CN111403367A - Lead frame with increased cross reinforcing ribs - Google Patents
Lead frame with increased cross reinforcing ribs Download PDFInfo
- Publication number
- CN111403367A CN111403367A CN202010389694.8A CN202010389694A CN111403367A CN 111403367 A CN111403367 A CN 111403367A CN 202010389694 A CN202010389694 A CN 202010389694A CN 111403367 A CN111403367 A CN 111403367A
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- China
- Prior art keywords
- lead frame
- reinforcing ribs
- ribs
- cross
- cutting connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention belongs to the field of semiconductor manufacturing, and particularly relates to a lead frame with an added cross reinforcing rib design, which comprises a lead frame body and reinforcing ribs arranged on semi-etching cutting connecting ribs of the lead frame; the reinforcing ribs are arranged at the intersections of the half-etched cutting connecting ribs in an array mode and fix the lead frames contacted with the reinforcing ribs at the corners. The problem that the lead frame is easy to deform and the semiconductor package overflows in the manufacturing process can be effectively solved by adding the reinforcing ribs on the lead frame, the manufacturing yield of the lead frame is effectively improved, the manufacturing cost of the lead frame is reduced, and the package overflow problem is effectively improved while the profit of the manufacturing industry of the lead frame is ensured.
Description
Field of the structure
The invention belongs to the field of semiconductor manufacturing, and particularly relates to a lead frame with a design of adding cross reinforcing ribs.
Background
QFN, quad Flat Package; (QFN) is a lead-free package with peripheral terminal pads and one chip pad for mechanical and thermal integrity exposure. The package can be square or rectangular, and is mainly characterized in that: 1. the assembly is very thin (<1mm) and can meet the application with strict requirements on space; 2. the surface mount packaging non-pin bonding pad design occupies smaller PCB area;
due to the limitation of the package characteristics, the lead frame structure design used in QFN package needs to be made half-etched (part of the position needs to be made half the material thickness) and the lead frame thickness cannot be too thick. At present, the conventional QFN lead frame is 0.152mm and 0.203mm thick, and cutting connecting ribs are all half-etched, so that the lead frame is easy to deform in the process of producing the lead frame, and the manufacturing yield of the lead frame is low. The slightly deformed lead frame has the phenomena of glue overflow and the like in the packaging process, and the development of the lead frame production and the semiconductor packaging industry is seriously influenced.
Disclosure of Invention
In view of the above, the present invention is directed to a lead frame with an added cross stiffener design to overcome the shortcomings of the prior art.
The technical scheme adopted by the invention is as follows:
a lead frame with an added cross reinforcing rib design comprises a lead frame body and reinforcing ribs arranged on semi-etching cutting connecting ribs of the lead frame; the reinforcing ribs are arranged at the intersections of the half-etched cutting connecting ribs in an array mode and fix the lead frames contacted with the reinforcing ribs at the corners.
The lead frame with the added cross reinforcing rib design provided by the invention can be further provided with the reinforcing rib comprising: full cross reinforcing ribs and non-cross reinforcing ribs; the full-cross reinforcing rib is arranged in the inner area of the half-etching cutting connecting rib; the cross-lacking reinforcing ribs are arranged in the edge area of the half-etching cutting connecting ribs.
The lead frame with the added cross reinforcing ribs can be further provided with the reinforcing ribs which are integrally formed and cast.
Advantageous effects
In summary, due to the adoption of the technical scheme, the invention has the beneficial effects that:
the invention changes the lead frame design: at present, cutting connecting ribs of a conventional QFN lead frame are half-etched, and the support degree of the lead frame is very weak. The reinforcing ribs are added on the QFN lead frame, so that the problems of easy deformation and semiconductor packaging flash of the lead frame in the manufacturing process can be effectively solved, the manufacturing yield of the lead frame is effectively improved, the manufacturing cost of the lead frame is reduced, and the packaging flash is effectively improved while the profit of the lead frame manufacturing industry is ensured.
Drawings
FIG. 1 is a schematic view of a lead frame without previously provided stiffener bars;
fig. 2 is a schematic structural diagram of the present invention.
Wherein: 1, a lead frame; 2. semi-etching and cutting the connecting ribs; 3. and (5) reinforcing ribs.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The frame design of the invention is that a cross-shaped reinforcing rib 3 is added on a half-etching connecting rib of a QFN lead frame 1 so as to enhance the supporting strength of the lead frame 1 and prevent deformation and encapsulation flash; as shown in fig. 2: a lead frame 1 with an added cross reinforcing rib 3 comprises a lead frame 1 body and is characterized by further comprising a reinforcing rib 3 arranged on a semi-etching cutting connecting rib 2 of the lead frame 1; the reinforcing ribs 3 are arranged at the intersections of the half-etched cutting ribs 2 in an array manner and fix each contacted lead frame 1 at the corners. The reinforcing rib 3 includes: a full cross reinforcing rib 3 and a cross-lacking reinforcing rib 3; the full cross-shaped reinforcing ribs 3 are arranged in the inner area of the half etching cutting connecting ribs 2; the cross-lacking reinforcing ribs 3 are arranged in the edge area of the half-etching cutting connecting rib 2. The reinforcing ribs 3 are integrally formed and cast.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Claims (4)
1. A lead frame with an added cross reinforcing rib design comprises a lead frame body and is characterized by further comprising reinforcing ribs arranged on semi-etching cutting connecting ribs of the lead frame; the reinforcing ribs are arranged at the intersections of the half-etched cutting connecting ribs in an array mode and fix the lead frames contacted with the reinforcing ribs at the corners.
2. The lead frame with an added cross stiffener design of claim 1, wherein the stiffener comprises: full cross reinforcing ribs and non-cross reinforcing ribs; the full-cross reinforcing rib is arranged in the inner area of the half-etching cutting connecting rib; the cross-lacking reinforcing ribs are arranged in the edge area of the half-etching cutting connecting ribs.
3. The lead frame with an added cross stiffener design of claim 2, wherein the stiffener is provided as an integrally molded casting.
4. The lead frame with an added cross reinforcement design of claim 3, wherein one reinforcement bar of the cross-less reinforcement bars is shorter than the other three reinforcement bars by a length ratio of not less than one sixth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010389694.8A CN111403367A (en) | 2020-05-09 | 2020-05-09 | Lead frame with increased cross reinforcing ribs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010389694.8A CN111403367A (en) | 2020-05-09 | 2020-05-09 | Lead frame with increased cross reinforcing ribs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111403367A true CN111403367A (en) | 2020-07-10 |
Family
ID=71414178
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010389694.8A Pending CN111403367A (en) | 2020-05-09 | 2020-05-09 | Lead frame with increased cross reinforcing ribs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111403367A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332441A (en) * | 2010-07-12 | 2012-01-25 | 无锡华润安盛科技有限公司 | High-alignment-packaging-type lead frame and packaging structure thereof |
| CN103107098A (en) * | 2011-11-14 | 2013-05-15 | 美新半导体（无锡）有限公司 | Encapsulating method of advanced square flat pins-free and encapsulating structure thereof |
| CN104659010A (en) * | 2015-02-11 | 2015-05-27 | 江苏长电科技股份有限公司 | Quad flat no-lead package lead frame structure and package structure |
| CN208767293U (en) * | 2018-09-13 | 2019-04-19 | 天水华洋电子科技股份有限公司 | A kind of QFN lead frame piece |
-
2020
- 2020-05-09 CN CN202010389694.8A patent/CN111403367A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102332441A (en) * | 2010-07-12 | 2012-01-25 | 无锡华润安盛科技有限公司 | High-alignment-packaging-type lead frame and packaging structure thereof |
| CN103107098A (en) * | 2011-11-14 | 2013-05-15 | 美新半导体（无锡）有限公司 | Encapsulating method of advanced square flat pins-free and encapsulating structure thereof |
| CN104659010A (en) * | 2015-02-11 | 2015-05-27 | 江苏长电科技股份有限公司 | Quad flat no-lead package lead frame structure and package structure |
| CN208767293U (en) * | 2018-09-13 | 2019-04-19 | 天水华洋电子科技股份有限公司 | A kind of QFN lead frame piece |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200710 |
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| RJ01 | Rejection of invention patent application after publication |