CN111367365B

CN111367365B - Display module

Info

Publication number: CN111367365B
Application number: CN202010368119.XA
Authority: CN
Inventors: 林宗伟
Original assignee: Xiamen Tianma Microelectronics Co Ltd
Current assignee: Xiamen Tianma Microelectronics Co Ltd
Priority date: 2020-04-30
Filing date: 2020-04-30
Publication date: 2021-12-31
Anticipated expiration: 2040-04-30
Also published as: CN111367365A

Abstract

The invention discloses a display module. The display module according to the embodiment of the invention comprises: the supporting frame is provided with an accommodating space and comprises a side wall part enclosing the accommodating space, and the supporting frame is provided with an accommodating groove; the backlight assembly is arranged in the accommodating space; the display panel is overlapped with the backlight assembly and comprises a display area and a non-display area arranged around the display area, the display area is provided with an identification area, the non-display area is provided with a drive circuit binding area, the orthographic projection of the accommodating groove on the display panel is not overlapped with the drive circuit binding area, and the orthographic projection of the accommodating groove on the display panel is adjacent to the drive circuit binding area and the display area; the fingerprint assembly comprises an emitting module and a receiving module, at least part of the emitting module is accommodated in the accommodating groove, and the receiving module is positioned on one side of the backlight assembly, which faces away from the display panel. According to the display module provided by the embodiment of the invention, the width of the frame can be reduced, and the screen occupation ratio is improved.

Description

Display module

Technical Field

The invention relates to the field of display, in particular to a display module.

Background

With the rapid development of electronic devices, the requirements of users on screen occupation ratio are higher and higher.

Present electronic equipment is like cell-phone, panel computer etc. in order to realize the full screen or be close to comprehensive screen effect, mostly adopts fingerprint technology to realize fingerprint identification under the screen, in fingerprint technology under the side formula screen, need set up the light source that is used for fingerprint identification in the position that corresponds the screen frame, but the light source that sets up fingerprint device under the screen can lead to the screen frame widen, influences the improvement that electronic equipment's screen accounts for the ratio.

Disclosure of Invention

The invention provides a display module which can reduce the width of a frame and improve the screen occupation ratio.

In a first aspect, an embodiment of the present invention provides a display module, including: the supporting frame is provided with an accommodating space and comprises a side wall part enclosing the accommodating space, and the supporting frame is provided with an accommodating groove; the backlight assembly is arranged in the accommodating space; the display panel is overlapped with the backlight assembly and comprises a display area and a non-display area arranged around the display area, the display area is provided with an identification area, the non-display area is provided with a drive circuit binding area, the orthographic projection of the accommodating groove on the display panel is not overlapped with the drive circuit binding area, and the orthographic projection of the accommodating groove on the display panel is adjacent to the drive circuit binding area and the display area; the fingerprint assembly comprises an emitting module and a receiving module, at least part of the emitting module is accommodated in the accommodating groove, and the receiving module is positioned on one side of the backlight assembly, which faces away from the display panel.

According to the display module provided by the embodiment of the invention, the emission module of the fingerprint assembly is accommodated in the accommodating groove of the support frame, the accommodating groove is not overlapped in the orthographic projection of the display panel and the binding area of the drive circuit, and the orthographic projection of the accommodating groove on the display panel is adjacent to the binding area of the drive circuit and the display area, so that the emission module is prevented from occupying the outer area of the support frame, and the frame width of the display module can be reduced.

Drawings

Other features, objects and advantages of the invention will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof, and which are not to scale.

Fig. 1 is a schematic cross-sectional view illustrating a conventional display module;

FIG. 2 is a schematic cross-sectional view of a display module according to a first embodiment of the invention;

FIG. 3 is a schematic top view illustrating a display module according to a first embodiment of the invention;

FIG. 4 shows a schematic cross-sectional structure of one example along line M-M in FIG. 3;

FIG. 5 shows a schematic cross-sectional structure of another example of FIG. 3 along line M-M;

FIG. 6 shows a schematic cross-sectional structure of still another example of FIG. 3 taken along line M-M;

FIG. 7 shows an enlarged schematic view of the support frame of region G of FIG. 3;

FIG. 8 shows a schematic cross-sectional view taken along line N-N of FIG. 7;

FIG. 9 is a schematic top view illustrating a display module according to a second embodiment of the invention;

fig. 10 is a schematic cross-sectional view illustrating a display module according to a third embodiment of the invention.

In the figure:

100-a support frame; 110-a containment space; 120-a sidewall portion; 130-a receiving groove; 140-chamfer groove; 150-bottom; 160-a stop;

200-a backlight assembly; 210-a light guide plate; 220-a light emitting device;

300-a display panel;

400-a fingerprint component; 410-a transmitting module; 411-the transmitting end; 412-an emission surface; 420-a receiving module;

600-a cover plate;

AA-display area; NA-non-display area; an RA-recognition region; BA-drive circuit binding area; OP1 — first opening; OP2 — second opening; OP 3-third opening; SD 1-first side; SD2 — second side.

Detailed Description

Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.

Current display modules (e.g., cell phones) are beginning to use the technology of finger printing under the screen to enhance the user experience. . For the side-edge underscreen fingerprint technology, as shown in fig. 1, fig. 1 shows a schematic cross-sectional structure diagram of a conventional display module. Sensor 1 is located display panel 2's below, and light source 3 is located the carriage 4 outside and is located apron 5 below, and this has increased the length of apron 5, and has increased the frame width that sets up one side of light source 3 in the display module assembly, and the screen that influences the display module assembly accounts for the improvement of comparing.

Therefore, in order to solve the above problems, the present invention provides a display module capable of reducing the width of a frame and increasing the screen area ratio.

For easy understanding, the display module provided by the present invention will be described below with reference to fig. 2 to 10.

Referring to fig. 2 to 4, fig. 2 is a schematic cross-sectional view illustrating a display module according to a first embodiment of the invention, fig. 3 is a schematic top view illustrating the display module according to the first embodiment of the invention, and fig. 4 is a schematic cross-sectional view illustrating an example of the display module along the line M-M in fig. 3.

As shown in fig. 1, an embodiment of the present invention provides a display module, including: a support frame 100, a backlight assembly 200, a display panel 300, and a fingerprint assembly 400.

The support frame 100 has an accommodating space 110, the support frame 100 includes a sidewall 120 enclosing the accommodating space 110, and the support frame 100 has a receiving groove 130. The receiving space 110 may have a substantially cubic shape. The support frame 100 has a support surface, for example, for supporting the display panel 300. The side wall portion 120 is disposed around the accommodation space 110 in a plane parallel to the support surface and extends away from the support surface in a direction perpendicular to the support surface. The receiving groove 130 may be located at the sidewall portion 120. The receiving groove 130 may have a groove inner space. In some embodiments, the support frame 100 may be a metallic material. In other embodiments, the support frame 100 may also be an organic material, such as a black organic glue. In still other embodiments, a portion of the support frame 100 may be a metallic material, and another portion may be an organic material.

The backlight assembly 200 is disposed in the accommodating space 110. The backlight assembly 200 may provide backlight for the display panel 300. The backlight assembly 200 has a light emitting surface facing the display panel 300. The backlight assembly 200 may be a side-Emitting backlight assembly, for example, including a Light guide plate and an LED (Light Emitting Diode) Light source located between the Light guide plate and the sidewall 120, wherein Light emitted from the LED Light source exits to an exit surface through the Light guide plate. The backlight assembly 200 may also be a bottom-emitting backlight assembly, for example, including LED light sources arranged in an array in a plane parallel to the light-emitting surface, and the LED light sources may emit light toward the light-emitting surface.

The display panel 300 is stacked with the backlight assembly 200. The display panel 300 may be supported on a supporting surface of the support frame 100. An optical adhesive may be disposed between the display panel 300 and the backlight assembly 200.

Referring to fig. 3, the display panel 300 includes a display area AA and a non-display area NA surrounding the display area AA. The display area AA has an identification area RA. The identification area RA is multiplexed for display and fingerprint identification. The identification area RA may be disposed adjacent to the non-display area NA. The non-display area NA has a driving circuit binding area BA. The driving circuit bonding area BA may include a bonding connection part of the display panel 300 and an external circuit board. The orthographic projection of the accommodating groove 130 on the display panel 300 is not overlapped with the driving circuit binding area BA, and the orthographic projection of the accommodating groove 130 on the display panel 300 is adjacent to the driving circuit binding area BA and the display area AA. In the direction perpendicular to the display panel 300, the accommodating groove 130 and the driving circuit binding area BA are staggered, so as to prevent the driving circuit binding area BA from blocking the emergent light of the emitting module 410 in the accommodating groove 130.

The display area AA of the display panel 300 may include a plurality of sub-pixels arranged in an array.

Among them, the display panel 300 may be a liquid crystal display panel. The display panel 300 may include an array substrate, a color filter substrate, and a liquid crystal layer between the array substrate and the color filter substrate, which are oppositely disposed. The color film substrate may include color resistance units corresponding to the sub-pixels. The orthographic projection of each sub-pixel on the array substrate is overlapped with the orthographic projection of the color resistance unit on the array substrate. And each sub-pixel realizes colorized display through the color resistance unit of the color film substrate. The color resistance unit may include a first red color resistance unit, a first green color resistance unit, and a first blue color resistance unit respectively disposed corresponding to the first red subpixel, the first green subpixel, and the first blue subpixel.

Referring also to fig. 4, the fingerprint assembly 400 includes a transmitting module 410 and a receiving module 420. At least a portion of the emission module 410 is received in the receiving groove 130. In some embodiments, the transmitting module 410 may be completely accommodated within the accommodating groove 130. In other embodiments, especially in the case that the receiving groove 130 is located on the sidewall 120, since the emission module 410 has a predetermined size, and in order to reduce the thickness of the sidewall 120 in the direction away from the receiving space 110 while satisfying the supporting function and the supporting strength of the supporting frame 100, the material usage of the sidewall 120 is reduced, the weight of the sidewall 120 is reduced, and the area of the non-display area NA is reduced by reducing the orthographic projection area of the sidewall 120 on the display panel 300, the emission module 410 may partially protrude out of the receiving groove 130. The receiving module 420 is located at a side of the backlight assembly 200 facing away from the display panel 300.

The transmitting module 410 is coupled to the receiving module 420, the transmitting module 410 is configured to send a detection signal to the identification area RA, and the receiving module 420 is configured to receive a return signal reflected by an object above the identification area RA and generate identification information of the object. The object may be, for example, a finger print of the user, and the identification information may be, for example, print information. In some embodiments, the emitting module 410 is an infrared light emitting unit, for example, the emitting module 410 is an infrared light LED. The receiving module 420 is an infrared light sensitive element, for example, the receiving module 420 is an infrared light sensitive sensor. The detection signal may be infrared light.

According to the display module of the embodiment of the invention, the emission module 410 of the fingerprint assembly 400 is accommodated in the accommodating groove 130 of the supporting frame 100, the orthographic projection of the accommodating groove 130 on the display panel 300 is not overlapped with the driver circuit binding area BA, and the orthographic projection of the accommodating groove 130 on the display panel 300 is adjacent to the driver circuit binding area BA and the display area NA, so that the emission module 410 is prevented from occupying the outer area of the supporting frame 100, and the frame width of the display module can be reduced.

Referring to fig. 4 and 5 together, fig. 5 is a schematic cross-sectional view of another example of the structure of fig. 3 taken along line M-M.

In some optional embodiments, the opening of the receiving slot 130 is at least disposed toward the identification area RA, and the transmitting module 410 has a transmitting end 411, and the transmitting end 411 is disposed toward the identification area RA. The emitting module 410 emits light for fingerprint recognition through the emitting terminal 411. The light emitted from the emitting end 411 may be in a fan shape, such that the light emitted from the emitting end 411 at least covers the identification area RA.

The emitting end 411 includes an emitting surface 412. The emitting surface 412 may be a light emitting surface. The direction perpendicular to the emitting surface 412 is disposed toward the identification area RA. The emission surface 412 is disposed at an angle α with respect to a surface of the display panel 300 facing the backlight assembly 200, and the emission surface 412 is disposed at least facing the accommodating space 110. That is, the emission surface 412 is disposed obliquely to the receiving space 110 with respect to the display panel 300. Wherein the included angle alpha ranges from 5 degrees to 45 degrees. Fig. 5 shows an embodiment with an angle alpha of 45 deg..

In some alternative embodiments, the receiving groove 130 has a first opening OP1 facing the receiving space 110 and a second opening OP2 facing the display panel 300, and the first opening OP1 is communicated with the second opening OP 2. In some embodiments, the emitting module 410 may be completely disposed in the receiving groove 130, and may emit light through the first opening OP1 and/or the second opening OP 2. In other embodiments, the emitting module 410 may be partially disposed in the receiving groove 130 and protrude outward through the first opening OP1, so that the design size requirements of the emitting module 410 and the supporting frame 100 can be met at the same time. That is, in the case where the emission module 410 has a predetermined size to meet the requirements of the size of the emission surface 412 and the emission power, and the support frame 100 has a thickness that is thinner in the direction away from the receiving space 110 in the sidewall part 120, the emission module 410 may protrude outward through the first opening OP 1.

Referring to fig. 6, fig. 6 is a schematic cross-sectional view of another example of the structure of fig. 3 taken along the line M-M.

In other optional embodiments, the receiving groove 130 further has a third opening OP3 facing away from the receiving space 110, and the first opening OP1, the second opening OP2 and the third opening OP3 are communicated with each other. In some embodiments, the emitting module 410 may be completely disposed in the receiving groove 130, and may emit light through the first opening OP1 and/or the second opening OP 2. In other embodiments, the emission module 410 may be partially disposed in the receiving groove 130 and protrude outward through the first opening OP1 and/or the third opening OP3, so that the design size requirements of the emission module 410 and the support frame 100 can be met at the same time. Since the emission module 410 can protrude outward through the first and third openings OP1 and OP3 in a direction parallel to the display panel 300, in the case where a predetermined size is satisfied between the emission module 410 and the backlight assembly 200 in the receiving space 110, the thickness of the side wall part 120 in a direction away from the receiving space 110 can be further reduced, and thus the area of the non-display area NA can be reduced. Optionally, the distance between the emission module 410 and the backlight assembly 200 is 0.05mm to 0.3mm, for example, the distance between the emission module 410 and the backlight assembly 200 is 0.1 mm. The maximum distance of the portion of the emission module 410 protruding outward from the third opening OP3 is 0.05mm to 0.3mm, for example, the maximum distance of the portion of the emission module 410 protruding outward from the third opening OP3 is 0.14 mm.

Referring to fig. 7 and 8 together, fig. 7 is an enlarged schematic view of the supporting frame in the region G of fig. 3, and fig. 8 is a schematic view of a cross-sectional structure of fig. 7 along the line N-N.

In some alternative embodiments, the side of the support frame 100 facing away from the accommodating space 110 has a chamfered groove 140. The chamfered groove 140 is open at least toward the display panel 300 and the chamfered groove 140 is open at least away from the accommodating space 110. The chamfer groove 140 is disposed adjacent to the receiving groove 130 and is communicated with the receiving groove 130. The plane of the bottom surface of the chamfered groove 140 is disposed at an angle β with respect to the surface of the display panel 300 facing the backlight assembly 200, and the angle β ranges from 5 ° to 45 °. Included angle β may be the same as included angle α. Under the condition that the emitting module 410 has the flexible circuit board, the flexible circuit board of the emitting module 410 is located on a side surface of the emitting module 410 facing away from the accommodating space 110, and the flexible circuit board of the emitting module 410 is perpendicular to the emitting surface 412, and when the included angle β is the same as the included angle α, the flexible circuit board of the emitting module 410 can be disposed in the chamfered groove 140 and attached to the bottom surface of the chamfered groove 140, so that the flexible circuit board of the emitting module 410 can be better accommodated and fixed. One receiving groove 130 may be correspondingly provided with two chamfered grooves 140, and the two chamfered grooves 140 may be oppositely disposed at two sides of the receiving groove 130, so as to be capable of adapting to flexible circuit boards of the radiation modules 410 with different sizes.

Referring to fig. 9, fig. 9 is a schematic top view illustrating a display module according to a second embodiment of the invention.

In some optional embodiments, the number of the receiving grooves 130 is plural, for example, the number of the receiving grooves 130 is two. Each receiving groove 130 may be provided with one emitting module 410. The plurality of emission modules 410 can emit light rays to the identification area RA from different directions to better present the texture of the fingerprint, making the fingerprint identification more accurate.

The driving circuit bonding area BA has opposite first and second sides SD1 and SD2 in a direction perpendicular to the driving circuit bonding area BA toward the display area AA. A distance between the first side SD1 and the second side SD2 may be less than a width of the display area AA in a direction perpendicular to the direction toward the driving circuit bonding area BA. The driving circuit bonding area BA thus has a gap between the first side SD1 and/or the second side SD2 and the display area AA.

The orthographic projection of a portion of the receiving cavity 130 in the plurality of receiving cavities 130 on the display panel 300 is located on the first side SD1 of the driving circuit bonding area BA, and the orthographic projection of a portion of the receiving cavity 130 in the plurality of receiving cavities 130 on the display panel 300 is located on the second side SD2 of the driving circuit bonding area BA. In the embodiment that the number of the accommodating grooves 130 is two and the driving circuit binding area BA has notches between the first side SD1 and the second side SD2 and the display area AA, the number of the notches is two, and the two notches are respectively provided with one corresponding accommodating groove 130, so that the emitting module 410 arranged in the accommodating groove 130 makes full use of the occupied space of the notches, thereby avoiding widening the frame of the display module caused by correspondingly arranging the emitting module 410 in the driving circuit binding area BA back to the display area AA, and further improving the screen occupation ratio of the display module.

Referring to fig. 10, fig. 10 is a schematic cross-sectional view illustrating a display module according to a third embodiment of the invention.

As shown in fig. 10, in some alternative embodiments, the supporting frame 100 further includes a bottom portion 150 and a stopping portion 160 connected to the sidewall portion 120 and jointly enclosing the accommodating space 110. The stopper 160 is located on a side of the sidewall 120 facing the display panel 300. The stopping portion 160 may extend from the sidewall portion 120 to the area where the accommodating space 110 is located. The supporting surface of the supporting frame 100 may be located on a surface of the stopper portion 160 facing away from the bottom portion 150. The bottom portion 150 is located on a side of the sidewall portion 120 facing away from the display panel 300. The backlight assembly 200 may be disposed on the bottom 150. The display panel 300 may be supported on the stopper 160. The receiving groove 130 penetrates the sidewall 120 and the stopper 160. In some embodiments, the stopping portion 160 may have a through hole, so that the light emitted from the emitting module 410 disposed in the receiving groove 130 can be transmitted to the identification area RA through the through hole of the stopping portion 160.

In embodiments including the bottom portion 150, the receiving module 420 may be disposed between the bottom portion 150 and the backlight assembly 200, or the receiving module 420 may be disposed at a side of the bottom portion 150 facing away from the backlight assembly 200, and the bottom portion 150 may have a through hole (not shown) to allow light to pass through the through hole to reach the receiving module 420.

In some optional embodiments, the display module further comprises a circuit board. The circuit board may be a flexible circuit board. The circuit board is connected to the driving circuit bonding area BA of the display panel 300 and extends at least away from the display panel 300. The orthographic projection of the circuit board on the display panel 300 at least partially overlaps the orthographic projection of the support frame 100 on the display panel 300. The circuit board may be bent around the sidewall portion 120 of the support frame 100 to a side of the backlight assembly 200 facing away from the display panel 300. The orthographic projection of the accommodating groove 130 on the display panel 300 and the orthographic projection of the circuit board on the display panel 300 do not overlap. In the direction perpendicular to the display panel 300, the accommodating groove 130 and the circuit board are disposed in a staggered manner, so as to prevent the circuit board from shielding the light emitted from the emitting module 410 in the accommodating groove 130.

As shown in fig. 10, in some alternative embodiments, the backlight assembly 200 includes a light guide plate 210 and a light emitting device 220. The light emitting device 220 is located between the light guide plate 210 and the sidewall 120. The light emitting surface of the light emitting device 220 faces the light guide plate 210 to provide backlight for the display panel 300 through the light guide plate 210. The light guide plate 210 covers the display area AA in the front projection of the display panel 300. The front projection of the light emitting device 220 on the display panel 300 is located in the non-display area NA. The light emitting device 220 is located on a side of the light guide plate 210 facing the receiving groove 130. The emission module 410 in the receiving groove 130 may be disposed adjacent to the light emitting device 220.

The backlight assembly 200 may further include a reflective sheet and a diffusion sheet (not shown), and the reflective sheet may be positioned between the light guide plate 210 and the bottom 150 and used to reflect light emitted from the light emitting device 220 and emitted through the light guide plate 210 to the display panel 300. The diffusion sheet is located between the light guide plate 210 and the display panel 300, and serves to diffuse the light emitted toward the display panel 300 through the light guide plate 210 and to make the emitted light more uniformly distributed.

As shown in fig. 10, in some alternative embodiments, the display module further includes a cover plate 600, the cover plate 600 is located on a side of the display panel 300 facing away from the backlight assembly 200, and an orthogonal projection of the emission module 410 on the cover plate 600 at least partially overlaps an orthogonal projection of the support frame 100 on the cover plate 600. The cover plate 600 covers the display panel 300 and protects the display panel 300. In embodiments including the cover 600, the object may be positioned on the cover 600 and correspond to the recognition area RA of the display panel 300. The display module provided by the embodiment of the invention can avoid the additional increase of the size of the cover plate 600 for arranging the transmitting module 410, thereby improving the screen occupation ratio of the display module.

In accordance with the above-described embodiments of the present invention, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A display module, comprising:

the supporting frame is provided with an accommodating space, the supporting frame comprises a side wall part enclosing the accommodating space, and an accommodating groove is formed in the supporting frame;

the backlight assembly is arranged in the accommodating space;

the display panel is overlapped with the backlight assembly and comprises a display area and a non-display area arranged around the display area, the display area is provided with an identification area, the non-display area is provided with a drive circuit binding area, the orthographic projection of the accommodating groove on the display panel is not overlapped with the drive circuit binding area, and the orthographic projection of the accommodating groove on the display panel is adjacent to the drive circuit binding area and the display area;

the fingerprint assembly comprises an emitting module and a receiving module, at least part of the emitting module is accommodated in the accommodating groove, and the receiving module is positioned on one side of the backlight assembly, which faces away from the display panel;

one side, back to the accommodating space, of the support frame is provided with a chamfer groove, the chamfer groove at least faces the opening of the display panel and at least backs to the opening of the accommodating space, and the chamfer groove is adjacent to the accommodating groove and communicated with the accommodating groove;

the supporting frame further comprises a bottom part and a stopping part, wherein the bottom part and the stopping part are connected with the side wall part and jointly enclose the accommodating space, the stopping part is positioned on one side, facing the display panel, of the side wall part, the bottom part is positioned on one side, facing away from the display panel, of the side wall part, the display panel is supported on the stopping part, and the accommodating groove penetrates through the side wall part and the stopping part; the stopping part is provided with a through hole, and the light emitted by the emitting module can be transmitted to the identification area through the through hole.

2. The display module assembly according to claim 1, wherein the opening of the receiving cavity is at least disposed toward the identification area, and the transmitting module has a transmitting end disposed toward the identification area.

3. The display module according to claim 2, wherein the emission end comprises an emission surface, the emission surface is disposed at an angle relative to a surface of the display panel facing the backlight assembly, and the emission surface is disposed at least facing the accommodating space, and the angle is in a range of 5 ° to 45 °.

4. The display module assembly according to claim 1, wherein the receiving cavity has a first opening facing the receiving space and a second opening facing the display panel, and the first opening and the second opening are connected.

5. The display module according to claim 4, wherein the receiving cavity further has a third opening facing away from the receiving space, and the first opening, the second opening and the third opening are connected.

6. The display module according to claim 1, wherein the number of the receiving slots is plural, and in a direction perpendicular to the driving circuit bonding area and toward the display area, the driving circuit bonding area has a first side and a second side opposite to each other, an orthogonal projection of a portion of the receiving slots in the plurality of receiving slots on the display panel is located on the first side of the driving circuit bonding area, and an orthogonal projection of a portion of the receiving slots in the plurality of receiving slots on the display panel is located on the second side of the driving circuit bonding area.

7. The display module assembly according to claim 1, further comprising a circuit board connected to the driving circuit bonding region of the display panel and extending away from the display panel, wherein an orthogonal projection of the circuit board on the display panel at least partially overlaps an orthogonal projection of the supporting frame on the display panel, and an orthogonal projection of the accommodating groove on the display panel does not overlap an orthogonal projection of the circuit board on the display panel.

8. The display module according to claim 1, wherein the backlight assembly comprises a light guide plate and a light emitting device, the light emitting device is located between the light guide plate and the sidewall portion, the orthographic projection of the light guide plate on the display panel covers the display area, the orthographic projection of the light emitting device on the display panel is located in the non-display area, and the light emitting device is located on a side of the light guide plate facing the accommodating groove.

9. The display module of claim 1, wherein the emitting module is an infrared light emitting unit and the receiving module is an infrared light sensing device.

10. The display module according to claim 1, further comprising a cover plate disposed on a side of the display panel facing away from the backlight assembly, wherein an orthographic projection of the emission module on the cover plate at least partially overlaps with an orthographic projection of the support frame on the cover plate.

11. The display module of claim 1, wherein the transmitter module is coupled to the receiver module, the transmitter module is configured to send a detection signal to the identification area, and the receiver module is configured to receive a return signal reflected by an object above the identification area and generate identification information of the object.