CN111429443A - Defect positioning method and device for detection image of infrared thermal imaging system - Google Patents

Defect positioning method and device for detection image of infrared thermal imaging system Download PDF

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CN111429443A
CN111429443A CN202010247482.6A CN202010247482A CN111429443A CN 111429443 A CN111429443 A CN 111429443A CN 202010247482 A CN202010247482 A CN 202010247482A CN 111429443 A CN111429443 A CN 111429443A
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王倩
杨宇
詹绍正
康卫平
祁小凤
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AVIC Aircraft Strength Research Institute
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Abstract

The application belongs to the technical field of aviation strength tests, and particularly relates to a defect positioning method and device for an infrared thermal imaging system detection image. The method comprises the following steps: converting a detection image into image data; reading the image data, and acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the image data; step three, carrying out corrosion expansion processing on the image data, and carrying out binarization segmentation to obtain a binarization image; acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the defect region according to the binary image; and step five, calculating the actual position and size of the defect area. The defect locating and quantitative measuring method and device can achieve defect locating and quantitative measuring of the detection image of the infrared thermal imaging system, and make up for the defect edge which cannot be rapidly and accurately obtained by using a conventional drawing board, so that the defect can be accurately located and quantitatively measured.

Description

Defect positioning method and device for detection image of infrared thermal imaging system
Technical Field
The application belongs to the technical field of aviation strength tests, and particularly relates to a defect positioning method and device for an infrared thermal imaging system detection image.
Background
The infrared thermal imaging system cannot directly obtain coordinate information on a detection image because the infrared thermal imaging system does not have a direct positioning device, so that the size information of the defect can be obtained only by converting the detection image obtained by the infrared thermal imaging system. In addition, for the selection of the defect edge, the gray difference between the defect area and the non-defect area is small due to the non-uniformity of the detected image, and the defect edge cannot be quickly and accurately obtained by the conventional method using the drawing board, so that the defect cannot be accurately positioned and quantitatively measured.
Accordingly, a technical solution is desired to overcome or at least alleviate at least one of the above-mentioned drawbacks of the prior art.
Disclosure of Invention
The application aims to provide a method and a device for positioning defects of a detection image of an infrared thermal imaging system, so as to solve at least one problem in the prior art.
The technical scheme of the application is as follows:
the first aspect of the present application provides a method for locating a defect in a detected image of an infrared thermal imaging system, including:
converting a detection image into image data;
reading the image data, and acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the image data;
step three, carrying out corrosion expansion processing on the image data, and carrying out binarization segmentation to obtain a binarization image;
acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the defect region according to the binary image;
and step five, calculating the actual position and size of the defect area.
Optionally, in the first step, the detection image is converted into image data in an Excel format, where the arrangement of the image data is as follows: row pixel values, column pixel values and gray scale values and stored by row.
Optionally, in the fourth step, the obtaining the coordinate values of the two end points in the length direction of the defect area according to the binarized image, and the coordinate values of the two end points in the width direction include:
respectively accumulating the gray values of the binary image by columns and rows to obtain a gray value curve accumulated by columns and a gray value curve accumulated by rows;
acquiring a concave part in the gray value curve accumulated according to the columns and a concave part in the gray value curve accumulated according to the rows;
and obtaining coordinate values of two end points in the length direction of the defect region according to the sunken part in the gray value curve accumulated according to the columns, and obtaining coordinate values of two end points in the width direction of the defect region according to the sunken part in the gray value curve accumulated according to the rows.
Optionally, in step five, the calculating the actual position and size of the defect area includes:
calculating the actual position and size of the defect region in the length direction by the following formula:
Figure BDA0002434333100000021
in the formula, d1Actual size of defect region in length direction, L1For the actual dimension of the test piece to be tested in the length direction, Δ1、Δ2Coordinate values, Δ, of two end points in the length direction of the image data, respectively1′、Δ2' image data lengths corresponding to defective regions, respectivelyCoordinate values of two end points in the direction;
calculating the actual position and size of the defect region in the width direction by the following formula:
Figure BDA0002434333100000022
in the formula, d2L, actual size of defect region in width direction2For the actual dimension of the test piece to be tested in the width direction, Δ3、Δ4Coordinate values, Δ, of two end points in the width direction of the image data, respectively3′、Δ4' are coordinate values of both end points in the width direction of the image data corresponding to the defective region, respectively.
A second aspect of the present application provides a defect locating device for detecting an image by an infrared thermal imaging system, comprising:
a conversion module for converting the detection image into image data;
the first end point acquisition module is used for reading the image data and acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the image data;
the processing module is used for carrying out corrosion expansion processing on the image data and carrying out binarization segmentation to obtain a binarization image;
the second end point acquisition module is used for acquiring coordinate values of two end points in the length direction of the defect area and coordinate values of two end points in the width direction according to the binary image;
and the calculation module is used for calculating the actual position and size of the defect area.
Optionally, the conversion module is configured to convert the detection image into image data in an Excel format, where an arrangement manner of the image data is as follows: row pixel values, column pixel values and gray scale values and stored by row.
Optionally, the second endpoint acquisition module includes:
the curve acquisition unit is used for respectively accumulating the gray values of the binary image by columns and rows to obtain a gray value curve accumulated by columns and a gray value curve accumulated by rows;
the target acquisition unit is used for acquiring a concave part in the gray value curve accumulated according to the columns and a concave part in the gray value curve accumulated according to the rows;
and the coordinate value acquisition unit is used for acquiring coordinate values of two end points in the length direction of the defect region according to the sunken part in the row-accumulated gray value curve and acquiring coordinate values of two end points in the width direction of the defect region according to the sunken part in the row-accumulated gray value curve.
Optionally, the calculation module comprises:
a length direction calculating unit, configured to calculate an actual position and a size of the defect region in a length direction by using the following formulas:
Figure BDA0002434333100000031
in the formula, d1Actual size of defect region in length direction, L1For the actual dimension of the test piece to be tested in the length direction, Δ1、Δ2Coordinate values, Δ, of two end points in the length direction of the image data, respectively1′、Δ2The coordinate values of two end points in the length direction of the image data corresponding to the defect area are respectively;
a width direction calculating unit for calculating the actual position and size of the defect region in the width direction by the following formula:
Figure BDA0002434333100000032
in the formula, d2L, actual size of defect region in width direction2For the actual dimension of the test piece to be tested in the width direction, Δ3、Δ4Coordinate values, Δ, of two end points in the width direction of the image data, respectively3′、Δ4' are coordinate values of both end points in the width direction of the image data corresponding to the defective region, respectively.
A third aspect of the present application provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and capable of running on the processor, and when the processor executes the computer program, the processor implements the defect localization method for detecting an image by an infrared thermal imaging system as described above.
A fourth aspect of the present application provides a computer-readable storage medium, which stores a computer program, which when executed by a processor, can implement the method for locating a defect in an ir thermography image as described above.
The invention has at least the following beneficial technical effects:
the defect positioning method for the infrared thermal imaging system detection image can realize the defect positioning and quantitative measurement of the infrared thermal imaging system detection image, and overcomes the defect that the defect edge cannot be quickly and accurately obtained by using the conventional drawing board method, so that the defect is accurately positioned and quantitatively measured.
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FIG. 1 is a flowchart of a method for locating defects in an inspection image of an infrared thermal imaging system according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of image data of a defect locating method for detecting an image by an infrared thermal imaging system according to an embodiment of the present application;
FIG. 3 is an image of an IR imaging system for detecting defects in an image and performing erosion dilation on the image data according to an embodiment of the present disclosure;
FIG. 4 is an image divided into two binary values after the image data is processed by erosion expansion according to the defect locating method for detecting an image by an infrared thermal imaging system according to an embodiment of the present application;
FIG. 5 is a curve obtained by accumulating binarized images in columns according to a defect locating method for detecting images by an infrared thermal imaging system according to an embodiment of the present disclosure;
FIG. 6 is a curve obtained by row-wise accumulation of a binarized image by a defect locating method for detecting an image by an infrared thermal imaging system according to an embodiment of the present application;
FIG. 7 is a schematic view of a defect locating device for detecting an image by an IR thermal imaging system according to an embodiment of the present application;
FIG. 8 is a schematic diagram of a second endpoint acquisition module of the defect locating apparatus for detecting an image by an IR thermal imaging system according to an embodiment of the present application.
Detailed Description
In order to make the implementation objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the drawings in the embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The described embodiments are a subset of the embodiments in the present application and not all embodiments in the present application. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
In the description of the present application, it is to be understood that the terms "center", "longitudinal", "lateral", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on those shown in the drawings, and are used merely for convenience in describing the present application and for simplifying the description, and do not indicate or imply that the referenced device or element must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be construed as limiting the scope of the present application.
The present application is described in further detail below with reference to fig. 1 to 8.
The first aspect of the present application provides a method for locating a defect in a detected image of an infrared thermal imaging system, including:
converting a detection image into image data;
reading image data, and acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the image data;
performing corrosion expansion processing on the image data, and performing binarization segmentation to obtain a binarization image;
acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the defect region according to the binary image;
and step five, calculating the actual position and size of the defect area.
In the method for positioning the defect of the detected image of the infrared thermal imaging system, in the first step, the detected image is converted into image data in an Excel format through a software data output interface of the infrared thermal imaging system and is output. In this embodiment, the arrangement of the image data is as follows: row pixel values, column pixel values and gray scale values and stored by row.
In the third step, the image data is subjected to erosion expansion processing and binarization segmentation to obtain a binarized image with definite distinction between a defective area and a non-defective area, and then in the fourth step, coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the defective area are obtained according to the binarized image, including:
respectively accumulating the gray value of the binary image by columns and rows to obtain a gray value curve accumulated by columns and a gray value curve accumulated by rows;
acquiring a concave part in the gray value curve accumulated according to the columns and a concave part in the gray value curve accumulated according to the rows;
coordinate values of two end points in the length direction of the defect region are obtained according to the recessed part in the gray value curve accumulated according to the columns, and coordinate values of two end points in the width direction of the defect region are obtained according to the recessed part in the gray value curve accumulated according to the rows.
In the method for positioning the defect of the detection image of the infrared thermal imaging system, in the fifth step, calculating the actual position and size of the defect area comprises the following steps:
calculating the actual position and size of the defect region in the length direction by the following formula:
Figure BDA0002434333100000061
in the formula, d1Actual size of defect region in length direction, L1For the actual dimension of the test piece to be tested in the length direction, Δ1、Δ2Coordinate values, Δ, of two end points in the length direction of the image data, respectively1′、Δ2The coordinate values of two end points in the length direction of the image data corresponding to the defect area are respectively;
similarly, the actual position and size of the defect region in the width direction are calculated by the following formula:
Figure BDA0002434333100000062
in the formula, d2L, actual size of defect region in width direction2For the actual dimension of the test piece to be tested in the width direction, Δ3、Δ4Coordinate values, Δ, of two end points in the width direction of the image data, respectively3′、Δ4' are coordinate values of both end points in the width direction of the image data corresponding to the defective region, respectively.
A second aspect of the present application provides a defect locating device for detecting an image by an infrared thermal imaging system, comprising:
a conversion module 101 for converting the detection image into image data;
a first end point obtaining module 102, configured to read image data, and obtain coordinate values of two end points in a length direction and coordinate values of two end points in a width direction of the image data;
the processing module 103 is used for performing corrosion expansion processing on the image data and performing binarization segmentation to obtain a binarization image;
a second end point obtaining module 104, configured to obtain coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the defect region according to the binarized image;
and a calculating module 105 for calculating the actual position and size of the defect area.
According to the defect positioning device for detecting the image by the infrared thermal imaging system, the conversion module 101 is used for converting the detected image into the image data in the Excel format, and the arrangement mode of the image data is as follows: row pixel values, column pixel values and gray scale values and stored by row.
The defect positioning device for detecting images of the infrared thermal imaging system of the application, the second end point acquisition module 104 comprises:
a curve obtaining unit 401, configured to respectively perform row-wise and row-wise accumulation on the gray value of the binarized image to obtain a row-wise accumulated gray value curve and a row-wise accumulated gray value curve;
an object acquisition unit 402 for acquiring a depressed portion in the gradation value curve accumulated by columns and a depressed portion in the gradation value curve accumulated by rows;
the coordinate value obtaining unit 403 is configured to obtain coordinate values of two end points in the length direction of the defect region according to the recessed portion in the row-accumulated gray value curve, and obtain coordinate values of two end points in the width direction of the defect region according to the recessed portion in the row-accumulated gray value curve.
The defect positioning device for detecting the image by the infrared thermal imaging system comprises a calculation module 105, a detection module and a detection module, wherein the calculation module comprises:
a length direction calculating unit for calculating the actual position and size of the defect region in the length direction by the following formula:
Figure BDA0002434333100000071
in the formula, d1Actual size of defect region in length direction, L1For the actual dimension of the test piece to be tested in the length direction, Δ1、Δ2Are respectively image data lengthCoordinate values of two end points in the direction of the degrees, Delta1′、Δ2The coordinate values of two end points in the length direction of the image data corresponding to the defect area are respectively;
a width direction calculating unit for calculating the actual position and size of the defect region in the width direction by the following formulas:
Figure BDA0002434333100000072
in the formula, d2L, actual size of defect region in width direction2For the actual dimension of the test piece to be tested in the width direction, Δ3、Δ4Coordinate values, Δ, of two end points in the width direction of the image data, respectively3′、Δ4' are coordinate values of both end points in the width direction of the image data corresponding to the defective region, respectively.
A third aspect of the present application provides an electronic device, which includes a memory, a processor, and a computer program stored in the memory and capable of running on the processor, and when the processor executes the computer program, the processor implements the above method for locating a defect in an infrared thermal imaging system detected image. In the present application, the computer program is programmed using Matlab software.
A fourth aspect of the present application provides a computer-readable storage medium, which stores a computer program, and when the computer program is executed by a processor, the method for locating a defect in an infrared thermal imaging system inspection image as above can be implemented.
The defect positioning method and device for the detection image of the infrared thermal imaging system solve the problem that the infrared thermal imaging system cannot directly obtain coordinate information on the detection image, and simultaneously make up the defect that the defect edge cannot be quickly and accurately obtained by using a conventional drawing board, so that the defect is positioned and quantitatively measured.
The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present application should be covered within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims (10)

1. A defect positioning method for detecting images by an infrared thermal imaging system is characterized by comprising the following steps:
converting a detection image into image data;
reading the image data, and acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the image data;
step three, carrying out corrosion expansion processing on the image data, and carrying out binarization segmentation to obtain a binarization image;
acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the defect region according to the binary image;
and step five, calculating the actual position and size of the defect area.
2. The method for locating the defect of the detected image by the infrared thermal imaging system according to claim 1, wherein in the first step, the detected image is converted into image data in an Excel format, and the arrangement of the image data is as follows: row pixel values, column pixel values and gray scale values and stored by row.
3. The method for locating defects of an inspection image of an infrared thermal imaging system according to claim 2, wherein in step four, the obtaining the coordinate values of the two end points in the length direction and the coordinate values of the two end points in the width direction of the defect area according to the binarized image comprises:
respectively accumulating the gray values of the binary image by columns and rows to obtain a gray value curve accumulated by columns and a gray value curve accumulated by rows;
acquiring a concave part in the gray value curve accumulated according to the columns and a concave part in the gray value curve accumulated according to the rows;
and obtaining coordinate values of two end points in the length direction of the defect region according to the sunken part in the gray value curve accumulated according to the columns, and obtaining coordinate values of two end points in the width direction of the defect region according to the sunken part in the gray value curve accumulated according to the rows.
4. The method as claimed in claim 3, wherein the step five of calculating the actual position and size of the defect area comprises:
calculating the actual position and size of the defect region in the length direction by the following formula:
Figure FDA0002434333090000021
in the formula, d1Actual size of defect region in length direction, L1For the actual dimension of the test piece to be tested in the length direction, Δ1、Δ2Coordinate values, Δ, of two end points in the length direction of the image data, respectively1′、Δ2The coordinate values of two end points in the length direction of the image data corresponding to the defect area are respectively;
calculating the actual position and size of the defect region in the width direction by the following formula:
Figure FDA0002434333090000022
in the formula, d2L, actual size of defect region in width direction2For the actual dimension of the test piece to be tested in the width direction, Δ3、Δ4Coordinate values, Δ, of two end points in the width direction of the image data, respectively3′、Δ4' are coordinate values of both end points in the width direction of the image data corresponding to the defective region, respectively.
5. A defect positioning device for detecting images by an infrared thermal imaging system is characterized by comprising:
a conversion module for converting the detection image into image data;
the first end point acquisition module is used for reading the image data and acquiring coordinate values of two end points in the length direction and coordinate values of two end points in the width direction of the image data;
the processing module is used for carrying out corrosion expansion processing on the image data and carrying out binarization segmentation to obtain a binarization image;
the second end point acquisition module is used for acquiring coordinate values of two end points in the length direction of the defect area and coordinate values of two end points in the width direction according to the binary image;
and the calculation module is used for calculating the actual position and size of the defect area.
6. The apparatus of claim 5, wherein the converting module is configured to convert the inspection image into image data in an Excel format, and the image data is arranged in a manner of: row pixel values, column pixel values and gray scale values and stored by row.
7. The apparatus of claim 6, wherein the second endpoint acquisition module comprises:
the curve acquisition unit is used for respectively accumulating the gray values of the binary image by columns and rows to obtain a gray value curve accumulated by columns and a gray value curve accumulated by rows;
the target acquisition unit is used for acquiring a concave part in the gray value curve accumulated according to the columns and a concave part in the gray value curve accumulated according to the rows;
and the coordinate value acquisition unit is used for acquiring coordinate values of two end points in the length direction of the defect region according to the sunken part in the row-accumulated gray value curve and acquiring coordinate values of two end points in the width direction of the defect region according to the sunken part in the row-accumulated gray value curve.
8. The infrared thermal imaging system inspection image defect locating device of claim 7, wherein the computing module comprises:
a length direction calculating unit, configured to calculate an actual position and a size of the defect region in a length direction by using the following formulas:
Figure FDA0002434333090000031
in the formula, d1Actual size of defect region in length direction, L1For the actual dimension of the test piece to be tested in the length direction, Δ1、Δ2Coordinate values, Δ, of two end points in the length direction of the image data, respectively1′、Δ2The coordinate values of two end points in the length direction of the image data corresponding to the defect area are respectively;
a width direction calculating unit for calculating the actual position and size of the defect region in the width direction by the following formula:
Figure FDA0002434333090000032
in the formula, d2L, actual size of defect region in width direction2For the actual dimension of the test piece to be tested in the width direction, Δ3、Δ4Coordinate values, Δ, of two end points in the width direction of the image data, respectively3′、Δ4' are coordinate values of both end points in the width direction of the image data corresponding to the defective region, respectively.
9. An electronic device comprising a memory, a processor and a computer program stored in the memory and capable of running on the processor, wherein the processor when executing the computer program implements the method for locating defects in an inspection image of an infrared thermal imaging system according to any one of claims 1 to 4.
10. A computer-readable storage medium, in which a computer program is stored, which, when being executed by a processor, is capable of implementing a method for locating defects in an ir thermography image according to any of claims 1 to 4.
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左克铸;邹媛媛;李鹏飞;张琦;: "基于迭代的不等厚激光拼焊焊缝边界特征点识别方法" *
张宏钊;刘国坚;黄荣辉;姚森敬;王丰华;: "高压设备放电紫外图像特征量提取方法研究" *
莫胜撼;喻宁娜;梁广瑞;戴建树;: "基于结构光无坡口对接焊缝图像实时处理研究" *

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