-transmitting adhesive layer is re-solidified), trimming the L ED module according to the product requirement;
the melting point of the light-transmitting film 4 is higher than that of the light-transmitting glue layer 3;
the preset temperature is higher than the melting point of the light-transmitting glue layer 3 and lower than the melting point of the light-transmitting film 4.
Further, as shown in fig. 1 and 4, when the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 are stacked, the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 are sequentially stacked in the first fixing clamp 1 from bottom to top, so that the side of the circuit board, which is provided with L ED lamp beads, faces upwards;
when pressing, the light transmissive film 4 is pressed downward by the first upper stamper 5.
The method is characterized in that a circuit board 2 is kept horizontal through the action of a first fixing clamp 1, a solid light-transmitting adhesive layer 3 is in a molten state at a preset temperature, a light-transmitting film 4 is still in a solid state at the moment, when a first upper pressing die presses the light-transmitting film 4 downwards, the molten light-transmitting adhesive layer 3 can be pressed into gaps among L ED lamp beads to completely cover the upper surface of the circuit board 2, after a L ED module is taken out, the light-transmitting adhesive layer 3 can be trimmed after being cooled to return to the solid state, and the L ED module meets the size requirement.
The circuit board 2 is kept horizontal in the pressure applying process, so that the thickness of the glue layer can be ensured to be uniform at all positions; compared with the mode of forming a glue layer by coating glue (the thickness precision of the glue layer is difficult to ensure) in the prior art, the glue layer with the corresponding thickness can be obtained by processing the light-transmitting glue layer 3 into the required size when the light-transmitting glue layer is solid, the control of the thickness of the glue layer is more convenient, and the process is simpler; after packaging, the subsequent processing can be carried out only by cooling the transparent adhesive layer (because the transparent adhesive layer can be changed into a solid state again as long as the temperature is reduced below the melting point), compared with the prior art that high-temperature curing is carried out for a long time, the required time is less, the energy consumption is less, the production efficiency is higher, the cost is lower, and the large-scale production is easier to realize; compared with the mode of using glue to make the glue layer in the prior art, the solid light-transmitting glue layer is heated to be molten and then pressed into the glue layer, so that less harmful gas is released, and the glue layer is more environment-friendly.
The preset temperature may be set according to specific materials of the light transmissive adhesive layer 3 and the light transmissive film 4, for example, when the light transmissive adhesive layer 3 is an elastomer based on (C2H4) x. (C4H6O2) y (ethylene-vinyl acetate copolymer, EVA for short), and the light transmissive film 4 is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film, the preset temperature may be set to 60 ℃ to 160 ℃.
The first fixing clamp 1 is structurally shown in fig. 4, the top of the first fixing clamp is provided with a first positioning groove 1.1 matched with the circuit board 2, and the bottom of the first positioning groove 1.1 is provided with a first avoiding hole/first avoiding groove 1.2 for the component 2.1 of the circuit board to extend into. After the circuit board 2 is placed into the first positioning groove 1.1, the bottom of the circuit board 2 is supported by the bottom of the first positioning groove 1.1, and the first avoidance hole/the first avoidance groove 1.2 into which the component 2.1 extends is formed, so that the circuit board 2 can be kept horizontal, and bending or inclination is avoided.
The depth of the first positioning groove 1.1 can be greater than, less than or equal to the thickness of the circuit board 2, as required.
In some preferred embodiments, the depth of the first positioning groove 1.1 is greater than the thickness of the circuit board 2. after the circuit board 2 is placed in the first positioning groove 1.1, the upper portion of the first positioning groove 1.1 can be used as a containing space for the light-transmitting adhesive layer 3, so as to prevent the melted light-transmitting adhesive layer 3 from extruding out from the side edge during pressurization, and ensure that the light-transmitting adhesive layer 3 can fully fill the gap between L ED lamp beads.
In some embodiments, the transparent film 4 is larger than the first positioning groove 1.1, when the transparent film 4 is laid on the transparent adhesive layer 3, the whole edge of the transparent film 4 is arranged outside the notch of the first positioning groove 1.1 (as shown in fig. 4), the transparent film 4 covers the notch of the first positioning groove 1.1, so that the molten transparent adhesive layer 3 can be further prevented from being extruded during pressurization, and the transparent adhesive layer 3 can be further ensured to fully fill the gap between L ED lamp beads.
In some preferred embodiments, before the first upper die is used to press the transparent film 4 downwards, the first fixing jig 1 and the workpiece (the circuit board 2, the transparent adhesive layer 3 and the transparent film 4) are placed in a vacuum box, and the vacuum box is evacuated, and the flow of the method is shown in fig. 2. By evacuation, air between the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 can be evacuated, avoiding air bubbles in the glue layer formed at the end. In other embodiments, the first fixing jig 1 is previously placed/set in the vacuum chamber, and then the circuit board 2, the light-transmitting adhesive layer 3, and the light-transmitting film 4 are placed.
Further, during operation, after the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 are placed, the vacuum box can be heated to enable the internal temperature to reach the preset temperature.
Further, the first upper die 5 may be an upper die separately provided in a vacuum chamber and driven to move up and down by a cylinder, a motor, or the like; or a movable upper cover of the vacuum box, and the movable upper cover is driven to move up and down by air pressure, an air cylinder, a motor and the like.
When patterns are required to be formed on the light-transmitting film 4, embossing can be arranged on the lower surface of the first upper die so as to form the patterns on the light-transmitting film 4, and/or patterns can be sprayed or printed on the light-transmitting film 4 after the light-transmitting adhesive layer 3 is cooled (which can be carried out before or after the L ED module is trimmed);
when the surface of the light-transmitting film 4 is required to be smooth and flat, the lower surface of the first upper pressing die is smooth and flat.
In some preferred embodiments, as shown in fig. 3, at the beginning, the method further comprises the steps of:
cleaning and drying the circuit board with L ED lamp beads;
so as to ensure the cleanness of the circuit board and avoid the influence of impurities adhered on the circuit board on the adhesive force between the light-transmitting glue layer 3 and the circuit board.
In some preferred embodiments, an adhesion promoter is applied to the side of the light-transmissive film 4 facing the light-transmissive glue layer 3 before the light-transmissive films are stacked, to improve adhesion between the light-transmissive film 4 and the light-transmissive glue layer 3.
It should be noted that, during the pressing, the pressing needs to be kept for a preset time to ensure the reliable adhesion among the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4; the predetermined time is generally 1 to 60 minutes.
Example two
Compared with the first embodiment, the main difference of the present embodiment is that the stacking order of the circuit board, the transparent adhesive layer, and the transparent film is different, and the principle and advantages of the present embodiment are the same as those of the first embodiment.
The L ED module packaging method provided by the embodiment comprises the following steps:
sequentially stacking a circuit board 2 provided with L ED lamp beads 2.2, a solid light-transmitting adhesive layer 3 and a light-transmitting film 4, wherein the surface of the circuit board 2 provided with L ED lamp beads 2.2 faces the light-transmitting adhesive layer 3;
pressing the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 which are stacked in a preset temperature environment to obtain an L ED module;
after the light-transmitting adhesive layer 3 is re-solidified (cooled to be lower than the melting point, the light-transmitting adhesive layer is re-solidified), trimming the L ED module according to the product requirement;
the melting point of the light-transmitting film 4 is higher than that of the light-transmitting glue layer 3;
the preset temperature is higher than the melting point of the light-transmitting glue layer 3 and lower than the melting point of the light-transmitting film 4.
Further, as shown in fig. 5 and 8, when the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 are stacked, the light-transmitting film 4, the light-transmitting adhesive layer 3 and the circuit board 2 are sequentially stacked in the second fixing clamp 6 from bottom to top, so that the side of the circuit board 2, which is provided with L ED lamp beads 2.2, faces downwards;
when pressing, the circuit board 2 is pressed downward with the second upper die 7.
The preset temperature may be set according to specific materials of the light transmissive adhesive layer 3 and the light transmissive film 4, for example, when the light transmissive adhesive layer 3 is an elastomer based on (C2H4) x. (C4H6O2) y (ethylene-vinyl acetate copolymer, EVA for short), and the light transmissive film 4 is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film, the preset temperature may be set to 60 ℃ to 160 ℃.
The second fixing clamp is structurally shown in fig. 8, a second positioning groove 6.1 matched with the light-transmitting film 4 and the light-transmitting glue layer 3 is formed in the top of the second fixing clamp, and a second avoiding hole/a second avoiding groove 7.1 for the component 2.1 of the circuit board 2 to extend into is formed in the bottom of the second upper pressing die 7. Through setting up second and keeping away position hole/second and keeping away position groove 7.1, can guarantee that second goes up moulding-die 7 and directly contacts with the base plate of circuit board to guarantee that circuit board 2 keeps the level, avoid taking place crooked or slope.
The size of the substrate of the circuit board 2 can be smaller than, equal to or larger than the second positioning groove 6.1; if the size of the substrate of the circuit board 2 is larger than the second positioning slot 6.1, a third positioning slot 6.2 matched with the substrate of the circuit board 2 can be arranged at the upper side of the second positioning slot 6.1 to position the substrate.
In some preferred embodiments, the second fixing jig 6 and the workpiece (the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4) are placed in a vacuum box before the circuit board 2 is pressed downward by the second upper die 7, and the vacuum box is evacuated, and the flow of the method is shown in fig. 6. By evacuation, air between the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 can be evacuated, avoiding air bubbles in the glue layer formed at the end. In other embodiments, the second fixing jig 6 is previously placed/set in the vacuum chamber, and then the circuit board 2, the light-transmitting adhesive layer 3, and the light-transmitting film 4 are placed.
Further, during operation, after the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4 are placed, the vacuum box can be heated to enable the internal temperature to reach the preset temperature.
Further, the second upper die 7 may be a second upper die 7 separately provided in a vacuum chamber and driven to move up and down by a cylinder, a motor, or the like; or a movable upper cover of the vacuum box, and the movable upper cover is driven to move up and down by air pressure, an air cylinder, a motor and the like.
When patterns need to be formed on the light-transmitting film 4, embossing can be arranged at the bottom of the second positioning groove 6.1 so as to extrude the patterns on the light-transmitting film 4, and/or the patterns can be sprayed or printed on the light-transmitting film 4 after the light-transmitting adhesive layer 3 is cooled and solidified (which can be carried out before or after trimming the L ED module);
when the surface of the light-transmitting film 4 is required to be smooth and flat, the bottom of the second positioning groove 6.1 is smooth and flat.
In some preferred embodiments, as shown in fig. 7, at the beginning, the method further comprises the steps of:
cleaning and drying the circuit board 2 with L ED lamp beads 2.2;
so as to ensure the cleanness of the circuit board and avoid the influence of impurities adhered on the circuit board on the adhesive force between the light-transmitting glue layer 3 and the circuit board.
In some preferred embodiments, an adhesion promoter is applied to the side of the light-transmissive film 4 facing the light-transmissive glue layer 3 before the light-transmissive film 4 is stacked, to improve the adhesion between the light-transmissive film 4 and the light-transmissive glue layer 3.
It should be noted that, during the pressing, the pressing needs to be kept for a preset time to ensure the reliable adhesion among the circuit board 2, the light-transmitting glue layer 3 and the light-transmitting film 4; the predetermined time is generally 1 to 60 minutes.
Referring to fig. 4 and 8, the invention further provides an L ED module, which comprises a circuit board 2 with L ED lamp beads 2.2 on the upper surface, a light-transmitting adhesive layer 3 covering the upper surface of the circuit board, and a light-transmitting film 4 covering the upper surface of the light-transmitting adhesive layer 3, wherein the melting point of the light-transmitting adhesive layer 3 is lower than that of the light-transmitting film 4, and the circuit board 2, the light-transmitting adhesive layer 3 and the light-transmitting film 4 can be packaged together by adopting the L ED module packaging method.
The base material of the circuit board can be but is not limited to a PCB (printed circuit board), a glass plate, a sapphire plate, a plastic plate, PET (polyethylene terephthalate), an FPC (flexible printed circuit) board and the like, and a circuit can be printed or sprayed on the base and L ED (electronic component) lamp beads and other components can be mounted on the base so as to obtain the circuit board.
In some embodiments, the light-transmissive adhesive layer 3 is an elastomer with (C2H4) x. (C4H6O2) y (ethylene-vinyl acetate copolymer, EVA for short) as a base material, and the light-transmissive adhesive layer 3 may be colorless or colored, and may be transparent or translucent. The high-temperature-resistant and high-temperature-resistant composite material has good elasticity in a solid state, generates small stress under high-temperature and low-temperature circulation, is not easy to separate from the circuit board 2 and fall off due to temperature change, and has better weather resistance. If the glue layer is colored, materials with corresponding colors can be added into the base material.
The light-transmitting film 4 is transparent as required.
In some embodiments, the light transmissive film 4 is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film, and the light transmissive film 4 may be colorless or colored (red, green, blue, black, etc.), may be transparent or translucent, and may be surface reflective or surface non-reflective. The light transmissive film may also be textured or non-textured.
If the light-transmitting film 4 is colored, materials with corresponding colors can be added into the film, or a coating is formed on the surface of the film in a coating, spraying, pressing and other modes; if the surface is required to be reflective or not reflective, a reflective or non-reflective coating can be formed on the surface of the film in a coating, spray painting, pressing and other modes; if patterns are required, embossing can be arranged on the lower surface of the first upper pressing die or the bottom of the second positioning groove 6.1 during packaging so as to press the patterns on the light-transmitting film 4; and/or spraying or printing patterns on the light-transmitting film 4 after the light-transmitting glue layer 3 is cooled and solidified.
In order to make the L ED module have blue light-proof performance, a blue-light-proof agent (the blue-light-proof agent is the prior art and can be directly purchased from the market) can be contained in the light-transmitting glue layer 3 and/or the light-transmitting film 4;
and/or a blue light prevention layer is arranged between the light-transmitting glue layer 3 and the light-transmitting film 4; the blue light prevention layer can be adhered to the upper surface of the light-transmitting glue layer 3 or the lower surface of the light-transmitting film 4 in advance in an adhering or coating mode or a single prefabricated blue light prevention layer is formed, and the blue light prevention layer (two surfaces of the blue light prevention layer need to be coated with glue) is paved on the light-transmitting glue layer 3 in the packaging process, and then the light-transmitting film 4 is paved, so that the blue light prevention layer and the light-transmitting film are pressed together;
and/or the upper surface of the light-transmitting film 4 is provided with a blue-light prevention layer, wherein the blue-light prevention layer can be adhered to the upper surface of the light-transmitting film 4 in advance in a sticking or coating mode, or the blue-light prevention layer can be adhered to the light-transmitting film 4 in a sticking or coating mode after the light-transmitting adhesive layer 3 is cooled and solidified during packaging (the adhering or coating can be carried out before or after the L ED module is trimmed).
From the above, the L ED module packaging method and the L ED module have the following advantages that the L ED module is obtained by stacking the circuit board, the solid transparent adhesive layer and the transparent film, melting the transparent adhesive layer at a high temperature and pressing the circuit board, the transparent adhesive layer and the transparent film downwards, and the method comprises the following steps:
1. the thickness of the glue layer can be ensured to be uniform at all positions;
2. compared with the prior art, the control of the thickness of the glue layer is more convenient, and the process is simpler;
3. after packaging, the subsequent processing can be carried out only by cooling and solidifying the light-transmitting adhesive layer, and compared with the prior art in which high-temperature solidification needs to be carried out for a long time, the required time is less, the energy consumption is less, so that the production efficiency is higher, the cost is lower, and the large-scale production is easier to realize;
4. compared with the mode of manufacturing the glue layer by using glue in the prior art, the solid light-transmitting glue layer is heated to be molten and then is pressed into the glue layer, so that less harmful gas is released, and the glue layer is more environment-friendly;
5. the formed adhesive layer is ensured to have no bubbles through vacuum pumping;
6. the transparent adhesive layer takes (C2H4) x (C4H6O2) y as a base material, the stress generated under high-temperature and low-temperature circulation is small, the transparent adhesive layer is not easy to separate from the circuit board due to temperature change and fall off, and the weather resistance is better;
7. by adding the blue light resistant agent or the blue light resistant layer, blue light emitted by the L ED module can be reduced, which is beneficial to protecting eye health of users.
In summary, although the present invention has been described with reference to the preferred embodiments, the above-described preferred embodiments are not intended to limit the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, which are substantially the same as the present invention.
Claims (10)
1. An L ED module packaging method, comprising the steps of:
sequentially stacking a circuit board provided with L ED lamp beads, a solid light-transmitting adhesive layer and a light-transmitting film, wherein one surface of the circuit board provided with L ED lamp beads faces the light-transmitting adhesive layer;
pressing the circuit board, the light-transmitting adhesive layer and the light-transmitting film which are stacked under a preset temperature environment to obtain an L ED module;
after the light-transmitting adhesive layer is solidified again, trimming the L ED module according to the product requirement;
the melting point of the light-transmitting film is higher than that of the light-transmitting adhesive layer;
the preset temperature is higher than the melting point of the light-transmitting glue layer and lower than the melting point of the light-transmitting film.
2. The L ED module packaging method of claim 1, wherein, when stacking the circuit board, the adhesive layer, and the film, the circuit board, the adhesive layer, and the film are stacked in the first fixture from bottom to top with the side of the circuit board with L ED beads facing upwards;
when pressing, the first upper pressing die is used for pressing the light-transmitting film downwards.
3. The L ED module packaging method of claim 1, wherein, when stacking the circuit board, the transparent adhesive layer, and the transparent film, the transparent adhesive layer, and the circuit board are stacked in the second fixture from bottom to top with the side of the circuit board with L ED beads facing downwards;
when pressing, the second upper pressing die is used for pressing the circuit board downwards.
4. The L ED module packaging method of any one of claims 1-3, wherein before applying the pressure, the fixture and the workpiece are placed in a vacuum box and a vacuum is applied to the vacuum box.
5. The L ED module packaging method of any one of claims 1-3, wherein the pattern is embossed on the light transmissive film during pressing and/or sprayed or printed on the light transmissive film after the light transmissive adhesive layer is re-solidified.
6. The L ED module packaging method of any one of claims 1-3, wherein the pressure is maintained for a predetermined time, the predetermined time being 1-60 minutes.
7. An L ED module is characterized by comprising a circuit board with L ED lamp beads on the upper surface, a light-transmitting adhesive layer covering the upper surface of the circuit board, and a light-transmitting film covering the upper surface of the light-transmitting adhesive layer, wherein the melting point of the light-transmitting adhesive layer is lower than that of the light-transmitting film.
8. The L ED module packaging method of claim 7, wherein the clear adhesive layer is an elastomer based on (C2H4) x. (C4H6O2) y.
9. The L ED module of claim 7, wherein the light-transmissive film is [ -CH2-CH2-O-C (= O) -ph-C (= O) O- ] n film or C2F4 film.
10. The L ED module of claim 7, wherein the light-transmissive glue layer and/or film contains a blue-light inhibitor;
and/or a blue light prevention layer is arranged between the light-transmitting adhesive layer and the light-transmitting film;
and/or the upper surface of the light-transmitting film is provided with a blue-light-proof layer.
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| CN202010352225.9A CN111429816A (en) | 2020-04-28 | 2020-04-28 | L ED module packaging method and L ED module |
| CN202011487413.9A CN112331091A (en) | 2020-04-28 | 2020-12-16 | LED module packaging method and LED module |
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| CN112820817A (en) * | 2020-12-31 | 2021-05-18 | 深圳全息界科技有限公司 | Small-spacing LED module packaging process |
| CN112951808A (en) * | 2021-03-25 | 2021-06-11 | 深圳博元新材科技有限公司 | LED light-emitting module packaging method and device |
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| CN201946238U (en) * | 2010-07-30 | 2011-08-24 | 北京韦侨顺科贸有限公司 | LED lattice display panel |
| JP2016519850A (en) * | 2013-04-08 | 2016-07-07 | コーニンクレッカ フィリップス エヌ ヴェＫｏｎｉｎｋｌｉｊｋｅ Ｐｈｉｌｉｐｓ Ｎ．Ｖ． | LED module manufacturing method |
| CN203941668U (en) * | 2014-06-13 | 2014-11-12 | 深圳金丽豪科技有限公司 | A kind of LED module displays plate |
| CN203966485U (en) * | 2014-07-18 | 2014-11-26 | 黄加安 | A kind of new-type display screen structure |
| CN105206734A (en) * | 2015-09-09 | 2015-12-30 | 梁高华 | LED support and manufacturing method thereof |
| CN207282092U (en) * | 2017-10-12 | 2018-04-27 | 深圳市创显光电有限公司 | A kind of led display devices |
| CN107633777A (en) * | 2017-10-12 | 2018-01-26 | 深圳市创显光电有限公司 | A kind of led display devices and its manufacture method |
| CN207458485U (en) * | 2017-11-10 | 2018-06-05 | 深圳市创显光电有限公司 | A kind of solid LED display module |
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| CN108074499A (en) * | 2017-12-27 | 2018-05-25 | 周卫江 | A kind of LED module and its method for packing |
| CN108417699A (en) * | 2018-05-18 | 2018-08-17 | 深圳市德彩光电有限公司 | The plastic package die of LED light source |
| CN108807649B (en) * | 2018-06-13 | 2020-09-11 | 深德彩光电(深圳)有限公司 | Plastic packaging method for LED light source |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112820817A (en) * | 2020-12-31 | 2021-05-18 | 深圳全息界科技有限公司 | Small-spacing LED module packaging process |
| CN112951808A (en) * | 2021-03-25 | 2021-06-11 | 深圳博元新材科技有限公司 | LED light-emitting module packaging method and device |
| CN112951808B (en) * | 2021-03-25 | 2022-12-30 | 深圳博元新材科技有限公司 | LED light-emitting module packaging method and device |
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