CN111319177B - Bionic adhesion material with mushroom-shaped end and preparation method thereof - Google Patents
Bionic adhesion material with mushroom-shaped end and preparation method thereof Download PDFInfo
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- CN111319177B CN111319177B CN202010137559.4A CN202010137559A CN111319177B CN 111319177 B CN111319177 B CN 111319177B CN 202010137559 A CN202010137559 A CN 202010137559A CN 111319177 B CN111319177 B CN 111319177B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/04—Rotational or centrifugal casting, i.e. coating the inside of a mould by rotating the mould
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C41/00—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor
- B29C41/02—Shaping by coating a mould, core or other substrate, i.e. by depositing material and stripping-off the shaped article; Apparatus therefor for making articles of definite length, i.e. discrete articles
- B29C41/14—Dipping a core
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
- B81B1/006—Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00055—Grooves
- B81C1/00071—Channels
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00111—Tips, pillars, i.e. raised structures
Abstract
The invention discloses a bionic adhesive material with mushroom-shaped ends and a preparation method thereof. The bionic adhesive material comprises an end head, a cylinder and a substrate; the lower surface of the end head is connected to the base through the column body, and the upper surface is densely distributed with submicron-level gully structures. The end head is round, polygonal or irregular. The preparation method comprises the steps of preparing a silicon-glass mold and preparing the bionic adhesion material with the mushroom-shaped end. The invention can provide mushroom-shaped end bionic adhesive materials with various shapes for the research of the adhesion mechanism. The submicron-level gully structure naturally formed on the upper surface of the end head greatly improves the adhesion performance of the bionic adhesion material. The contact end of the connecting cylinder and the substrate is eliminated by the silicon-glass mold, so that the connecting cylinder can be fully contacted with the prefabricated liquid when being immersed in the prefabricated liquid, and the structural strength of the bionic adhesive material is improved. Meanwhile, the infiltration fillet formed between the connecting column body and the substrate well improves the structural strength of the bionic adhesive material.
Description
Technical Field
The invention relates to the technical field of bionic structure manufacturing in a micro-mechanical system, in particular to a bionic adhesion material of a mushroom-shaped end head and a preparation method thereof
Background
Adhesion (Adhesion) is a phenomenon in which objects exhibit attraction to each other when in contact. In nature, organisms have evolved footpads that can be used to climb, for example, a gecko that climbs freely. Inspired by the above, the study on the adhesion mechanism of gecko climbing has become a focus of attention of a plurality of subject groups at home and abroad. In 2000, Autumn et al reported in the Top-level journal, Nature, that the adhesion of gecko foot pads results from intermolecular forces, van der Waals forces. Arzt et al in 2003 proposed the principle of exfoliation and splitting by studying the relationship among organism body weight, footpad structure size, and adhesion properties. Currently, biomimetic adhesive materials have been applied in a variety of fields such as biomedical engineering, precision industrial manufacturing, and climbing robots. However, the bionic adhesive material has more structural parameters, which are related to each other, and finding a suitable set of structural parameters is still a complicated task. Moreover, the bionic adhesive materials of the mushroom-shaped ends are all round, so that the research on the adhesion mechanism of the bionic adhesive materials is greatly limited.
For the preparation of biomimetic adhesive materials, a great number of reports have been reported in the literature. At present, there are two main methods of preparation by inverse molding, i.e., an SOI silicon mold method and a double-layer photoresist mold method. The top layer of SOI silicon is etched to form a first layer of patterned structure by silicon etching, the silicon dioxide of the middle layer is etched to form a second layer of patterned structure by hydrofluoric acid, and the bionic adhesion material is prepared by soft materials such as silica gel and the like through a reverse mould method. Or, carrying out two times of etching on the spin-coated two layers of photoresist with different properties (positive and negative) to obtain the double-layer photoresist mould. Both of the above approaches, however, have limitations. The SOI silicon die method has low applicability, and one die can only prepare a bionic adhesive material with one structural size; and the size of the end head is only slightly larger than that of the column body, otherwise great difficulty is caused to demoulding; moreover, it is very costly. The double-layer photoresist mold is easily damaged at the time of mold release, and thus has no reusability.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention provides a bionic adhesive material of a mushroom-shaped end head and a preparation method thereof.
The technical scheme of the invention is as follows:
a bionic adhesive material of mushroom-shaped end comprises an end, a cylinder and a base; the lower surface of the end head is connected to the base through a column body, and submicron-level gully structures are densely distributed on the upper surface of the end head.
Further, the end head is circular, polygonal or irregular.
A preparation method of bionic adhesive material of mushroom-shaped end comprises the following steps:
the method comprises the following steps: preparing a silicon-glass mold comprising:
carrying out deep silicon etching on the silicon wafer from the upper surface to form a pit, wherein the depth of the pit is greater than the height of the column;
the silicon wafer is subjected to thinning, grinding and polishing treatment from the lower surface, so that the pits become through holes;
carrying out anodic bonding on the silicon wafer and the first glass substrate to obtain a silicon-glass mold;
carrying out hydrophobic treatment on the surface of the silicon-glass mold;
step two: preparing a bionic adhesive material of a mushroom-shaped end, comprising:
pouring the silica gel prefabricated liquid into a silicon-glass mold for spin coating, vacuumizing and curing;
stripping the cured silica gel film from the silicon-glass mold, wherein the silica gel film comprises a film layer and a cylinder with one end connected to the film layer;
adhering a thin film layer of the silica gel film to a second glass substrate with the upper surface coated with photoresist in a spinning mode;
laser cutting the thin film layer of the silica gel thin film around the cylinder, wherein the cutting depth is greater than the thickness of the thin film layer;
immersing the other end of the cylinder into a silica gel prefabricated liquid which is spin-coated on a third glass substrate;
and after the silica gel prefabricated liquid is solidified, dissolving the photoresist, and removing the second glass substrate and the part of the thin film layer, which is not connected with the cylinder, to obtain the bionic adhesive material with the mushroom-shaped end.
Further, the silica gel pre-prepared solution is Dow Corning 184, and the weight ratio of the silica gel pre-prepared solution is 10: preparing stock solution and curing solution according to the volume ratio of 1, and vacuumizing after preparation.
Further, the photoresist is AZ 5214.
The invention can provide mushroom-shaped end bionic adhesive materials with various shapes for the research of the adhesion mechanism. Due to thermal expansion and cold contraction, submicron-level gully structures are naturally formed on the upper surface of the end head, so that the adhesion performance of the bionic adhesion material is greatly improved. The contact end of the connecting cylinder and the substrate is eliminated by the silicon-glass mold, so that the connecting cylinder can be fully contacted with the prefabricated liquid when being immersed in the prefabricated liquid, and the structural strength of the bionic adhesive material is improved. Meanwhile, the infiltration fillet formed between the connecting column body and the substrate well improves the structural strength of the bionic adhesive material.
Drawings
FIG. 1 is a bionic adhesive material with mushroom-shaped end.
FIG. 2 shows another bionic adhesive material with mushroom-shaped ends.
Fig. 3 shows a submicron-scale gap structure on the top surface of the tip.
FIG. 4 is a working principle of the bionic adhesion material with mushroom-shaped ends.
FIG. 5 shows the results of adhesion strength test of the biomimetic adhesive material with mushroom-shaped tips.
FIG. 6 is a preparation method of a bionic adhesive material with mushroom-shaped ends.
In the figure: 1-end, 2-connecting column and 3-base.
Detailed Description
The invention is further described with reference to the following figures and specific embodiments.
Referring to fig. 1, the bionic adhesive material structure of the mushroom-shaped end comprises an end 1, a connecting cylinder 2 and a base 3, wherein the end 1 and the connecting cylinder 2 form a mushroom-shaped end structure, and the other end of the connecting cylinder 2 is connected with the base 3.
Referring to fig. 1, the head 1 has a size larger than that of the coupling cylinder 2.
Referring to fig. 1 and 2, the tip 1 may be circular, polygonal, and other irregular shapes.
Referring to fig. 3, submicron-level gully structures are densely distributed on the upper surface of the end.
Referring to fig. 4, the working principle of the bionic adhesion material of the mushroom-shaped end is as follows:
under the action of preload, the adhesive material is contacted with the glass substrate; when the preload is reversed, the adhesive material adheres to the glass substrate until peeling occurs. The submicron-level gully structure densely distributed on the upper surface of the mushroom-shaped end can greatly reduce the contact rigidity, increase the contact area and generate a hook-lock effect with the irregular bulges on the glass substrate, so that the adhesion performance of the bionic adhesion material can be greatly improved.
Referring to fig. 5, the bionic adhesive material of the mushroom-shaped tip has an adhesive strength more than 3 times that of the conventional bionic adhesive material.
Referring to fig. 6, the preparation method of the bionic adhesion material of the mushroom-shaped tip is divided into two parts, specifically:
part (a) preparation of a silicon-glass mold.
S1: and (3) ultrasonically cleaning a silicon wafer with the thickness of 500 microns by using acetone, absolute ethyl alcohol and deionized water in sequence, and then carrying out deep silicon etching on the silicon wafer to form a pit. The etch depth was 280 microns, 30 microns greater than the height of the connecting pillars.
S2: and (3) shearing, grinding and polishing the etched silicon wafer from the lower surface to enable the etched pits to be through holes, wherein the residual thickness is 250 micrometers.
S3: and carrying out anodic bonding on the rest silicon wafers and the glass substrate to obtain the silicon-glass mold.
S4: and performing surface hydrophobization treatment on the silicon-glass mold after anodic bonding.
The silicon-glass mold obtained in the way eliminates the round angle at the bottom of the pit, and the connecting cylinder can be fully contacted with the prefabricated liquid when being immersed in the prefabricated liquid, so that the structural strength of the bionic adhesive material is increased.
Preparing the bionic adhesive material of the mushroom-shaped end of part (II).
S1: preparing a silica gel prefabricated liquid (Dow Corning 184) according to the volume ratio of 10:1, and vacuumizing. And then pouring the prefabricated liquid onto a silicon-glass mold for spin coating, vacuumizing and curing.
S2: and stripping the cured silica gel film, wherein the silica gel film comprises a film layer on the upper surface of the mold and a connecting cylinder in the pit. And (3) turning the silica gel film to enable the film layer of the silica gel film to be adhered to the glass substrate of which the upper surface is coated with the photoresist AZ5214 serving as a sacrificial layer in a spinning mode.
S3: carrying out patterned laser cutting on the silica gel film, wherein the cutting depth is slightly larger than the thickness of the film;
s4: immersing the other end of the connecting column body into silica gel prefabricated liquid spin-coated on a glass substrate;
s5: after curing, the sacrificial layer AZ5214 is dissolved.
The bionic adhesive material with the mushroom-shaped end can be obtained by the method.
Other similar materials may be used for the silica gel pre-solution and the photoresist.
Claims (3)
1. A preparation method of bionic adhesion material of mushroom-shaped end is characterized by comprising the following steps:
the method comprises the following steps: preparing a silicon-glass mold comprising:
carrying out deep silicon etching on the silicon wafer from the upper surface to form a pit, wherein the depth of the pit is greater than the height of the column;
the silicon wafer is subjected to thinning, grinding and polishing treatment from the lower surface, so that the pits become through holes;
carrying out anodic bonding on the silicon wafer and the first glass substrate to obtain a silicon-glass mold;
carrying out hydrophobic treatment on the surface of the silicon-glass mold;
step two: preparing a bionic adhesive material of a mushroom-shaped end, comprising:
pouring the silica gel prefabricated liquid into a silicon-glass mold for spin coating, vacuumizing and curing;
stripping the cured silica gel film from the silicon-glass mold, wherein the silica gel film comprises a film layer and a cylinder with one end connected to the film layer;
adhering a thin film layer of the silica gel film to a second glass substrate with the upper surface coated with photoresist in a spinning mode;
laser cutting the thin film layer of the silica gel thin film around the cylinder, wherein the cutting depth is greater than the thickness of the thin film layer;
immersing the other end of the cylinder into a silica gel prefabricated liquid which is spin-coated on a third glass substrate;
and after the silica gel prefabricated liquid is solidified, dissolving the photoresist, and removing the second glass substrate and the part of the thin film layer, which is not connected with the cylinder, to obtain the bionic adhesive material with the mushroom-shaped end.
2. The method of claim 1, wherein the pre-formed silica gel solution is Dow Corning 184, in a ratio of 10: preparing stock solution and curing solution according to the volume ratio of 1, and vacuumizing after preparation.
3. The method of claim 1, wherein the photoresist is AZ 5214.
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| CN202010137559.4A CN111319177B (en) | 2020-03-01 | 2020-03-01 | Bionic adhesion material with mushroom-shaped end and preparation method thereof |
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| CN202010137559.4A CN111319177B (en) | 2020-03-01 | 2020-03-01 | Bionic adhesion material with mushroom-shaped end and preparation method thereof |
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| CN111319177B true CN111319177B (en) | 2021-05-18 |
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| CN112936670A (en) * | 2021-01-28 | 2021-06-11 | 清华大学 | Horn-shaped controllable adhesion structure and using method and preparation method thereof |
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| KR20090055951A (en) * | 2007-11-29 | 2009-06-03 | 한국기계연구원 | Simple manufacturing method for dry adhesion using molding |
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Patent Citations (4)
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| CN101774528A (en) * | 2010-01-04 | 2010-07-14 | 中国科学院合肥物质科学研究院 | Cross-scale biomimetic micro-nano branch structure array and preparation method thereof |
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| KR101863817B1 (en) * | 2017-01-17 | 2018-06-01 | 울산과학기술원 | Manufacturing method of dry adhesive structure |
| CN109273366A (en) * | 2018-07-17 | 2019-01-25 | 西南交通大学 | A kind of preparation method of " island body-connection cylinder-substrate " structural flexibility matrix |
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