CN111412685A - Heat exchange device and air conditioner - Google Patents

Abstract

The invention relates to a heat exchange device and an air conditioner, comprising: the semiconductor refrigerating piece is provided with a cold end and a hot end which are connected with each other; the first heat exchange mechanism is in contact heat transfer with the cold end, and the second heat exchange mechanism is in contact heat transfer with the hot end; at least part of the first heat exchange mechanism and at least part of the second heat exchange mechanism move synchronously with the semiconductor refrigerating piece, so that the first heat exchange mechanism and the second heat exchange mechanism disturb air and exchange heat with the air. The heat exchange device can realize the refrigeration or heating of the indoor space by matching the semiconductor refrigerating piece with the first heat exchange mechanism and the second heat exchange mechanism, has a simple structure, and is convenient to clean; meanwhile, at least part of the first heat exchange mechanism and at least part of the second heat exchange mechanism move synchronously with the semiconductor refrigerating piece, so that the heat exchange efficiency of the first heat exchange mechanism and the second heat exchange mechanism with air is improved, and the heat exchange effect of the heat exchange device is ensured.

Description

Heat exchange device and air conditioner

Technical Field

The invention relates to the technical field of heat exchange, in particular to a heat exchange device and an air conditioner.

Background

The heat exchange device can adjust parameters such as air temperature, humidity and flow velocity of the environment in the building or structure by manual means. Various heat exchange devices such as air pipe machines, patio machines, all-in-one machines and the like are put into the market of air conditioners in the kitchen environment at present.

However, the structure is complicated no matter the air duct machine, the courtyard machine and the integrated machine are adopted, so that the cleaning is inconvenient.

Disclosure of Invention

Therefore, it is necessary to provide a heat exchange device and an air conditioner with simple structure to solve the problem of inconvenient cleaning due to the complicated structure of the conventional heat exchange device.

A heat exchange apparatus comprising:

the semiconductor refrigerating piece is provided with a cold end and a hot end which are connected with each other;

the first heat exchange mechanism is in contact heat transfer with the cold end, and the second heat exchange mechanism is in contact heat transfer with the hot end;

at least part of the first heat exchange mechanism and at least part of the second heat exchange mechanism move synchronously with the semiconductor refrigerating piece, so that the first heat exchange mechanism and the second heat exchange mechanism disturb air and exchange heat with the air.

The heat exchange device can realize the refrigeration or heating of the indoor space by matching the semiconductor refrigerating piece with the first heat exchange mechanism and the second heat exchange mechanism, has a simple structure, and is convenient to clean; meanwhile, at least part of the first heat exchange mechanism and at least part of the second heat exchange mechanism move synchronously with the semiconductor refrigerating piece, so that the heat exchange efficiency of the first heat exchange mechanism and the second heat exchange mechanism with air is improved, and the heat exchange effect of the heat exchange device is ensured.

In one embodiment, the semiconductor refrigerating pieces comprise at least two semiconductor refrigerating pieces, and every two adjacent semiconductor refrigerating pieces are arranged at intervals.

In one embodiment, the heat exchange device further comprises a thermal insulation member, which is disposed between every two adjacent semiconductor cooling members and is used for insulating heat conduction between every two adjacent semiconductor cooling members.

In one embodiment, the heat exchange device further includes a heat insulation member disposed between the first heat exchange mechanism and the second heat exchange mechanism for blocking heat conduction between the first heat exchange mechanism and the second heat exchange mechanism.

In one embodiment, the first heat exchange mechanism comprises a first hub and a first fan blade, the semiconductor refrigeration piece is arranged between the first hub and the second heat exchange mechanism, and the first fan blade is fixedly connected with the first hub;

the first hub and the first fan blade move synchronously with the semiconductor refrigerating piece to disturb air.

In one embodiment, the projection of the first fan blade on the plane where the semiconductor refrigerating piece is located is at least partially overlapped with the semiconductor refrigerating piece.

In one embodiment, the second heat exchange mechanism comprises a second hub and a second fan blade, the semiconductor refrigeration piece is arranged between the first heat exchange mechanism and the second hub, and the second fan blade is fixedly connected with the second hub;

the second hub and the second fan blade move synchronously with the semiconductor refrigerating piece to disturb air.

In one embodiment, the projection of the second fan blade on the plane where the semiconductor refrigerating piece is located is at least partially overlapped with the semiconductor refrigerating piece.

In one embodiment, the first heat exchange mechanism comprises a first hub and a first fan blade, the second heat exchange mechanism comprises a second hub and a second fan blade, the first hub is sleeved in the second hub, the semiconductor refrigeration piece is arranged between the first hub and the second hub, the first fan blade is fixedly connected with the first hub, and the second fan blade is fixedly connected with the second hub;

the first hub, the first fan blade, the second hub and the second fan blade move synchronously with the semiconductor refrigerating piece.

In one embodiment, the first fan blade is fixedly connected with the inner surface of the first hub, and the second fan blade is fixedly connected with the outer surface of the second hub.

In one embodiment, the first fan blade is an axial flow fan blade, the second fan blade is a centrifugal fan blade, and the extending direction of the centrifugal fan blade is parallel to the axial direction of the first hub.

In one embodiment, the second heat exchange mechanism further includes an assembly part, the assembly part is fixedly connected with the outer surface of the second hub, the second fan blade is fixedly connected to the assembly part, an airflow space is defined among the second fan blade, the assembly part and the outer circumferential surface of the second hub, and an air inlet end is formed at one axial end of the airflow space along the second hub while a closed end is formed at the other axial end of the airflow space.

In one embodiment, the second heat exchange mechanism further comprises a flow guide piece, and the flow guide piece is arranged in the airflow space and used for guiding airflow from the air inlet end to the second fan blade to be discharged.

In one embodiment, the heat exchange device further comprises an air duct mechanism, the air duct mechanism is provided with a first air inlet duct and a second air inlet duct, and the first air inlet duct and the second air inlet duct are independently arranged;

the air inlet end of the first heat exchange mechanism is communicated with the first air inlet duct, the first air inlet duct is used for air inlet of the first heat exchange mechanism, the air inlet end of the second heat exchange mechanism is communicated with the second air inlet duct, and the second air inlet duct is used for air inlet of the second heat exchange mechanism.

In one embodiment, the first air inlet channel is provided with a first air inlet communicated with the outside, and the second air inlet channel is provided with a second air inlet communicated with the outside;

the first air inlet comprises a main air opening and an auxiliary air opening which are mutually independent, or the second air inlet comprises a main air opening and an auxiliary air opening which are mutually independent.

In one embodiment, the heat exchange device further comprises an air duct mechanism, the air duct mechanism is provided with a first air outlet duct and a second air outlet duct, and the first air outlet duct and the second air outlet duct are independently arranged;

the air outlet end of the first heat exchange mechanism is communicated with the first air outlet duct, the first air outlet duct is used for air outlet of the first heat exchange mechanism, the air outlet end of the second heat exchange mechanism is communicated with the second air outlet duct, and the second air outlet duct is used for air outlet of the second heat exchange mechanism.

In one embodiment, the heat exchanging device further comprises a driving mechanism, and the driving mechanism is used for driving at least part of the first heat exchanging mechanism, at least part of the second heat exchanging mechanism and the semiconductor refrigerating element to move synchronously.

An air conditioner comprising a heat exchange apparatus as claimed in any one of the preceding claims.

Drawings

FIG. 1 is a block diagram of a heat exchange device according to an embodiment of the present invention;

FIG. 2 is a partial block diagram of the heat exchange device shown in FIG. 1;

FIG. 3 is a structural view of a first heat exchange mechanism and a connection frame of the heat exchange device shown in FIG. 1;

FIG. 4 is a block diagram of a heat exchange device according to another embodiment of the present invention;

FIG. 5 is a structural view of a second heat exchange mechanism of the heat exchange device shown in FIGS. 1 and 4;

FIG. 6 is a front view of the heat exchange device shown in FIG. 1;

FIG. 7 is an assembled view of a heat exchange device according to yet another embodiment of the present invention;

FIG. 8 is an assembly view of a portion of the construction of the heat exchange device shown in FIG. 7;

FIG. 9 is an exploded view of part of the structure of the drive mechanism of the heat exchange device shown in FIG. 7;

FIG. 10 is an assembly view of a portion of the construction of the heat exchange device shown in FIG. 7;

FIG. 11 is an exploded view of the heat exchange device shown in FIG. 7;

fig. 12 is an exploded view of a part of the structure of the heat exchange device shown in fig. 7.

100. A heat exchange device; 10. a semiconductor refrigeration member; 11. refrigerating noodles; 12. heating the noodles; 20. a first heat exchange mechanism; 21. a first hub; 211. a first assembly plane; 212. assembling a groove; 22. a first fan blade; 30. a second heat exchange mechanism; 31. a second hub; 311. a second assembly plane; 32. a second fan blade; 33. an assembly member; 34. a drainage member; 40. an air flow space; 50. a thermal insulation member; 60. a drive mechanism; 61. a connecting frame; 62. a drive member; 63. a fixed seat; 64. a support; 71. a housing; 711. a housing; 7111. a third opening; 7112. a body; 7113. a cover plate; 712. a partition plate; 72. a first air inlet duct; 721. a first air inlet; 7211. a main tuyere; 7212. an auxiliary tuyere; 73. a second air inlet; 74. a first air outlet; 75. a flow guide ring; 76. a volute; 761. a first opening; 762. a second opening; 77. a second air outlet duct; 771. and a second air outlet.

Detailed Description

To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1, an embodiment of the present invention provides a heat exchange apparatus 100 for cooling or heating an indoor space. Specifically, the heat exchange device 100 includes a semiconductor refrigeration member 10, a first heat exchange mechanism 20 and a second heat exchange mechanism 30, the semiconductor refrigeration member 10 has a cold end and a hot end connected to each other, the first heat exchange mechanism 20 is in contact with the cold end of the semiconductor refrigeration member 10 for heat transfer, and the second heat exchange mechanism 30 is in contact with the hot end of the semiconductor refrigeration member 10 for heat transfer.

That is, when the semiconductor cooling device 10 is powered on, the temperature of the cold end thereof is decreased to generate cold, and the temperature of the hot end thereof is increased to generate heat. Because the first heat exchange mechanism 20 is in contact heat transfer with the cold end, the first heat exchange mechanism 20 can absorb cold energy transferred by the cold end, and the second heat exchange mechanism 30 is in contact heat transfer with the hot end, the second heat exchange mechanism 30 can absorb heat transferred by the hot end.

Specifically, at least part of the first heat exchanging mechanism 20 and at least part of the second heat exchanging mechanism 30 move synchronously with the semiconductor refrigeration device 10, so that the first heat exchanging mechanism 20 and the second heat exchanging mechanism 30 disturb air and exchange heat with the air.

When the indoor space needs to be refrigerated, the first heat exchange mechanism 20 is arranged to exchange heat with air, and cold air formed after heat exchange is blown to the indoor space, so that the purpose of refrigeration is achieved; meanwhile, the second heat exchange mechanism 30 exchanges heat with air, and hot air formed after heat exchange flows to an outdoor space, so that the temperature of the hot end is reduced, the purpose of reducing the temperature of the cold end is achieved, and the cold end has lower temperature and is convenient to refrigerate. When the indoor space needs to be heated, the second heat exchange mechanism 30 is arranged to exchange heat with air, and hot air formed after heat exchange is blown to the indoor space, so that the purpose of heating is achieved; meanwhile, the first heat exchange mechanism 20 exchanges heat with air, and makes cold air formed after heat exchange flow to an outdoor space, so that the temperature of the cold end is increased, the purpose of increasing the temperature of the hot end is achieved, and the hot end has higher temperature and is convenient for heating.

In the heat exchange device 100 provided by this embodiment, the semiconductor refrigeration element 10 is matched with the first heat exchange mechanism 20 and the second heat exchange mechanism 30, so that refrigeration or heating of an indoor space can be realized, and the heat exchange device 100 with a simple structure is convenient to clean; meanwhile, at least part of the first heat exchange mechanism 20 and at least part of the second heat exchange mechanism 30 move synchronously with the semiconductor refrigerating element 10, so that the heat exchange efficiency between the first heat exchange mechanism 20 and the second heat exchange mechanism 30 and air is improved, and the heat exchange effect of the heat exchange device is ensured.

The following describes the technical solution of the present invention in detail, taking as an example the use of the heat exchange device 100 for cooling an indoor space. The present embodiment is merely exemplary and does not limit the technical scope of the present invention. In addition, the drawings in the embodiments omit unnecessary components and clearly show the technical features of the invention.

Referring to fig. 2, in one embodiment, the semiconductor cooling members 10 include at least two semiconductor cooling members 10, and every two adjacent semiconductor cooling members 10 are spaced apart from each other. In this way, by providing at least two semiconductor cooling members 10, the cooling effect of the heat exchange device 100 can be ensured. It is understood that in other embodiments, the semiconductor cooling element 10 may comprise only one, so as to facilitate the arrangement, which is not limited herein.

Specifically, the semiconductor cooling element 10 is a sheet structure, and the semiconductor cooling element 10 has a cooling surface 11 and a heating surface 12 which are arranged away from each other. The refrigeration face 11 is formed at the cold junction, and the heating face 12 is formed at the hot junction, and the refrigeration face 11 closely laminates with first heat transfer mechanism 20, and the heating face 12 closely laminates with second heat transfer mechanism 30 to improve the heat transfer effect of first heat transfer mechanism 20 and second heat transfer mechanism 30 and semiconductor refrigeration piece 10.

Further, in order to improve the heat exchange effect, the first heat exchange mechanism 20 and the second heat exchange mechanism 30 are both made of metal materials with high heat conductivity coefficients, such as aluminum materials. It is contemplated that, in other embodiments, the first heat exchanging mechanism 20 and the second heat exchanging mechanism 30 may be made of other metal materials with high thermal conductivity, such as aluminum, and is not limited herein.

Referring to fig. 1 and 2, in one embodiment, the heat exchange device 100 further includes a heat insulation element 50, and the heat insulation element 50 is disposed between the first heat exchange unit 20 and the second heat exchange unit 30 for blocking heat conduction between the first heat exchange unit 20 and the second heat exchange unit 30. Thus, the heat insulation member 50 can obstruct heat conduction between the first heat exchange mechanism 20 and the second heat exchange mechanism 30, and reduce heat leakage between the first heat exchange mechanism 20 and the second heat exchange mechanism 30.

In one embodiment, the whole of the first heat exchanging mechanism 20 and the whole of the second heat exchanging mechanism 30 move synchronously with the semiconductor cooling fins and the thermal insulation member 50. It is understood that, in other embodiments, both the portion of the first heat exchanging mechanism 20 and the portion of the second heat exchanging mechanism 30 may be provided to move synchronously with the semiconductor cooling device 10 and the heat insulating device 50, which is not limited herein.

Referring to fig. 3, in an embodiment, the first heat exchanging mechanism 20 includes a first hub 21 and a first blade 22, the semiconductor refrigerating element 10 and the heat insulating element 50 are disposed between the first hub 21 and the second heat exchanging mechanism 30 (see fig. 4), and the first blade 22 is fixedly connected to the first hub 21. The first hub 21 and the first fan 22 move synchronously with the semiconductor refrigerating element 10 and the heat insulating element 50 to disturb air.

Referring to fig. 5, further, the second heat exchanging mechanism 30 includes a second hub 31 and a second blade 32, the semiconductor refrigerating element 10 and the heat insulating element 50 are disposed between the first hub 21 and the second hub 31 (see fig. 4), and the second blade 32 is fixedly connected to the second hub 31. The second hub 31 and the second blades 32 move synchronously with the semiconductor refrigerating element 10 and the heat insulating element 50 to disturb air.

Specifically, at least two semiconductor refrigeration pieces 10 are arranged between the first hub 21 and the second hub 31 at intervals along the circumferential direction of the first hub 21 or the second hub 31. The heat insulator 50 includes a plurality of heat insulators 50, and similarly, the plurality of heat insulators 50 are provided between the first hub 21 and the second hub 31 at intervals in the circumferential direction of the first hub 21 or the second hub 31. More specifically, the heat insulation members 50 and the semiconductor refrigeration members 10 are arranged in a staggered manner along the circumferential direction of the first hub 21 or the second hub 31, that is, the heat insulation members 50 are arranged between every two adjacent semiconductor refrigeration members 10, and are used for isolating heat conduction between every two adjacent semiconductor refrigeration members 10, so as to ensure the heat exchange effect of the heat exchange device.

In one embodiment, the first hub 21 is nested within the second hub 31. It is understood that in other embodiments, the second hub 31 can be sleeved in the first hub 21, and is not limited herein.

Here, the first hub 21 is inserted into the second hub 31, or the second hub 31 is inserted into the first hub 21, which means that: the first hub 21 and the second hub 31 are connected by being sleeved with each other.

Further, since the first hub 21 and the second hub 31 are annular, in order to facilitate the assembly of the sheet-shaped semiconductor cooling elements 10, a first assembly plane 211 (see fig. 3) is formed on the outer circumferential surface of the first hub 21, a second assembly plane 311 (see fig. 5) is formed on the inner circumferential surface of the second hub 31, and each semiconductor cooling element 10 is sandwiched between each first assembly plane 211 and each second assembly plane 311.

With continued reference to fig. 3, the first hub 21 is provided with a mounting slot 212 at the position where the thermal insulation element 50 is mounted, so as to facilitate the mounting of the wires electrically connected to the semiconductor cooler 10. After the wires are assembled in the assembly groove 212, the heat insulation member 50 is pressed on the wires, the second hub 31 is sleeved outside the first hub 21, and the first hub 21 and the second hub 31 are fixed by fasteners such as screws.

Specifically, the screws are inserted through the middle heat insulating member 50 to directly apply an acting force on the heat insulating member 50, and the semiconductor cooling member 10 and the rest heat insulating member 50 are fixed between the first hub 21 and the second hub 31 by the clamping force of the first hub 21 and the second hub 31.

Referring to fig. 6, in one embodiment, the first blade 22 is fixedly connected to the inner surface of the first hub 21, and the second blade 32 is fixedly connected to the outer surface of the second hub 31. Specifically, the first fan blade 22 and the second fan blade 32 are both arranged opposite to the semiconductor refrigeration piece 10, that is, the projection of the first fan blade 22 and the second fan blade 32 on the plane where the semiconductor refrigeration piece 10 is located is at least partially overlapped with the semiconductor refrigeration piece 10, so that more cooling capacity is transmitted to the first fan blade 22, and more heat is transmitted to the second fan blade 32, and the heat exchange effect is further ensured.

Further, the first fan blade 22 is an axial flow fan blade, the second fan blade 32 is a centrifugal fan blade, and the extending direction of the centrifugal fan blade is parallel to the axial direction of the first hub 21 (see fig. 5). The first hub 21, the first fan blade 22, the second hub 31, the second fan blade 32 and the semiconductor refrigerating element 10 are all controllable to rotate along the circumferential direction of the first hub 21.

By arranging the first fan blades 22 as axial-flow fan blades, air can flow to the first heat exchange mechanism 20 along the axial direction of the first hub 21 and then flows out from the axial direction of the first hub 21 after heat exchange; by setting the second blades 32 as centrifugal blades, the air can flow to the second heat exchanging mechanism 30 along the axial direction of the second hub 31 and then flow out from the radial direction of the second hub 31 after heat exchange (see fig. 5).

It is conceivable that, in other embodiments, the first fan blade 22 may be configured as an axial flow fan blade, and the second fan blade 32 may be configured as a cross-flow fan blade, where an extending direction of the cross-flow fan blade is parallel to an axial direction of the first hub 21, and is not limited herein. By arranging the first fan blades 22 as axial-flow fan blades, air can flow to the first heat exchange mechanism 20 along the axial direction of the first hub 21 and then flows out from the axial direction of the first hub 21 after heat exchange; by setting the second fan blade 32 as a cross-flow fan blade, the air can flow to the second heat exchange mechanism 30 along the tangential direction of the second hub 31 to exchange heat and then flows out from the tangential direction of the second hub 31.

Continuing to refer to fig. 5, specifically, the second heat exchanging mechanism 30 further includes an assembly member 33, the assembly member 33 is fixedly connected to the outer surface of the second hub 31, the second blade 32 is fixedly connected to the assembly member 33, that is, the second blade 32 is fixedly connected to the outer surface of the second hub 31 through the assembly member 33, an airflow space 40 is defined between the second blade 32, the assembly member 33 and the outer peripheral surface of the second hub 31, and an air inlet end is formed at one axial end of the airflow space 40 along the first hub 21, and a closed end is formed at the other axial end of the airflow space. So set up, after the air flows to the heat transfer of second heat transfer mechanism 30 along the axial one end of second wheel hub 31, because airflow space 40 seals along the axial other end of second wheel hub 31, then guarantee with the radial outflow of second wheel hub 31 of all gaseous after the heat transfer of second heat transfer mechanism 30.

Further, the second heat exchanging mechanism 30 further includes a flow guiding element 34, and the flow guiding element 34 is disposed in the airflow space 40 and is used for guiding the airflow from the air inlet end to the second fan blade 32 for discharging. It will be appreciated that the flow director 34 not only serves to direct flow, but also to conduct some of the heat. Specifically, the flow guide member 34 is disposed in the airflow space 40 obliquely with respect to the axial direction of the second hub 31, so that when the airflow enters the airflow space 40 along the axial direction of the second hub 31, the flow guide member 34 obliquely disposed in the airflow space 40 guides the airflow to the second fan blade 32 in the radial direction for discharge.

With continued reference to fig. 4, in one embodiment, the heat exchanging device 100 further includes a driving mechanism 60, and the driving mechanism 60 is configured to drive at least a portion of the first heat exchanging mechanism 20, at least a portion of the second heat exchanging mechanism 30, and the semiconductor cooling element 10 to move synchronously.

Specifically, the driving mechanism 60 includes a driving member 62 and a connecting frame 61, the connecting frame 61 is fixedly connected to the inner peripheral surface of the first hub 21, and is disposed at an interval with the first fan blade 22, the driving member 62 is connected to the connecting frame 61 and is used for driving the connecting frame 61 to rotate along the circumferential direction of the first hub 21, so as to drive the first heat exchanging mechanism 20, the semiconductor refrigerating element 10, the heat insulating element 50 and the second heat exchanging mechanism 30 to rotate synchronously. More specifically, the driving member 62 is a driving motor.

In one embodiment, the heat exchange device 100 further includes a duct mechanism (not shown) having a first air inlet duct 72 (see fig. 10) and a second air inlet duct (not shown), and the first air inlet duct 72 and the second air inlet duct are independently disposed therebetween. The air inlet end of the first heat exchange mechanism 20 is communicated with the first air inlet duct 72, the first air inlet duct 72 is used for air inlet of the first heat exchange mechanism 20, the air inlet end of the second heat exchange mechanism 30 is communicated with the second air inlet duct, and the second air inlet duct is used for air inlet of the second heat exchange mechanism 30. Through the arrangement, the air inlet of the first heat exchange mechanism 20 and the air inlet of the second heat exchange mechanism 30 are guaranteed not to influence each other.

The air duct mechanism further has a first air outlet duct (not shown) and a second air outlet duct 77 (see fig. 7), and the first air outlet duct and the second air outlet duct 77 are independently disposed. The air outlet end of the first heat exchange mechanism 20 is communicated with the first air outlet duct, the first air outlet duct is used for air outlet of the first heat exchange mechanism 20, the air outlet end of the second heat exchange mechanism 30 is communicated with the second air outlet duct 77, and the second air outlet duct 77 is used for air outlet of the second heat exchange mechanism 30. Through the arrangement, the air outlet of the first heat exchange mechanism 20 and the air outlet of the second heat exchange mechanism 30 are guaranteed not to be influenced by each other.

In one embodiment, the air duct mechanism includes a housing 71 (see fig. 7) and a baffle ring 75 (see fig. 8), and the first heat exchanging mechanism 20, the semiconductor cooler 10, the heat insulator 50, the driving mechanism 60, the second heat exchanging mechanism 30 and the baffle ring 75 are disposed in the housing 71. The first hub 21 has a first axial end face and a second axial end face, the baffle ring 75 is covered outside the driving mechanism 60, one end of the baffle ring is fixedly connected with the casing 71, the other end of the baffle ring is butted with the first axial end face, and the second axial end face of the first hub 21 is butted with the casing 71. The first axial end face and the second axial end face are two end faces of the first hub 21 in the axial direction. The driving mechanism 60 further includes a fixing seat 63 and a bracket 64 (see fig. 9), the fixing seat 63 is fixedly connected with the housing 71 (see fig. 10), the bracket 64 is fixedly connected with the fixing seat 63, a driving body of the driving element 62 is fixedly connected with the bracket 64, and a driving end of the driving element 62 is fixedly connected with the first hub 21 through the connecting frame 61.

The first air inlet duct 72 is partially opened on the casing 71, the rest is formed in the deflector ring 75, the first air outlet duct is formed on the casing 71, and the first heat exchange mechanism 20 supplies air in the axial direction and discharges air in the axial direction.

It should be noted that although the other end of the deflector ring 75 is abutted against the first axial end face and the housing 71 is abutted against the second axial end face, the deflector ring 75 and the housing 71 do not restrict the movement of the first hub 21.

Referring to fig. 11, further, the air duct mechanism further includes a spiral casing 76, the spiral casing 76 is covered outside the second heat exchanging mechanism 30, and the spiral casing 76 has a first opening 761 and a second opening 762 (refer to fig. 12) along the axial direction of the second hub 31, the first opening 761 allows the wind to flow from the first wind inlet duct 72 to the first heat exchanging mechanism 20, and the second opening 762 allows the wind to flow from the first heat exchanging mechanism 20 to the first wind outlet duct. The second air inlet duct is partially opened on the casing 71, the rest is formed between the casing 71 and the deflector ring 75, the second air outlet duct 77 is formed on the volute 76, the first opening 761 is arranged to allow air to flow from the second air inlet duct to the second heat exchange mechanism 30 for heat exchange, and the second heat exchange mechanism 30 supplies air in the axial direction and discharges air in the radial direction.

The end of the first air inlet duct 72 away from the first heat exchanging mechanism 20 has a first air inlet 721 (see fig. 7) provided on the casing 71, and the end of the first air outlet duct away from the first heat exchanging mechanism 20 has a first air outlet 74 (see fig. 11) provided on the casing 71. The end of the second air inlet duct far away from the second heat exchanging mechanism 30 has a second air inlet 73, and the end of the second air outlet duct 77 far away from the second heat exchanging mechanism 30 has a second air outlet 771 (see fig. 10). That is, the first air inlet duct 72 has a first air inlet 721 communicating with the outside, the first air outlet duct has a first air outlet 74 communicating with the outside, the second air inlet duct has a second air inlet 73 communicating with the outside, and the second air outlet duct 77 has a second air outlet 771 communicating with the outside. It should be noted that the above-mentioned outside including the above-mentioned outside does not include only the outdoor space, but includes the above-mentioned indoor space and outdoor space.

Air enters the first air inlet duct 72 from the first air inlet 721, and flows from the first air inlet duct 72 to the first heat exchanging mechanism 20 for heat exchange, and then enters the first air outlet duct and is discharged from the first air outlet 74. The air enters the second air inlet duct from the second air inlet 73, and flows from the second air inlet duct to the second heat exchanging mechanism 30 to exchange heat, and then enters the second air outlet duct 77 and is discharged from the second air outlet 771.

Further, the first air inlet 721 includes a main air inlet 7211 and an auxiliary air inlet 7212 (see fig. 7 and 11) which are independent of each other, the indoor return air can flow to the first heat exchanging mechanism 20 through the main air inlet 7211 for heat exchange, the outdoor fresh air can flow to the first heat exchanging mechanism 20 for heat exchange through the auxiliary air inlet 7212, and at this time, the heat exchanging device 100 has a fresh air function while refrigerating. It is understood that, in other embodiments, when the heat exchanging device 100 is used for heating, the second air inlet 73 may also include a main air inlet 7211 and an auxiliary air inlet 7212 that are independently disposed, the indoor return air may flow to the second heat exchanging mechanism 30 through the main air inlet 7211 for heat exchange, and the outdoor fresh air may flow to the second heat exchanging mechanism 30 through the auxiliary air inlet 7212 for heat exchange, where the heat exchanging device 100 has a fresh air function while heating.

Specifically, the casing 71 includes a housing 711 (see fig. 7) and a partition 712 (see fig. 10 and 11), the partition 712 is disposed in the housing 711, the partition 712 divides the housing 711 into a first space and a second space, and the semiconductor refrigeration element 10, the first heat exchange mechanism 20, the second heat exchange mechanism 30, the heat insulation element 50, the flow guiding ring 75 and the spiral casing 76 are disposed in the second space. The baffle plate 712 is fixedly connected with the baffle plate 75 and the fixing seat 63 of the driving mechanism 60, and the first space is used as a part of the first air inlet channel and is communicated with the auxiliary air inlet 7212 and the baffle plate 75 and is communicated between the main air inlet 7211 and the baffle plate 75.

That is, during cooling, the indoor return air flows into the first space through the main air port 7211 and then flows to the guide ring 75, and the outdoor fresh air flows into the first space through the auxiliary air port 7212 and then flows to the guide ring 75. Like this, water conservancy diversion circle 75 has the water conservancy diversion effect on the one hand, and on the other hand plays the effect of keeping apart the wind channel, can be convenient for set up the wind gap on each wall that forms first space to the setting of vice wind gap 7212 and main wind gap 7211 is convenient for.

Still referring to fig. 11, more specifically, the housing 711 of the casing 71 has a hollow rectangular parallelepiped structure, the partition 712 is provided in the housing 711 in the width direction (the axial direction of the first hub 21 and the second hub 31), the sub-air inlet 7212 of the first air inlet 721 is provided at one end of the housing 711 in the width direction, and the first air outlet 74 is provided at the other end of the housing 711 in the width direction. The main inlet 7211 and the second inlet 73 of the first inlet 721 are both opened at both ends of the housing 711 along the length direction, the second outlet 771 is opened at the top end of the volute 76 along the height direction, and the top end of the housing 711 along the height direction has a third opening 7111 allowing the second outlet 771 to communicate with the outside.

Referring to fig. 11, the housing 711 further includes a body 7112 and a cover plate 7113, the body 7112 is covered by the cover plate 7113, the main air inlet 7211, the second air inlet 73 and the first air outlet 74 are all disposed on the body 7112, and the auxiliary air inlet 7212 is disposed on the cover plate 7113. The housing 711 includes a body 7112 and a cover 7113, which are separately disposed, and may facilitate assembly of the partition 712, the semiconductor cooler 10, the first heat exchanging mechanism 20, the second heat exchanging mechanism 30, the heat insulating member 40, and the driving mechanism 60.

Referring to fig. 11, the operation principle of the heat exchange device 100 provided in this embodiment is described as follows:

when the sub-air inlet 7212 included in the first air inlet 721 is communicated with the outdoor space:

the driving mechanism 60 drives the first heat exchange mechanism 20 and the second heat exchange mechanism 30 to rotate, outdoor fresh air is driven to enter the first space from the auxiliary air port 7212, indoor return air enters the first space from the main air port 7211 and enters the first heat exchange mechanism 20 through the flow guide ring 75 for heat exchange, and cold air formed after heat exchange flows to the indoor space through the first air outlet 74 for refrigeration.

Meanwhile, the indoor return air flows to the second heat exchange mechanism 30 through the second air inlet 73 for heat exchange, so that the heat of the hot end of the semiconductor refrigerating element 10 is reduced, the cold end of the semiconductor refrigerating element 10 has lower temperature, and refrigeration is facilitated. The heat space formed after the heat exchange with the second heat exchanging mechanism 30 is discharged to the outdoor space through the second outlet 771.

When the sub air inlet 7212 included in the first air inlet 721 is not communicated with the outdoor space:

the driving mechanism 60 drives the first heat exchanging mechanism 20 and the second heat exchanging mechanism 30 to rotate, so as to drive the indoor return air to enter the first space from the main air inlet 7211 and enter the first heat exchanging mechanism 20 through the guide ring 75 for heat exchange, and the cold air formed after heat exchange flows to the indoor space through the first air outlet 74 for refrigeration.

Meanwhile, the indoor return air flows to the second heat exchange mechanism 30 through the second air inlet 73 for heat exchange, so that the heat of the hot end of the semiconductor refrigerating element 10 is reduced, the cold end of the semiconductor refrigerating element 10 has lower temperature, and refrigeration is facilitated. The heat space formed after the heat exchange with the second heat exchanging mechanism 30 is discharged to the indoor space through the second outlet 771.

It is understood that, in other embodiments, the primary air inlet 7211 and the secondary air inlet 73 can be used as the fresh air inlet, and the secondary air inlet 7212 can be used as the return air inlet, depending on the environment in which the heat exchange device 100 is installed.

Another embodiment of the present invention further provides an air conditioner, including the heat exchange device 100 in the above embodiment, and since the heat exchange device 100 in the above embodiment has beneficial effects, the air conditioner provided in the embodiment of the present invention has corresponding beneficial effects, and details are not repeated herein.

The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.

The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (18)

1. A heat exchange apparatus, comprising:

a semiconductor refrigeration member (10) having a cold end and a hot end connected to each other;

the heat exchanger comprises a first heat exchange mechanism (20) and a second heat exchange mechanism (30), wherein the first heat exchange mechanism (20) is in contact with the cold end for heat transfer, and the second heat exchange mechanism (30) is in contact with the hot end for heat transfer;

at least part of the first heat exchange mechanism (20) and at least part of the second heat exchange mechanism (30) move synchronously with the semiconductor refrigeration piece (10), so that the first heat exchange mechanism (20) and the second heat exchange mechanism (30) disturb air and exchange heat with the air.

2. Heat exchange device according to claim 1, characterised in that said semiconductor cooling elements (10) comprise at least two, every two adjacent semiconductor cooling elements (10) being arranged spaced apart from each other.

3. A heat exchange device according to claim 2, further comprising a thermal insulating member (50), wherein the thermal insulating member (50) is disposed between every two adjacent semiconductor cooling members (10) for insulating heat conduction between every two adjacent semiconductor cooling members (10).

4. A heat exchange device according to claim 1, further comprising a heat insulating member (50), wherein the heat insulating member (50) is disposed between the first heat exchange means (20) and the second heat exchange means (30) for blocking heat conduction between the first heat exchange means (20) and the second heat exchange means (30).

5. The heat exchange device according to claim 1, wherein the first heat exchange mechanism (20) comprises a first hub (21) and a first fan blade (22), the semiconductor refrigeration piece (10) is arranged between the first hub (21) and the second heat exchange mechanism (30), and the first fan blade (22) is fixedly connected with the first hub (21);

the first hub (21) and the first fan blade (22) move synchronously with the semiconductor refrigerating piece (10) to disturb air.

6. Device according to claim 5, characterised in that the projection of said first fan blades (22) onto the plane of said semiconductor refrigerating element (10) at least partially overlaps said semiconductor refrigerating element (10).

7. The heat exchange device according to claim 1, wherein the second heat exchange mechanism (30) comprises a second hub (31) and a second fan blade (32), the semiconductor refrigeration piece (10) is arranged between the first heat exchange mechanism (20) and the second hub (31), and the second fan blade (32) is fixedly connected with the second hub (31);

the second hub (31) and the second fan blade (32) move synchronously with the semiconductor refrigerating piece (10) to disturb air.

8. Device according to claim 7, characterised in that the projection of said second fan blades (32) onto the plane of said semiconductor refrigerating element (10) at least partially overlaps said semiconductor refrigerating element (10).

9. The heat exchange device according to any one of claims 1 to 8, wherein the first heat exchange mechanism (20) comprises a first hub (21) and first blades (22), the second heat exchange mechanism (30) comprises a second hub (31) and second blades (32), the first hub (21) is sleeved in the second hub (31), the semiconductor refrigeration piece (10) is arranged between the first hub (21) and the second hub (31), the first blades (22) are fixedly connected with the first hub (21), and the second blades (32) are fixedly connected with the second hub (31);

the first wheel hub (21), the first fan blade (22), the second wheel hub (31) and the second fan blade (32) move synchronously with the semiconductor refrigerating piece (10).

10. The heat exchange device according to claim 9, wherein the first fan blade (22) is fixedly connected with the inner surface of the first hub (21), and the second fan blade (32) is fixedly connected with the outer surface of the second hub (31).

11. The heat exchange device according to claim 9, wherein the first fan blades (22) are axial-flow fan blades, the second fan blades (32) are centrifugal fan blades, and the extension direction of the centrifugal fan blades is parallel to the axial direction of the first hub (21).

12. The heat exchange device according to claim 11, wherein the second heat exchange mechanism (30) further comprises an assembly member (33), the assembly member (33) is fixedly connected with the outer surface of the second hub (31), the second fan blade (32) is fixedly connected to the assembly member (33), an airflow space (40) is defined among the outer peripheral surfaces of the second fan blade (32), the assembly member (33) and the second hub (31), and an air inlet end is formed at one axial end of the airflow space (40) along the second hub (31) while a closed end is formed at the other axial end of the airflow space.

13. The heat exchange device according to claim 12, wherein the second heat exchange mechanism (30) further comprises a flow guide member (34), and the flow guide member (34) is disposed in the airflow space (40) and is used for guiding the airflow from the air inlet end to the second fan blade (32) for discharging.

14. The heat exchange device according to claim 1, further comprising an air duct mechanism having a first air intake duct (72) and a second air intake duct, wherein the first air intake duct (72) and the second air intake duct are independently disposed;

the air inlet end of the first heat exchange mechanism (20) is communicated with the first air inlet duct (72), the first air inlet duct (72) is used for air inlet of the first heat exchange mechanism (20), the air inlet end of the second heat exchange mechanism (30) is communicated with the second air inlet duct, and the second air inlet duct is used for air inlet of the second heat exchange mechanism (30).

15. The heat exchange device of claim 14, wherein the first air intake channel has a first air intake opening (721) communicating with the outside, and the second air intake duct has a second air intake opening (73) communicating with the outside;

the first air inlet (721) comprises a main air port (7211) and an auxiliary air port (7212) which are arranged independently, or the second air inlet (73) comprises a main air port (7211) and an auxiliary air port (7212) which are arranged independently.

16. The heat exchange device according to claim 1, further comprising an air duct mechanism having a first air outlet duct and a second air outlet duct (77), wherein the first air outlet duct and the second air outlet duct (77) are independently disposed;

the air outlet end of the first heat exchange mechanism (20) is communicated with the first air outlet duct, the first air outlet duct is used for air outlet of the first heat exchange mechanism (20), the air outlet end of the second heat exchange mechanism (30) is communicated with the second air outlet duct (77), and the second air outlet duct (77) is used for air outlet of the second heat exchange mechanism (30).

17. Heat exchange device according to claim 1, further comprising a driving mechanism (60), said driving mechanism (60) being adapted to drive at least part of said first heat exchanging mechanism (20), at least part of said second heat exchanging mechanism (30) and said semiconductor cooling element (10) in a synchronous movement.

18. An air conditioner characterized by comprising the heat exchange device according to any one of claims 1 to 17.

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