CN111367124B - 配向膜转印版以及配向膜制造方法 - Google Patents

配向膜转印版以及配向膜制造方法 Download PDF

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CN111367124B
CN111367124B CN202010088015.3A CN202010088015A CN111367124B CN 111367124 B CN111367124 B CN 111367124B CN 202010088015 A CN202010088015 A CN 202010088015A CN 111367124 B CN111367124 B CN 111367124B
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alignment film
substrate
transfer printing
printing plate
base plate
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CN111367124A (zh
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吴咏波
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Wuhan China Star Optoelectronics Technology Co Ltd
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Priority to US15/733,071 priority patent/US11815766B2/en
Priority to PCT/CN2020/082951 priority patent/WO2021159597A1/zh
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    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
    • G02F1/01Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour 
    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B30PRESSES
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    • B30B15/06Platens or press rams
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B41PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41NPRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
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    • BPERFORMING OPERATIONS; TRANSPORTING
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B44DECORATIVE ARTS
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    • G02F1/00Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
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    • G02F1/13Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour  based on liquid crystals, e.g. single liquid crystal display cells
    • G02F1/133Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
    • G02F1/13306Circuit arrangements or driving methods for the control of single liquid crystal cells
    • G02F1/13312Circuits comprising photodetectors for purposes other than feedback
    • GPHYSICS
    • G09EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
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    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1218Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or structure of the substrate
    • HELECTRICITY
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    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/12Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
    • H01L27/1214Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
    • H01L27/1259Multistep manufacturing methods
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    • H10K50/80Constructional details
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Abstract

本申请提供一种配向膜转印版,其用于防止配向膜材料在盲孔中堆积,所述配向膜转印版包括基板、设置于基板上的第一网点和设置于所述第一网点周围的多个第二网点,所述第二网点在垂直于所述基板表面方向上的高度小于或者等于所述第一网点在垂直于所述基板表面方向上的高度,所述第一网点远离所述基板的一端具有阻挡部,所述第二网点远离所述基板的端面面积小于所述阻挡部远离所述基板的端面面积。

Description

配向膜转印版以及配向膜制造方法
技术领域
本申请涉及显示领域,尤其涉及一种配向膜转印版以及配向膜制造方法。
背景技术
为了实现全面屏显示,盲孔屏被开发出来。所谓的盲孔屏是指在液晶显示装置的背光层上开孔,将摄像头设置于液晶显示装置的保护盖板以及液晶显示面板下方。在盲孔屏中,由于液晶显示面板与盲孔对应的位置形成有配向膜,配向膜导致光穿透率较差,影响摄像头的成像效果,并且导致盲孔处的外观较差。
发明内容
有鉴于此,本申请目的在于提供一种能够提高盲孔处的光穿透率,并且使盲孔处的外观优良的配向膜转印版以及配向膜制造方法。
本申请提供一种配向膜转印版,其用于防止配向膜材料在盲孔中堆积,所述配向膜转印版包括基板、设置于基板上的第一网点和设置于所述第一网点周围的多个第二网点,所述第二网点在垂直于所述基板表面方向上的高度小于或者等于所述第一网点在垂直于所述基板表面方向上的高度,所述第一网点远离所述基板的一端具有阻挡部,所述第二网点远离所述基板的端面面积小于所述阻挡部远离所述基板的端面面积。
在一实施方式中,所述第一网点靠近所述基板的端面面积大于所述阻挡部远离所述基板的端面面积。
在一实施方式中,所述第一网点靠近所述基板的端面面积小于或者等于所述阻挡部远离所述基板的端面面积。
在一实施方式中,所述第一网点包括与所述阻挡部连接的缩进部,所述缩进部的横截面积沿所述基板朝向所述阻挡部的方向逐渐缩小。
在一实施方式中,所述阻挡部远离所述基板的端面形状为多边形。
在一实施方式中,所述第二网点远离所述基板的端面形状为多边形。
在一实施方式中,所述第一网点和所述第二网点的材料为具有弹性的感光树脂材料。
本申请还提供一种配向膜制造方法,包括以下步骤:
提供一如上任一项所述的配向膜转印版,在配向膜转印版具有所述第一网点和第二网点的表面上涂覆配向膜材料;
提供一配向基板,通过所述配向膜转印版将所述配向膜材料转印至配向基板上,所述配向基板上开设有盲孔,所述阻挡部用于阻挡所述配向膜材料进入所述盲孔;以及
对所述配向膜材料进行固化处理,形成配向膜。
在一实施方式中,所述阻挡部用于嵌入所述盲孔中。
在一实施方式中,所述阻挡部用于覆盖所述盲孔。
相较于现有技术,本申请的配向膜转印版以及配向膜制造方法通过在对应于液晶显示面板盲孔的网点上设置阻挡部。在转印配向膜材料以形成配向膜时,利用阻挡部阻挡配向膜材料进入盲孔,可以防止配向膜在盲孔中堆积,提高盲孔处的光透过率,从而获得更好的感光效果,同时提高产品的美观性。
本申请的配向膜转印版以及配向膜制造方法通过在对应于液晶显示面板盲孔的网点上设置阻挡部。在转印配向膜材料以形成配向膜时,利用阻挡部阻挡配向膜材料进入盲孔,可以防止配向膜在盲孔中堆积,提高盲孔处的光透过率,从而获得更好的感光效果,同时提高产品的美观性。
附图说明
为了更清楚地说明本申请中的技术方案,下面将对实施方式描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施方式,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。
图1为利用本申请的配向膜转印版制造的液晶显示装置的剖面示意图。
图2为图1的液晶显示装置的局部放大图。
图3为本申请第二实施方式的配向膜转印版的平面示意图。
图4为在图3的配向膜转印版上涂覆配向膜材料的示意图。
图5(a)-图5(c)为本申请第三实施方式的配向膜制造方法的流程图。
图6(a)-图6(c)为本申请另一实施方式的配向膜制造方法的流程图。
具体实施方式
下面将结合本申请实施方式中的附图,对本申请中的技术方案进行清楚、完整地描述。显然,所描述的实施方式仅仅是本申请一部分实施方式,而不是全部的实施方式。基于本申请中的实施方式,本领域技术人员在没有做出创造性劳动前提下所获得的所有其他实施方式,都属于本申请保护的范围。
请参考图1和图2,申请第一实施方式的液晶显示装置1包括液晶显示面板10、背光模组20以及感光元件30。背光模组20设置于液晶显示面板10一侧。背光模组20中开设有一收容部20a。感光元件30设置于收容部20a。收容部20a可以为开设于背光模组20中的通孔。感光元件30包括但不限于前置摄像头、人脸识别感光元件、手势传感器等。
液晶显示装置1还包括设置于显示面板10与背光模组20之间的第一偏光片(图未示)和设置于显示面板10远离背光模组20的第二偏光片(图未示)。可以理解,液晶显示装置1还包括其他液晶显示装置的常用部件,例如盖板玻璃、胶框等。
液晶显示面板10包括第一基板11、第二基板12以及位于第一基板11与第二基板12之间的液晶分子13。第一基板11包括第一衬底基板111、设置于第一衬底基板111上的第一功能膜层112以及设置于第一功能膜层112上的第一配向膜113。第一功能膜层112中开设有第一开口112a。第一配向膜113中开设有第二开口113a。第一开口112a与第二开口113a相连通。例如,第一开口112a与第二开口113a同轴设置。第一开口112a和第二开口113a与感光元件30相对应,用于供光进入感光元件30。在本申请一实施方式中,第一基板11可以为阵列基板。第一功能膜层112包括薄膜晶体管层。第一功能膜层112还可以包括绝缘层、钝化层以及平坦化层等。第一开口112a为贯穿第一功能膜层112的通孔,第一衬底基板111从第一开口112a中暴露出来。在本申请的其他实施方式中,第一开口112a还可以为开设于第一功能膜层112中的盲孔。例如,在本申请一实施方式中,薄膜晶体管层包括依次层叠的遮光层、缓冲层、半导体层、栅极绝缘层、栅极层、层间绝缘层、源漏极层等。第一开口112a贯穿至半导体层,缓冲层从第一开口112a中暴露出来。
第二基板12包括第二衬底基板121、设置于第二衬底基板121上的第二功能膜层122以及设置于第二功能膜层122上的第二配向膜123。第二功能膜层122中开设有第三开口122a。第二配向膜123中开设有第四开口123a。第三开口122a与第四开口123a相连通。例如,第三开口122a与第四开口123a同轴设置。第三开口122a和第四开口123a与第一开口112a、第二开口113以及感光元件30相对应,用于供光进入感光元件30。在本申请一实施方式中,第二基板12可以为彩膜基板,第二功能膜层122包括彩膜层和黑矩阵。在本申请一实施方式中,第三开口122a贯穿第二功能膜层112。第二衬底基板122从第三开口122a中暴露出。在本申请的其他实施方式中,第三开口122a还可以为开设于第二功能膜层122中的盲孔。
请同时参考图1至图4,本申请第二实施方式的配向膜转印版1可以用于制造盲孔屏类型的液晶显示装置100(如图1和图2所示)。配向膜转印版1用于防止配向膜(例如,第一配向膜113和第二配向膜114)在盲孔(例如,第一开口112a和第三开口122a)中堆积。这里的盲孔是指相对于液晶显示装置100而言的盲孔。
也可被称为凸版、软版、柱皮。配向膜转印版1包括基板101、设置于基板101上的第一网点102和设置于所述第一网点102周围的第一网点102的多个第二网点103。第一网点102和第二网点103的材料可以为具有弹性的感光树脂材料。在一实施方式中,第一网点102和第二网点103的材料可以为日本旭化成开发的感光性树脂(英文名称:AsahikaseiPhotosensitiveResin,缩写:APR)。即,配向膜转印版1可以为APR版。
在转印配向膜材料200以形成配向膜时,配向膜材料200分布于第一网点102与第二网点103之间。第一网点102和第二网点103可以形成为柱状,例如是圆柱或者棱柱等。第二网点103在垂直于基板101表面方向上的高度小于第一网点102在垂直于基板101表面方向上的高度。第二网点103远离基板101的端面面积小于阻挡部1021远离基板101的端面面积。通过将第二网点103的端面面积小于设置为阻挡部1021远离基板101的端面面积,可以使配向膜材料200在第一功能膜层112上均匀分布以形成均匀的第一配向膜113。第一网点102远离基板101的一端具有阻挡部1021。阻挡部1021用于阻挡配向膜材料200进入盲孔。第一网点102靠近基板101的端面面积大于阻挡部1021远离102的端面面积。
阻挡部1021远离基板101的端面形状可以为多边形。第二网点103远离101基板的端面形状也可以为多边形。相较于圆形的端面,多边形端面更有利于配向膜材料的沿着多边形的边进行扩散,从而均匀分布。
下面以第一基板11为例子,对配向膜转印版1的结构和使用进行说明。可以理解,配向膜转印版1也可以用于形成第二基板12的第二配向膜123。
请参考图5(a)~图5(c),在本申请一实施方式中,阻挡部1021可以形成为在转印配向膜材料200以形成第一配向膜113时,用于嵌入第一开口112a中。从而在转印配向膜材料200时,配向膜材料200不会进入第一开口112a。当转印完成之后,在第一配向膜113中形成与第一开口112a连通的第二开口113a。
阻挡部1021形成为与第一基板11上的第一开口112a对应的形状。所谓对应的形状可以是相同形状也可以是大致相同的形状。例如,当第一开口112a形成为圆柱状的通孔时,阻挡部1021也形成为俯视时呈圆形与第一开口112a相匹配的圆柱状。并且阻挡部1021的面积与第一开口112a相同或略小于第一开口112a。即,阻挡部1021与第一开口112a直径与第一开口112a相同或略小于第一开口112a。由于APR版的材料包括弹性树脂,阻挡部1021在转印时受到向下的压力会稍稍扩张变形。当阻挡部1021的直径相同或略小于第一开口112a时,在进行配向膜材料转印时,阻挡部1021可以与第一开口112a紧密嵌合。在本申请其他实施方式中,当第一开口112a为俯视时呈圆形的开口时,阻挡部1021也形成为俯视时呈多边形,例如六边形、八边形或者十边形。并且多边形的中心到端点的距离等于或者略小于第一开口112a的直径。同样地,在进行配向膜材料转印时,阻挡部1021在转印时受到向下的压力会稍稍扩张变形,可以与第一开口112a紧密嵌合。
请参考图6(a)~图6(c),在本申请另一实施方式中,阻挡部1021可以形成为在转印配向膜材料200以形成配向膜113时,位于第一开口112a上方并覆盖第一开口112a。从而在转印配向膜材料200时,配向膜材料200不会进入第一开口112a。当转印完成之后,在第一配向膜113中形成与第一开口112a连通的第二开口113a。
第二网点103在垂直于基板101表面方向上的高度小于或者等于第一网点102在垂直于基板101表面方向上的高度。第二网点103远离基板101的端面面积小于阻挡部1021远离基板101的端面面积。第一网点103靠近基板101的端面面积小于或者等于阻挡部1021远离基板101的端面面积。此外,第一网点102还包括与阻挡部1021连接的缩进部1022。缩进部1022的横截面积沿基板101朝向阻挡部1021的方向逐渐缩小。阻挡部1021远离基板101的端面形状可以为多边形。第二网点103远离101基板的端面形状也可以为多边形。
在本实施方式中,并不限定阻挡部1021与第一开口112a的形状。只要是在转印时,阻挡部1021能够完全覆盖第一开口112a即可。例如,当第一开口112a为俯视时呈圆形的开口时,阻挡部1021也形成为俯视时呈圆形。并且阻挡部1021的面积大于第一开口112a。即,阻挡部1021与第一开口112a直径大于第一开口112a。
本申请第三实施方式还提供一种配向膜制造方法,其使用如上所述的配向膜转印版。所述配向膜制造方法包括以下步骤:
S1:请参考图5(a),提供一配向膜转印版1,在配向膜转印版1具有第一网点102和第二网点103的表面上涂覆配向膜材料200。
配向膜材料200例如是高分子材料,而高分子材料例如是聚酰亚胺(polyimide)。如上述实施方式所述,配向膜转印版1用于防止配向膜在盲孔中堆积,配向膜转印版1包括基板101和设置于基板101上的第一网点102,第一网点102远离基板101的一端具有阻挡部1021。
S2:请参考图5(b),提供一配向基板11a,通过配向膜转印版1将配向膜材料200转印至配向基板11a上,配向基板11a上开设有盲孔。阻挡部1021用于阻挡配向膜材料200进入所述盲孔。
此处,还是以第一基板11为例子,对配向膜转印版1的结构和使用进行说明。配向基板11a包括第一衬底基板111、设置于第一衬底基板111上的第一功能膜层112。第一功能膜层112中开设有第一开口112a。第一开口112a即为所述盲孔。在转印配向膜材料200至配向基板11a上时,位于网点之间的配向膜材料200被挤压至配向基板11a上,并在配向基板11a上扩散,形成均匀的膜层。由于阻挡部1021的存在,配向膜材料200不能进入第一开口112a。在移除配向膜转印版1之后,在第一配向膜113中形成第二开口113a。第一开口112a与第二开口113a相连通。在一个实施方式中,通过将第二网点103的端面面积小于设置为阻挡部1021远离基板101的端面面积,可以使配向膜材料200在第一功能膜层112上均匀分布以形成均匀的第一配向膜113。阻挡部1021远离基板101的端面形状可以为多边形。第二网点103远离101基板的端面也形成为多边形。相较于圆形的端面,多边形端面更有利于配向膜材料的沿着多边形的边进行扩散,从而均匀分布。
可以理解,配向基板11a可以是彩膜基板也可以是阵列基板。在另一个实施方式中,配向膜转印版1的结构也可以如图6(a)所示,在此不再赘述。阻挡部1021用于覆盖盲孔。
S3:移除配向膜转印版1,对配向膜材料200进行固化处理,形成配向膜。使配向膜材料固化的方法例如是热固化(thermal curing)法或紫外光固化(ultravioletcuring)法。
本申请的配向膜转印版以及配向膜制造方法通过在对应于液晶显示面板盲孔的网点上设置阻挡部。在转印配向膜材料以形成配向膜时,利用阻挡部阻挡配向膜材料进入盲孔,可以防止配向膜在盲孔中堆积,提高盲孔处的光透过率,从而获得更好的感光效果,同时提高产品的美观性。
以上对本申请实施方式提供了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施方式的说明只是用于帮助理解本申请。同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。

Claims (8)

1.一种配向膜转印版,其特征在于,用于防止配向膜材料在盲孔中堆积,所述配向膜转印版包括基板、设置于基板上的第一网点和设置于所述第一网点周围的多个第二网点,所述第二网点在垂直于所述基板表面方向上的高度等于所述第一网点在垂直于所述基板表面方向上的高度,所述第一网点远离所述基板的一端具有阻挡部,所述第二网点远离所述基板的端面面积小于所述阻挡部远离所述基板的端面面积,所述阻挡部远离所述基板的端面面积大于所述盲孔面积。
2.如权利要求1所述的配向膜转印版,其特征在于,所述第一网点靠近所述基板的端面面积小于或者等于所述阻挡部远离所述基板的端面面积。
3.如权利要求1所述的配向膜转印版,其特征在于,所述第一网点包括与所述阻挡部连接的缩进部,所述缩进部的横截面积沿所述基板朝向所述阻挡部的方向逐渐缩小。
4.如权利要求1所述的配向膜转印版,其特征在于,所述阻挡部远离所述基板的端面形状为多边形。
5.如权利要求1所述的配向膜转印版,其特征在于,所述第二网点远离所述基板的端面形状为多边形。
6.如权利要求4或5所述的配向膜转印版,其特征在于,所述第一网点和所述第二网点的材料为具有弹性的感光树脂材料。
7.一种配向膜制造方法,其特征在于,其包括以下步骤:
提供一如权利要求1至5任一项所述的配向膜转印版,在配向膜转印版具有所述第一网点和第二网点的表面上涂覆配向膜材料;
提供一配向基板,通过所述配向膜转印版将所述配向膜材料转印至配向基板上,所述配向基板上开设有盲孔,所述阻挡部用于阻挡所述配向膜材料进入所述盲孔;以及
对所述配向膜材料进行固化处理,形成配向膜。
8.如权利要求7所述的配向膜制造方法,其特征在于,所述阻挡部用于覆盖所述盲孔。
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