CN111313685B - Drive control module and vehicle-mounted air conditioner - Google Patents

Drive control module and vehicle-mounted air conditioner Download PDF

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Publication number
CN111313685B
CN111313685B CN202010220513.9A CN202010220513A CN111313685B CN 111313685 B CN111313685 B CN 111313685B CN 202010220513 A CN202010220513 A CN 202010220513A CN 111313685 B CN111313685 B CN 111313685B
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voltage
control module
circuit
inductive
elements
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CN111313685A (en
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霍兆镜
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Guangzhou Hualing Refrigeration Equipment Co Ltd
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Guangzhou Hualing Refrigeration Equipment Co Ltd
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    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • H02M1/44Circuits or arrangements for compensating for electromagnetic interference in converters or inverters
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60HARRANGEMENTS OF HEATING, COOLING, VENTILATING OR OTHER AIR-TREATING DEVICES SPECIALLY ADAPTED FOR PASSENGER OR GOODS SPACES OF VEHICLES
    • B60H1/00Heating, cooling or ventilating [HVAC] devices
    • B60H1/00421Driving arrangements for parts of a vehicle air-conditioning
    • B60H1/00428Driving arrangements for parts of a vehicle air-conditioning electric
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B60VEHICLES IN GENERAL
    • B60RVEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
    • B60R16/00Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
    • B60R16/02Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
    • B60R16/03Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for supply of electrical power to vehicle subsystems or for
    • HELECTRICITY
    • H02GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
    • H02MAPPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
    • H02M1/00Details of apparatus for conversion
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0228Compensation of cross-talk by a mutually correlated lay-out of printed circuit traces, e.g. for compensation of cross-talk in mounted connectors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0216Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0233Filters, inductors or a magnetic substance
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02TCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
    • Y02T10/00Road transport of goods or passengers
    • Y02T10/80Technologies aiming to reduce greenhouse gasses emissions common to all road transportation technologies
    • Y02T10/88Optimized components or subsystems, e.g. lighting, actively controlled glasses

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • Dc-Dc Converters (AREA)

Abstract

The invention provides a drive control module and a vehicle-mounted air conditioner, wherein the drive control module comprises: the voltage-multiplying booster circuit of circuit substrate and multichannel, voltage-multiplying booster circuit are suitable for according to the operation of a plurality of loads of power supply signal drive, and voltage-multiplying booster circuit sets up on circuit substrate, and circuit substrate is provided with power source, and voltage-multiplying booster circuit includes: the input end of the first inductive element is suitable for being connected with the power interface; a plurality of parallel first capacitive elements adapted to be connected to the output of the first inductive element; and the second inductive elements are arranged in a plurality of ways and are suitable for being connected with the plurality of first capacitive elements, and the first capacitive elements are suitable for supplying power to the second inductive elements. Through the technical scheme of the invention, mutual interference among the inductors is prevented, so that EMC optimization is realized, and a filtering magnetic ring or a filtering capacitor for optimizing EMC is not required to be added.

Description

Drive control module and vehicle-mounted air conditioner
Technical Field
The invention relates to the field of drive control, in particular to a drive control module and a vehicle-mounted air conditioner.
Background
In the related art, the EMC problem is solved by adding a filter magnetic ring or a filter capacitor in the drive control circuit of the current vehicle-mounted air conditioner, but the following defects exist:
the above method causes difficulty in producing a circuit substrate of the drive control circuit, and increases unreliability.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
To this end, an object of the invention is to propose a drive control module.
Another object of the present invention is to provide a vehicle air conditioner.
The technical solution of the first aspect of the present invention provides a driving control module, including a circuit substrate and multiple voltage-multiplying voltage boost circuits, where the voltage-multiplying voltage boost circuits are adapted to drive multiple loads to operate according to a power supply signal, the voltage-multiplying voltage boost circuits are disposed on the circuit substrate, the circuit substrate is provided with a power interface, and the voltage-multiplying voltage boost circuits include: the input end of the first inductive element is suitable for being connected with the power interface; a plurality of parallel first capacitive elements adapted to be connected to the output of the first inductive element; and the second inductive elements are arranged in a plurality of ways and are suitable for being connected with the plurality of first capacitive elements, and the first capacitive elements are suitable for supplying power to the second inductive elements.
The multiple paths of second inductive elements are arranged on the circuit substrate side by side.
In the technical scheme, the first inductive element is specifically a common mode inductor, the first capacitive element is specifically an energy storage capacitor, the second inductive element is specifically a boost inductor, for example, two voltage-multiplying boost circuits are taken as two paths, the second inductive element (boost inductor) comprises two boost inductors which are arranged in parallel, so that mutual interference between the inductors can be prevented, and EMC (Electro Magnetic Compatibility, that is, the capacity that equipment and a system can normally work in an electromagnetic environment and cannot bear electromagnetic disturbance to any things in the environment) optimization is realized, so that a filter Magnetic ring or a filter capacitor for optimizing EMC is not required to be added.
In addition, the power interface is suitable for being connected with an alternating current power supply, and the energy storage inductor is suitable for supplying power to devices in the voltage-multiplying booster circuit at the rear end.
In the above technical solution, the power interface includes a positive power interface and a negative power interface, the input end of the first inductive element includes a first input end and a second input end, the first input end is suitable for being connected with the positive power interface by using a first section of wiring, the second input end is suitable for being connected with the negative power interface by using a second section of wiring, the first section of wiring and the second section of wiring are arranged in parallel, or a first included angle is defined between the first section of wiring and the second section of wiring, and the first included angle is greater than 0 ° and less than or equal to 5 °.
In the technical scheme, a line (a first line segment) from the positive power interface to the first input end of the common mode inductor and a line (a second line segment) from the negative power interface to the second input end of the common mode inductor are arranged in a parallel line mode, and the area formed by the two lines is very small, so that the electromagnetic field emitted by the two lines is very small, and the EMC optimization is further realized.
In addition, aiming at the arrangement mode that two wires are not completely parallel, the included angle between the two wires can be limited to be not more than 5 degrees, the two wires are parallel or the included angle is less than or equal to 5 degrees, and the arrangement mode is within the protection range of the application.
In any of the above technical solutions, the first inductive element includes a first output end and a second output end, a trace between the first output end and the positive electrode of the first capacitive element is parallel to a trace between the positive electrode of the first capacitive element and the second inductive element, or a second included angle is defined, the second included angle is greater than 0 ° and less than or equal to 5 °; the second output terminal is connected to a ground line on the circuit substrate.
In the technical scheme, the common mode inductor outputs the line reaching the energy storage capacitor, the energy storage capacitor reaches the line of the boost inductor, and the mode of parallel line or near parallel line is also defined, namely the second included angle is less than or equal to 5 degrees, so as to reduce the electromagnetic interference between devices.
In any of the above technical solutions, the plurality of parallel first capacitive elements are disposed between the first inductive element and the plurality of paths of second inductive elements.
In this technical scheme, on the circuit substrate, through placing energy storage capacitor between common mode inductance and multichannel boost inductance, on the one hand, be favorable to the differential mode interference that filtering boost circuit caused, on the other hand can provide the electric energy for boost circuit, and on the other hand again, through keeping apart boost inductance and common mode inductance, prevented two kinds of inductances from producing mutual interference when make full use of space to can promote common mode inductance's efficiency by a wide margin.
In any of the above technical solutions, the length direction of the first inductive element is set along a first direction, the length direction of the second inductive element is set along a second direction, and a third included angle is defined between the first direction and the second direction.
Wherein the third included angle is greater than or equal to 80 ° and less than or equal to 100 °.
In any of the above embodiments, preferably, the third included angle is 90 °.
In the technical scheme, the common mode inductor and the boost inductor are arranged on the circuit substrate in a relative position relationship of 90 degrees or nearly 90 degrees, so that on one hand, the common mode inductor can be prevented from failing due to mutual coupling of the boost inductor and the common mode inductor, and on the other hand, other EMC interference can be prevented from being caused.
In any of the above technical solutions, the voltage-doubling boost circuit further includes a plurality of paths of power switching tubes and a plurality of paths of second capacitive elements, which are correspondingly disposed: the multi-path power switching tubes and the multi-path second inductive elements are arranged correspondingly one by one, each path of power switching tube comprises a conducting circuit and a closing circuit, and the conducting circuit is suitable for connecting the power switching tubes with the corresponding second inductive elements and the first capacitive elements; the voltage-multiplying booster circuit also comprises a plurality of paths of first diodes, second diodes and third capacitive elements, wherein the anodes of the first diodes are connected to the output ends of the corresponding second inductive elements, the cathodes of the first diodes are connected to the third capacitive elements, the closing circuit comprises a first circuit and a second circuit, the first circuit is suitable for connecting the second capacitive elements, the second diodes and the third capacitive elements, and the second circuit is suitable for connecting the first diodes and the second capacitive elements in different paths. The conducting circuit, the first circuit and the second circuit are arranged in parallel.
The second capacitive element is specifically a boost capacitor, the third capacitive element is specifically an electrolytic capacitor for outputting bus voltage, and the anode of the second diode is connected with the cathode of the second diode.
In the technical scheme, one voltage-multiplying booster circuit is taken as an example in a multi-path voltage-multiplying booster circuit, when a power switch tube in the path is switched on, energy is stored in a corresponding booster inductor, and the current trend is that the energy is returned to a plurality of energy storage capacitors connected in parallel from the booster inductor to the power switch tube through a ground wire.
The power switch tube in the circuit comprises two current flow paths after being closed, the first current flow path reaches the electrolytic capacitor from the boost capacitor through the second diode, the second current flow path reaches the boost capacitor of the other current flow path from the first diode, wiring corresponding to the current flow paths is arranged in a parallel mode, and a smaller surrounding area is defined, so that a good effect of preventing electromagnetic emission can be achieved.
In any of the above technical solutions, the second capacitive element is disposed between the second inductive element and the power switch tube.
In the technical scheme, after the boost capacitor is placed on the boost inductor on the circuit substrate, the boost inductor can reach the boost capacitor through the shortest path when energy is released, so that the generation of excessive electromagnetic radiation caused by overlong current path is prevented.
In any of the above technical solutions, the multiple power switch tubes and the multiple first diodes are disposed in parallel at one end of the circuit substrate.
In the technical scheme, at least two power switching tubes and corresponding diodes are placed at one end of the circuit substrate, so that concentrated heat dissipation and/or shielding and other treatment can be better performed on the power devices.
A second aspect of the present invention provides a vehicle-mounted air conditioner, including: a load; according to the drive control module of any one of the technical schemes, the drive control module comprises a circuit substrate and a plurality of paths of voltage-multiplying and boosting circuits, a copper-clad layer is laid on the circuit substrate, the voltage-multiplying and boosting circuits are arranged on the circuit substrate, and the voltage-multiplying and boosting circuits are suitable for driving a plurality of loads to operate according to power supply signals.
In this technical solution, the vehicle-mounted air conditioner includes the drive control circuit in any one of the above technical solutions, and therefore, the vehicle-mounted air conditioner includes all the beneficial effects of the drive control module in any one of the above technical solutions, which is not described herein again.
In the above technical solution, the load includes a compressor and/or a fan.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 shows a schematic diagram of the relative positions of some components of a drive control module according to an embodiment of the invention;
FIG. 2 illustrates a layout diagram of a drive control module according to one embodiment of the present invention;
fig. 3 shows a schematic diagram of a voltage doubler boost circuit according to an embodiment of the invention.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, a more particular description of the invention will be rendered by reference to the appended drawings. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited to the specific embodiments disclosed below.
The drive control module according to an embodiment of the present invention includes: the circuit board and the multi-path voltage-doubling booster circuit.
The multi-path voltage-doubling booster circuit is shown in fig. 3.
Specifically, the power supply is accessed from power interfaces CN1 and CN2, and reaches energy storage capacitors E4, E6 and E8 after passing through common mode inductor L1, so as to supply power to the following multi-path interleaved voltage-doubling boost circuit.
Taking two staggered voltage-multiplying booster circuits as an example, when the two staggered voltage-multiplying booster circuits work, the power switch tube Q601 and the power switch tube Q602 work alternately, the power switch tube Q601 stores energy for the boosting inductor L603 when being switched on, and after the power switch tube Q601 is switched off, the energy of the boosting inductor L603 is released, on one hand, the boosting capacitor C603 is charged through the first diode D600, on the other hand, the energy reaches the electrolytic capacitor E2 through the boosting capacitor C602 and the second diode D603, and the electrolytic capacitor E2 is charged.
Correspondingly, when the power switch tube Q602 is turned on, energy is stored in the boost inductor L602, and when the power switch tube Q602 is turned off, the energy in the boost inductor L602 is released, so that the boost capacitor C602 is charged through the diode D601, and the boost capacitor C603 and the diode D603 reach the electrolytic capacitor E2 to charge the electrolytic capacitor E2. An electrolytic capacitor E2 powers the compressor and fan.
As shown in fig. 1, specifically, the voltage-doubling boost circuit is suitable for driving a plurality of loads to operate according to a power supply signal, the voltage-doubling boost circuit is disposed on a circuit substrate 10, as shown in fig. 2, the circuit substrate 10 is provided with a power interface, and the voltage-doubling boost circuit includes: the input end of the first inductive element is suitable for being connected with the power interface; a plurality of parallel first capacitive elements adapted to be connected to the output of the first inductive element; and the second inductive elements are arranged in a plurality of ways and are suitable for being connected with the plurality of first capacitive elements, and the first capacitive elements are suitable for supplying power to the second inductive elements.
Wherein, the plurality of second inductive elements are arranged on the circuit substrate 10 side by side.
In this embodiment, the first inductive element is specifically a common mode inductor L1, the first capacitive element is specifically energy storage capacitors E4, E6 and E8, the second inductive element is specifically a boost inductor, taking a two-way voltage-multiplying boost circuit as an example, the second inductive element (boost inductors L602 and L603) includes two boost inductors L602 and L603, which are placed in parallel, so as to be beneficial for preventing mutual interference between the inductors, so as to achieve EMC (Electro Magnetic Compatibility, that is, the ability of the device and system to work normally in its electromagnetic environment and not to form electromagnetic disturbance that cannot be borne by anything in the environment) optimization, and thus, there is no need to add a filter Magnetic ring or a filter capacitor for optimizing EMC.
In addition, the power interface is suitable for being connected with an alternating current power supply, and the energy storage inductor is suitable for supplying power to devices in the voltage-multiplying booster circuit at the rear end.
As shown in fig. 1, in the above embodiment, the power interface includes a positive power interface CN2 and a negative power interface CN1, the input end of the first inductive element includes a first input end and a second input end, the first input end is suitable for being connected to the positive power interface CN2 by using a first segment of routing, the second input end is suitable for being connected to the negative power interface CN1 by using a second segment of routing, the first segment of routing is parallel to the second segment of routing, or a first included angle is defined between the first segment of routing and the second segment of routing, and the first included angle is greater than 0 ° and less than or equal to 5 °.
In this embodiment, the trace (the first trace section) from the positive power interface CN2 to the first input end of the common mode inductor L1 and the trace (the second trace section) from the negative power interface CN1 to the second input end of the common mode inductor L1 are arranged in a parallel trace manner, and since the area formed by the two traces in a surrounding manner is very small, the electromagnetic field emitted by the two traces is correspondingly very small, thereby further realizing optimization of EMC.
In addition, aiming at the arrangement mode that two wires are not completely parallel, the included angle between the two wires can be limited to be not more than 5 degrees, the two wires are parallel or the included angle is less than or equal to 5 degrees, and the arrangement mode is within the protection range of the application.
In any of the above embodiments, the first inductive element common mode inductor L1 includes a first output terminal and a second output terminal, the first output terminal and the first capacitive element, that is, the trace between the positive electrodes of the energy storage capacitors E4, E6 and E8 connected in parallel are arranged in parallel with the trace between the positive electrode of the first capacitive element and the second inductive element, or define a second included angle, the second included angle is greater than 0 ° and less than or equal to 5 °; the second output terminal is connected to the ground on the circuit substrate 10.
In this embodiment, the common mode inductor L1 output reaches the traces of the energy storage capacitors E4, E6, and E8, and the energy storage capacitors E4, E6, and E8 reach the traces of the boost inductors L602 and L603, which are also defined as parallel traces or traces close to parallel traces, that is, the second included angle is less than or equal to 5 °, so as to reduce the electromagnetic interference between the devices.
In any of the above embodiments, the plurality of parallel first capacitive elements are disposed between the first inductive element and the plurality of paths of second inductive elements.
In this embodiment, on the circuit substrate 10, the energy storage capacitors E4, E6, and E8 are disposed between the common mode inductor L1 and the multi-path boost inductors L602 and L603, which is beneficial to filtering out the differential mode interference caused by the boost circuit, on the other hand, the power can be provided for the boost circuit, and on the other hand, the boost inductors L602 and L603 and the common mode inductor L1 are isolated, so that the mutual interference between the two inductors is prevented while the space is fully utilized, and the efficiency of the common mode inductor L1 can be greatly improved.
As shown in fig. 1, in any of the above embodiments, the length direction of the first inductive element is arranged along the first direction, the length direction of the second inductive element is arranged along the second direction, and a third included angle is defined between the first direction and the second direction.
Wherein the third included angle is greater than or equal to 80 ° and less than or equal to 100 °.
In any of the above embodiments, preferably, the third included angle is 90 °.
In this embodiment, by disposing the common mode inductor L1 and the boost inductors L602 and L603 at a relative positional relationship of 90 ° or nearly 90 ° on the circuit substrate 10, it is possible to prevent the common mode inductor L1 from failing due to the mutual coupling of the boost inductors L602 and L603 and the common mode inductor L1, and to prevent EMC interference from other components.
As shown in fig. 2, in any of the above embodiments, the voltage-doubling boost circuit further includes multiple power switch transistors (including a first power switch transistor Q601 and a second power switch transistor Q602) and multiple second capacitive elements (including a first boost capacitor C602 and a second boost capacitor C603), which are correspondingly disposed, the multiple power switch transistors and the multiple second inductive elements are correspondingly disposed one by one, each power switch transistor includes a conducting circuit and a closing circuit, and the conducting circuit is adapted to connect the power switch transistor with the corresponding second inductive element and the first capacitive element (the power switch transistor Q601 and the boost capacitor C602, the power switch transistor Q602 and the boost capacitor C603).
The voltage-multiplying booster circuit further comprises a plurality of paths of first diodes (D600 and D601), wherein the first diode D600 and the power switch tube Q601 in the first path are connected with the booster inductor L603 in the second path, and the first diode D601 and the power switch tube Q602 in the second path are connected with the booster inductor L602 in the first path.
The boost capacitor is connected to the first diode and also to the anode of the second diode D603, the cathode of the second diode is connected to the electrolytic capacitor E2 of the third capacitive element, the anode of the first diode is connected to the output of the corresponding second inductive element, the cathode of the first diode is connected to the third capacitive element, the closing circuit comprises a first line and a second line, the first line is adapted to connect the second capacitive element, the second diode and the third capacitive element, the second line is adapted to connect the first diode and the second capacitive element in the same line. The conducting circuit, the first circuit and the second circuit are arranged in parallel.
The second capacitive element is specifically a boost capacitor, the third capacitive element is specifically an electrolytic capacitor E2 for outputting bus voltage, and the anode of the second diode is connected with the cathode of the second diode.
In this embodiment, for example, one voltage-multiplying voltage boosting circuit is used in the multiple voltage-multiplying voltage boosting circuits, when the power switch tube in the circuit is turned on, energy is stored in the corresponding voltage boosting inductors L602 and L603, and the current flows from the voltage boosting inductors L602 and L603 to the power switch tube and then flows back to the multiple energy storage capacitors E4, E6, and E8 connected in parallel through the ground line.
The power switch tube in the circuit comprises two current flow paths after being closed, the first current flow path reaches the electrolytic capacitor E2 from the boost capacitor through the second diode, the second current flow path reaches the boost capacitor from the first diode, wiring corresponding to the current flow paths is set to be in a parallel mode, and a smaller surrounding area is defined, so that a good effect of preventing electromagnetic emission can be achieved.
As shown in fig. 2, in any of the above embodiments, the second capacitive element (the boost capacitor C602 and the boost capacitor C603) is disposed between the second inductive element (the boost inductor L602 and the boost inductor L604) and the power switch (Q601 and Q602).
In this embodiment, after the boost capacitors are disposed on the boost inductors L602 and L603 on the circuit substrate 10, the boost inductors L602 and L603 can reach the boost capacitors in the shortest path when energy is released, so as to prevent the generation of excessive electromagnetic radiation due to too long current path.
As shown in fig. 2, in any of the above embodiments, the multiple power switches Q601 and Q602 and the multiple first diodes D300 and D301 are disposed side by side at one end of the circuit substrate 10.
In this embodiment, at least two power switching tubes and corresponding diodes are disposed at one end of the circuit substrate 10, so that the power devices can be better subjected to concentrated heat dissipation and/or shielding.
An in-vehicle air conditioner according to an embodiment of the present invention includes: a load; the drive control module according to any one of the embodiments above, wherein the drive control module includes a circuit substrate and multiple voltage-multiplying voltage boost circuits, the circuit substrate is provided with a copper-clad layer, the voltage-multiplying voltage boost circuits are disposed on the circuit substrate, and the voltage-multiplying voltage boost circuits are adapted to drive multiple loads to operate according to a power supply signal.
In this embodiment, the vehicle-mounted air conditioner includes the driving control circuit described in any one of the embodiments above, and therefore, the vehicle-mounted air conditioner includes all the beneficial effects of the driving control module described in any one of the embodiments above, which are not described herein again.
In the above embodiments, the load comprises a compressor and/or a fan.
In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; the term "plurality" means two or more unless expressly limited otherwise. The terms "mounted," "connected," "fixed," and the like are to be construed broadly, and for example, "connected" may be a fixed connection, a removable connection, or an integral connection; "coupled" may be direct or indirect through an intermediary. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "left", "right", "front", and "front" are used herein,
The directions or positional relationships indicated by "rear" and the like are based on the directions or positional relationships shown in the drawings, and are only for convenience of describing the present invention and simplifying the description, but do not indicate or imply that the referred device or unit must have a specific direction, be configured and operated in a specific direction, and thus, should not be construed as limiting the present invention.
In the description herein, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
In addition, a plurality described in the present application is specifically at least two.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (11)

1. A drive control module, characterized by, including circuit substrate and multichannel voltage doubling boost circuit, voltage doubling boost circuit is suitable for according to the operation of a plurality of loads of power supply signal drive, voltage doubling boost circuit sets up in on the circuit substrate, the circuit substrate is provided with power source, voltage doubling boost circuit includes:
a first inductive element, an input end of the first inductive element being adapted to be connected to the power supply interface;
a plurality of parallel first capacitive elements adapted to be connected to the output of the first inductive element;
a plurality of second inductive elements arranged in a plurality of ways, adapted to be connected to a plurality of said first capacitive elements, said first capacitive elements being adapted to power said second inductive elements,
the multiple second inductive elements are arranged on the circuit substrate side by side, so that mutual interference among the inductors is prevented.
2. The drive control module of claim 1, wherein the power interface comprises a positive power interface and a negative power interface, the input of the first inductive element comprises a first input and a second input,
the first input end is suitable for being connected with the positive power interface through a first section of wiring, the second input end is suitable for being connected with the negative power interface through a second section of wiring, the first section of wiring and the second section of wiring are arranged in parallel, or a first included angle is limited between the first section of wiring and the second section of wiring, and the first included angle is larger than 0 degree and smaller than or equal to 5 degrees.
3. The drive control module of claim 2,
the first inductive element comprises a first output end and a second output end, a line between the first output end and the anode of the first capacitive element and a line between the anode of the first capacitive element and the second inductive element are arranged in parallel, or a second included angle is defined, and the second included angle is larger than 0 degrees and smaller than or equal to 5 degrees;
the second output end is connected with a ground wire on the circuit substrate.
4. The drive control module of claim 1,
the plurality of parallel first capacitive elements are arranged between the first inductive element and the plurality of paths of second inductive elements.
5. The drive control module of claim 1,
the length direction of the first inductive element is arranged along a first direction, the length direction of the second inductive element is arranged along a second direction, and a third included angle is defined between the first direction and the second direction,
wherein the third included angle is greater than or equal to 80 ° and less than or equal to 100 °.
6. The drive control module of claim 5,
the third included angle is 90 °.
7. The driving control module according to any one of claims 1 to 6, wherein the voltage-doubling boost circuit further comprises a plurality of power switching tubes and a plurality of second capacitive elements correspondingly arranged,
the multi-path power switch tubes and the multi-path second inductive elements are arranged correspondingly one by one, each path of power switch tube comprises a conducting circuit and a closing circuit, and the conducting circuit is suitable for connecting the power switch tubes with the corresponding second inductive elements and the corresponding first capacitive elements;
the voltage-multiplying booster circuit also comprises a plurality of paths of first diodes, second diodes and third capacitive elements, wherein the anodes of the first diodes are connected to the output ends of the corresponding second inductive elements, the cathodes of the first diodes are connected to the third capacitive elements,
said switch-off line comprising a first line adapted to connect said second capacitive element, said second diode and said third capacitive element, and a second line adapted to connect said first diode and said second capacitive element of different lines,
wherein the conductive line, the first line, and the second line are arranged in parallel.
8. The drive control module of claim 7,
the second capacitive element is arranged between the second inductive element and the power switch tube.
9. The drive control module of claim 8,
the multi-path power switch tube and the multi-path first diodes are arranged at one end of the circuit substrate in parallel.
10. An in-vehicle air conditioner, characterized by comprising:
a load;
the driving control module according to any one of claims 1 to 9, comprising a circuit substrate and a plurality of voltage-multiplying voltage boosting circuits, wherein the voltage-multiplying voltage boosting circuits are disposed on the circuit substrate, and are adapted to drive a plurality of loads to operate according to a power supply signal.
11. The on-vehicle air conditioner according to claim 10,
the load comprises a compressor and/or a fan.
CN202010220513.9A 2020-03-25 2020-03-25 Drive control module and vehicle-mounted air conditioner Active CN111313685B (en)

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CN105932896A (en) * 2016-05-31 2016-09-07 江苏固德威电源科技股份有限公司 Photovoltaic grid-connected inverter with common-mode current suppression and suppression method thereof
KR20190008608A (en) * 2017-07-17 2019-01-25 엘지전자 주식회사 Air conditioner
CN209415699U (en) * 2019-01-07 2019-09-20 广东美的制冷设备有限公司 Circuit board and air conditioner
CN110736250A (en) * 2019-10-31 2020-01-31 广东美的制冷设备有限公司 Drive control circuit board and air conditioner
CN110753440A (en) * 2019-10-31 2020-02-04 广东美的制冷设备有限公司 Drive control circuit board and air conditioner

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Publication number Priority date Publication date Assignee Title
CN101707845A (en) * 2009-12-02 2010-05-12 上海宏源照明电器有限公司 Method for improving electromagnetic compatibility of electronic ballast and electronic ballast
CN110601531B (en) * 2019-10-31 2022-06-28 广东美的制冷设备有限公司 Power supply control circuit and vehicle-mounted air conditioner

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105932896A (en) * 2016-05-31 2016-09-07 江苏固德威电源科技股份有限公司 Photovoltaic grid-connected inverter with common-mode current suppression and suppression method thereof
KR20190008608A (en) * 2017-07-17 2019-01-25 엘지전자 주식회사 Air conditioner
CN209415699U (en) * 2019-01-07 2019-09-20 广东美的制冷设备有限公司 Circuit board and air conditioner
CN110736250A (en) * 2019-10-31 2020-01-31 广东美的制冷设备有限公司 Drive control circuit board and air conditioner
CN110753440A (en) * 2019-10-31 2020-02-04 广东美的制冷设备有限公司 Drive control circuit board and air conditioner

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