CN111360255A

CN111360255A - Integrated processing system and processing method for conductive material

Info

Publication number: CN111360255A
Application number: CN202010208457.7A
Authority: CN
Inventors: 耿洪滨; 耿晨曦; 张翰兴; 李兴冀; 吕钢
Original assignee: Harbin Institute of Technology
Current assignee: Harbin Institute of Technology
Priority date: 2020-03-23
Filing date: 2020-03-23
Publication date: 2020-07-03
Anticipated expiration: 2040-03-23
Also published as: CN111360255B

Abstract

The invention provides an integrated processing system and a processing method for a conductive material, wherein the integrated processing system for the conductive material comprises a driving device, a control device, a guiding device and an etching device which can conduct electricity; the driving device comprises a workbench capable of conducting electricity. In the invention, the control device is used for controlling the driving device to drive the guide device to move when the workbench or the conductive material formed on the workbench is connected with the negative pole of the pulse power supply and the guide device is connected with the positive pole of the pulse power supply, so that the conductive material extending out of the guide device is melted and deposited on the forming area of the workbench; and when the blank formed on the workbench by the conductive material is connected with the anode of the pulse power supply and the etching device is connected with the cathode of the pulse power supply, controlling the driving device to drive the etching device to move so that the etching device can reduce the material of the blank.

Description

Integrated processing system and processing method for conductive material

Technical Field

The invention relates to the field of mechanical equipment, in particular to an integrated processing system and a processing method for a conductive material.

Background

In the processing production, when alloy is used for manufacturing large-size anisotropic structural parts and complex geometric parts, the large-size anisotropic structural parts and the complex geometric parts need to be decomposed into a plurality of components, then the components are manufactured through the traditional casting, forging, heat treatment and machining processes, and finally the components are connected into an integral structure through the processes of welding, riveting, gluing and the like. Therefore, by adopting the method, the process of each link is complex, the probability that each component has tissue structure defects and the like at the connecting part is high, and the integral bearing capacity of the structural member is limited.

Disclosure of Invention

The invention solves the problems of how to avoid the complex process and reduce the probability of the defect of the organization structure.

In order to solve the problems, the invention provides an integrated processing system for conductive materials, which comprises a driving device, a control device, a guide device and an etching device, wherein the guide device and the etching device are all conductive; the driving device comprises a conductive workbench and is detachably connected with the guiding device and the etching device; the guiding device is used for being in contact with a conductive material and allowing the conductive material to pass through; the control device is electrically connected with the driving device;

the control device is used for controlling the driving device to drive the guide device to move when the workbench or the conductive material formed on the workbench is connected with the negative pole of the pulse power supply and the guide device is connected with the positive pole of the pulse power supply, so that the conductive material extending out of the guide device is melted and deposited on the forming area of the workbench;

and when the blank formed on the workbench by the conductive material is connected with the anode of the pulse power supply and the etching device is connected with the cathode of the pulse power supply, controlling the driving device to drive the etching device to move so that the etching device can reduce the material of the blank.

Optionally, the guide means comprises a housing body for connection to an output shaft of the drive means; the shell body is used for electrically connecting the pulse power supply; and the shell body is provided with a cavity which penetrates through the shell body along the vertical direction, the cavity is suitable for the conductive material to penetrate through, and the inner wall of the cavity is suitable for being in contact with the conductive material.

Optionally, the device further comprises a raw material conveying device, the raw material conveying device is electrically connected with the control device, and the control device is further used for controlling the raw material conveying device to drive the conductive material to penetrate through the cavity from top to bottom.

Optionally, the ultrasonic vibration device further comprises an ultrasonic transducer and a horn; the ultrasonic transducer is positioned above the guiding device or the etching device, one end of the amplitude transformer is connected with the ultrasonic transducer, and the other end of the amplitude transformer is connected with the guiding device or the etching device; the ultrasonic transducer is electrically connected with the control device, and the control device is also used for controlling the ultrasonic transducer to drive the guide device or the etching device to vibrate up and down.

Optionally, the conductive material heating device further comprises a shielding gas delivery device, the shielding gas delivery device is electrically connected with the control device, and the control device is further used for controlling the shielding gas delivery device to deliver shielding gas to protect the heated conductive material.

Compared with the prior art, the invention has the following beneficial effects: when the control device is connected with the negative pole of the pulse power supply on the workbench or the conductive material formed on the workbench and the guide device is connected with the positive pole of the pulse power supply, the drive device drives the guide device to move, so that the conductive material can be melted, and a blank can be deposited and formed in the placement area of the workbench; then, when the blank formed on the workbench by the conductive material is connected with the anode of the pulse power supply and the etching device is connected with the cathode of the pulse power supply, the control device drives the etching device to move through the driving device, so that the material reduction of the blank can be realized, and an object with a required size can be obtained; therefore, the deposition and cutting of the conductive material can be realized by adopting an electric spark mode, and the complexity of the process is reduced; meanwhile, the conductive material is deposited by solution, metallurgical bonding is formed between the melts, the metallographic structure is uniform and compact, and the probability of defects of the microstructure is reduced.

Another objective of the present invention is to provide an integrated processing method for conductive materials, so as to solve the problems of avoiding complex process and reducing the probability of having structural defects.

In order to solve the above problems, the technical solution of the present invention is realized as follows:

the integrated processing method of the conductive material is based on the integrated processing system of the conductive material, and is characterized by comprising the following steps:

activating an electric spark deposition mode to control the conductive material to be melted and deposited on a forming area of the workbench until a blank to be printed is formed;

executing a power supply conversion mode to control the conductive etching device to be connected with the cathode of the pulse power supply, and connecting the blank with the anode of the pulse power supply;

and activating an electric spark etching mode to control the etching device to reduce the material of the blank until the object to be printed is formed.

Optionally, the activating the spark deposition mode to control the conductive material to be melted and placed on the forming area of the table until the blank to be printed is formed comprises:

controlling a raw material conveying device to directionally push out the conductive material;

controlling a gap between the conductive material and the workbench to discharge, and enabling the guide device to be connected with the anode of the pulse power supply, and the workbench to be connected with the cathode of the pulse power supply;

controlling the motion trail of the conductive material to change the relative position between the conductive material and the workbench;

and controlling the conductive material to be melted into liquid drops and sputter-deposited on the forming area of the workbench during the movement of the conductive material so as to cumulatively and gradually form the blank.

Optionally, the controlling the motion trajectory of the conductive material to change the relative position between the conductive material and the workbench includes:

establishing a model file of the object;

generating a 3D printing program of the model file;

and transmitting the 3D printing program to a driving device so that the driving device drives the conductive material to move according to the movement track.

Optionally, the activating the electric spark etching mode to control the etching device to perform material reduction processing on the blank until the object to be printed is formed includes:

controlling the etching device and the blank to form gap discharge;

and controlling the motion trail of the etching device to change the mutual contact position between the etching device and the blank so as to melt and remove the redundant micro-areas on the blank until the required size of the object is achieved.

Optionally, the controlling the motion trajectory of the etching device to change the mutual contact position between the etching device and the blank to melt and remove the excess micro-areas on the blank until the required size of the object is reached includes:

establishing a model file of the blank;

generating a track file program for rough machining and finish machining of the blank tool path according to the model file of the blank;

and transmitting the track file program to a driving device so that the driving device drives the conductive material to move according to the motion track.

The integrated processing method of the conductive material has the same advantages as the integrated processing system of the conductive material in the prior art, and is not described again here.

Drawings

FIG. 1 is a block diagram of one embodiment of an integrated conductive material processing system of the present invention;

FIG. 2 is a schematic structural diagram of an embodiment of a driving device according to the present invention;

FIG. 3 is a schematic structural view of one embodiment of the guiding device of the present invention;

FIG. 4 is a schematic structural diagram of an embodiment of an etching apparatus according to the present invention.

Fig. 5 is a schematic flow chart illustrating an embodiment of the integrated processing method of conductive material according to the present invention.

Description of reference numerals:

1-a control device; 2-a drive device; 3-a workbench; 4-a raw material conveying device; 5-ultrasonic vibration device; 6-protective gas delivery means; 7-a conductive material; 8-a guiding device; 9-etching device; 10-an air cavity; 51-an ultrasonic transducer; 52-horn.

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.

In the description of the present invention, it is to be understood that the forward direction of "X" in the drawings represents the right direction, and correspondingly, the reverse direction of "X" represents the left direction; the forward direction of "Y" represents forward, and correspondingly, the reverse direction of "Y" represents rearward; the forward direction of "Z" represents the upward direction, and correspondingly, the reverse direction of "Z" represents the downward direction, and the directions or positional relationships indicated by the terms "X", "Y", "Z", etc. are based on the directions or positional relationships shown in the drawings of the specification, and are only for convenience of describing and simplifying the description, but do not indicate or imply that the device or element referred to must have a particular direction, be constructed and operated in a particular direction, and thus should not be construed as limiting the present invention. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

In actual production, for large-size special-shaped metal structural parts such as main bearing trusses of airplanes and the like, the conventional processing method is to firstly decompose the structural parts into a plurality of components, manufacture the components through the traditional casting, forging, heat treatment and machining processes, and finally connect the components into an integral structure through the processes of welding, riveting, gluing and the like. And for the production of parts with complex geometric shapes such as an aircraft engine turbine disc and the like, a blank is obtained firstly by adopting the traditional cast-forge welding, heat treatment and mechanical rough machining, and finally, the blank is precisely machined and formed by five-axis numerical control machining. The difficulty and cost of the processing methods of the processes (such as casting, forging, heat treatment and mechanical processing) are high due to the properties of high melting point, high hardness, high toughness, high wear resistance and the like of the used alloy.

As shown in fig. 1-4, the present invention provides an integrated processing system for conductive materials, which comprises a driving device 2, a control device 1, and a guiding device 8 and an etching device 9 which are all capable of conducting electricity; the driving device 2 comprises a conductive workbench 3, and the driving device 2 is detachably connected with the guiding device 8 and the etching device 9; the guiding device 8 is used for contacting with the conductive material 7 and allowing the conductive material 7 to pass through; the control device 1 is electrically connected with the driving device 2;

the control device 1 is used for controlling the driving device 2 to drive the guide device 8 to move when the workbench 3 or the conductive material 7 formed on the workbench 3 is connected with the negative pole of a pulse power supply, and the guide device 8 is connected with the positive pole of the pulse power supply, so that the conductive material 7 extending out of the guide device 8 is melted and deposited on the forming area of the workbench 3;

and when the blank formed on the workbench 3 by the conductive material 7 is connected with the anode of the pulse power supply and the etching device 9 is connected with the cathode of the pulse power supply, controlling the driving device 2 to drive the etching device 9 to move so that the etching device 9 performs material reduction processing on the blank.

After the embodiment is adopted, when the workbench 3 or the conductive material 7 formed on the workbench 3 is connected with the negative pole of the pulse power supply and the guiding device 8 is connected with the positive pole of the pulse power supply, the control device 1 drives the guiding device 8 to move through the driving device 2, so that the conductive material 7 can be melted, and a blank can be deposited and formed in the placing area of the workbench 3; then, when the blank formed on the workbench 3 by the conductive material 7 is connected with the positive electrode of the pulse power supply and the etching device 9 is connected with the negative electrode of the pulse power supply, the control device 1 drives the etching device 9 to move through the driving device 2, so that the blank can be reduced in size, and an object with a required size can be obtained; therefore, the deposition and cutting of the conductive material 7 can be realized by adopting an electric spark mode, and the complexity of the process is reduced; meanwhile, the conductive material 7 is deposited by solution, metallurgical bonding is formed between the melts, the metallographic structure is uniform and compact, and the probability of defects of the microstructure is reduced.

In this embodiment, the control device 1 mainly comprises a computer, a driving circuit and a sensing circuit, wherein the computer is a composite computer system composed of a general-purpose computer and an embedded computer, the general-purpose computer is used as an upper computer, and the embedded computer is used as a lower computer; the driving circuit provides driving current and/or driving signals for each actuating mechanism; the computer obtains various state information required by the electric spark deposition and the electric spark cutting, such as position, pressure, temperature, current intensity, gas composition, rotating speed, magnetic field intensity, capacitance, resistance, humidity, infrared ray, image and the like through the sensing circuit.

Specifically, the circuit unit includes at least a current generation circuit and a power conversion device both controlled by the control device 1; when the drive device 2 is detachably connected with the guide device 8, the pulse power supply of the current generation circuit electrically connects the guide device 8 with the table 3 or the conductive material 7 which has been molded on the table 3, thereby serving to apply a current; when the driving device 2 is detachably connected with the engraving device, the pulse power supply of the current generating circuit is electrically connected with the etching device 9 and the blank formed on the workbench 3 by the conductive material 7 so as to apply current; the power supply conversion device is a relay, and can realize the conversion of the anode and the cathode of the pulse power supply under the control of the control device 1, thereby avoiding the condition that power supply circuits are respectively designed for electric spark deposition and electric spark cutting, and optimizing the circuit.

Alternatively, as shown in fig. 2, the driving device 2 is a five-axis numerical control device. Five-axis numerical control equipment is also called five-axis linkage machining center and has the characteristics of high efficiency and high precision. The five-axis numerical control equipment adopted by the embodiment depends on the rotation of the vertical spindle head. The front end of the main shaft is provided with a rotary head which can automatically surround the Z shaft by 360 degrees to form a C shaft, and the rotary head is also provided with an A shaft which can rotate around the X shaft and generally can reach more than +/-90 degrees, so that the same functions are realized. The advantage of this arrangement is that the spindle can be machined very flexibly, the working table 3 can also be designed very large, and the huge fuselage and huge engine casing of a passenger aircraft can be machined in such machining centers.

Wherein, the forming area of the worktable 3 is the space used when printing objects; the conductive material 7 is a metal or an impure metal. Since the electric spark is used for machining in the present embodiment, in order to ensure the generation of the electric spark, the guiding device 8 and the etching device 9 are respectively required to be conductive and resistant to high temperature in the electric spark deposition and electric spark cutting modes, preferably, both the guiding device 8 and the etching device 9 are made of a high temperature resistant material, such as a special tungsten alloy, which can be both conductive and can avoid melting at high temperature, thereby affecting the deposition and cutting.

Further, the guide means 8 comprises a housing body for connecting an output shaft of the drive means 2; the shell body is used for electrically connecting the pulse power supply; and the shell body is provided with a cavity which penetrates through the shell body along the vertical direction, the cavity is suitable for the conductive material 7 to penetrate through, and the inner wall of the cavity is suitable for being in contact with the conductive material 7.

In this embodiment, the guiding device 8 is generally installed on a rotating head of a main shaft of a five-axis numerical control device, and by adopting the guiding device 8 of this embodiment, not only can the guiding function of the conductive material 7 be achieved, but also the conductive material 7 can be electrified, so that the subsequent processing in an electric spark deposition mode can be facilitated.

Further, the etching device 9 is an etching head, and the structure of the etching device 9 and the structure of the guiding device 8 are different only in that the etching device 9 does not have a cavity penetrating in the up-down direction.

Meanwhile, the guide device 8 and the etching device 9 are respectively applied to the electric spark deposition and the electric spark cutting. A rotary head of a main shaft of the five-axis numerical control equipment selects and installs a guide device 8 or an etching device 9 according to different modes. Therefore, the processing space is saved, and the interference caused by simultaneously installing the guide device 8 and the etching device 9 is avoided.

Optionally, the device further comprises a raw material conveying device 4, the raw material conveying device 4 is electrically connected with the control device 1, and the control device 1 is further configured to control the raw material conveying device 4 to drive the conductive material 7 to pass through the cavity from top to bottom. Therefore, the automatic conveying and feeding of the conductive materials 7 can be realized, and a large amount of manpower is saved.

In particular, the raw material delivery device 4 is a wire feeder, which generally effects the displacement of the wire by means of two rollers. Thereby, it is facilitated to thread the wire through the cavity to contact the table 3 or the formed metal. In one embodiment, the wire is wound on a rotatable spool; the wire passes under the pull/push of the two rollers and reaches the inside of the guide 8.

Optionally, as shown in fig. 3 and 4, the ultrasonic vibration device 5 is further included, where the ultrasonic vibration device 5 includes an ultrasonic transducer 51 and a horn 52; the ultrasonic transducer 51 is positioned above the guiding device 8 or the etching device 9, one end of the amplitude transformer 52 is connected with the ultrasonic transducer 51, and the other end of the amplitude transformer is connected with the guiding device 8 or the etching device 9; the ultrasonic transducer 51 is electrically connected with the control device 1, and the control device 1 is further configured to control the ultrasonic transducer 51 to drive the guiding device 8 or the etching device 9 to vibrate up and down. Thereby, the guide means 8 is vibrated up and down, and the conductive material 7 protruding out of the guide means 8 is brought into intermittent contact with the work table 3 or the conductive material 7 already molded on the work table 3; the etching device 9 vibrates up and down to realize the intermittent contact between the etching device 9 and the blank formed on the workbench 3 by the conductive material 7.

Specifically, the frequency of the ultrasonic transducer 51 is 28kHz and the power consumption is 100W. In order to enable the guide device 8 to vibrate up and down better, the ultrasonic transducer 51 and the horn 52 are located directly above the guide device 8. And the ultrasonic transducer 51 and the horn 52 are provided with through holes for the wire to pass through in order to facilitate the wire to pass through. Since the etching device 9 does not need to be traversed by a wire, the horn 52 is situated directly above the guide device 8.

Optionally, the device further comprises a shielding gas delivery device 6, the shielding gas delivery device 6 is electrically connected with the control device 1, and the control device 1 is further configured to control the shielding gas delivery device 6 to deliver shielding gas to protect the heated conductive material 7.

Specifically, as shown in fig. 3, the guide device 8 is further provided with an air cavity 10 opened below; the protective gas is argon gas and is used for protecting the heated metal, such as molten metal raw materials and heated formed metal, and avoiding the reaction with components in the air; the protective gas is from a high-pressure gas cylinder; is communicated with the air cavity 10 through a pipeline, and is internally provided with an electromagnetic valve and a sensor; in the actual operation process, the control device 1 compares actual data obtained from sensors such as a pressure sensor and a gas sensor (for example, an oxygen concentration sensor) according to set parameters such as pressure intensity and gas concentration, and controls the on-off and on-off frequency of the electromagnetic valve to realize the adjustment of the pressure intensity and the protective gas concentration in the air cavity 10; the electromagnetic valve is a high-speed electromagnetic valve, so that the conduction and the cutoff of the protective gas can be realized sensitively.

Similarly, as shown in fig. 4, the etching device 9 is provided with an air cavity 10 with an opening at the lower part; the protective gas is from a high-pressure gas cylinder; the pipeline is communicated with the air cavity 10, and the blown gas can peel off molten drops on the blank in an electric spark cutting mode, so that the aim of reducing the material is fulfilled.

When the device works, during deposition additive machining, the driving device 2 is detachably connected with the guiding device 8, the control device 1 controls the guiding device 8 to be electrically connected with the positive electrode of the pulse power supply, and the workbench 3 is electrically connected with the negative electrode of the pulse power supply; in the process that the driving device 2 drives the guide device 8 to move, the metal wire is in periodic contact with the workbench 3 through ultrasonic vibration, the metal wire and the workbench 3 discharge within 5-10 seconds of ultrashort time, so that transient electric spark is generated at an electric contact part, a contact micro-area is heated to be more than 6000 ℃, instant high-temperature molten drop sputtering is formed on the end face of the metal wire, and the blank is manufactured through continuous accumulation. When the material is reduced by etching, the etching device 9 is connected with the negative electrode of a pulse power supply, the blank is connected with the positive electrode of the pulse power supply, and the micro-area on the surface of the blank is melted and stripped by inert gas flow due to electric spark discharge. And adjusting the discharge parameters to perform rough machining and finish machining on the surface of the workpiece.

Another object of the present invention is to provide an integrated processing method of conductive material, based on the integrated processing system of conductive material, as shown in fig. 5, including:

s1, activating an electric spark deposition mode to control the conductive material 7 to be melted and deposited on the forming area of the workbench 3 until the blank to be printed is formed;

s2, executing a power supply conversion mode to control the conductive etching device 9 to be connected with the cathode of the pulse power supply, wherein the blank is connected with the anode of the pulse power supply;

and S3, activating an electric spark etching mode to control the etching device 9 to perform material reduction processing on the blank until the object to be printed is formed.

After the integrated processing method of the conductive material is adopted, the conductive material 7 can be melted in an electric spark deposition mode, so that a blank is formed in the placing area of the workbench 3; after the adjustment of the power supply conversion mode, the material reduction of the blank can be realized in the electric spark etching mode, so that an object with the required size can be obtained; therefore, the deposition and cutting of the conductive material 7 can be realized by adopting an electric spark mode, and the complexity of the process is reduced; meanwhile, the conductive material 7 is deposited by solution, metallurgical bonding is formed between the melts, the metallographic structure is uniform and compact, and the probability of defects existing in the structure is reduced; the material reduction of the blank is realized through electric sparks, and compared with cutting by a cutter, the precision is higher.

Preferably, step S1 includes:

s11, controlling the raw material conveying device 4 to directionally push out the conductive material 7;

s12, controlling the gap discharge between the conductive material 7 and the workbench 3, and connecting the guiding device 8 with the positive pole of the pulse power supply, and connecting the workbench 3 with the negative pole of the pulse power supply;

s13, controlling the motion track of the conductive material 7 to change the relative position between the conductive material 7 and the workbench 3;

and S14, controlling the conductive material 7 to be melted into liquid drops and sputter deposited on the forming area of the workbench 3 in the moving process of the conductive material 7 so as to cumulatively and gradually form the blank.

Specifically, in step S11, the conductive material 7 is a metal or a non-pure metal, preferably a wire or a wire, and the displacement of the wire is realized by the raw material conveying device 4 so that the wire is continuously consumed.

In the embodiment, a metal wire material is used as a raw material, and a high-efficiency electric spark fuse is used for obtaining metal micro droplets, and the metal micro droplets are stacked and formed in a droplet sputtering deposition mode. The manufacturing cost of the electric spark deposition processing method is obviously reduced, and an effective technical approach is provided for the practical application of the additive manufacturing of the conductive material 7.

In step S12, the guiding device 8 is connected to the positive electrode of the pulse power supply, that is, the conductive material 7 is connected to the positive electrode of the pulse power supply, so that the conductive material 7 and the worktable 3 are energized to form a capacitor structure, the capacitor structure is charged by the dc pulse power supply in less than 5-10 seconds, during the deposition and material-increasing process, the wire is connected to the positive electrode, the worktable 3 is connected to the negative electrode, when the wire and the worktable 3 are in periodic contact, the capacitor structure is discharged in an ultra-short time of 5-10 seconds, transient electric sparks are generated at the contact part of the wire and the worktable 3, the contact micro-area is heated to more than 6000 ℃, and the instantaneous high-temperature molten droplet sputtering is formed on the end surface of the wire, so as to be placed on the worktable 3. The discharge power and the discharge interval can be effectively adjusted by changing the diameter (0.4-1.0 mm) of the metal wire, the frequency (30-3000Hz) of the pulse power supply and the duty ratio (10-100%), and the size and the flow rate of the sputtering molten drop can be accurately controlled by matching with the wire feeding speed (10-1800 mm/min). Since the discharge time is extremely short compared to the discharge interval time, no excessive heat is accumulated. The workbench 3 does not need to be preheated, the blank forming temperature is relatively low (<400 ℃), molten drops are condensed quickly, metallurgical bonding is formed among the molten drops, the metallographic structure is uniform and compact, and the forming efficiency is high.

In step S14, the molten metal wire is transformed into the print forming metal after having no fluidity, and the molten metal wire is continuously accumulated on the basis of the print forming metal until the blank to be printed is formed; wherein: in the process of accumulating the molten metal, the position where the molten metal is placed is determined by the shape and structure of the blank to be printed.

Preferably, step S13 includes:

s131, establishing a model file of the object;

s132, generating a 3D printing program of the model file;

and S133, transmitting the 3D printing program to a driving device 2, so that the driving device 2 drives the conductive material 7 to move according to a motion track.

Specifically, a three-dimensional software (such as 3D max, Zbrush and the like) is used for establishing a workpiece model file; then, a 3D printing program (namely a G code file of the model) of the product model is exported by using slicing software (such as cure, Slic3r and the like); and finally, importing the G code file into a printing control program of five-axis numerical control equipment, and executing, thereby driving the metal wire to displace through the five-axis numerical control equipment, and meeting the requirement of blank printing.

Preferably, in step S2, the electric spark circuit uses an integrated single chip microcomputer control board, uses a high-capacity capacitor for energy storage, and a high-low voltage separation technology, and the circuit output parameters ensure that the electric spark circuit is suitable for both metal droplet deposition and metal droplet etching, and the output stability and reliability of the power supply are high. And the polarity conversion of the pulse power supply is realized by a program instruction and is automatically completed by the switching of the relay. In one embodiment, the values of the parameters are: the power supply parameters are as follows: 220 ± 20% volts, 50/60Hz, power consumption: 4000W; frequency range (30-3000Hz), duty cycle (10-100%) of the pulse power supply, output current: 0.5-500A, output voltage: 0-30 volts.

Preferably, step S3 includes:

s31, controlling the etching device 9 and the blank to form gap discharge;

and S32, controlling the motion track of the etching device 9 to change the mutual contact position between the etching device 9 and the blank so as to melt and remove the redundant micro-areas on the blank until the required size of the object is achieved.

In step S31, the etching device 9 and the blank are powered on to form a capacitor structure, the capacitor structure is charged by a dc pulse power supply in less than 5-10 seconds, when the blank is connected to a positive electrode and the etching device 9 is connected to a negative electrode during the material reducing machining, when the etching device 9 and the blank are periodically contacted, the capacitor structure discharges in 10-5 seconds, transient electric sparks are generated at the contact part of the blank and the etching device 9, the contact micro-area is heated to more than 6000 ℃, and instantaneous high-temperature molten droplet sputtering is formed on the end face of the blank, thereby reducing the material.

Optionally, step S32 includes:

s321, establishing a model file of the blank;

s322, generating a track file program for rough machining and finish machining of the blank according to the model file of the blank;

and S323, transmitting the track file program to the driving device 2, so that the driving device 2 drives the conductive material 7 to move according to the motion track.

Specifically, firstly, a workpiece blank model file is established by UG software; then processing is carried out, and G code files of rough machining and finish machining tool paths of the blank are led out; and finally, importing the G code file into a printing control program of five-axis numerical control equipment, and executing to enable the driving device 2 to drive the conductive material 7 to move according to the motion track.

The current 3D printing equipment for printing metal has the following problems:

(1) raw material aspect: the micron-sized metal powder is mainly imported from foreign countries, the price is high, and the types of selectable metals and alloys are limited. And the powder is easy to float, which causes harm to human health and environment, and the required protection cost is high.

(2) Heat source equipment aspect: compared with other materials, the melting point of the metal and the alloy is relatively high, and the required heat source mainly takes a high-power short-wavelength laser or a high-energy electron beam accelerator to melt the metal in a region selection mode, so that the heat source equipment cost is high, secondary radiation such as X rays and gamma rays is easily generated in the irradiation process, and the required protection cost is also high.

(3) The surface quality of the product is as follows: the metal 3D printing can reach higher mechanical property only through a metallurgical bonding mechanism (namely melting crystallization), and the liquid metal has higher surface tension, so that the surface of a product presents a convex-concave shape, the matching precision requirement like a part cannot be met, and subsequent machining is needed.

Compared with the traditional 3D printing equipment for printing metal, the conducting material integrated processing method can realize the conversion between an electric spark deposition mode and an electric spark cutting mode under the action of the control device 1, and utilizes the high-efficiency electric spark fuse to obtain metal micro liquid drops, and the metal micro liquid drops are accumulated and formed in a liquid drop sputtering deposition mode, and finally, the electric spark etching is utilized to carry out rough machining and finish machining on the outer surface. The electric spark deposition and electric spark etching integrated processing equipment effectively breaks through the problems existing in metal 3D printing manufacturing, a workpiece is fine and compact in microstructure, equivalent to a forging piece in performance, manufacturing cost is obviously reduced, and an effective technical approach is provided for practical application of metal material additive manufacturing.

Although the present disclosure has been described above, the scope of the present disclosure is not limited thereto. Various changes and modifications may be effected therein by one of ordinary skill in the pertinent art without departing from the spirit and scope of the present disclosure, and these changes and modifications are intended to be within the scope of the present disclosure.

Claims

1. The integrated processing system for the conductive materials is characterized by comprising a driving device (2), a control device (1), a guide device (8) and an etching device (9), wherein the guide device and the etching device are all conductive; the driving device (2) comprises a conductive workbench (3), and the driving device (2) is detachably connected with the guide device (8) and the etching device (9); the guiding device (8) is used for being in contact with the conductive material (7) and allowing the conductive material (7) to pass through; the control device (1) is electrically connected with the driving device (2);

the control device (1) is used for controlling the driving device (2) to drive the guide device (8) to move when the workbench (3) or the conductive material (7) formed on the workbench (3) is connected with the negative pole of a pulse power supply and the guide device (8) is connected with the positive pole of the pulse power supply, so that the conductive material (7) extending out of the guide device (8) is melted and deposited on the forming area of the workbench (3);

and when the blank formed on the workbench (3) by the conductive material (7) is connected with the anode of the pulse power supply, and the etching device (9) is connected with the cathode of the pulse power supply, controlling the driving device (2) to drive the etching device (9) to move so that the etching device (9) can reduce the material of the blank.

2. The integrated processing system of conductive materials according to claim 1, characterized in that the guiding device (8) comprises a housing body for connecting an output shaft of the driving device (2); the shell body is used for electrically connecting the pulse power supply; and the shell body is provided with a cavity which penetrates through the shell body along the vertical direction, the cavity is suitable for the conductive material (7) to penetrate through, and the inner wall of the cavity is suitable for being in contact with the conductive material (7).

3. The integrated processing system for conductive materials as claimed in claim 2, further comprising a raw material conveying device (4), wherein the raw material conveying device (4) is electrically connected with the control device (1), and the control device (1) is further configured to control the raw material conveying device (4) to drive the conductive materials (7) to pass through the cavity from top to bottom.

4. The integrated processing system for conductive materials as claimed in claim 2, further comprising an ultrasonic vibration device (5), wherein the ultrasonic vibration device (5) comprises an ultrasonic transducer (51), a horn (52); the ultrasonic transducer (51) is positioned above the guiding device (8) or the etching device (9), one end of the amplitude transformer (52) is connected with the ultrasonic transducer (51), and the other end of the amplitude transformer is connected with the guiding device (8) or the etching device (9); the ultrasonic transducer (51) is electrically connected with the control device (1), and the control device (1) is also used for controlling the ultrasonic transducer (51) to drive the guide device (8) or the etching device (9) to vibrate up and down.

5. The integrated processing system of conductive materials according to any one of claims 1 to 4, further comprising a shielding gas delivery device (6), wherein the shielding gas delivery device (6) is electrically connected with the control device (1), and the control device (1) is further used for controlling the shielding gas delivery device (6) to deliver shielding gas to protect the heated conductive materials (7).

6. An integrated processing method of conductive materials, based on the integrated processing system of conductive materials as claimed in any one of claims 1 to 5, characterized by comprising:

activating an electric spark deposition mode to control the conductive material (7) to be melted and deposited on the forming area of the workbench (3) until the blank to be printed is formed;

executing a power supply conversion mode to control a conductive etching device (9) to be connected with the negative electrode of a pulse power supply, wherein the blank is connected with the positive electrode of the pulse power supply;

and activating an electric spark etching mode to control the etching device (9) to perform material reduction processing on the blank until the object to be printed is formed.

7. The integrated processing method of conductive materials according to claim 6, characterized in that said activating the electro-spark deposition mode to control the melting and the deposition of the conductive material (7) onto the forming area of the worktable (3) until the formation of the blank to be printed comprises:

controlling a raw material conveying device (4) to directionally push out the conductive material (7);

controlling the gap discharge formed between the conductive material (7) and the workbench (3), and connecting the guide device (8) with the positive pole of the pulse power supply, and connecting the workbench (3) with the negative pole of the pulse power supply;

controlling the motion track of the conductive material (7) to change the relative position between the conductive material (7) and the workbench (3);

controlling the conductive material (7) to be melted into liquid drops and sputter deposited on a forming area of the workbench (3) during the movement of the conductive material (7) so as to cumulatively and gradually form the blank.

8. The integrated processing method of conductive material according to claim 7, wherein the controlling the motion track of the conductive material (7) to change the relative position between the conductive material (7) and the workbench (3) comprises:

establishing a model file of the object;

generating a 3D printing program of the model file;

and transmitting the 3D printing program to a driving device (2) so that the driving device (2) drives the conductive material (7) to move according to a motion track.

9. The integrated processing method of conductive materials according to claim 6, characterized in that the activating of the spark erosion mode to control the etching device (9) to perform the material reduction processing on the blank until the object to be printed is formed comprises:

controlling the etching device (9) and the blank to form gap discharge;

and controlling the motion track of the etching device (9) to change the mutual contact position between the etching device (9) and the blank so as to melt and remove redundant micro-areas on the blank until the required size of the object is achieved.

10. The integrated processing method of conductive materials according to claim 9, characterized in that said controlling the motion trajectory of the etching device (9) to change the mutual contact position between the etching device (9) and the blank to melt and remove the excess micro-areas on the blank until the required size of the object is reached comprises:

establishing a model file of the blank;

and transmitting the track file program to a driving device (2) so that the driving device (2) drives the conductive material (7) to move according to the motion track.