CN111354562A - Manufacturing method of chip inductor and chip inductor - Google Patents
Manufacturing method of chip inductor and chip inductor Download PDFInfo
- Publication number
- CN111354562A CN111354562A CN202010264353.8A CN202010264353A CN111354562A CN 111354562 A CN111354562 A CN 111354562A CN 202010264353 A CN202010264353 A CN 202010264353A CN 111354562 A CN111354562 A CN 111354562A
- Authority
- CN
- China
- Prior art keywords
- soft magnetic
- silver paste
- alloy soft
- chip inductor
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 31
- 239000000956 alloy Substances 0.000 claims abstract description 99
- 229910045601 alloy Inorganic materials 0.000 claims abstract description 99
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims abstract description 85
- 229910052709 silver Inorganic materials 0.000 claims abstract description 68
- 239000004332 silver Substances 0.000 claims abstract description 66
- 239000006247 magnetic powder Substances 0.000 claims abstract description 29
- 238000007639 printing Methods 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000012545 processing Methods 0.000 claims abstract description 7
- 239000011347 resin Substances 0.000 claims description 19
- 229920005989 resin Polymers 0.000 claims description 19
- 239000002131 composite material Substances 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 13
- 230000001070 adhesive effect Effects 0.000 claims description 12
- 239000000853 adhesive Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- 238000000137 annealing Methods 0.000 claims description 8
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 6
- XEVZIAVUCQDJFL-UHFFFAOYSA-N [Cr].[Fe].[Si] Chemical compound [Cr].[Fe].[Si] XEVZIAVUCQDJFL-UHFFFAOYSA-N 0.000 claims description 3
- 229910000147 aluminium phosphate Inorganic materials 0.000 claims description 3
- VAWNDNOTGRTLLU-UHFFFAOYSA-N iron molybdenum nickel Chemical compound [Fe].[Ni].[Mo] VAWNDNOTGRTLLU-UHFFFAOYSA-N 0.000 claims description 3
- XWHPIFXRKKHEKR-UHFFFAOYSA-N iron silicon Chemical compound [Si].[Fe] XWHPIFXRKKHEKR-UHFFFAOYSA-N 0.000 claims description 3
- -1 iron silicon aluminum Chemical compound 0.000 claims description 3
- 230000008569 process Effects 0.000 claims description 2
- 238000007598 dipping method Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 230000006698 induction Effects 0.000 abstract description 2
- 230000035699 permeability Effects 0.000 description 11
- 239000000463 material Substances 0.000 description 10
- 239000000843 powder Substances 0.000 description 5
- 238000007789 sealing Methods 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 230000008595 infiltration Effects 0.000 description 3
- 238000001764 infiltration Methods 0.000 description 3
- 238000010345 tape casting Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 239000002002 slurry Substances 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- UGKDIUIOSMUOAW-UHFFFAOYSA-N iron nickel Chemical compound [Fe].[Ni] UGKDIUIOSMUOAW-UHFFFAOYSA-N 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0246—Manufacturing of magnetic circuits by moulding or by pressing powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F17/0013—Printed inductances with stacked layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/005—Impregnating or encapsulating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/0206—Manufacturing of magnetic cores by mechanical means
- H01F41/0233—Manufacturing of magnetic circuits made from sheets
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/041—Printed circuit coils
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F17/00—Fixed inductances of the signal type
- H01F17/0006—Printed inductances
- H01F2017/0053—Printed inductances with means to reduce eddy currents
Abstract
The invention relates to the technical field of inductance components and parts and discloses a manufacturing method of a chip inductor and the chip inductor. The manufacturing method of the patch inductor comprises the following steps: pressing the alloy soft magnetic powder into a square magnetic core; cutting the square magnetic core into alloy soft magnetic sheets; processing a through hole on the alloy soft magnetic sheet; printing conductive silver paste on the alloy soft magnetic sheet to form a silver paste circuit, wherein the conductive silver paste covers and fills the through hole; stacking and bonding the next alloy soft magnetic sheet on the silver paste circuit; and repeating the steps of printing silver paste circuits and stacking and bonding the alloy soft magnetic sheets for multiple times, wherein the silver paste circuits on two adjacent alloy soft magnetic sheets are communicated through the through holes and are manufactured into the chip inductor. The manufacturing method of the surface mounted inductor can obtain the surface mounted inductor with high magnetic conductivity, small volume, low loss and high inductance under the equal volume. The chip inductor has the advantages of high magnetic induction, small DCR, low loss and good anti-electromagnetic interference effect.
Description
Technical Field
The invention relates to the technical field of inductance components, in particular to a manufacturing method of a chip inductor and the chip inductor.
Background
With the rapid development of power electronics, electronic products have increasingly stronger functions and are increasingly developed to be thinner and lighter, so that the requirements on the chip inductor tend to be developed in the directions of miniaturization, high inductance and low loss.
In the prior art, the manufacturing method of the chip inductor mainly includes the following three methods: firstly, adopt integrated into one piece's mould pressing mode, it is through landfill coil in magnetic powder material, then mould pressing integrated into one piece, the paster inductance technology that this mode was made is simple, magnetic screen is effectual, but for the convenience of shaping need add 3wt-7 wt% resin glue in the alloy soft magnetism powder to increase powder mobility and the adhesive action to the powder intergranular after the shaping, consequently can lead to the density of magnetic core low, so the magnetic permeability is low, it is difficult to obtain the paster inductance of high inductance (inductance ^ magnetic permeability coil number of turns), finally lead to inductance low or DCR (Direct Current Resistance) high, can't satisfy the high requirement of small volume. The second mode of the prior art is that high pressure is adopted to press and form magnetic powder, then a slot is cut in the middle of the magnetic core, the coil is wound at the groove through high-temperature sintering treatment, and finally the groove and the coil are sealed by adopting magnetic glue. The third mode in the prior art is a tape casting lamination type inductor, which adopts ferrite materials or alloy powder to add a large amount of resin adhesive to prepare slurry, then prepares a magnetic film in a tape casting mode, then prints conductive silver paste on the surface of the film through a printing technology, prepares a required block through repeated tape casting and silver paste printing, and then sinters and cuts the block. The patch inductor prepared by the method has the advantages of small volume, high efficiency and the like, but the low material density causes low magnetic permeability and high loss.
Therefore, it is desirable to invent a method for manufacturing a high-inductance chip inductor to solve the above-mentioned problems of the chip inductor in the prior art.
Disclosure of Invention
The invention aims to provide a manufacturing method of a chip inductor.
The second objective of the invention is to provide a chip inductor which has a lower DCR under the same inductance or a higher inductance under the same DCR by using the above manufacturing method, and has excellent comprehensive characteristics.
In order to achieve the purpose, the invention adopts the following technical scheme:
the manufacturing method of the chip inductor comprises the following steps:
insulating the alloy soft magnetic powder and pressing into a square magnetic core;
cutting the square magnetic core into an alloy soft magnetic sheet, wherein the thickness of the alloy soft magnetic sheet is 0.05-0.3 mm;
processing a through hole on the alloy soft magnetic sheet;
printing conductive silver paste on the alloy soft magnetic sheet to form a silver paste circuit, wherein the conductive silver paste covers and fills the through hole;
stacking and bonding the next alloy soft magnetic sheet on the silver paste circuit;
and repeating the steps of printing the silver paste circuit and stacking and bonding the alloy soft magnetic sheets for multiple times, wherein the silver paste circuits on the two adjacent alloy soft magnetic sheets are communicated through the through holes and are manufactured into the chip inductor.
Optionally, before the alloy soft magnetic powder is pressed, an insulation treatment is performed, wherein the insulation treatment is as follows:
adding 0.1-0.8 wt% of high-temperature resin adhesive into the alloy soft magnetic powder; or
And phosphating the alloy soft magnetic powder by adopting 0.05-0.8 wt% of phosphoric acid.
Optionally, the alloy soft magnetic powder comprises one or more of iron silicon, iron silicon aluminum, iron nickel molybdenum and iron silicon chromium.
Optionally, before the square magnetic core is cut, high-temperature annealing treatment is performed, wherein the annealing treatment temperature is 600-800 ℃.
Optionally, before cutting the square magnetic core, the square magnetic core is put into a resin solution in a vacuum atmosphere for infiltration treatment.
Optionally, the next alloy soft magnetic sheet is bonded to the alloy soft magnetic sheet printed with the silver paste circuit through a high-density magnetic composite material, and the high-density magnetic composite material avoids the position of the through hole when being coated.
Optionally, the high-density magnetic composite material comprises 6-12 wt% of high-temperature resin adhesive and 88-94 wt% of magnetic powder, and the magnetic permeability of the magnetic composite material is 16-30 u.
Optionally, each alloy soft magnet is printed with a plurality of silver paste circuits according to the design requirements of the inductor, and the alloy soft magnet printed with the silver paste circuits is cut into a plurality of inductor bodies in unit after being laminated and bonded.
Optionally, electrodes are connected to two ends of the inductor body to form the patch inductor, and the electrodes are communicated with the silver paste circuit.
The chip inductor is manufactured by the manufacturing method of the chip inductor.
The invention has the beneficial effects that:
according to the manufacturing method of the chip inductor, the alloy soft magnetic powder is pressed to form the high-density square magnetic core, so that the high-density square magnetic core has high magnetic conductivity and very low loss, and the high-inductance chip inductor is convenient to obtain; the alloy soft magnetic powder is subjected to insulation treatment before being pressed, so that the eddy current loss of the subsequent chip inductor material is reduced; then cutting the square magnetic core into alloy soft magnetic sheets with required thickness according to requirements so as to meet the requirements on the design and the volume of the chip inductor circuit; then processing a through hole on the alloy soft magnetic sheet and printing conductive silver paste; after the silver paste circuits are repeatedly printed and the alloy soft magnetic sheets are stacked and bonded for many times, the silver paste circuits on two adjacent alloy soft magnetic sheets are communicated through conductive silver paste in through holes of the alloy soft magnetic sheets, and the printed silver paste circuits are coated by the alloy soft magnetic sheets without the phenomenon of exposed magnetic leakage.
The chip inductor has the advantages of high magnetic conductivity, small volume, low loss, equal volume, high inductance under DCR and excellent comprehensive characteristics by adopting the manufacturing method of the chip inductor.
Drawings
Fig. 1 is a flowchart of a method for manufacturing a chip inductor according to an embodiment of the present invention;
fig. 2 is an exploded view of an inductor structure provided in accordance with an embodiment of the present invention;
fig. 3 is a schematic structural diagram of a patch inductor according to an embodiment of the present invention.
In the figure:
1-alloy soft magnetic sheet; 2-a through hole; 3-silver paste circuit; 4-leading out silver paste; 5-sealing the cover; 6-an inductor; 7-electrodes.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, removably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
The invention provides a manufacturing method of a chip inductor and the chip inductor, which can be used in the technical field of inductor components. As shown in fig. 1-2, the manufacturing method of the chip inductor includes:
insulating the alloy soft magnetic powder and pressing into a square magnetic core;
cutting the square magnetic core into an alloy soft magnetic sheet 1;
processing a through hole 2 on the alloy soft magnetic sheet 1;
printing conductive silver paste on the alloy soft magnetic sheet 1 to form a silver paste circuit 3, and covering and filling the through hole 2 with the conductive silver paste;
a next alloy soft magnetic sheet 1 is stacked and bonded on the silver paste circuit 3;
and repeating the steps of printing the silver paste circuits 3 and stacking and bonding the alloy soft magnetic sheets 1 for multiple times, wherein the silver paste circuits 3 on two adjacent alloy soft magnetic sheets 1 are communicated through the through holes 2 and are made into a chip inductor.
The alloy soft magnetic powder is firstly pressed to form a high-density square magnetic core so as to have higher magnetic permeability and very low loss, thereby being convenient for obtaining a high-inductance chip inductor. In this embodiment, the alloy soft magnetic powder is a powder including one or more of iron silicon, iron silicon chromium, iron silicon aluminum, iron nickel, or iron nickel molybdenum, and the material has the advantages of high saturation magnetic induction, high frequency, low loss, and the like, and can be applied under wider use conditions. Preferably, the molding pressure for pressing the alloy soft magnetic powder is 15-20T/cm2Under the condition, the density of the magnetic core formed by the square magnetic core can reach 5.8-6.9 g/cm3, and the magnetic permeability of the finally manufactured patch inductor is more than 90 mu, and even more than 147 mu.
After the square magnetic core is formed, the square magnetic core is molded according to the requirementThe alloy soft magnetic sheet 1 with the required thickness is cut, and the requirements on the design and the volume of the chip inductor under different use conditions can be met. In this embodiment, the thickness of the alloy soft magnetic sheet 1 is 0.05-0.3 mm. And then processing a through hole 2 on the alloy soft magnetic sheet 1, and printing conductive silver paste to form a silver paste circuit, wherein the conductive silver paste occupies a small volume and has small internal resistance, so that the DCR of the final chip inductor is low. The conductive silver paste contains Ag or Ag2The slurry of O has good conductive effect and low internal resistance. It should be noted that not all the alloy soft magnetic sheets 1 need to be punched, and the alloy soft magnetic sheet 1 used as the bottom layer of the chip inductor does not need to be punched. And finally, repeatedly printing silver paste circuits 3 for many times and stacking and bonding the alloy soft magnetic sheets 1, wherein the silver paste circuits 3 on two adjacent alloy soft magnetic sheets 1 are communicated through conductive silver paste in the through holes 2 of the alloy soft magnetic sheets 1 so as to form a spiral conductive coil, and the printed silver paste circuits 3 are coated by the alloy soft magnetic sheets 1 without the phenomenon of exposed magnetic leakage.
The alloy soft magnetic powder is subjected to insulation treatment before being pressed, so that the eddy current loss of the subsequent chip inductor is reduced. Specifically, the insulation treatment may be a phosphating treatment of the alloy soft magnetic powder with 0.05 to 0.8 wt% of phosphoric acid. Certainly, the insulation treatment can also be to add 0.1-0.8 wt% of high-temperature resin adhesive into the alloy soft magnetic powder, the high-temperature resin adhesive particles can be coated on the surface of the alloy soft magnetic powder to achieve an insulation effect, and the 0.1-0.8 wt% of high-temperature resin adhesive can slightly reduce the magnetic permeability of the alloy soft magnetic powder, but can reduce the eddy current loss of the material and improve the pressure resistance to a certain extent, and the improvement of the magnetic permeability of the high-density square magnetic core formed under high pressure can completely compensate the reduction of the magnetic permeability brought by the high-temperature resin adhesive.
In order to further reduce the hysteresis loss of the final chip inductor, high-temperature annealing treatment is carried out on the square magnetic core before cutting. The high-temperature annealing can remove the internal stress and coercive force of the square magnetic core during high-pressure molding, thereby reducing the loss of the manufactured chip inductor. Preferably, the annealing temperature of the square magnetic core is 600-800 ℃, and at the temperature, the forming stress and the coercive force in the square magnetic core can be well removed, and the high-temperature resin can not be carbonized and disappear and can still be attached to the surface of the alloy soft magnetic powder to play an insulating effect.
Preferably, the square magnetic core is put into a resin solution in a vacuum atmosphere for infiltration treatment at the end of high temperature annealing and before being cut into the alloy soft magnetic sheet 1. The square magnetic core inevitably has certain hole inside when compression moulding, and after the square magnetic core placed vacuum atmosphere's resin solution in, resin material can fill and get into in the hole, not only can not reduce the density of square magnetic core and influence magnetic permeability, and can suitably improve the intensity and the toughness of square magnetic core for the square magnetic core is difficult for taking place brittle failure when the cutting.
In order to avoid the magnetic conductivity of the alloy soft magnetic sheet 1 after the silver paste circuit is printed from being greatly reduced in the bonding process, the next alloy soft magnetic sheet 1 is bonded on the alloy soft magnetic sheet 1 printed with the silver paste circuit 3 through the high-density magnetic composite material, and the high-density magnetic composite material avoids the position of the through hole 2 during coating. After lamination and bonding, the silver paste circuits 3 on the two adjacent alloy soft magnetic sheets 1 are communicated through the conductive silver paste in the through holes 2. Preferably, the high-density magnetic composite material comprises 6-12 wt% of high-temperature resin adhesive and 88-94 wt% of magnetic powder, the density of the material after curing is within the range of 5.5-6.2g/cm3, the material has higher magnetic permeability compared with a common bonding material, and the high-density magnetic composite material has an insulating effect and can insulate the alloy soft magnetic sheets 1.
In order to improve the production efficiency of the chip inductor and realize batch production, a plurality of silver paste circuits 3 are printed on each alloy soft magnetic sheet 1, and the alloy soft magnetic sheets 1 printed with the silver paste circuits 3 are cut into a plurality of inductor bodies 6 by taking the silver paste circuits 3 as a unit after being laminated and bonded, so that each layer of laminated gold soft magnetic sheets 1 of each inductor body 6 is not required to be independently printed, and the production efficiency is greatly improved.
After the inductor 6 is cut, as shown in fig. 3, the electrodes 7 are connected to both ends of the inductor 6, and the chip inductor is manufactured. For connecting electrodes 7 at both ends of inductor 6 with the inside of inductor 6The silver paste circuits 3 are communicated, and after the silver paste circuits 3 are printed on the alloy soft magnetic sheets 1, the leading-out silver pastes 4 are respectively printed on the alloy soft magnetic sheets 1 on the uppermost layer and the lowermost layer. Specifically, one end of the lead-out silver paste 4 is connected with the silver paste circuit 3, and the other end extends to the edge of the alloy soft magnetic sheet 1. The lead-out silver paste 4 communicated with the silver paste circuit 3 at the uppermost layer and the lead-out silver paste 4 communicated with the silver paste circuit 3 at the lowermost layer are respectively positioned at two ends of the inductor body 6, and each lead-out silver paste 4 is communicated with one electrode 7. In this embodiment, the silver paste 4 containing Ag or Ag is used2And printing conductive silver paste of O.
Preferably, the uppermost layer is provided with a sealing cover 5 according to the requirement of the inductor, and the sealing cover 5 is located at the uppermost layer of the chip inductor and is used for covering the silver paste circuit 3 at the uppermost layer. Specifically, in this embodiment, the cover 5 is made of an alloy soft magnetic sheet without holes and printed with silver paste circuits 3, and the cover 5 is bonded to the alloy soft magnetic sheet 1 printed with the silver paste circuits 3 at the uppermost layer by using the above-mentioned high-density magnetic composite material.
The manufacturing method of the chip inductor comprises the following specific steps:
s1, adding 0.1-0.8 wt% of high-temperature resin adhesive into the alloy soft magnetic powder for insulation treatment;
s2, pressing the alloy soft magnetic powder after the insulation treatment into a square magnetic core;
s3, carrying out high-temperature annealing treatment on the square magnetic core;
s4, placing the square magnetic core into resin solution in vacuum atmosphere for infiltration treatment;
s5, cutting the square magnetic core into alloy soft magnetic sheets 1;
s6, processing a through hole 2 on the alloy soft magnetic sheet 1;
s7, printing conductive silver paste on the alloy soft magnetic sheet 1 to form a plurality of silver paste circuits 3, wherein the conductive silver paste covers and fills the through holes 2;
s8, coating a high-density magnetic composite material on the silver paste circuit 3 by avoiding the through hole 2, and stacking and bonding the next alloy soft magnetic sheet 1;
s9, repeating the steps of printing the silver paste circuit 3 and stacking the bonding alloy soft magnetic sheets 1 for multiple times, and printing the lead-out silver pastes 4 on the alloy soft magnetic sheets 1 at the uppermost layer and the lowermost layer;
s10, adhering a sealing cover 5 on the topmost silver paste circuit 3;
s11, cutting the laminated and bonded alloy soft magnetic sheet 1 into a plurality of inductors 6 by taking the silver paste circuit 3 as a unit;
and S12, connecting electrodes 7 at two ends of the inductor 6 to form a patch inductor.
The embodiment also provides a chip inductor, and the chip inductor is manufactured by adopting the manufacturing method of the chip inductor. As shown in fig. 2, the chip inductor includes the alloy soft magnetic sheet 1 laminated and bonded and printed with the silver paste circuits 3, the adjacent two layers of silver paste circuits 3 are communicated through the conductive silver paste arranged in the through holes 2 on the alloy soft magnetic sheet 1, the leading-out silver paste 4 is printed at the end portions of the silver paste circuits of the uppermost layer and the lowermost layer of alloy soft magnetic sheet 1, the inductor 6 is formed after the sealing cover 5 is bonded on the uppermost layer of alloy soft magnetic sheet 1, the leading-out silver paste 4 extends to the side surface of the inductor 6, and as shown in fig. 3, the electrodes 7 are connected to two ends of the inductor 6 and are respectively connected with one leading-out. The chip inductor has high inductance, small DCR, low loss and good anti-electromagnetic interference effect.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the invention and are not to be construed as limitations of the embodiments of the present invention, but may be modified in various embodiments and applications by those skilled in the art according to the spirit of the present invention, and the content of the present description should not be construed as a limitation of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A method for manufacturing a chip inductor is characterized by comprising the following steps:
insulating the alloy soft magnetic powder and pressing into a square magnetic core;
cutting the square magnetic core into alloy soft magnetic sheets (1);
processing a through hole (2) on the alloy soft magnetic sheet (1);
printing conductive silver paste on the alloy soft magnetic sheet (1) to form a silver paste circuit (3), wherein the conductive silver paste covers and fills the through hole (2);
stacking and bonding the next alloy soft magnetic sheet (1) on the silver paste circuit (3);
the steps of printing the silver paste circuit (3) and stacking and bonding the alloy soft magnetic sheets (1) are repeated for multiple times, and the silver paste circuits (3) on the two adjacent alloy soft magnetic sheets (1) are communicated through the through holes (2) and are made into a chip inductor.
2. The method for manufacturing a chip inductor according to claim 1, wherein the insulation treatment is:
adding 0.1-0.8 wt% of high-temperature resin adhesive into the alloy soft magnetic powder; or
And phosphating the alloy soft magnetic powder by adopting 0.05-0.8 wt% of phosphoric acid.
3. The method for manufacturing a chip inductor according to claim 1, wherein the alloy soft magnetic powder comprises one or more of iron silicon, iron silicon aluminum, iron nickel molybdenum, and iron silicon chromium.
4. The method of manufacturing a chip inductor according to claim 1, wherein a high temperature annealing process is performed before the dicing of the square magnetic core.
5. The method of manufacturing a patch inductor according to claim 1, wherein the square magnetic core is subjected to a dipping treatment in a resin solution in a vacuum atmosphere before the square magnetic core is cut.
6. The method for manufacturing a chip inductor according to claim 1, wherein a next alloy soft magnetic sheet (1) is bonded to the alloy soft magnetic sheet (1) printed with the silver paste circuit (3) through a high-density magnetic composite material, and the high-density magnetic composite material is coated so as to avoid the position of the through hole (2).
7. The method for manufacturing a chip inductor according to claim 6, wherein the high-density magnetic composite material comprises 6-12 wt% of high-temperature resin adhesive and 88-94 wt% of magnetic powder.
8. A method for manufacturing a chip inductor according to any one of claims 1 to 7, wherein a plurality of silver paste circuits (3) are printed on each of the alloy soft magnetic sheets (1), and the alloy soft magnetic sheets (1) printed with the silver paste circuits (3) are laminated and bonded and then cut into a plurality of inductor bodies (6) in units of the silver paste circuits (3).
9. The method for manufacturing a chip inductor according to claim 8, wherein electrodes (7) are connected to two ends of the inductor body (6) to form the chip inductor, and the electrodes (7) are communicated with the silver paste circuit (3).
10. A chip inductor, characterized in that the chip inductor is manufactured by the manufacturing method of the chip inductor according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010264353.8A CN111354562A (en) | 2020-04-07 | 2020-04-07 | Manufacturing method of chip inductor and chip inductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010264353.8A CN111354562A (en) | 2020-04-07 | 2020-04-07 | Manufacturing method of chip inductor and chip inductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111354562A true CN111354562A (en) | 2020-06-30 |
Family
ID=71196451
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010264353.8A Pending CN111354562A (en) | 2020-04-07 | 2020-04-07 | Manufacturing method of chip inductor and chip inductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111354562A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113963928A (en) * | 2021-11-30 | 2022-01-21 | 横店集团东磁股份有限公司 | Power inductor and preparation method thereof |
| CN114597015A (en) * | 2022-03-16 | 2022-06-07 | 深圳市铂科新材料股份有限公司 | Laminated inductor and preparation method and application thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118797A (en) * | 2006-08-04 | 2008-02-06 | 安泰科技股份有限公司 | Composite powder, magnetic powder core for magnetic powder and preparation method thereof |
| JP2011504662A (en) * | 2008-03-11 | 2011-02-10 | チャン ソン コーポレイション | Multilayer power inductor using a sheet filled with soft magnetic metal powder |
| CN102231452A (en) * | 2011-04-15 | 2011-11-02 | 深圳市麦捷微电子科技股份有限公司 | Low temperature co-fired ceramic (LTCC) filter production process and LTCC filter |
| CN103887053A (en) * | 2014-04-10 | 2014-06-25 | 深圳市宏业翔科技有限公司 | Method for manufacturing multi-layer inductor |
| CN104867640A (en) * | 2015-05-29 | 2015-08-26 | 深圳市铂科磁材有限公司 | Novel high-density magnetic composite material for inductor |
| CN105097162A (en) * | 2014-05-04 | 2015-11-25 | 惠州铂科磁材有限公司 | Technology method for soft magnetic product immersion |
| CN107578876A (en) * | 2017-10-17 | 2018-01-12 | 德清森腾电子科技有限公司 | A kind of manufacturing process of ferro-silicium soft-magnetic composite material |
| KR20180084410A (en) * | 2017-01-17 | 2018-07-25 | (주)제이엠씨 | Soft magnetic ribbon core with amorphous and nanocrystalline phases |
| CN110085385A (en) * | 2019-06-03 | 2019-08-02 | 马鞍山新康达磁业有限公司 | A kind of high magnetic permeability composite powder and preparation method thereof |
-
2020
- 2020-04-07 CN CN202010264353.8A patent/CN111354562A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101118797A (en) * | 2006-08-04 | 2008-02-06 | 安泰科技股份有限公司 | Composite powder, magnetic powder core for magnetic powder and preparation method thereof |
| JP2011504662A (en) * | 2008-03-11 | 2011-02-10 | チャン ソン コーポレイション | Multilayer power inductor using a sheet filled with soft magnetic metal powder |
| CN102231452A (en) * | 2011-04-15 | 2011-11-02 | 深圳市麦捷微电子科技股份有限公司 | Low temperature co-fired ceramic (LTCC) filter production process and LTCC filter |
| CN103887053A (en) * | 2014-04-10 | 2014-06-25 | 深圳市宏业翔科技有限公司 | Method for manufacturing multi-layer inductor |
| CN105097162A (en) * | 2014-05-04 | 2015-11-25 | 惠州铂科磁材有限公司 | Technology method for soft magnetic product immersion |
| CN104867640A (en) * | 2015-05-29 | 2015-08-26 | 深圳市铂科磁材有限公司 | Novel high-density magnetic composite material for inductor |
| KR20180084410A (en) * | 2017-01-17 | 2018-07-25 | (주)제이엠씨 | Soft magnetic ribbon core with amorphous and nanocrystalline phases |
| CN107578876A (en) * | 2017-10-17 | 2018-01-12 | 德清森腾电子科技有限公司 | A kind of manufacturing process of ferro-silicium soft-magnetic composite material |
| CN110085385A (en) * | 2019-06-03 | 2019-08-02 | 马鞍山新康达磁业有限公司 | A kind of high magnetic permeability composite powder and preparation method thereof |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113963928A (en) * | 2021-11-30 | 2022-01-21 | 横店集团东磁股份有限公司 | Power inductor and preparation method thereof |
| CN114597015A (en) * | 2022-03-16 | 2022-06-07 | 深圳市铂科新材料股份有限公司 | Laminated inductor and preparation method and application thereof |
| CN114597015B (en) * | 2022-03-16 | 2024-01-09 | 深圳市铂科新材料股份有限公司 | Laminated inductor and preparation method and application thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6062691B2 (en) | Sheet-shaped inductor, multilayer substrate built-in type inductor, and manufacturing method thereof | |
| KR101662208B1 (en) | Power inductor and method of manufacturing the same | |
| KR101983136B1 (en) | Power inductor and manufacturing method thereof | |
| KR101503967B1 (en) | Laminated Inductor and Manufacturing Method Thereof | |
| KR101922871B1 (en) | Multilayered electronic component, manufacturing method thereof and board having the same mounted thereon | |
| KR101662206B1 (en) | Power inductor | |
| KR20140061036A (en) | Multilayered power inductor and method for preparing the same | |
| US20140285304A1 (en) | Inductor and method for manufacturing the same | |
| US20130214889A1 (en) | Multilayer type inductor and method of manufacturing the same | |
| CN111354562A (en) | Manufacturing method of chip inductor and chip inductor | |
| KR20160076656A (en) | Power inductor and method for manufacturing the same | |
| CN111243814A (en) | Copper sheet embedded soft magnetic powder core inductor and preparation method and application thereof | |
| CN110828108A (en) | Magnetic matrix containing metal magnetic particles and electronic component containing the same | |
| JP6456729B2 (en) | Inductor element and manufacturing method thereof | |
| JP2021174937A (en) | Coil component | |
| CN104078204B (en) | Inductor and the method for manufacturing it | |
| TW202211265A (en) | Electronic component and method for manufacturing the same | |
| KR20140121809A (en) | Inductor and method for manufacturing the same | |
| CN219393092U (en) | Composite inductor | |
| KR100596502B1 (en) | Multilayered chip-type power inductor and manufacturing method thererof | |
| JP3177893B2 (en) | Surface mount electronic components | |
| US20220277884A1 (en) | Coil component, circuit board, electronic device, and method of manufacturing coil component | |
| CN216597243U (en) | Inductor | |
| CN110233029B (en) | Large-inductance laminated chip inductor and design method thereof | |
| CN116052985A (en) | Composite inductor and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200630 |