CN111363358A - Oriented high-thermal-conductivity interface material and preparation method thereof - Google Patents
Oriented high-thermal-conductivity interface material and preparation method thereof Download PDFInfo
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- CN111363358A CN111363358A CN202010182448.5A CN202010182448A CN111363358A CN 111363358 A CN111363358 A CN 111363358A CN 202010182448 A CN202010182448 A CN 202010182448A CN 111363358 A CN111363358 A CN 111363358A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/04—Reinforcing macromolecular compounds with loose or coherent fibrous material
- C08J5/0405—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
- C08J5/042—Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with carbon fibres
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2383/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2383/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
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Abstract
The invention discloses an oriented high-thermal-conductivity interface material which is composed of 10-90 parts of adhesive resin and 10-90 parts of long fiber heat-conducting material. The preparation method comprises the following steps: and regularly arranging the long fiber materials in a shell with a preset shape, curing and molding the fiber materials through adhesive resin to obtain a block, and cutting the block to a required thickness as required to obtain the flaky high-thermal-conductivity oriented interface material. The interface material prepared by the formula and the preparation method has ultra-high thermal conductivity, and the thermal conductivity coefficient can reach 80W/(m.k) or even higher.
Description
Technical Field
The invention belongs to the technical field of heat conduction materials, and particularly relates to an oriented high-heat-conduction interface material and a preparation method thereof.
Background
With the rapid development of electronic technology, electronic communication is entering the 5G era, high frequency introduction, hardware component upgrading and internet equipment and antenna number increase in multiples, and meanwhile, as the 5G adopts Massive operation and Massive MIMO technology, the power consumption of the 5G base station is remarkably improved, and the heat productivity is rapidly increased. The conventional anisotropic thermal conductive silicone rubber sheet (thermal conductive pad) has a thermal conductivity of 1-10W/m.K, and cannot meet the development requirements of current and future electronic communications. Conducting heat quickly and efficiently to the outside of the device is becoming a developing bottleneck, which directly impacts product life, operating speed, performance, and user experience.
Disclosure of Invention
Aiming at the problems in the prior art, the invention aims to provide an oriented high-thermal-conductivity interface material and a preparation method thereof.
The invention is realized by the following technical scheme:
the oriented high-thermal-conductivity interface material is characterized by comprising 10-90 parts of adhesive resin and 10-90 parts of long fiber heat-conducting material.
The oriented high-thermal-conductivity interface material is characterized in that the adhesive resin is a curable resin or a thermoplastic resin, the curable resin is any one of liquid silicone rubber, epoxy resin and polyurethane, and the thermoplastic resin is any one of polyethylene, polypropylene and thermoplastic elastomer.
The oriented high-thermal-conductivity interface material is characterized in that the adhesive resin is liquid silicone rubber.
The oriented high-thermal-conductivity interface material is characterized in that the long fiber thermal-conductivity material is a carbon fiber wire, the length of the carbon fiber wire is 10-1000mm, and the thermal conductivity coefficient is 300-1100W/(m.k).
The oriented high-thermal-conductivity interface material is characterized in that the carbon fiber filaments are pitch-based carbon fiber filaments.
The preparation method of the oriented high-thermal-conductivity interface material is characterized by comprising the following steps of: firstly, orderly arranging long fiber heat-conducting materials in a square shell container, adding adhesive resin under the condition that the vacuum degree is more than or equal to 0.098Mpa, pressing down an upper cover plate on the square shell container after the adhesive is vertically added, shaping the long fiber heat-conducting materials and the adhesive, removing vacuum, curing to obtain a block body, and cutting into required thickness according to the requirement to obtain the sheet-shaped oriented high heat-conducting interface material.
The preparation method of the oriented high-thermal-conductivity interface material is characterized in that the square shell container is a container body with an opening at the upper part, an upper cover plate is arranged on the container body, and the outer wall of the upper cover plate is matched with the inner wall of the container body.
The preparation method of the oriented high-thermal-conductivity interface material is characterized in that the total mass of the binder resin and the long fibers is 100 parts.
The interface material prepared by the formula and the preparation method has ultra-high thermal conductivity, and the thermal conductivity coefficient can reach 80W/(m.k) or even higher.
Drawings
FIG. 1 is a schematic cross-sectional view of a square shell container;
in the figure, 1-long fiber heat conducting material, 2-square shell container, 3-adhesive resin, 4-upper cover plate.
Detailed Description
The invention is further described in detail below with reference to the drawings and examples, and specific embodiments are given.
The oriented high-thermal-conductivity interface material is composed of 10-90 parts of adhesive resin and 10-90 parts of long fiber heat-conducting material. Wherein, the adhesive resin is selected from a curable resin or a thermoplastic resin, the curable resin is any one of liquid silicon rubber, epoxy resin and polyurethane, preferably the liquid silicon rubber, and the thermoplastic resin is any one of polyethylene, polypropylene and thermoplastic elastomer; the long fiber heat conduction material is a carbon fiber filament, preferably an asphalt-based carbon fiber filament, the length of the carbon fiber filament is 10-1000mm, and the heat conduction coefficient is 300-1100W/(m.k).
The preparation method of the oriented high-thermal-conductivity interface material comprises the following steps: firstly, orderly arranging long fiber heat-conducting materials in a square shell container, adding adhesive resin under the condition that the vacuum degree is more than or equal to 0.098Mpa, pressing down an upper cover plate on the square shell container after the adhesive is vertically added, shaping the long fiber heat-conducting materials and the adhesive, removing vacuum, curing to obtain a block body, and cutting into required thickness according to the requirement to obtain the sheet-shaped oriented high heat-conducting interface material. The structure of the square shell container is shown in fig. 1, and is a container body with an opening at the upper part, an upper cover plate is arranged on the container body, and the outer wall of the upper cover plate is matched with the inner wall of the container body.
Example 1
Arranging 50 parts of carbon fiber bundles with the thermal conductivity of 900W/(m.k) and the length of 50mm in a square shell, adding 50 parts of 500cps liquid silica gel under the vacuum degree of more than or equal to 0.098Mpa, pressing down an upper cover plate to shape the fibers and the adhesive, removing the vacuum, curing at 120 ℃ for 1h to obtain a block-shaped elastomer, and cutting into sheets with the thickness of 2 mm.
Example 2
Arranging 40 parts of carbon fiber bundles with the thermal conductivity coefficient of 900W/(m.k) and the length of 50mm in a square shell, adding 60 parts of 500cps liquid silica gel under the vacuum degree of more than or equal to 0.098Mpa, pressing down an upper cover plate to shape the fibers and the adhesive, removing the vacuum, curing at 120 ℃ for 1h to obtain a blocky elastomer, and cutting into slices with the thickness of 2 mm.
Example 3
Arranging 60 parts of carbon fiber bundles with the thermal conductivity coefficient of 900W/(m.k) and the length of 50mm in a square shell, adding 40 parts of 500cps liquid silica gel under the vacuum degree of more than or equal to 0.098Mpa, pressing down an upper cover plate to shape the fibers and the adhesive, removing the vacuum, curing at 120 ℃ for 1h to obtain a blocky elastomer, and cutting into slices with the thickness of 2 mm.
Example 4
Arranging 50 parts of carbon fiber bundles with the thermal conductivity coefficient of 600W/(m.k) and the length of 50mm in a square shell, adding 50 parts of 500cps liquid silica gel under the vacuum degree of more than or equal to 0.098Mpa, pressing down an upper cover plate to shape the fibers and the adhesive, removing the vacuum, curing at 120 ℃ for 1h to obtain a block-shaped elastomer, and cutting into sheets with the thickness of 2 mm.
Comparative example 1
And uniformly mixing 94 parts of spherical alumina and 6 parts of liquid 500cps liquid silica gel in vacuum, and calendering to 2mm thickness and curing at 120 ℃ to obtain the sheet taking the alumina as the heat-conducting filler.
Comparative example 2
55 parts of spherical alumina, 25 parts of carbon fiber powder with the thermal conductivity of 900W/(m.k) and the length of 200um and 20 parts of liquid 500cps liquid silica gel are uniformly mixed in vacuum, aligned by specific equipment, cured and cut into slices with the thickness of 2 mm.
The test method comprises the following steps: testing the thermal conductivity of the gasket according to ASTM D5470-; the hardness of the gasket was determined according to ASTM 2240-. The test results are shown in Table 1.
TABLE 1
| Item | Example 1 | Example 2 | Example 3 | Example 4 | Comparative example 1 | Comparative example 2 |
| Thermal conductivity, W/m.k | 65 | 46 | 79 | 48 | 6.1 | 30 |
| Hardness, shore00 | 45 | 31 | 63 | 43 | 65 | 57 |
The above description is only a preferred embodiment of the present invention, and any construction, modification and principle equivalent changes, equivalents and improvements made within the scope of the present invention are included in the protection scope of the present invention.
Claims (8)
1. The oriented high-thermal-conductivity interface material is characterized by comprising 10-90 parts of adhesive resin and 10-90 parts of long fiber thermal-conductive material.
2. The oriented high thermal interface material according to claim 1, wherein the binder resin is selected from a curable resin and a thermoplastic resin, the curable resin is any one of liquid silicone rubber, epoxy resin and polyurethane, and the thermoplastic resin is any one of polyethylene, polypropylene and thermoplastic elastomer.
3. The oriented high thermal interface material of claim 2, wherein said binder resin is a liquid silicone rubber.
4. The oriented high thermal interface material as claimed in claim 1, wherein the long fiber thermal conductive material is carbon fiber filament, the length of the carbon fiber filament is 10-1000mm, and the thermal conductivity is 300-1100W/(m.k).
5. The oriented high thermal interface material of claim 1, wherein said carbon fiber filaments are pitch-based carbon fiber filaments.
6. The method for preparing the oriented high thermal conductivity interface material according to claim 1, characterized by comprising the following steps: firstly, orderly arranging long fiber heat conduction materials (1) in a square shell container (2), adding adhesive resin (3) under the condition that the vacuum degree is more than or equal to 0.098Mpa, pressing an upper cover plate (4) on the square shell container (2) downwards after the adhesive is vertically added, shaping the long fiber heat conduction materials and the adhesive, removing vacuum, curing to obtain a block body, and cutting into required thickness as required to obtain the sheet-shaped oriented high heat conduction interface material.
7. The method according to claim 6, wherein the square container is a container body with an opening at the top, and the container body is provided with an upper cover plate, and the outer wall of the upper cover plate is matched with the inner wall of the container body.
8. The method according to claim 6, wherein the total mass of the binder resin and the long fibers is 100 parts.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010182448.5A CN111363358A (en) | 2020-03-16 | 2020-03-16 | Oriented high-thermal-conductivity interface material and preparation method thereof |
| PCT/CN2020/131363 WO2021184816A1 (en) | 2020-03-16 | 2020-11-25 | Oriented high-thermal-conductivity interface material and preparation method therefor |
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| CN202010182448.5A CN111363358A (en) | 2020-03-16 | 2020-03-16 | Oriented high-thermal-conductivity interface material and preparation method thereof |
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| CN111363358A true CN111363358A (en) | 2020-07-03 |
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| CN202010182448.5A Pending CN111363358A (en) | 2020-03-16 | 2020-03-16 | Oriented high-thermal-conductivity interface material and preparation method thereof |
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| WO (1) | WO2021184816A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112029172A (en) * | 2020-09-08 | 2020-12-04 | 四川大学 | Polymer-based heat-conducting composite material and preparation method thereof |
| CN113337253A (en) * | 2021-06-11 | 2021-09-03 | 常州富烯科技股份有限公司 | Heat-conducting gasket and preparation method thereof |
| WO2021184816A1 (en) * | 2020-03-16 | 2021-09-23 | 平湖阿莱德实业有限公司 | Oriented high-thermal-conductivity interface material and preparation method therefor |
| CN115386227A (en) * | 2021-12-09 | 2022-11-25 | 上海阿莱德实业股份有限公司 | Oriented high-thermal-conductivity interface material and preparation method thereof |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114539779A (en) * | 2022-03-18 | 2022-05-27 | 东莞市盛元新材料科技有限公司 | Ultrahigh-temperature-resistant high-thermal-conductivity carbon fiber silica gel gasket and preparation method thereof |
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- 2020-03-16 CN CN202010182448.5A patent/CN111363358A/en active Pending
- 2020-11-25 WO PCT/CN2020/131363 patent/WO2021184816A1/en active Application Filing
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2021184816A1 (en) * | 2020-03-16 | 2021-09-23 | 平湖阿莱德实业有限公司 | Oriented high-thermal-conductivity interface material and preparation method therefor |
| CN112029172A (en) * | 2020-09-08 | 2020-12-04 | 四川大学 | Polymer-based heat-conducting composite material and preparation method thereof |
| CN113337253A (en) * | 2021-06-11 | 2021-09-03 | 常州富烯科技股份有限公司 | Heat-conducting gasket and preparation method thereof |
| CN115386227A (en) * | 2021-12-09 | 2022-11-25 | 上海阿莱德实业股份有限公司 | Oriented high-thermal-conductivity interface material and preparation method thereof |
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| WO2021184816A1 (en) | 2021-09-23 |
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Application publication date: 20200703 |