CN111370550B - Packaging method of red light LED chip - Google Patents
Packaging method of red light LED chip Download PDFInfo
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- CN111370550B CN111370550B CN201811587608.3A CN201811587608A CN111370550B CN 111370550 B CN111370550 B CN 111370550B CN 201811587608 A CN201811587608 A CN 201811587608A CN 111370550 B CN111370550 B CN 111370550B
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- led chip
- led
- red light
- red
- light led
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
A packaging method of a red light LED chip is characterized in that the glass paper is used in pure water, the tension of water and the glass paper are utilized to fix the side face of the red light LED chip on a base of the side face of an LED support, then a gold wire, an aluminum wire or an alloy wire is used to connect the electrode of the red light LED chip with the corresponding polarity of the support, conductive silver adhesive is not used in the method, the curing temperature of the used epoxy resin adhesive is greatly reduced relative to that of the conductive silver adhesive, the influence of the conductive silver adhesive on the photoelectric parameters of the LED lamp bead and the influence of the stress release of the silver adhesive during baking can be fundamentally avoided, the glass paper is insulating, and meanwhile, the finally used epoxy resin adhesive is also insulating, so that the occurrence of electric leakage can be effectively avoided.
Description
Technical Field
The invention relates to the technical field of light emitting diode manufacturing, in particular to a packaging method of a red light LED chip.
Background
The LED is used as a new illumination light source in the 21 st century, and under the same brightness, the power consumption of a semiconductor lamp is only l/10 of that of a common incandescent lamp, but the service life of the semiconductor lamp can be prolonged by 100 times. The LED device is a cold light source, has high light efficiency, low working voltage, low power consumption and small volume, can be packaged in a plane, is easy to develop light and thin products, has firm structure and long service life, does not contain harmful substances such as mercury, lead and the like in the light source, does not have infrared and ultraviolet pollution, and does not generate pollution to the outside in production and use. Therefore, the semiconductor lamp has the characteristics of energy conservation, environmental protection, long service life and the like, and like the transistor replaces the electron tube, the semiconductor lamp replaces the traditional incandescent lamp and the traditional fluorescent lamp, and the trend is also great. From the viewpoint of saving electric energy, reducing greenhouse gas emission and reducing environmental pollution, the LED serving as a novel lighting source has great potential for replacing the traditional lighting source.
The LED lamp bead has the following advantages of 1. voltage: the LED lamp bead uses a low-voltage power supply, the power supply voltage is 2-4V, and the power supply voltage is different according to different products, so that the LED lamp bead is driven to be a high-voltage power supply; a safer power supply, particularly for public places; 2. current: the working current is 0-15 mA, and the brightness is lightened along with the increase of the current; 3. efficiency: the consumed energy is reduced by 80 percent compared with an incandescent lamp with the same luminous efficiency; 4. applicability: each unit LED small piece is 3-5mm square, so that the LED lamp bead-shaped device can be prepared into various LED lamp bead-shaped devices and is suitable for a variable environment; 5. response time: the response time of an incandescent lamp is in millisecond level, and the response time of an LED lamp is in nanosecond level; 6. and (3) environmental pollution: no harmful metallic mercury; 7. color: the color of the LED can be changed by changing the current, and the LED can conveniently adjust the energy band structure and the band gap of the material by a chemical modification method to realize the multi-color luminescence of red, yellow, green, blue and orange. For example, an LED which is red at a low current may be sequentially changed into orange, yellow and finally green as the current increases.
The LED lamp bead is widely used in the production fields of lamp decoration illumination, LED large screen display, traffic lights, decoration, computers, electronic toy gifts, exchangers, telephones, advertisements, urban light and color engineering and the like.
When the red light LED chip is packaged into the LED lamp bead, the N surface of the chip is adhered to the lamp bead base by using conductive silver adhesive due to the characteristics of the red light chip, and the P surface is connected and conducted by welding wires. The requirement for the encapsulation of ruddiness LED chip is higher and higher at present stage, also higher and higher to the requirement of conductive silver adhesive, the photoelectric parameter of the LED after the encapsulation is especially influenced by the quality of silver adhesive great, if the in-process silver adhesive that glues leads to too much silver adhesive to cover also can lead to the lamp pearl to appear the phenomenon of electric leakage on ruddiness LED chip side epitaxial layer, and can be with better bonding on the support of chip because gluing needs toasting, toast in-process glue and can lead to appearing the problem that the core splits and cause the lamp pearl to die if contact the chip because of stress release problem.
Disclosure of Invention
In order to overcome the defects of the technology, the invention provides the packaging method of the red LED chip, which does not need conductive silver adhesive and improves the yield of the red LED lamp beads.
The technical scheme adopted by the invention for overcoming the technical problems is as follows:
a packaging method of a red LED chip comprises the following steps:
a) turning the LED support by 90 degrees, turning the base positioned on the side surface of the LED support upwards, and laying a layer of cellophane on the base;
b) soaking the LED bracket in pure water, placing the side surface of the red LED chip on the upper surface of the glass paper, adsorbing and fixing the side surface of the red LED chip on the upper surface of the glass paper by using the surface tension of water, and adsorbing and fixing the lower surface of the glass paper on the base;
c) taking the LED bracket out of the pure water, and removing the residual water on the surface of the LED bracket;
d) connecting the anode of the red light LED chip with the anode of the LED bracket by using a gold wire or an aluminum wire, and connecting the cathode of the red light LED chip with the cathode of the LED bracket by using the gold wire or the aluminum wire;
e) reversely overturning the LED support by 90 degrees, so that the light emitting surface of the red light LED chip is overturned upwards, and coating and filling epoxy resin glue on the outer side of the red light LED chip;
f) and (3) putting the LED support into an oven for heating, and curing the epoxy resin adhesive to obtain the packaged red light LED chip lamp bead.
Further, the length of the cellophane in the step a) is 80-100 μm, and the width is 60-80 μm.
Further, in the step c), residual water on the surface of the LED support is dried by an air gun.
Further, the heating time in the step f) is 210-250 minutes, and the baking temperature is 150-170 ℃.
The invention has the beneficial effects that: the method has the advantages that the glass paper is used in pure water, the tension of the water and the glass paper are used for fixing the side face of the red light LED chip on the base of the side face of the LED support, then the gold wire or the aluminum wire or the alloy wire is used for connecting the electrode of the red light LED chip with the corresponding polarity of the support, conductive silver adhesive is not used in the method, the curing temperature of the used epoxy resin adhesive is greatly reduced relative to the conductive silver adhesive, the influence of the conductive silver adhesive on the photoelectric parameters of the LED lamp bead and the influence of chip cracking caused by stress release when the silver adhesive is baked are fundamentally avoided, the glass paper is insulating, and meanwhile, the finally used epoxy resin adhesive is also insulating, so that the occurrence of electric leakage is effectively avoided, the method is simple to operate, no step is added in the packaging process, and the yield of the red light LED lamp bead is higher under the.
Detailed Description
The present invention is further explained below.
A packaging method of a red LED chip comprises the following steps:
a) turning the LED support by 90 degrees, turning the base positioned on the side surface of the LED support upwards, and laying a layer of cellophane on the base;
b) soaking the LED bracket in pure water, placing the side surface of the red LED chip on the upper surface of the glass paper, adsorbing and fixing the side surface of the red LED chip on the upper surface of the glass paper by using the surface tension of water, and adsorbing and fixing the lower surface of the glass paper on the base;
c) taking the LED bracket out of the pure water, and removing the residual water on the surface of the LED bracket;
d) connecting the anode of the red light LED chip with the anode of the LED bracket by using a gold wire or an aluminum wire, and connecting the cathode of the red light LED chip with the cathode of the LED bracket by using the gold wire or the aluminum wire;
e) reversely overturning the LED support by 90 degrees, so that the light emitting surface of the red light LED chip is overturned upwards, and coating and filling epoxy resin glue on the outer side of the red light LED chip;
f) and (3) putting the LED support into an oven for heating, and curing the epoxy resin adhesive to obtain the packaged red light LED chip lamp bead.
In the existing packaging method of the red light LED chip, because the red light LED chip is of a vertical structure, the red light LED chip is required to be adhered to a base of a lamp bead support by using conductive silver adhesive, the quality of the conductive silver adhesive has great influence on the parameters of the red light LED lamp bead, the reason of the chip or the conductive silver adhesive is often the reason of the judgment that the subsequent lamp bead parameters cannot be confirmed when being analyzed abnormally, the analysis on the yield and the defective products of the red light LED chip causes great influence, the conductive silver adhesive needs to be baked to better adhere the chip on the support, and the problem that the chip cracks due to stress release in the baking process can also occur. According to the packaging method of the red light LED chip, the glass paper is used in pure water, the tension of the water is utilized, the glass paper is used for fixing the side face of the red light LED chip on the base of the side face of the LED support, the gold wire or the aluminum wire or the alloy wire is used for connecting the electrode of the red light LED chip with the corresponding polarity of the support, conductive silver adhesive is not used, the curing temperature of the used epoxy resin adhesive is greatly reduced relative to that of the conductive silver adhesive, the influence of the conductive silver adhesive on the photoelectric parameters of the LED lamp bead and the influence of the stress release of the silver adhesive during baking can be fundamentally avoided, the glass paper is insulating, and meanwhile, the finally used epoxy resin adhesive is also insulating, so that the electric leakage situation can be effectively avoided, the method is simple to operate, no step is added in the packaging process, and the yield of the red light LED lamp bead is higher under the condition that the production efficiency.
Example 1:
the length of the cellophane in the step a) is 80-100 μm, and the width is 60-80 μm.
Example 2:
and c) drying the residual water on the surface of the LED support by using an air gun.
Example 3:
the heating time in the step f) is 210-250 minutes, and the baking temperature is 150-170 ℃.
Claims (4)
1. A packaging method of a red LED chip is characterized by comprising the following steps:
a) turning the LED support by 90 degrees, turning the base positioned on the side surface of the LED support upwards, and laying a layer of cellophane on the base;
b) soaking the LED bracket in pure water, placing the side surface of the red LED chip on the upper surface of the glass paper, adsorbing and fixing the side surface of the red LED chip on the upper surface of the glass paper by using the surface tension of water, and adsorbing and fixing the lower surface of the glass paper on the base;
c) taking the LED bracket out of the pure water, and removing the residual water on the surface of the LED bracket;
d) connecting the anode of the red light LED chip with the anode of the LED bracket by using a gold wire or an aluminum wire, and connecting the cathode of the red light LED chip with the cathode of the LED bracket by using the gold wire or the aluminum wire;
e) reversely overturning the LED support by 90 degrees, so that the light emitting surface of the red light LED chip is overturned upwards, and coating and filling epoxy resin glue on the outer side of the red light LED chip;
f) and (3) putting the LED support into an oven for heating, and curing the epoxy resin adhesive to obtain the packaged red light LED chip lamp bead.
2. The method for packaging a red LED chip according to claim 1, wherein: the length of the cellophane in the step a) is 80-100 μm, and the width is 60-80 μm.
3. The method for packaging a red LED chip according to claim 1, wherein: and c) drying the residual water on the surface of the LED support by using an air gun.
4. The method for packaging a red LED chip according to claim 1, wherein: the baking time in the step f) is 210-250 minutes, and the heating temperature is 150-170 ℃.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811587608.3A CN111370550B (en) | 2018-12-25 | 2018-12-25 | Packaging method of red light LED chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811587608.3A CN111370550B (en) | 2018-12-25 | 2018-12-25 | Packaging method of red light LED chip |
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| CN111370550A CN111370550A (en) | 2020-07-03 |
| CN111370550B true CN111370550B (en) | 2021-01-22 |
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| CN114141926A (en) * | 2020-09-03 | 2022-03-04 | 山东浪潮华光光电子股份有限公司 | Packaging method of light emitting diode |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1343004A (en) * | 2000-09-08 | 2002-04-03 | 北京普罗强生半导体有限公司 | Electrically conductive resin feeder for packing semiconductor device |
| CN101231960A (en) * | 2007-01-24 | 2008-07-30 | 贵阳华翔半导体有限公司 | Improvement of semiconductor device packaging technique |
| CN101567412A (en) * | 2009-06-02 | 2009-10-28 | 中山大学 | Encapsulating method of blue-light LED chip |
| WO2015008870A3 (en) * | 2013-07-16 | 2015-03-19 | Kabushiki Kaisha Toshiba | Semiconductor device using a self-assembly method for its manufacturing |
| CN108767092A (en) * | 2018-07-17 | 2018-11-06 | 佛山市国星半导体技术有限公司 | A kind of method and apparatus of batch transfer MicroLED chips |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080149949A1 (en) * | 2006-12-11 | 2008-06-26 | The Regents Of The University Of California | Lead frame for transparent and mirrorless light emitting diodes |
| TWI633679B (en) * | 2006-11-15 | 2018-08-21 | 美國加利福尼亞大學董事會 | Standing transparent mirrorless light emitting diode |
| CN102102862B (en) * | 2010-11-12 | 2012-05-30 | 北京工业大学 | Method for packing micro-volume multi-LED (Light-Emitting Diode) integrated unit |
| CN105140374A (en) * | 2015-08-13 | 2015-12-09 | 山东浪潮华光光电子股份有限公司 | Routing-free LED packaging structure and preparation method therefor |
-
2018
- 2018-12-25 CN CN201811587608.3A patent/CN111370550B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1343004A (en) * | 2000-09-08 | 2002-04-03 | 北京普罗强生半导体有限公司 | Electrically conductive resin feeder for packing semiconductor device |
| CN101231960A (en) * | 2007-01-24 | 2008-07-30 | 贵阳华翔半导体有限公司 | Improvement of semiconductor device packaging technique |
| CN101567412A (en) * | 2009-06-02 | 2009-10-28 | 中山大学 | Encapsulating method of blue-light LED chip |
| WO2015008870A3 (en) * | 2013-07-16 | 2015-03-19 | Kabushiki Kaisha Toshiba | Semiconductor device using a self-assembly method for its manufacturing |
| CN108767092A (en) * | 2018-07-17 | 2018-11-06 | 佛山市国星半导体技术有限公司 | A kind of method and apparatus of batch transfer MicroLED chips |
Non-Patent Citations (2)
| Title |
|---|
| "基于表面张力作用的MEMS自组装及其精度控制技术研究";颜毅林;《CNKI优秀硕士学位论文全文库》;20090131;全文 * |
| "基于表面张力组装配机理及其在微电子封装中的应用";徐敏;《CNKI优秀硕士学位论文全文库》;20050301;全文 * |
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