CN111331262B - Packaging carrier plate and method for processing inner groove of metal cavity - Google Patents
Packaging carrier plate and method for processing inner groove of metal cavity Download PDFInfo
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- CN111331262B CN111331262B CN202010207459.4A CN202010207459A CN111331262B CN 111331262 B CN111331262 B CN 111331262B CN 202010207459 A CN202010207459 A CN 202010207459A CN 111331262 B CN111331262 B CN 111331262B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/142—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor for the removal of by-products
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Abstract
The invention relates to a packaging carrier plate and a method for processing an inner groove of a metal cavity, wherein cutting equipment is started to act on the edge of a first processing area; then, moving the metal cavity to enable the cutting equipment to move relative to the metal cavity; when the equipment to be cut moves to the first cutting termination position, the metal cavity is paused to move, and at the moment, a first station to be processed is left between the first cutting termination position and the first cutting start position; after the preset time, the metal cavity is moved again, and the remaining first to-be-processed position is cut off through cutting equipment. Because the method adopts at least two sections of cutting modes, the kinetic energy obtained by separating the residual scraps from the metal cavity comes from the last section of cutting process, the speed of flying the residual scraps from the metal cavity is greatly reduced, the dust collector can effectively absorb the residual scraps, and the residual scraps are prevented from flying to an unprocessed metal cavity to shield a processing area, so that the continuous and stable operation of groove processing of the metal cavity is effectively ensured.
Description
Technical Field
The invention relates to the technical field of PCB processing, in particular to a packaging carrier plate and a method for processing an inner groove of a metal cavity.
Background
With the trend of more and more intensive electronic components, a package carrier has appeared. A plurality of metal cavities are formed in the packaging carrier plate, and groove structures are arranged in the metal cavities. The groove structure has the characteristics of high dimensional accuracy (the dimensional accuracy is +/-50 mu m), high requirement on the quality of the groove wall (no burrs, foreign matters) and the like, and is used for bearing wafers, patches and components.
The traditional method for processing the inner groove of the metal cavity is mainly a milling cutter processing method, and in order to ensure the processing precision, the milling cutter is usually kept still to move the packaging carrier plate. In the processing process, the milling cutter acts on the boundary of the area to be processed, and the packaging carrier plate is moved, so that the milling cutter moves for a circle on the metal cavity. After the milling cutter finishes processing a circle, the scraps in the area to be processed are sucked out of the metal cavity under the action of dust collection vacuum, so that the processing operation of the inner groove of the metal cavity is finished. However, in this processing method, the scraps are easily scattered into the unmachined area, which results in that the area is blocked, and thus the cutting cannot be performed normally, and the processing efficiency of the inner groove of the metal cavity is seriously affected.
Disclosure of Invention
Therefore, it is necessary to provide a package carrier and a method for processing an inner groove of a metal cavity, aiming at the problem that the inner groove of the metal cavity cannot be processed normally due to the fact that the unprocessed area is easily shielded by the scraps.
A method for processing an inner groove of a metal cavity comprises the following steps: providing a metal cavity to be processed; starting a cutting device, enabling the cutting device to act on the edge of a first processing area in the metal cavity and marking the edge as a first starting cutting position; moving the metal chamber so that the cutting apparatus makes a moving cut along an edge of the first processing region; stopping the metal cavity from moving when the cutting equipment moves to a first cutting stopping position on the first processing area, wherein a first station to be processed is reserved between the first cutting stopping position and the first cutting starting position; and after the preset time, moving the metal cavity, so that the cutting equipment moves along the edge of the first processing area, and cutting the first station to be processed.
In the processing method for the inner groove of the metal cavity, in the groove processing process, the cutting equipment is started to act on the edge of the first processing area, so that the cutting equipment starts to cut from the first starting cutting position; then keeping the cutting equipment still, moving the metal cavity, enabling the cutting equipment to move relative to the metal cavity, and cutting the edge of the first processing area; when the equipment to be cut moves to the first cutting termination position, the metal cavity is paused to move, and at the moment, a first station to be processed is left between the first cutting termination position and the first cutting start position; after the preset time, the metal cavity is moved again, and the remaining first to-be-processed position is cut off through the cutting equipment, so that the cutting equipment completes a circle of cutting on the first processing area, and the residual scraps in the first processing area are guaranteed to be separated from the metal cavity. Because the method adopts at least two sections of cutting modes, the kinetic energy obtained by separating the residual scraps from the metal cavity comes from the last section of cutting process, the speed of flying the residual scraps from the metal cavity is greatly reduced, the dust collector can effectively absorb the residual scraps, and the residual scraps are prevented from flying to an unprocessed metal cavity to shield a processing area, so that the continuous and stable operation of groove processing of the metal cavity is effectively ensured, and the improvement of the groove processing efficiency is facilitated; meanwhile, the processing quality of the inner groove of the metal cavity is also guaranteed.
In one embodiment, the cutting apparatus is a laser drilling apparatus.
In one embodiment, the step of moving the metal chamber such that the cutting apparatus makes a moving cut along the edge of the first processing zone comprises: moving the metal cavity, so that the laser drilling equipment machines a plurality of first drill holes on the edge of the first machining area, and forming a first drill strip; controlling the radius d of the first bore1Is 80um to 120um and controls the distance L between the centers of the two adjacent first drill holes1Is 40um to 60 um.
In one embodiment, the distance L between the side of the first drill belt outside the first machining zone and the edge of the first machining zone2Is 10um to 20 um.
In one embodiment, after a preset time, the step of moving the metal cavity so that the cutting device moves along the edge of the first processing area and cutting the first station to be processed includes: after the preset time, moving the metal cavity to enable the laser drilling equipment to process a plurality of second drill holes on the first station to be processed and form a second drill belt; controlling the radius d of the second bore2Is 81um to 121um, andcontrolling the hole center distance L of two adjacent second drilling holes3Is 40um to 60 um.
In one embodiment, the distance L between the side of the second drill strip outside the first machining zone and the edge of the first machining zone4Is 11um to 21 um.
In one embodiment, the steps further include: after the first position to be processed is cut, the metal cavity is turned over; after overturning, starting the cutting equipment, enabling the cutting equipment to act on the edge of a second area to be processed and marking the edge as a second initial cutting position; moving the metal cavity so that the cutting equipment performs moving cutting along the edge of the second area to be processed; stopping the metal cavity from moving when the cutting equipment moves to a second cutting stopping position on the second area to be processed, wherein a second station to be processed is reserved between the second cutting stopping position and the second cutting starting position; and after the preset time, moving the metal cavity to enable the cutting equipment to move along the edge of the second area to be processed and cutting the second position to be processed.
In one embodiment, the length L of the first to-be-processed position5Is 180um to 220 um.
In one embodiment, the preset time is 2S to 5S.
A package carrier plate comprises a metal cavity, wherein a bearing groove is formed in the metal cavity, and the bearing groove is manufactured by adopting the method for machining the inner groove of the metal cavity.
The packaging carrier plate comprises a metal cavity, wherein a bearing groove in the metal cavity is processed by the method for processing the groove in the metal cavity, and in the processing process of the groove, cutting equipment is started to act on the edge of a first processing area, so that the cutting equipment starts to cut from a first initial cutting position; then keeping the cutting equipment still, moving the metal cavity, enabling the cutting equipment to move relative to the metal cavity, and cutting the edge of the first processing area; when the equipment to be cut moves to the first cutting termination position, the metal cavity is paused to move, and at the moment, a first station to be processed is left between the first cutting termination position and the first cutting start position; after the preset time, the metal cavity is moved again, and the remaining first to-be-processed position is cut off through the cutting equipment, so that the cutting equipment completes a circle of cutting on the first processing area, and the residual scraps in the first processing area are guaranteed to be separated from the metal cavity. Because the method adopts at least two sections of cutting modes, the kinetic energy obtained by separating the residual scraps from the metal cavity comes from the last section of cutting process, the speed of flying the residual scraps from the metal cavity is greatly reduced, the dust collector can effectively absorb the residual scraps, and the residual scraps are prevented from flying to an unprocessed metal cavity to shield a processing area, so that the continuous and stable operation of groove processing of the metal cavity is effectively ensured, and the improvement of the groove processing efficiency is facilitated; meanwhile, the processing quality of the inner groove of the metal cavity is also guaranteed.
Drawings
FIG. 1 is a first flowchart of a method for machining an inner groove of a metal cavity according to an embodiment;
FIG. 2 is a flow chart of a method for machining an inner groove of a metal cavity according to an embodiment;
FIG. 3 is a flow chart of a third embodiment of a method for machining an inner groove of a metal cavity;
FIG. 4 is a fourth flowchart of a method for machining an inner groove of a metal cavity according to an embodiment;
FIG. 5 is a schematic view of a groove processing structure in a metal cavity according to an embodiment;
FIG. 6 is a schematic diagram illustrating a structure of an inner groove of a metal cavity at various stages of processing according to an embodiment;
FIG. 7 is a schematic diagram of the structure of the inner groove of the metal cavity at different stages of double-sided processing according to an embodiment;
fig. 8 is a schematic structural diagram illustrating an operation process of the package carrier according to an embodiment.
100. The package substrate comprises a package carrier plate, 110, a metal cavity, 111, a carrying groove, 112, a first processing area, 1121, a first start cutting position, 1122, a first stop cutting position, 1123, a first to-be-processed position, 120, scraps, 200, a cutting device, 210, a first drilling hole, 211, a first drilling belt, 220, a second drilling hole, 221, a second drilling belt, 300 and a dust collector.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and the like as used herein are for illustrative purposes only and do not denote a unique embodiment.
In an embodiment, referring to fig. 1 and fig. 6, a method for processing an inner groove of a metal cavity includes the following steps:
s10, providing a metal cavity 110 to be processed;
s20, starting the cutting device 200, so that the cutting device 200 acts on the edge of the first processing region 112 in the metal cavity 110, and is marked as a first initial cutting position 1121;
s30, moving the metal cavity 110, so that the cutting device 200 performs moving cutting along the edge of the first processing area 112;
s40, when the device to be cut 200 moves to the first cutting termination location 1122 on the first processing region 112, stopping the movement of the metal cavity 110, wherein a first to-be-processed location 1123 is left between the first cutting termination location 1122 and the first cutting start location 1121;
s50, after a preset time, the metal cavity 110 is moved so that the cutting apparatus 200 moves along the edge of the first processing region 112 and cuts the first to-be-processed station 1123.
In the method for processing the inner groove of the metal cavity, during the groove processing, the cutting device 200 is started, so that the cutting device 200 acts on the edge of the first processing region 112, and the cutting device 200 starts to cut from the first start cutting position 1121; then keeping the cutting device 200 still, moving the metal cavity 110, so that the cutting device 200 moves relative to the metal cavity 110, and cutting the edge of the first processing region 112; when the to-be-cut device 200 moves to the first termination cutting position 1122, the metal cavity 110 is suspended from moving, and at this time, a first to-be-processed position 1123 is left between the first termination cutting position 1122 and the first start cutting position 1121; after a preset time, the metal cavity 110 is moved again, and the cutting device 200 is used to cut off the remaining first to-be-processed location 1123, so that the cutting device 200 completes a circle of cutting on the first processing region 112, and the residual scraps 120 in the first processing region 112 are ensured to be separated from the metal cavity 110. Because the method adopts at least two-section cutting mode, the kinetic energy obtained by separating the residual scraps 120 from the metal cavity 110 comes from the last section of cutting process, the flying speed of the residual scraps 120 from the metal cavity 110 is greatly reduced, the dust collector 300 can effectively absorb the residual scraps 120, and the residual scraps 120 are prevented from flying to the unprocessed metal cavity 110 to shield a processing area, so that the groove processing operation of the metal cavity 110 is effectively ensured to be continuously and stably carried out, and the groove processing efficiency is favorably improved; meanwhile, the processing quality of the inner groove of the metal cavity 110 is also ensured.
It should be noted that the manner of cutting the first to-be-processed station 1123 in this embodiment may be a one-stage cutting manner; a multi-stage cutting mode can also be adopted, namely, after the first station to be processed 1123 is cut for one stage, the metal cavity 110 is stopped moving; then, the cutting and suspending operations are repeated until the first to-be-processed location 1123 is cut. Meanwhile, when the first to-be-processed location 1123 performs cutting, the cutting apparatus 200 may move cutting from the first start cutting location 1121 toward the first end cutting location 1122; the cut may also be moved from the first termination cut site 1122 toward the first start cut site 1121.
It should be noted that the first processing region 112 is a position corresponding to the carrying groove 111 in the metal cavity 110; meanwhile, the edge of the first processing region 112 corresponds to the notch boundary of the carrying groove 111. When the first processing area 112 finishes cutting, the scraps 120 in the first processing area 112 fall off from the metal cavity 110, so that a groove structure, i.e., the carrying groove 111, is formed in the metal cavity 110.
It should be further noted that, in order to facilitate understanding how the scraps 120 fly to the unprocessed region for shielding, referring to fig. 8, after the groove processing is completed on the metal cavity 110, the scraps 120 obtain two different directional velocities, i.e., a velocity V of the metal cavity 110 moving on the scraps 1201(ii) a Secondly, the speed V of the dust collector 300 acting on the residual scraps 1202. Therefore, when the debris 120 falls off from the metal cavity 110, the debris 120 will make a parabolic movement as shown in the figure under the action of the dust collector 300. However, since the scraps 120 have a relative table moving speed, the scraps 120 may finally move to the diagonal unmachined area, causing a shielding phenomenon, resulting in a poor cutting of the metal cavity 110. Therefore, the present embodiment adopts a multi-stage cutting manner, which reduces the moving speed of the scraps 120 relative to the table, so that the dust collector 300 can more easily suck the scraps 120, and effectively prevent the scraps 120 from moving to the unmachined area at the opposite corners. Wherein, the table top is an operation table, and in the processing process, the package carrier 100 is placed on the table top, so that the metal cavity 110 can move correspondingly by moving the table top.
Specifically, the metal cavity 110 has a square structure, and during the groove machining process, the metal cavity 110 moves along four sides.
Further, referring to fig. 7, the cutting apparatus 200 is a laser drilling apparatus. Therefore, in the processing process, the laser drilling equipment is adopted, and compared with the traditional milling cutter cutting mode, the laser drilling equipment effectively avoids contact with a metal copper surface, and the service life of the cutting equipment 200 is greatly prolonged; meanwhile, the phenomenon of cutter breakage in the machining process is effectively avoided. In addition, because the laser drilling equipment is processed by a plurality of laser beam single points, the processed notches have fewer burrs, and the processing precision of the metal cavity 110 is effectively improved.
Specifically, the laser drilling equipment is CO2The laser drill cutting apparatus 200.
Further, referring to fig. 2, 5 and 6, the step of moving the metal cavity 110 so that the cutting apparatus 200 performs the moving cut S30 along the edge of the first processing region 112 includes: moving the metal cavity 110 such that the laser drilling apparatus machines a plurality of first drill holes 210 on the edge of the first machining region 112 and forms a first drill strip 211S 31; controlling the radius d of the first bore 2101Is 80um to 120um, and controls the hole center distance L of two adjacent first drilling holes 2101Is 40um to 60um S32. It can be seen that the metal cavity 110 is moved such that the laser drilling apparatus leaves a series of first drill holes 210 on the edge of the first processing area 112 and forms a first drill strip 211 on the first processing area 112. Since laser drilling is laser beam single-point processing, in the processing process, the moving speed of the metal cavity 110 and the processing frequency of the laser drilling equipment need to be reasonably controlled, so that the radius d of the first drill hole 2101Is 80 um-120 um, the hole center distance L of two adjacent first drilling holes 2101Is 40um to 60um, so as to ensure that the series of first drilling holes 210 can cover the edge of the first processing region 112, thereby ensuring that the edge of the first processing region 112 is completely cut, and avoiding that the edge of the first processing region 112 is partially connected with the metal cavity 110, so that the scraps 120 cannot be separated from the metal cavity 110.
Specifically, referring to fig. 5, the radius d of the first bore 2101Is 100 um; the hole center distance L between two adjacent first drill holes 2101Is 50 um.
In one embodiment, referring to FIG. 5, the distance L between the side of the first drill strip 211 outside the first processing region 112 and the edge of the first processing region 1122Is 10um to 20 um. In this manner, it is ensured that the edge of the first processing region 112 is completely cut during the first stage cutting process.
Specifically, referring to fig. 5, a distance L between a side of the first drill strip 211 outside the first processing region 112 and an edge of the first processing region 1122Is 15 um; radius d of the first bore 2101Is 100 um; the hole center distance L between two adjacent first drill holes 2101Is 50 um. From this, the radius d of the first bore 210 is known1Much greater than the distance L between the first drill strip 211 side and the edge of the first machining region 1122In this way, it is ensured that the first drill zone 211 is located largely within the first machining region 112, such that a large portion of the output of the cutting apparatus 200 acts on the first machining region 112, increasing the useful work of the cutting apparatus 200 on the first machining region 112.
It should be noted that, in the embodiment, the first drill strip 211 is extended by 15um from the edge of the first processing region 112, which does not affect the actual size of the carrying groove 111, because the outside of the first processing region 112 is protected by the metal copper surface.
In one embodiment, referring to fig. 3 and 5, after a predetermined time, the step of moving the metal cavity 110 to move the cutting apparatus 200 along the edge of the first processing region 112 and cutting the first to-be-processed station 1123 comprises: referring to fig. 6(a) to 6(d), after a predetermined time, the metal cavity 110 is moved, so that the laser drilling apparatus processes a plurality of second drill holes 220 on the first to-be-processed site 1123 and forms a second drill strip 221S 51; controlling the radius d of the second bore 2202Is 81um to 121um and controls the hole center distance L of two adjacent second drilling holes 2203Is 40um to 60um S52. It can be seen that after a time pause, the metal cavity 110 is moved again so that the laser drilling apparatus leaves a series of second drill holes 220 on the edge of the first processing area 112 and forms a second drill strip 221 on the first processing area 112. Since laser drilling is a laser beam single point process,therefore, during the machining process, it is necessary to reasonably control the moving speed of the metal cavity 110 and the machining frequency of the laser drilling device so that the radius d of the second drilled hole 2202Is a hole center distance L of 81um to 121um and two adjacent second drill holes 220340um to 60um, so as to ensure that the series of second drilled holes 220 can cover the edge of the first processing area 112, thereby ensuring that the first station to be processed 1123 is completely cut, and preventing the connecting portion of the first station to be processed 1123 with the metal cavity 110 from causing the debris 120 not to be separated from the metal cavity 110.
Specifically, referring to fig. 5 and 6, the radius d of the second bore 2202Is 101 um; the hole center distance L between two adjacent second drill holes 2203Is 50 um.
Further, referring to fig. 5, a distance L between a side of the second drill strip 221 outside the first processing region 112 and an edge of the first processing region 1124Is 11um to 21 um. In this manner, it is ensured that the edges of the first processing region 112 are completely cut during the second cutting pass.
Specifically, referring to fig. 5 and 6, the distance L between the side of the second drill strip 221 outside the first processing region 112 and the edge of the first processing region 112 is shown4Is 15 um; radius d of second bore 2202Is 101 um; the hole center distance L between two adjacent second drill holes 2203Is 50 um. From this, the radius d of the second bore 220 is known2Much larger than the distance L between the second drill strip 221 side and the edge of the first machining region 1124In this way, it is ensured that the second drill zone 221 is located largely within the first machining region 112, so that a large portion of the output of the cutting apparatus 200 acts on the first machining region 112, increasing the useful work of the cutting apparatus 200 on the first machining region 112. At the same time, the length L of the second drill strip 2216Is 500 um. In addition, in the actual production process, the processing efficiency can be improved by 4-7 times, and the processing cost is reduced by more than 85%.
In an embodiment, please refer to fig. 1, fig. 4, fig. 5, and fig. 7(a) to fig. 7(d), the steps further include:
s60, turning the metal cavity 110 after the first to-be-processed position 1123 is cut;
s61, after the cutting device 200 is turned over, the cutting device 200 is activated to act on the edge of the second area to be processed and marked as a second start cutting position;
s62, moving the metal cavity 110, so that the cutting device 200 performs moving cutting along the edge of the second region to be processed;
s63, when the device 200 to be cut moves to a second cutting termination position on a second region to be processed, stopping the movement of the metal cavity 110, wherein a second station to be processed is left between the second cutting termination position and the second cutting start position;
s64, after a preset time, moving the metal cavity 110, so that the cutting apparatus 200 moves along the edge of the second region to be processed, and cutting the second region to be processed.
Therefore, in the present embodiment, a double-sided processing manner is adopted, that is, in the groove processing process, when the cutting device 200 cuts on one side surface of the metal cavity 110, the metal cavity 110 cannot be cut through, and at this time, the metal cavity 110 needs to be turned over, so that the cutting device 200 can process the other side surface of the metal cavity 110. In the process of processing the other side face, more than two sections of processing modes are also adopted. The method specifically comprises the following steps: starting the cutting device 200 such that the cutting device 200 acts on the edge of the second machining zone, so that the cutting device 200 starts cutting from the second starting cutting position; then, keeping the cutting device 200 still, moving the metal cavity 110, so that the cutting device 200 moves relative to the metal cavity 110, and cutting the edge of the second processing area; when the to-be-cut device 200 moves to the second cutting termination position, the metal cavity 110 is paused to move, and at the moment, a second to-be-processed position is left between the second cutting termination position and the second cutting start position; after the preset time, the metal cavity 110 is moved again, and the remaining second to-be-processed position is cut off by the cutting device 200, so that the cutting device 200 completes a circle of cutting on the second processing area, and the scraps 120 in the second processing area are guaranteed to be separated from the metal cavity 110. Because the other side surface of the metal cavity 110 is also cut by at least two sections, the kinetic energy obtained by separating the residual scraps 120 from the metal cavity 110 is obtained from the last section of cutting process, so that the flying speed of the residual scraps 120 from the metal cavity 110 is greatly reduced, the dust collector 300 can effectively absorb the residual scraps 120, and the situation that the residual scraps 120 fly to the unprocessed metal cavity 110 to shield a processing area is avoided.
Further, referring to fig. 7, the cutting apparatus 200 of the present embodiment is a laser drilling apparatus. When the other side surface of the metal cavity 110 is cut, the laser drilling device forms a plurality of third drill holes, a plurality of fourth drill holes, a third drill strip and a fourth drill strip in the second processing region, wherein the parameters of the third drill holes, the fourth drill holes, the third drill strip and the fourth drill strip may refer to the parameters of the first drill holes 210, the second drill holes 220, the first drill strips 211 and the second drill strips 221, and thus, the description thereof is omitted.
Specifically, the cutting device 200 of the present embodiment is a CO2The laser drill cutting apparatus 200.
In one embodiment, referring to FIG. 6, the length L of the first to-be-processed station 11235Is 180um to 220 um. Thus, the length L of the first to-be-processed site 1123 is controlled5For 180um ~ 220um, after guaranteeing first section cutting, the length that first needs processing position 1123 is shortened as far as possible under the prerequisite that the sweeps 120 can be connected at metal cavity 110 for the sweeps 120 speed of remaining is the minimum.
In one embodiment, the preset time is 2S to 5S. Therefore, after the first stage of cutting is completed, the metal cavity 110 is stopped for 2S to 5S.
Specifically, the preset time is 2S to 3S.
In an embodiment, referring to fig. 8, fig. 8(a) shows a package carrier 100 being diced, fig. 8(b) shows an uncut package carrier 100, and a package carrier 100 includes a metal cavity 110 of the package carrier 100. The metal cavity 110 is provided with a carrying groove 111. The bearing groove 111 is manufactured by the method for processing the inner groove of the metal cavity in any of the above embodiments.
The package carrier 100 includes the metal cavity 110, and the carrier groove 111 in the metal cavity 110 is processed by the above method for processing the groove in the metal cavity, during the processing of the groove, the cutting device 200 is started, so that the cutting device 200 acts on the edge of the first processing region 112, and the cutting device 200 starts to cut from the first start cutting position 1121; then keeping the cutting device 200 still, moving the metal cavity 110, so that the cutting device 200 moves relative to the metal cavity 110, and cutting the edge of the first processing region 112; when the to-be-cut device 200 moves to the first termination cutting position 1122, the metal cavity 110 is suspended from moving, and at this time, a first to-be-processed position 1123 is left between the first termination cutting position 1122 and the first start cutting position 1121; after a preset time, the metal cavity 110 is moved again, and the cutting device 200 is used to cut off the remaining first to-be-processed location 1123, so that the cutting device 200 completes a circle of cutting on the first processing region 112, and the residual scraps 120 in the first processing region 112 are ensured to be separated from the metal cavity 110. Because the method adopts at least two-section cutting mode, the kinetic energy obtained by separating the residual scraps 120 from the metal cavity 110 comes from the last section of cutting process, the flying speed of the residual scraps 120 from the metal cavity 110 is greatly reduced, the dust collector 300 can effectively absorb the residual scraps 120, and the residual scraps 120 are prevented from flying to the unprocessed metal cavity 110 to shield a processing area, so that the groove processing operation of the metal cavity 110 is effectively ensured to be continuously and stably carried out, and the groove processing efficiency is favorably improved; meanwhile, the processing quality of the inner groove of the metal cavity 110 is also ensured.
Further, referring to fig. 8, the number of the carrying grooves 111 is plural, and the plurality of carrying grooves 111 are arranged in a matrix manner.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. The method for processing the inner groove of the metal cavity is characterized by comprising the following steps of:
providing a metal cavity to be processed;
starting a cutting device, enabling the cutting device to act on the edge of a first processing area in the metal cavity and marking the edge as a first starting cutting position;
moving the metal cavity to enable the cutting device to perform moving cutting along the edge of the first processing area, wherein the cutting device is a laser drilling device, and moving the metal cavity to enable the laser drilling device to machine a plurality of first drill holes on the edge of the first processing area and form a first drill strip; controlling the radius d of the first bore1Is 80um to 120um and controls the distance L between the centers of the two adjacent first drill holes1Is 40um to 60 um;
stopping the metal cavity from moving when the cutting equipment moves to a first cutting stopping position on the first processing area, wherein a first station to be processed is reserved between the first cutting stopping position and the first cutting starting position;
and after the preset time, moving the metal cavity, so that the cutting equipment moves along the edge of the first processing area, and cutting the first station to be processed.
2. The method of claim 1, wherein the laser drilling apparatus is CO2Laser drilling cutting equipment.
3. The method of claim 1, wherein the radius d of the first bore is1Is 100 um; the hole center distance L of two adjacent first drill holes1Is 50 um.
4. The metal cavity inner groove machining method of claim 1, wherein a distance L between a side of the first drill strip outside the first machining region and an edge of the first machining region2Is 10um to 20 um.
5. The groove processing method as claimed in claim 1, wherein the step of moving the metal chamber after a predetermined time so that the cutting device moves along the edge of the first processing area and cutting the first station to be processed comprises:
after the preset time, moving the metal cavity to enable the laser drilling equipment to process a plurality of second drill holes on the first station to be processed and form a second drill belt;
controlling the radius d of the second bore2Is 81um to 121um and controls the hole center distance L of the two adjacent second drill holes3Is 40um to 60 um.
6. The metal cavity inner groove machining method of claim 5, wherein a distance L between a side of the second drill strip outside the first machining region and an edge of the first machining region4Is 11um to 21 um.
7. The method of claim 1, further comprising:
after the first position to be processed is cut, the metal cavity is turned over;
after overturning, starting the cutting equipment, enabling the cutting equipment to act on the edge of a second area to be processed and marking the edge as a second initial cutting position;
moving the metal cavity so that the cutting equipment performs moving cutting along the edge of the second area to be processed;
stopping the metal cavity from moving when the cutting equipment moves to a second cutting stopping position on the second area to be processed, wherein a second station to be processed is reserved between the second cutting stopping position and the second cutting starting position;
and after the preset time, moving the metal cavity to enable the cutting equipment to move along the edge of the second area to be processed and cutting the second position to be processed.
8. The method of processing the inner groove of a metal cavity as claimed in any one of claims 1 to 7, wherein the length L of the first station to be processed is5Is 180um to 220 um.
9. The method of processing the inner groove of a metal cavity according to any one of claims 1 to 7, wherein the predetermined time is 2S to 5S.
10. A package carrier, comprising a metal cavity, wherein a carrying groove is disposed in the metal cavity, and the carrying groove is manufactured by the method for processing a groove in a metal cavity according to any one of claims 1 to 9.
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| CN202010207459.4A CN111331262B (en) | 2020-03-23 | 2020-03-23 | Packaging carrier plate and method for processing inner groove of metal cavity |
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| CN202010207459.4A CN111331262B (en) | 2020-03-23 | 2020-03-23 | Packaging carrier plate and method for processing inner groove of metal cavity |
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