CN111334200B - 一种封装胶膜及其制备方法 - Google Patents
一种封装胶膜及其制备方法 Download PDFInfo
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- CN111334200B CN111334200B CN202010291985.3A CN202010291985A CN111334200B CN 111334200 B CN111334200 B CN 111334200B CN 202010291985 A CN202010291985 A CN 202010291985A CN 111334200 B CN111334200 B CN 111334200B
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- 229920005989 resin Polymers 0.000 claims abstract description 53
- 239000011347 resin Substances 0.000 claims abstract description 53
- 239000011159 matrix material Substances 0.000 claims abstract description 49
- 230000007797 corrosion Effects 0.000 claims abstract description 36
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 35
- 239000002981 blocking agent Substances 0.000 claims abstract description 25
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- NLFBCYMMUAKCPC-KQQUZDAGSA-N ethyl (e)-3-[3-amino-2-cyano-1-[(e)-3-ethoxy-3-oxoprop-1-enyl]sulfanyl-3-oxoprop-1-enyl]sulfanylprop-2-enoate Chemical compound CCOC(=O)\C=C\SC(=C(C#N)C(N)=O)S\C=C\C(=O)OCC NLFBCYMMUAKCPC-KQQUZDAGSA-N 0.000 claims abstract description 5
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- 230000015572 biosynthetic process Effects 0.000 claims description 3
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 claims description 3
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- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 2
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 2
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 2
- NOZAQBYNLKNDRT-UHFFFAOYSA-N [diacetyloxy(ethenyl)silyl] acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)C=C NOZAQBYNLKNDRT-UHFFFAOYSA-N 0.000 claims description 2
- 125000004036 acetal group Chemical group 0.000 claims description 2
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- 125000003172 aldehyde group Chemical group 0.000 claims description 2
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- 239000001110 calcium chloride Substances 0.000 claims description 2
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- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 claims description 2
- 229910017052 cobalt Inorganic materials 0.000 claims description 2
- 239000010941 cobalt Substances 0.000 claims description 2
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 claims description 2
- 229910000365 copper sulfate Inorganic materials 0.000 claims description 2
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 2
- 125000004185 ester group Chemical group 0.000 claims description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 claims description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 2
- WOXXJEVNDJOOLV-UHFFFAOYSA-N ethenyl-tris(2-methoxyethoxy)silane Chemical compound COCCO[Si](OCCOC)(OCCOC)C=C WOXXJEVNDJOOLV-UHFFFAOYSA-N 0.000 claims description 2
- 125000001033 ether group Chemical group 0.000 claims description 2
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- WPBNNNQJVZRUHP-UHFFFAOYSA-L manganese(2+);methyl n-[[2-(methoxycarbonylcarbamothioylamino)phenyl]carbamothioyl]carbamate;n-[2-(sulfidocarbothioylamino)ethyl]carbamodithioate Chemical compound [Mn+2].[S-]C(=S)NCCNC([S-])=S.COC(=O)NC(=S)NC1=CC=CC=C1NC(=S)NC(=O)OC WPBNNNQJVZRUHP-UHFFFAOYSA-L 0.000 claims description 2
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- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 2
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- RIPYNJLMMFGZSX-UHFFFAOYSA-N (5-benzoylperoxy-2,5-dimethylhexan-2-yl) benzenecarboperoxoate Chemical compound C=1C=CC=CC=1C(=O)OOC(C)(C)CCC(C)(C)OOC(=O)C1=CC=CC=C1 RIPYNJLMMFGZSX-UHFFFAOYSA-N 0.000 description 1
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- KOMNUTZXSVSERR-UHFFFAOYSA-N 1,3,5-tris(prop-2-enyl)-1,3,5-triazinane-2,4,6-trione Chemical compound C=CCN1C(=O)N(CC=C)C(=O)N(CC=C)C1=O KOMNUTZXSVSERR-UHFFFAOYSA-N 0.000 description 1
- LMDZBCPBFSXMTL-UHFFFAOYSA-N 1-ethyl-3-(3-dimethylaminopropyl)carbodiimide Chemical compound CCN=C=NCCCN(C)C LMDZBCPBFSXMTL-UHFFFAOYSA-N 0.000 description 1
- CSGAUKGQUCHWDP-UHFFFAOYSA-N 1-hydroxy-2,2,6,6-tetramethylpiperidin-4-ol Chemical compound CC1(C)CC(O)CC(C)(C)N1O CSGAUKGQUCHWDP-UHFFFAOYSA-N 0.000 description 1
- GOAHRBQLKIZLKG-UHFFFAOYSA-N 1-tert-butylperoxybutane Chemical compound CCCCOOC(C)(C)C GOAHRBQLKIZLKG-UHFFFAOYSA-N 0.000 description 1
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- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 description 1
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- HWSSEYVMGDIFMH-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOCCOC(=O)C(C)=C HWSSEYVMGDIFMH-UHFFFAOYSA-N 0.000 description 1
- IQQVCMQJDJSRFU-UHFFFAOYSA-N 2-ethyl-2-(hydroxymethyl)propane-1,3-diol;prop-2-enoic acid Chemical compound OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.OC(=O)C=C.CCC(CO)(CO)CO IQQVCMQJDJSRFU-UHFFFAOYSA-N 0.000 description 1
- SKVOYPCECYQZAI-UHFFFAOYSA-N 2-ethylhexyl 2-methylbutan-2-ylperoxy carbonate Chemical compound CCCCC(CC)COC(=O)OOOC(C)(C)CC SKVOYPCECYQZAI-UHFFFAOYSA-N 0.000 description 1
- BWOITHKYQUJGSB-UHFFFAOYSA-N 2-methylbutan-2-ylperoxycyclohexane Chemical compound CCC(C)(C)OOC1CCCCC1 BWOITHKYQUJGSB-UHFFFAOYSA-N 0.000 description 1
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- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
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- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
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- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- SVYKKECYCPFKGB-UHFFFAOYSA-N N,N-dimethylcyclohexylamine Chemical compound CN(C)C1CCCCC1 SVYKKECYCPFKGB-UHFFFAOYSA-N 0.000 description 1
- CNCOEDDPFOAUMB-UHFFFAOYSA-N N-Methylolacrylamide Chemical compound OCNC(=O)C=C CNCOEDDPFOAUMB-UHFFFAOYSA-N 0.000 description 1
- 238000010547 Norrish type II reaction Methods 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- FMRLDPWIRHBCCC-UHFFFAOYSA-L Zinc carbonate Chemical compound [Zn+2].[O-]C([O-])=O FMRLDPWIRHBCCC-UHFFFAOYSA-L 0.000 description 1
- 239000005083 Zinc sulfide Substances 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- XRMBQHTWUBGQDN-UHFFFAOYSA-N [2-[2,2-bis(prop-2-enoyloxymethyl)butoxymethyl]-2-(prop-2-enoyloxymethyl)butyl] prop-2-enoate Chemical compound C=CC(=O)OCC(COC(=O)C=C)(CC)COCC(CC)(COC(=O)C=C)COC(=O)C=C XRMBQHTWUBGQDN-UHFFFAOYSA-N 0.000 description 1
- VLVZXTNDRFWYLF-UHFFFAOYSA-N [2-ethyl-2-(prop-2-enoyloxymethyl)hexyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CC)(CCCC)COC(=O)C=C VLVZXTNDRFWYLF-UHFFFAOYSA-N 0.000 description 1
- KNSXNCFKSZZHEA-UHFFFAOYSA-N [3-prop-2-enoyloxy-2,2-bis(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical class C=CC(=O)OCC(COC(=O)C=C)(COC(=O)C=C)COC(=O)C=C KNSXNCFKSZZHEA-UHFFFAOYSA-N 0.000 description 1
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 1
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- QUZSUMLPWDHKCJ-UHFFFAOYSA-N bisphenol A dimethacrylate Chemical class C1=CC(OC(=O)C(=C)C)=CC=C1C(C)(C)C1=CC=C(OC(=O)C(C)=C)C=C1 QUZSUMLPWDHKCJ-UHFFFAOYSA-N 0.000 description 1
- 229920001400 block copolymer Polymers 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 238000006555 catalytic reaction Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 229910021419 crystalline silicon Inorganic materials 0.000 description 1
- 125000004093 cyano group Chemical group *C#N 0.000 description 1
- 238000003381 deacetylation reaction Methods 0.000 description 1
- LSXWFXONGKSEMY-UHFFFAOYSA-N di-tert-butyl peroxide Chemical group CC(C)(C)OOC(C)(C)C LSXWFXONGKSEMY-UHFFFAOYSA-N 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000006056 electrooxidation reaction Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
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- 238000011156 evaluation Methods 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 230000002209 hydrophobic effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
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- ZIUHHBKFKCYYJD-UHFFFAOYSA-N n,n'-methylenebisacrylamide Chemical compound C=CC(=O)NCNC(=O)C=C ZIUHHBKFKCYYJD-UHFFFAOYSA-N 0.000 description 1
- NHLUVTZJQOJKCC-UHFFFAOYSA-N n,n-dimethylhexadecan-1-amine Chemical compound CCCCCCCCCCCCCCCCN(C)C NHLUVTZJQOJKCC-UHFFFAOYSA-N 0.000 description 1
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- 229920001194 natural rubber Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
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- 125000004430 oxygen atom Chemical group O* 0.000 description 1
- 239000005022 packaging material Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- QYZLKGVUSQXAMU-UHFFFAOYSA-N penta-1,4-diene Chemical compound C=CCC=C QYZLKGVUSQXAMU-UHFFFAOYSA-N 0.000 description 1
- PNJWIWWMYCMZRO-UHFFFAOYSA-N pent‐4‐en‐2‐one Natural products CC(=O)CC=C PNJWIWWMYCMZRO-UHFFFAOYSA-N 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 229940116351 sebacate Drugs 0.000 description 1
- CXMXRPHRNRROMY-UHFFFAOYSA-L sebacate(2-) Chemical compound [O-]C(=O)CCCCCCCCC([O-])=O CXMXRPHRNRROMY-UHFFFAOYSA-L 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 125000004469 siloxy group Chemical group [SiH3]O* 0.000 description 1
- 229910001923 silver oxide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- GSECCTDWEGTEBD-UHFFFAOYSA-N tert-butylperoxycyclohexane Chemical compound CC(C)(C)OOC1CCCCC1 GSECCTDWEGTEBD-UHFFFAOYSA-N 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- PMQIWLWDLURJOE-UHFFFAOYSA-N triethoxy(1,1,2,2,3,3,4,4,5,5,6,6,7,7,10,10,10-heptadecafluorodecyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)CCC(F)(F)F PMQIWLWDLURJOE-UHFFFAOYSA-N 0.000 description 1
- PKYCTRXXOZUHFK-UHFFFAOYSA-N tris(1,2,2,6,6-pentamethylpiperidin-4-yl) phosphite Chemical compound C1C(C)(C)N(C)C(C)(C)CC1OP(OC1CC(C)(C)N(C)C(C)(C)C1)OC1CC(C)(C)N(C)C(C)(C)C1 PKYCTRXXOZUHFK-UHFFFAOYSA-N 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 239000011667 zinc carbonate Substances 0.000 description 1
- 235000004416 zinc carbonate Nutrition 0.000 description 1
- 229910000010 zinc carbonate Inorganic materials 0.000 description 1
- UGZADUVQMDAIAO-UHFFFAOYSA-L zinc hydroxide Chemical compound [OH-].[OH-].[Zn+2] UGZADUVQMDAIAO-UHFFFAOYSA-L 0.000 description 1
- 229910021511 zinc hydroxide Inorganic materials 0.000 description 1
- 229940007718 zinc hydroxide Drugs 0.000 description 1
- XOOUIPVCVHRTMJ-UHFFFAOYSA-L zinc stearate Chemical compound [Zn+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O XOOUIPVCVHRTMJ-UHFFFAOYSA-L 0.000 description 1
- 229910052984 zinc sulfide Inorganic materials 0.000 description 1
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C48/00—Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
- B29C48/16—Articles comprising two or more components, e.g. co-extruded layers
- B29C48/18—Articles comprising two or more components, e.g. co-extruded layers the components being layers
- B29C48/21—Articles comprising two or more components, e.g. co-extruded layers the components being layers the layers being joined at their surfaces
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/10—Adhesives in the form of films or foils without carriers
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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Abstract
本发明公开了一种封装胶膜及其制备方法。该封装胶膜包括阻隔层和抗腐蚀层,所述阻隔层包括基体树脂和阻水剂,所述阻水剂为含有能与水形成氢键的官能团的化合物Ⅰ或能与水发生化合反应的化合物Ⅱ或能吸附水形成结晶水的化合物Ⅲ;所述抗腐蚀层包括基体树脂和抗腐蚀助剂,所述抗腐蚀助剂的比表面积为70~180m2/g,所述基体树脂的密度为0.825~1.125g/cm3,基体树脂的熔融指数为0.5~45g/10min。本发明的封装胶膜具有较好的抗腐蚀性和粘结性,且制备工艺简单,成本低。
Description
技术领域
本发明属于光伏组件封装领域,特别是涉及一种封装胶膜及其制备方法。
背景技术
光伏组件在高温、高湿及光照的条件下使用时,湿气或水逐渐深入组件内部,在光和热的作用下,EVA发生Norrish typeⅡ脱乙酰反应,产生醋酸。在醋酸存在的环境下,锡铜焊带的两种金属之间形成电势电位差,电势电位低的金属将被腐蚀。涂锡铜焊带中两种金属的标准电极电位分别是Sn2+:-0.136V,Pb2+:-0.126V,两者电位虽然相近,但仍可能发生电化学腐蚀使涂锡铜焊带黄变。另外,EVA 交联一般由过氧化物引发,由于层压工艺的限制,组件不可避免地有过氧化物的残留,当EVA 胶膜的醋酸含量累积过高时,醋酸与EVA 中残留的过氧化物交联剂反应,形成氢过氧化物,氢过氧化物活性较高,与之接触的银被腐蚀成黑色的氧化银,晶体硅电池表面的银栅线被氧化而变黑。醋酸还能腐蚀电池的铝背场,降低铝背场与硅片的附着力,严重影响电池的电性能,降低组件的输出功率,组件的耐久性也降低。
因此,为了防止组件内部焊带、汇流条和金属栅线等的腐蚀,同时保持组件输出功率的稳定,延长组件使用寿命,因此亟待解决光伏封装EVA胶膜水解产生的醋酸等对组件内部的金属腐蚀,解决方案需要双官齐下:一方面除去体系中进入的水汽,另一方面除去产生的醋酸。
目前,专利CN102318080 B提供一种太阳能电池密封膜,通过加入pH大于9.0的水滑石作为吸附剂,来抑制导线、电极生锈,但水滑石价格相对较贵,增加了密封膜的生产成本。专利CN101542748 B公开一种太阳能电池密封膜,该EVA薄膜受光侧含有酸吸收剂氢氧化镁,背光侧含有酸吸收剂氢氧化镁、氧化镁、氢氧化钙等,此类酸吸收剂为极性无机物,表面能大,表面活性高,与乙烯-醋酸乙烯酯共聚物 (EVA) 的相容性很差,易造成界面缺陷,导致材料性能下降,不能很好的保证太阳能电池的耐久性,同时此类酸吸收剂的加入会造成EVA胶膜的透光率降低,进而引起组件的光电转换效率降低。
发明内容
本发明的目的是弥补现有技术的不足,提供一种封装胶膜及其制备方法。
本发明通过对阻隔层和抗腐蚀层进行配方优化设计,一方面,通过阻隔层优异的阻水锁水性能避免外界水汽的侵蚀,阻断光伏封装胶膜中的EVA水解产生醋酸;另一方面,利用抗腐蚀层的抗腐蚀助剂与EVA水解产生的醋酸进行反应,减少或消除体系中的醋酸,杜绝引起焊带、汇流条和金属栅线等金属腐蚀;另外,抗腐蚀助剂与醋酸反应产生的水可以通过阻隔层的阻水剂进一步锁定,与抗腐蚀助剂协同作用阻水阻酸双管齐下层层递进保护,提高抗腐蚀效果,避免焊带、汇流条等金属生锈,抑制由于组件腐蚀而引起的功率衰减,延长组件的使用寿命,达到光伏组件降本提效的目的。
为了达到上述的目的,本发明采取以下技术方案:
一种封装胶膜,至少包括阻隔层和抗腐蚀层,所述阻隔层包括基体树脂和阻水剂,所述基体树脂与阻水剂的质量比为100:0.1~15,所述阻水剂为含有能与水形成氢键的官能团的化合物Ⅰ或能与水发生化合反应的化合物Ⅱ或能吸附水形成结晶水的化合物Ⅲ;所述阻隔层的水汽透过率低于3.0g/m2 ▪24h;所述抗腐蚀层包括基体树脂和抗腐蚀助剂。
进一步地,所述抗腐蚀层的基体树脂和抗腐蚀助剂的质量比为100:0.001~40。
进一步地,所述化合物Ⅰ的官能团包括酰胺基、醛基、羟基、羰基、羧基、巯基、缩醛基、酯基、醚基、硅氧基中的一种或多种;具体如低聚硅氧烷、聚丙烯酰胺、N,N'-亚甲基双丙烯酰胺、羟甲基丙烯酰胺、羟乙基丙烯酰胺、N,N-二甲基丙烯酰胺,N,N-二甲基苄胺、N,N-二甲基环己胺、三亚乙基二胺、N',N',N',N-四甲基亚烷基二胺、N',N',N',N-五甲基二亚乙基三胺、三乙胺、N',N-二甲基十六胺、N',N-二甲基丁胺、二环己基碳二亚胺、1-乙基-(3-二甲基氨基丙基)碳酰二亚胺、纳米蒙脱土、聚丙烯酸盐、聚甲基丙烯酸盐、乙烯-甲基丙烯酸盐、乙烯-甲基丙烯酸共聚物、含氟化合物、硬脂酸锌、甲基丙烯酸十三氟辛酯、十七氟癸基三乙氧基硅烷。这些分子中心原子都含有孤对电子且原子半径较小易与水中的氢氧原子形成分子间氢键。
进一步地,所述化合物Ⅱ为氧化钡、氧化钙、氧化镁中的一种或多种。
进一步地,所述化合物Ⅲ为硫酸钙、硫酸锌、硫酸铜、硫酸镁、氯化钙中的一种或多种。
进一步地,所述抗腐蚀助剂为金属氧化物、氢氧化物、金属碳酸盐或双金属氢氧化物中的一种或多种,所述抗腐蚀助剂的比表面积为70~180m2/g。
进一步地,所述抗腐蚀助剂为选自铝,锆,钒,钼,锰,铁,钴,镍,钯,铜,锌,锡,锑,钛或其组合的氧化物、氢氧化物、金属碳酸盐或双金属氢氧化物。所述抗腐蚀助剂优选为硅烷偶联剂改性的氢氧化镁、氢氧化钙、氢氧化锌、氢氧化钡、氢氧化铝、氧化镁、氧化钙、氧化锌、氧化钡、氧化铝、碳酸镁、碳酸钙、碳酸锌、碳酸钡和水滑石中的一种或多种。
进一步地,所述抗腐蚀助剂通过硅烷偶联剂改性处理,所述硅烷偶联剂为氨丙基三乙氧基硅烷、氨丙基三甲氧基硅烷、乙烯基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三过氧化叔丁基硅烷、乙烯基三乙酰氧基硅烷、异丁基三乙氧基硅烷、乙烯基三(β-甲氧基乙氧基)硅烷、γ-缩水甘油醚氧丙基三甲氧基硅烷、γ-甲基丙烯酰氧丙基三甲氧基硅烷中的一种或多种。
进一步地,所述基体树脂为乙烯与一种或多种单体的共聚物;所述基体树脂的密度为0.825~1.125g/cm3,基体树脂的熔融指数为0.5~45g/10min。
优选的,所述基体树脂中所述单体为乙酸乙烯酯、丙烯酸甲酯、丙烯酸乙酯、甲基丙烯酸甲酯、α-烯烃、丁二烯、1,4-戊二烯、异戊二烯、乙叉降冰片烯、双环戊二烯、1,4-己二烯的二元或者多元共聚物、聚乙烯醇缩丁醛、丁二烯/异戊二烯与苯乙烯的嵌段共聚物、天然橡胶或反式聚异戊二烯橡胶。
优选的,所述阻隔层基体树脂为乙烯-α-烯烃共聚物。所述乙烯-α-烯烃共聚物由乙烯与一个或多个碳原子数为3~20的α-烯烃通过茂金属催化聚合得到。所述α-烯烃选自丙烯、1-丁烯、1-戊烯、1-己烯、3-甲基-1-丁烯、3,3-二甲基-1-丁烯、4-甲基-1-戊烯、1-辛烯、1-癸烯、1-十二碳烯。烯烃水汽阻隔性优于乙烯-乙酸乙烯酯。
优选的,所述抗腐蚀层的基体树脂为乙烯-乙酸乙烯酯,以降低共挤胶膜的成本。
所述基体树脂的密度为0.825~1.125g/cm3,熔融指数为0.5~45g/10min,优选为3~20g/10min,更优选为5~10g/10min。
所述的基体树脂可以进行改性处理,即可以是通过活性基团改性的乙烯共聚物,优选的,将活性基团通过单体参与共聚或自由基引发的接枝反应的方式引入改性树脂分子链,所述活性基团的含量为改性树脂的0.5~8wt%。通过对基体树脂进行改性,提高基体树脂与阻水剂或抗腐蚀助剂的相容性,很好的保证太阳能电池的耐久性。
更优选的,所述活性基团包括酸酐基、异氰酸酯基、硅烷偶联基、酰氯基、氨基、羧基、羟基、巯基、磺酸基、环氧基或氰基。
优选的,所述抗腐蚀层和阻隔层还包括其他常规助剂,如颜料、有机过氧化物、助交联剂、紫外光吸收剂、光稳定剂等。
优选的,所述颜料选自二氧化钛、二氧化硅、中空玻璃微珠、氧化锌、硫化锌、掺铝氧化锌、氧化铟锡、氧化锑锡、三氧化二锑、碳酸钙、硫酸钡、蒙脱土、高岭土、滑石粉、长石粉、炭黑、石墨烯、氧化石墨烯、铜铬黑、氮化硼和碳化硅中的一种或多种;更优选的,所述颜料为成本较低的碳酸钙。
所述的有机过氧化物交联剂由下列中的一种或者多种按任意比例混合组成:叔丁基过氧化碳酸异丙酯、2,5-二甲基-2,5-(双叔丁过氧基)己烷、叔丁基过氧化碳酸-2-乙基己酯、1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷、1,1-双(叔戊基过氧)-3,3,5-三甲基环己烷、1,1-双(叔戊基过氧)环己烷、1,1-双(叔丁基过氧)环己烷、2,2-双(叔丁基过氧)丁烷、过氧化2-乙基己基碳酸叔戊酯、2,5-二甲基2,5-二甲基2,5-二甲基2,5-双(苯甲酰过氧)-己烷、过氧化碳酸叔戊酯、过氧化3,3,5三甲基己酸叔丁酯。
所述助交联剂由下列中的一种或者多种按任意配比混合组成:三烯丙基异氰尿酸酯、三聚氰酸三烯丙酯、三羟甲基丙烷三丙烯酸酯、三羟甲基丙烷三甲基丙烯酸酯、季戊四醇三丙烯酸酯、三(2-羟乙基)异氰脲酸三丙烯酸酯、乙氧化三羟甲基丙烷三丙烯酸酯、丙氧化三羟甲基丙烷三丙烯酸酯、乙氧化甘油三丙烯酸酯、丙氧化甘油三丙烯酸酯、季戊四醇四丙烯酸酯、乙氧化季戊四醇四丙烯酸酯、三羟甲基丙烷四丙烯酸酯、双三羟甲基丙烷四丙烯酸酯、双三羟甲基丙烷四甲基丙烯酸酯、丙氧化季戊四醇四丙烯酸酯、2,4,6-三(2-丙烯基氧基)-1,3,5-三嗪、三环葵烷二甲醇二丙烯酸酯、丙氧化新戊二醇二丙烯酸酯、乙氧化双酚A二丙烯酸酯、乙氧化双酚A二甲基丙烯酸酯、2-丁基-2-乙基-1,3-丙二醇二丙烯酸酯、二乙二醇二甲基丙烯酸酯、三乙二醇二甲基丙烯酸酯、聚乙二醇二甲基丙烯酸酯。
所述光稳定剂由下列中的一种或者多种按任意配比混合组成:双(2,2,6,6-四甲基-4-哌啶基)葵二酸酯、双(1-辛氧基-2,2,6,6-四甲基-4-哌啶基)葵二酸酯、4-(甲基)丙烯酰氧基-2,2,6,6-四甲基哌啶与α-烯类单体聚合得到的接枝共聚物、4-羟基-2,2,6,6-四甲基-1-哌啶醇、3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯、葵二酸双-2,2,6,6-四甲基哌啶醇和三(1,2,2,6,6-五甲基-4-哌啶基)亚磷酸酯。
所述紫外光吸收剂由以下物质中的一种或多种按照任意配比混合组成:2-羟基-4-正辛氧基二苯甲酮、2,2-四亚甲基双(3,1-苯并噁嗪-4-酮)、2-(2’-羟基-5-甲基苯基)苯并***、2,2’-二羟基-4,4’-二甲氧基二苯甲酮。
本发明还提供了一种上述的封装胶膜的制备方法:将阻隔层和抗腐蚀层的材料分别混匀后,加入不同的挤出机,粘结层的挤出物料、抗腐蚀层的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过包括熔融挤出、流延成膜、冷却、分切和收卷的工序得到所述封装胶膜。
本发明具有以下技术特点:
1)本发明的封装胶膜的阻隔层含有阻水剂,一方面可以阻止外界水汽对电池片的侵蚀,另一方面可以锁定抗腐蚀助剂与醋酸产生的水,避免焊带、汇流条等金属生锈,进一步与抗腐蚀助剂协同作用提高抗腐蚀效果。
2)本发明的抗腐蚀助剂为金属氧化物、氢氧化物、金属碳酸盐或双金属氢氧化物中的一种或多种,此类抗腐蚀助剂可以与分解的醋酸发生反应,减少乃至消除醋酸。其中,优选的硅烷偶联剂改性的金属氧化物、金属氢氧化物、金属碳酸盐和双金属氢氧化物。本发明的抗腐蚀助剂一方面由于疏水改性能够减少与醋酸反应,甚至消除光伏封装体系中的醋酸,杜绝引起焊带、汇流条和金属栅线等金属腐蚀的源头,抑制由于组件腐蚀而引起的功率衰减;另一方面,硅烷偶联剂改性抗腐蚀助剂可以与基体树脂如EVA间形成键合,提高改性抗腐蚀助剂与基体树脂粒子的相容性,使改性抗腐蚀助剂在基体树脂母粒中均匀分散,进一步提高了抗腐蚀助剂的抗腐蚀效果。
3)本发明的封装胶膜通过多层共挤的方法制备而成,能够有效减少填料的使用量,达到降低成本的目的,阻隔层的阻水剂与抗腐蚀层的抗腐蚀助剂协同作用阻水阻酸双管齐下层层递进保护,提高抗腐蚀效果,避免焊带、汇流条等金属生锈,抑制由于组件腐蚀而引起的功率衰减,延长组件的使用寿命,达到光伏组件降本提效的目的。
具体实施方式
为使本发明实施例的目的、技术方案和优点更加清楚,下面将对本发明实施例的技术方案进行清楚、完整的描述。显然,所描述的实施例是本发明的一部分实施例,而不是全部的实施例。基于所描述的本发明的实施例,本领域普通技术人员在无需创造性劳动的前提下所获得的所有其他实施例,都属于本发明的保护范围。
除非另作定义,本公开所使用的技术术语或者科学术语应当为本发明所属领域内有一般技能的人士所理解的通常意义。
本发明具体实施方式中的封装胶膜通过如下方法制备得到:
将阻隔层和抗腐蚀层的材料分别混匀后,加入不同的挤出机,阻隔层的挤出物料、抗腐蚀层的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过包括熔融挤出、流延成膜、冷却、分切和收卷的工序得到所述封装胶膜。
本发明具体实施方式中各个实施例的组分含量如下表所示:
实施例1
阻隔层的原料:以重量份计,取100份基体树脂乙烯-己烯共聚物(美国陶氏),加入1.5份阻水剂N,N-二甲基丙烯酰胺,0.5份交联剂叔丁基过氧化碳酸异丙酯,0.5份助交联剂三羟甲基丙烷三甲基丙烯酸酯。
抗腐蚀层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为29 wt%,美国杜邦),加入20份甲基丙烯酰氧基丙基三甲氧基硅烷改性的氢氧化镁(5wt%)(比表面积160m2/g),0.5份交联剂叔丁基过氧化碳酸异丙酯,0.5份助交联剂三羟甲基丙烷三甲基丙烯酸酯。
将上述阻隔层的原料与抗腐蚀层的原料各自混匀后,加入不同的挤出机。所述阻隔层的挤出物料、抗腐蚀层的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备双层复合光伏共挤胶膜,记为E1,通过分配器计算可知阻隔层厚度为0.2mm,抗腐蚀层厚度0.3mm。
实施例2
阻隔层的原料:以重量份计,取20份基体树脂乙烯-辛烯共聚物(美国陶氏),80份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为28 wt%,美国杜邦),加入15份阻水剂低聚硅氧烷,0.8份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.8份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯。
抗腐蚀层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为22 wt%,美国杜邦),加入40份乙烯基三甲氧基硅烷改性的氢氧化钙 (比表面积100m2/g),0.8份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.8份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯。
将上述阻隔层的原料与抗腐蚀层的原料各自混匀后,加入不同的挤出机。所述阻隔层的挤出物料、抗腐蚀层的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备双层复合光伏共挤胶膜,记为E2,通过分配器计算可知阻隔层厚度为0.3mm,抗腐蚀层厚度0.2mm。
实施例3
阻隔层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为26 wt%,美国杜邦),加入15份阻水剂硫酸镁,0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
抗腐蚀层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为22 wt%,美国杜邦),加入10份氢氧化镁 (比表面积80m2/g),0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
将上述阻隔层的原料与抗腐蚀层的原料各自混匀后,加入不同的挤出机。所述阻隔层的挤出物料、抗腐蚀层的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备双层复合光伏共挤胶膜,记为E3,通过分配器计算可知阻隔层厚度为0.1mm,抗腐蚀层厚度0.4mm。
实施例4
阻隔层的原料:以重量份计,取100份基体树脂乙烯-3-甲基-1-丁烯共聚物(美国陶氏),加入5份阻水剂纳米蒙脱土,0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
抗腐蚀层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为22 wt%,美国杜邦),加入5份乙烯基三过氧化叔丁基硅烷改性的氢氧化锌 (比表面积40m2/g),0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
粘结层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为26 wt%,美国杜邦),加入0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的异丁基三乙氧基硅烷,0.2份2-(2’-羟基-5-甲基苯基)苯并***,0.3质量份3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯。
将上述阻隔层的原料、抗腐蚀层的原料和粘结层的原料各自混匀后,加入不同的挤出机。所述阻隔层、抗腐蚀层和粘结层的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备三层复合光伏共挤胶膜,记为E5,通过分配器计算可知阻隔层厚度为0.15mm,抗腐蚀层厚度0.2mm, 粘结层厚度为0.15mm。
实施例5
阻隔层A的原料:以重量份计,取100份基体树脂乙烯-辛烯共聚物(美国陶氏),加入5份阻水剂纳米蒙脱土,0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
抗腐蚀层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为22 wt%,美国杜邦),加入5份乙烯基三过氧化叔丁基硅烷改性的氢氧化锌 (比表面积40m2/g),0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
阻隔层B的原料:以重量份计,取100份基体树脂乙烯-辛烯共聚物(美国陶氏),加入5份阻水剂硫酸钙,0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
将上述阻隔层的原料、抗腐蚀层的原料和阻隔层的原料各自混匀后,加入不同的挤出机。所述阻隔层A、抗腐蚀层和阻隔层B的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备三层复合光伏共挤胶膜,记为E5,通过分配器计算可知阻隔层A厚度为0.15mm,抗腐蚀层厚度0.2mm, 阻隔层B厚度为0.15mm。
实施例6
阻隔层的原料:以重量份计,取100份基体树脂乙烯-4-甲基-1-戊烯共聚物(美国陶氏),加入1份阻水剂乙烯-甲基丙烯酸钠,0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
抗腐蚀层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为22 wt%,美国杜邦),加入0.1份氨丙基三乙氧基硅烷改性的氢氧化镁 (比表面积180m2/g),0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
粘结层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为26 wt%,美国杜邦),加入0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的异丁基三乙氧基硅烷,0.2份2-(2’-羟基-5-甲基苯基)苯并***,0.3质量份3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯,40份碳酸钙。
将上述阻隔层的原料、抗腐蚀层的原料和粘结层的原料各自混匀后,加入不同的挤出机。所述阻隔层、抗腐蚀层和粘结层的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备三层复合光伏共挤胶膜,记为E6,通过分配器计算可知阻隔层厚度为0.15mm,抗腐蚀层厚度0.2mm, 粘结层厚度为0.15mm。
实施例7
阻隔层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为26 wt%,美国杜邦),加入0.1份阻水剂氧化钙,0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
抗腐蚀层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为22 wt%,美国杜邦),加入0.001份γ-缩水甘油醚氧丙基三甲氧基硅烷改性的氢氧化镁(比表面积180m2/g),0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的氨丙基三甲氧基硅烷,0.2份2,2-四亚甲基双(3,1-苯并噁嗪-4-酮),0.3质量份2-羟基-4-正辛氧基二苯甲酮。
粘结层的原料:以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为26 wt%,美国杜邦),加入0.5份交联剂1,1-双(叔丁基过氧)-3,3,5-三甲基环己烷,0.5份助交联剂乙氧化三羟甲基丙烷三丙烯酸酯,1质量份的异丁基三乙氧基硅烷,0.2份2-(2’-羟基-5-甲基苯基)苯并***,0.3质量份3,5-二叔丁基-4-羟基-苯甲酸十六烷基酯。
将上述阻隔层的原料、抗腐蚀层的原料和粘结层的原料各自混匀后,加入不同的挤出机。所述阻隔层、抗腐蚀层和粘结层的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备三层复合光伏共挤胶膜,记为E7,通过分配器计算可知阻隔层厚度为0.15mm,抗腐蚀层厚度0.2mm, 粘结层厚度为0.15mm。
对比例1
以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为29 wt%,美国杜邦),加入20份甲基丙烯酰氧基丙基三甲氧基硅烷改性的氢氧化镁(5wt%)(比表面积160m2/g),0.5份交联剂叔丁基过氧化碳酸异丙酯,0.5份助交联剂三羟甲基丙烷三甲基丙烯酸酯。将上述原料混匀后,加入挤出机。经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备光伏封装胶膜,记为R1,胶膜厚度0.5mm。
对比例2
以重量份计,取100份基体树脂乙烯-己烯共聚物(美国陶氏),加入1.5份阻水剂N,N-二甲基丙烯酰胺,0.5份交联剂叔丁基过氧化碳酸异丙酯,0.5份助交联剂三羟甲基丙烷三甲基丙烯酸酯。将上述原料混匀后,加入挤出机。经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备光伏封装胶膜,记为R1,胶膜厚度0.5mm。
对比例3
以重量份计,取100份基体树脂乙烯-醋酸乙烯酯共聚物(VA含量为29 wt%,美国杜邦),加入20份甲基丙烯酰氧基丙基三甲氧基硅烷改性的氢氧化镁(5wt%)(比表面积160m2/g),1.5份阻水剂N,N-二甲基丙烯酰胺,0.5份交联剂叔丁基过氧化碳酸异丙酯,0.5份助交联剂三羟甲基丙烷三甲基丙烯酸酯。将上述原料混匀后,加入挤出机。经过熔融挤出、流延成膜、冷却、分切和收卷等工序制备光伏封装胶膜,记为R3,胶膜厚度0.5mm。
性能测试
通过上述实施例和对比例得到的封装胶膜应用于太阳能电池组件的封装,经过下列测试方法进行评价,评价结果列于下述表中。
1. 组件中电池片腐蚀情况外观评估:使用实施例1~6和比较例1~3的封装胶膜进行单玻组件封装试验,按玻璃/封装胶膜/电池片/封装胶膜/背板(BEC-301M)的次序放入真空层压机内,经过145℃层压(抽真空6min,层压12min)制得单玻组件,将上述组件进行PCT老化(121℃,100%RH)和DH老化(85℃,85%RH),通过EL跟踪观察组件电池片的外观腐蚀情况。
2. 玻璃/封装胶膜粘结强度测试:取3mm厚玻璃、封装胶膜、TPT背板,按玻璃/胶膜/背板次序放入真空层压机内,经过145℃层压16min。测试依据GB/T2790-1995进行测定,用拉力机进行测试,测试速度100mm/min,记录玻璃和胶膜的粘结强度值。
表1:实施例1~6和比较例1~3的封装材料相关测试结果
由上述实施例和对比例的PCT老化和DH老化后EL测试数据对比可知:在封装材料体系中设置阻隔层和抗腐蚀层,本发明方案的对比例组胶膜制备组件在PCT168h后电池片边缘和金属栅线出现严重腐蚀,DH2000h后出现轻微腐蚀,而同等老化条件下的实施例组胶膜制备的组件的电池片边缘及栅线基本无腐蚀。本发明方案所得封装胶膜的抗腐蚀效果优于分别单独加阻水剂和抗腐蚀助剂的效果。另外,共挤胶膜阻隔层和抗腐蚀层的同时存在的抗腐蚀效果优于单层胶膜中同时存在阻水剂和抗腐蚀助剂,理由如下:一方面,首先通过阻隔层优异的阻水锁水性能避免外界水汽的侵蚀,阻断光伏封装胶膜中的EVA水解产生醋酸的源头;另一方面,利用抗腐蚀层的抗腐蚀助剂与EVA水解产生的醋酸进行反应,减少或消除体系中的醋酸,杜绝引起焊带、汇流条和金属栅线等金属腐蚀;另外,抗腐蚀助剂与醋酸反应产生的水可以通过阻隔层的阻水剂进一步锁定,与抗腐蚀助剂协同作用阻水阻酸双管齐下层层递进保护,提高抗腐蚀效果,避免焊带、汇流条等金属生锈,抑制由于组件腐蚀而引起的功率衰减,延长组件的使用寿命,达到光伏组件降本提效的目的。
以上实施例的说明只是用于帮助理解本发明方法及其核心思想。应当指出,对于本技术领域的普通技术人员来说,在不脱离本发明原理的前提下,还可以对本发明进行若干改进和修饰,这些改进和修饰也落入本发明权利要求保护范围内。
Claims (9)
1.一种封装胶膜,包括阻隔层和抗腐蚀层,所述阻隔层包括基体树脂和阻水剂,基体树脂与阻水剂的质量比为100:0.1~15,所述阻水剂为含有能与水形成氢键的官能团的化合物Ⅰ或能与水发生化合反应的化合物Ⅱ或能吸附水形成结晶水的化合物Ⅲ;所述阻隔层的水汽透过率低于3.0g/m2 ▪24h;所述抗腐蚀层包括基体树脂和抗腐蚀助剂,其中,所述基体树脂为乙烯-乙酸乙烯酯,所述抗腐蚀助剂为金属氧化物、氢氧化物或双金属氢氧化物中的一种或多种;所述抗腐蚀层的基体树脂和抗腐蚀助剂的质量比为100:0.001~40。
2.根据权利要求1所述的一种封装胶膜,其特征在于,所述化合物Ⅰ的官能团包括酰胺基、醛基、羟基、羰基、巯基、缩醛基、酯基、醚基、硅氧基中的一种或多种。
3.根据权利要求1所述的一种封装胶膜,其特征在于,所述化合物Ⅱ为氧化钡、氧化钙、氧化镁中的一种或多种。
4.根据权利要求1所述的一种封装胶膜,其特征在于,所述化合物Ⅲ为硫酸钙、硫酸锌、硫酸铜、硫酸镁、氯化钙中的一种或多种。
5.根据权利要求1所述的一种封装胶膜,其特征在于,所述抗腐蚀助剂的比表面积为70~180m2/g。
6.根据权利要求1所述的一种封装胶膜,其特征在于,所述抗腐蚀助剂为选自铝,钒,锰,铁,钴,镍,钯,铜,锌,锡,锑或其组合的氧化物、氢氧化物或双金属氢氧化物。
7.根据权利要求1所述的一种封装胶膜,其特征在于,所述抗腐蚀助剂通过硅烷偶联剂改性处理,所述硅烷偶联剂为氨丙基三乙氧基硅烷、氨丙基三甲氧基硅烷、乙烯基三乙氧基硅烷、乙烯基三甲氧基硅烷、乙烯基三过氧化叔丁基硅烷、乙烯基三乙酰氧基硅烷、异丁基三乙氧基硅烷、乙烯基三(β-甲氧基乙氧基)硅烷、γ-缩水甘油醚氧丙基三甲氧基硅烷、γ-甲基丙烯酰氧丙基三甲氧基硅烷中的一种或多种。
8.根据权利要求1所述的一种封装胶膜,其特征在于,所述基体树脂为乙烯与一种或多种单体的共聚物;所述基体树脂的密度为0.825~1.125g/cm3,基体树脂的熔融指数为0.5~45g/10min。
9.一种如权利要求1-8任一项所述的封装胶膜的制备方法:将阻隔层和抗腐蚀层的材料分别混匀后,加入不同的挤出机,阻隔层的挤出物料、抗腐蚀层的挤出物料分别熔融塑化后注入同一模头中,在T模头内合并形成一个熔体流,经过包括熔融挤出、流延成膜、冷却、分切和收卷的工序得到所述封装胶膜。
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