CN111328182A - Deformed circuit board based on shape memory polymer composite material - Google Patents
Deformed circuit board based on shape memory polymer composite material Download PDFInfo
- Publication number
- CN111328182A CN111328182A CN201811538876.6A CN201811538876A CN111328182A CN 111328182 A CN111328182 A CN 111328182A CN 201811538876 A CN201811538876 A CN 201811538876A CN 111328182 A CN111328182 A CN 111328182A
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- Prior art keywords
- circuit board
- shape memory
- memory polymer
- polymer composite
- composite material
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/118—Printed elements for providing electric connections to or between printed circuits specially for flexible printed circuits, e.g. using folded portions
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention provides a deformed circuit board based on a shape memory polymer composite material, belongs to the technical field of folding smart phones, and particularly relates to a deformed circuit board based on a shape memory polymer composite material. The problem that the folding function of the foldable mobile phone can be realized only when the circuit board in the mobile phone needs to meet the requirements of a foldable screen and has a certain deformation degree is solved. The circuit board comprises a circuit board substrate, an electronic element and a driving mechanism. The folding intelligent mobile phone is mainly used for folding a circuit board in the intelligent mobile phone.
Description
Technical Field
The invention belongs to the technical field of folding smart phones, and particularly relates to a deformed circuit board based on a shape memory polymer composite material.
Background
The foldable mobile phone has a great number of innovative content forms, because of the folding characteristic of the foldable mobile phone, one surface of the mobile phone with a camera can be used as a front surface and a back surface, more free space and new playing methods are brought to photographing and video photographing, when one camera can meet the function of photographing in front and back, and the technical accumulation and the advantage of photographing in front and back of a straight-plate mobile phone are rapidly eliminated; on the other hand, for games and applications such as AR and VR games which need three-dimensional pictures and three-dimensional space design, the foldable mobile phone also brings a new playing method; the foldable mobile phone is equivalent to a notebook computer, a mobile phone and a tablet computer which can be combined into one, and only one mobile phone is needed when a user goes on a business trip, so that the life is more convenient and faster.
The problem to be solved by the foldable mobile phone is that devices such as circuit boards inside the mobile phone need to meet the requirements of foldable screens and have a certain degree of deformation, so that a deformable circuit board capable of being applied to mobile devices needs to be designed to solve the technical problem.
Disclosure of Invention
The invention provides a deformed circuit board based on a shape memory polymer composite material, aiming at solving the problems in the prior art.
In order to achieve the purpose, the invention adopts the following technical scheme: a deformed circuit board based on a shape memory polymer composite material comprises a circuit board substrate, an electronic element and a driving mechanism, wherein the circuit board substrate is made of the shape memory polymer composite material, the shape memory polymer composite material is a material formed by compounding a shape memory polymer and a fiber reinforcement phase, the electronic element is distributed on the circuit board substrate in an island-bridge mode, the electronic element comprises a semiconductor device and a lead, the island-bridge mode comprises a fixed island and a deformed bridge, the position where the semiconductor device is distributed is the fixed island, the lead connected between the semiconductor devices is the deformed bridge, the driving mechanism is located on the deformed bridge, and the driving mechanism stimulates the circuit board substrate and reaches the glass transition temperature of the shape memory polymer composite material.
Further, the shape memory polymer is a polyimide-based shape memory polymer or an epoxy-based shape memory polymer.
Furthermore, the fiber reinforced phase is one or more of carbon fiber, glass fiber, spandex fiber, Kevlar fiber, aramid fiber, graphene or carbon nano tube.
Further, the shape memory polymer composite material changes the glass transition temperature by compounding different shape memory polymers with different fiber reinforced phases.
Further, the driving mechanism is driven by thermal driving, electric driving or magnetic driving.
Furthermore, the driving mechanism is triggered to work through the keys of the mobile phone.
Furthermore, the deformation bridge is in a serpentine shape or a wave shape with upper and lower folds.
Furthermore, a bistable metal sheet is arranged on the circuit board substrate, and the bistable metal sheet has two states of an arc state and a straight plate shape.
Furthermore, the driving mechanism drives the bistable metal sheet to switch between an arc state and a straight plate state.
Compared with the prior art, the invention has the beneficial effects that: the foldable smart phone has the advantages of simple structure, variable rigidity and reusability, and solves a difficult problem for developing the foldable smart phone. Electronic elements are distributed on a circuit board substrate in an island-bridge mode, the rigidity changing characteristic of the shape memory polymer composite material of the circuit board substrate is utilized, the circuit board keeps high rigidity before and after deformation, the use of the circuit board is not affected, the rigidity is reduced in the deformation process, bending and folding are achieved, the circuit board can achieve autonomous deformation based on the shape memory characteristic, multiple stimulation modes can be selected according to needs to achieve deformation of the circuit board, the shape memory polymer composite material has good reusability, and the service life of the foldable smart phone is guaranteed.
Drawings
FIG. 1 is a schematic diagram of a deformed circuit board partially folded and unfolded state based on a shape memory polymer composite material according to the present invention
FIG. 2 is a schematic diagram of a partially folded state of a deformed circuit board based on a shape memory polymer composite according to the present invention
FIG. 3 is a schematic diagram of a deformed circuit board with a fully bent bending state based on a shape memory polymer composite according to the present invention
FIG. 4 is a schematic diagram of a deformed circuit board based on a shape memory polymer composite material in a fully-bent unfolded state
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely explained below with reference to the drawings in the embodiments of the present invention.
Referring to fig. 1-4 to illustrate the embodiment, a deformed circuit board based on a shape memory polymer composite material comprises a circuit board substrate, an electronic component and a driving mechanism, the circuit board substrate is made of a shape memory polymer composite material, the shape memory polymer composite material is a material formed by compounding a shape memory polymer and a fiber reinforcement phase, the electronic components are distributed on the circuit board substrate in an island-bridge mode, the electronic components include semiconductor devices and conductive lines, the island-bridge mode comprises fixed islands and deformed bridges, the semiconductor devices are distributed at the fixed islands, the conducting wire connected between the semiconductor devices is a deformation bridge, the driving mechanism is positioned on the deformation bridge, the driving mechanism generates stimulation to the circuit board substrate and reaches the glass transition temperature of the shape memory polymer composite material.
The shape memory polymer is polyimide shape memory polymer or epoxy resin shape memory polymer, the fiber reinforced phase is one or more of carbon fiber, glass fiber, spandex fiber, Kevlar fiber, aramid fiber, graphene or carbon nano tube, the shape memory polymer composite material changes the glass transition temperature by compounding different shape memory polymers and different fiber reinforced phases, the driving mode of the driving mechanism is thermal driving, electric driving or magnetic driving, the driving mechanism is triggered to work by a mobile phone key, and the deformation bridge is in a shape of snake or wave with upper and lower folds.
The shape memory polymer composite material is used as a material of the substrate of the circuit board, so that the internal hardware structure of the mobile phone cannot be damaged when the mobile phone is bent and folded, the prior art can be utilized to the greatest extent, and new problems are reduced. The shape memory polymer composite material has the characteristic of variable rigidity, so that the rigidity of the circuit board substrate is reduced only in the deformation process (folding or unfolding process), and the rigidity of the circuit board substrate is the same and far greater than the rigidity in deformation after the circuit board substrate is folded or unfolded, so that the internal structure is ensured to be in a sufficiently stable state when the circuit board substrate is used, and the situation is the same as that when a normal smart phone is used. The corresponding stimulation mode can be selected according to different shape memory polymer composite materials, so that the driving mode of the driving mechanism can be thermal, electric, magnetic, solution, pH and the like, and is selected according to design requirements, the driving mechanism can be a heating loop, the thermotropic shape memory polymer composite materials are driven to deform in a thermal driving mode, the heating loop is triggered by a key arranged on a mobile phone, folding can be realized under the action of external force due to temperature rise when the key is pressed, heating is stopped after the folding is finished, the folding mode is kept when the temperature is reduced, meanwhile, the modulus of the circuit board rises and becomes hard, normal use can be realized, and when the shape needs to be restored, the heating key is pressed again, and the deformed circuit board automatically restores the original shape under the action of the shape memory effect. The glass transition temperature of the shape memory polymer composite material is adjustable, so that the temperature to be heated can be designed according to the temperature which can be borne by the electronic component, and the safety of a circuit is ensured. In order to realize the deformation characteristic of the deformation bridge, a serpentine shape or a wave shape with upper and lower folds can be adopted to increase the deformation amount. The shape memory polymer composite material has good repeatability, provides guarantee for the service life of the foldable mobile phone, and can realize bending folding and automatic recovery of the circuit board on the premise of not needing obvious change.
The circuit board substrate is provided with the bistable metal sheet, the bistable metal sheet has an arc state and a straight plate state, and the driving mechanism drives the bistable metal sheet to switch between the arc state and the straight plate state. When the key is started, the heating loop is excited to generate heat in the power-on state, so that the modulus of the deformed circuit board is reduced and the deformed circuit board becomes soft, and meanwhile, the bistable metal plate is driven to be in the arc state, the circuit board also becomes the arc and keeps the shape to form a full-bending circuit board, and when the circuit board is restored, the bistable metal plate is in the straight plate state, and the circuit board also becomes the straight plate and keeps the shape.
The deformed circuit board based on the shape memory polymer composite material provided by the invention is described in detail, and the principle and the implementation mode of the invention are explained by applying specific examples, and the description of the examples is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present invention.
Claims (9)
1. A shape memory polymer composite-based deformed circuit board is characterized in that: the circuit board comprises a circuit board substrate, an electronic element and a driving mechanism, wherein the circuit board substrate is made of a shape memory polymer composite material, the shape memory polymer composite material is a material formed by compounding a shape memory polymer and a fiber reinforcement phase, the electronic element is distributed on the circuit board substrate in an island-bridge mode, the electronic element comprises a semiconductor device and a lead, the island-bridge mode comprises a fixed island and a deformable bridge, the semiconductor device is distributed in the fixed island, the lead connected between the semiconductor devices is the deformable bridge, the driving mechanism is positioned on the deformable bridge, and the driving mechanism stimulates the circuit board substrate and reaches the glass transition temperature of the shape memory polymer composite material.
2. The deformed circuit board based on a shape memory polymer composite material of claim 1, wherein: the shape memory polymer is a polyimide-based shape memory polymer or an epoxy-based shape memory polymer.
3. The deformed circuit board based on a shape memory polymer composite material of claim 1, wherein: the fiber reinforced phase is one or more of carbon fiber, glass fiber, spandex fiber, Kevlar fiber, aramid fiber, graphene or carbon nano tube.
4. The deformed circuit board based on a shape memory polymer composite material of claim 1, wherein: the shape memory polymer composite material changes the glass transition temperature by compounding different shape memory polymers with different fiber reinforced phases.
5. The deformed circuit board based on a shape memory polymer composite material of claim 1, wherein: the driving mechanism is driven in a thermal driving mode, an electric driving mode or a magnetic driving mode.
6. The deformed circuit board based on a shape memory polymer composite material of claim 1, wherein: the driving mechanism is triggered to work through the keys of the mobile phone.
7. The deformed circuit board based on a shape memory polymer composite material of claim 1, wherein: the deformation bridge is in a snake shape or a wave shape with upper and lower folds.
8. The deformed circuit board based on a shape memory polymer composite material of claim 1, wherein: the circuit board substrate is provided with a bistable metal sheet, and the bistable metal sheet has two states of an arc state and a straight plate shape.
9. The deformed circuit board based on a shape memory polymer composite of claim 8, wherein: the driving mechanism drives the bistable metal sheet to switch between an arc state and a straight plate state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811538876.6A CN111328182A (en) | 2018-12-13 | 2018-12-13 | Deformed circuit board based on shape memory polymer composite material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811538876.6A CN111328182A (en) | 2018-12-13 | 2018-12-13 | Deformed circuit board based on shape memory polymer composite material |
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| Publication Number | Publication Date |
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| CN111328182A true CN111328182A (en) | 2020-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201811538876.6A Pending CN111328182A (en) | 2018-12-13 | 2018-12-13 | Deformed circuit board based on shape memory polymer composite material |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113105613A (en) * | 2021-04-13 | 2021-07-13 | 电子科技大学 | Preparation method of shape memory, shape memory and preparation method of 3D screen |
| CN113949305A (en) * | 2021-05-08 | 2022-01-18 | 天津科技大学 | Preparation method of graphene micro-wrinkle friction nano generator |
| CN116141651A (en) * | 2023-03-14 | 2023-05-23 | 哈尔滨工业大学 | Shape memory material-based aircraft emergency slide and manufacturing method thereof |
Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10151242A1 (en) * | 2001-10-17 | 2003-05-08 | Siemens Ag | Circuit board fitted or for fitting with components, has shape memory alloy element(s) that adopts imposed shape depending on temperature to deform board |
| JP2006247081A (en) * | 2005-03-10 | 2006-09-21 | Pentax Corp | Capsule type apparatus |
| CN101909404A (en) * | 2010-07-19 | 2010-12-08 | 友达光电(厦门)有限公司 | Shape memory circuit board, liquid crystal display device applying shape memory circuit board and assembly method |
| US20120044637A1 (en) * | 2010-08-19 | 2012-02-23 | Apple Inc. | Formed pcb |
| US20130127690A1 (en) * | 2011-11-18 | 2013-05-23 | Industrial Technology Research Institute | Electronic apparatus and display apparatus |
| US20130298548A1 (en) * | 2012-05-11 | 2013-11-14 | Empire Technology Development Llc | Shape memory alloy composite flexible substrates |
| CN204291556U (en) * | 2014-10-13 | 2015-04-22 | 南京力聪新材料有限公司 | Can fast-changing circuit conductive parts |
| CN105356029A (en) * | 2015-11-09 | 2016-02-24 | 哈尔滨工业大学 | Planar reflection array antenna based on shape memory polymer composite material hinge and expansion method thereof |
| US20160089855A1 (en) * | 2014-09-26 | 2016-03-31 | Intel Corporation | Morphing form factor material |
| US20160135286A1 (en) * | 2013-05-29 | 2016-05-12 | Chang-soon Hwang | Bendable electronic device |
| US20160209877A1 (en) * | 2015-01-15 | 2016-07-21 | Samsung Display Co., Ltd. | Flexible display device |
| US20170094799A1 (en) * | 2015-09-25 | 2017-03-30 | Shipeng Qiu | Integrated circuit and method that utilize a shape memory material |
| CN107249254A (en) * | 2017-04-25 | 2017-10-13 | 广东工业大学 | A kind of stretchable or bending compound circuit system and preparation method thereof |
| JP2017220559A (en) * | 2016-06-07 | 2017-12-14 | パナソニックＩｐマネジメント株式会社 | Three-dimensional electronic circuit and manufacturing method thereof |
| US20180317314A1 (en) * | 2015-10-23 | 2018-11-01 | Universität des Saarlandes | Object Made of a Folded Sheet with Printed Electric Controls |
-
2018
- 2018-12-13 CN CN201811538876.6A patent/CN111328182A/en active Pending
Patent Citations (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE10151242A1 (en) * | 2001-10-17 | 2003-05-08 | Siemens Ag | Circuit board fitted or for fitting with components, has shape memory alloy element(s) that adopts imposed shape depending on temperature to deform board |
| JP2006247081A (en) * | 2005-03-10 | 2006-09-21 | Pentax Corp | Capsule type apparatus |
| CN101909404A (en) * | 2010-07-19 | 2010-12-08 | 友达光电(厦门)有限公司 | Shape memory circuit board, liquid crystal display device applying shape memory circuit board and assembly method |
| US20120044637A1 (en) * | 2010-08-19 | 2012-02-23 | Apple Inc. | Formed pcb |
| US20130127690A1 (en) * | 2011-11-18 | 2013-05-23 | Industrial Technology Research Institute | Electronic apparatus and display apparatus |
| US20130298548A1 (en) * | 2012-05-11 | 2013-11-14 | Empire Technology Development Llc | Shape memory alloy composite flexible substrates |
| US20160135286A1 (en) * | 2013-05-29 | 2016-05-12 | Chang-soon Hwang | Bendable electronic device |
| US20160089855A1 (en) * | 2014-09-26 | 2016-03-31 | Intel Corporation | Morphing form factor material |
| CN204291556U (en) * | 2014-10-13 | 2015-04-22 | 南京力聪新材料有限公司 | Can fast-changing circuit conductive parts |
| US20160209877A1 (en) * | 2015-01-15 | 2016-07-21 | Samsung Display Co., Ltd. | Flexible display device |
| US20170094799A1 (en) * | 2015-09-25 | 2017-03-30 | Shipeng Qiu | Integrated circuit and method that utilize a shape memory material |
| US20180317314A1 (en) * | 2015-10-23 | 2018-11-01 | Universität des Saarlandes | Object Made of a Folded Sheet with Printed Electric Controls |
| CN105356029A (en) * | 2015-11-09 | 2016-02-24 | 哈尔滨工业大学 | Planar reflection array antenna based on shape memory polymer composite material hinge and expansion method thereof |
| JP2017220559A (en) * | 2016-06-07 | 2017-12-14 | パナソニックＩｐマネジメント株式会社 | Three-dimensional electronic circuit and manufacturing method thereof |
| CN107249254A (en) * | 2017-04-25 | 2017-10-13 | 广东工业大学 | A kind of stretchable or bending compound circuit system and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113105613A (en) * | 2021-04-13 | 2021-07-13 | 电子科技大学 | Preparation method of shape memory, shape memory and preparation method of 3D screen |
| CN113949305A (en) * | 2021-05-08 | 2022-01-18 | 天津科技大学 | Preparation method of graphene micro-wrinkle friction nano generator |
| CN113949305B (en) * | 2021-05-08 | 2024-03-22 | 天津科技大学 | Preparation method of graphene micro-fold friction nano generator |
| CN116141651A (en) * | 2023-03-14 | 2023-05-23 | 哈尔滨工业大学 | Shape memory material-based aircraft emergency slide and manufacturing method thereof |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200623 |
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| RJ01 | Rejection of invention patent application after publication |