CN111312606A - 一种安全可靠的柔性cigs太阳能组件耐高压测试设备 - Google Patents
一种安全可靠的柔性cigs太阳能组件耐高压测试设备 Download PDFInfo
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- CN111312606A CN111312606A CN201911203532.4A CN201911203532A CN111312606A CN 111312606 A CN111312606 A CN 111312606A CN 201911203532 A CN201911203532 A CN 201911203532A CN 111312606 A CN111312606 A CN 111312606A
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- 238000012360 testing method Methods 0.000 title claims abstract description 52
- 238000003825 pressing Methods 0.000 claims abstract description 43
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 8
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 8
- 238000007664 blowing Methods 0.000 claims description 7
- 239000000428 dust Substances 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
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- 238000004519 manufacturing process Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 208000027418 Wounds and injury Diseases 0.000 description 2
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- 239000003973 paint Substances 0.000 description 2
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- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- KTSFMFGEAAANTF-UHFFFAOYSA-N [Cu].[Se].[Se].[In] Chemical compound [Cu].[Se].[Se].[In] KTSFMFGEAAANTF-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- HVMJUDPAXRRVQO-UHFFFAOYSA-N copper indium Chemical compound [Cu].[In] HVMJUDPAXRRVQO-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Photovoltaic Devices (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911203532.4A CN111312606B (zh) | 2019-11-29 | 2019-11-29 | 一种安全可靠的柔性cigs太阳能组件耐高压测试设备 |
Applications Claiming Priority (1)
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CN201911203532.4A CN111312606B (zh) | 2019-11-29 | 2019-11-29 | 一种安全可靠的柔性cigs太阳能组件耐高压测试设备 |
Publications (2)
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CN111312606A true CN111312606A (zh) | 2020-06-19 |
CN111312606B CN111312606B (zh) | 2023-06-02 |
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Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0574388A1 (de) * | 1991-03-07 | 1993-12-22 | Roemmler H Resopal Werk Gmbh | Verfahren und vorrichtung zur herstellung von hochdruck-schichtpressstoffplatten. |
JPH10233484A (ja) * | 1996-12-16 | 1998-09-02 | Fuji Electric Co Ltd | 半導体装置の組立方法および装置 |
TW200620517A (en) * | 2004-12-14 | 2006-06-16 | Advanced Semiconductor Eng | Method for testing a substrate and a common clamp used for the method |
KR20100054714A (ko) * | 2008-11-14 | 2010-05-25 | 가부시키가이샤 고베 세이코쇼 | 가압 성형 장치 |
CN101874288A (zh) * | 2007-10-30 | 2010-10-27 | 株式会社尼康 | 基板保持部件、基板接合装置、叠层基板制造装置、基板接合方法、叠层基板制造方法和叠层半导体装置制造方法 |
CN101879803A (zh) * | 2009-05-07 | 2010-11-10 | 安吉申科太阳能设备制造有限公司 | 一种适用于太阳能电池组装工艺的热板均匀加热层压机 |
CN202108360U (zh) * | 2011-04-21 | 2012-01-11 | 张建新 | 压敏式防夹橡胶装置 |
CN103983905A (zh) * | 2014-06-10 | 2014-08-13 | 国家电网公司 | 绝缘隔板表面工频耐压试验装置 |
WO2015098842A1 (ja) * | 2013-12-26 | 2015-07-02 | 日東電工株式会社 | 半導体装置の製造方法 |
CN106330096A (zh) * | 2016-08-29 | 2017-01-11 | 安徽凯达能源科技有限公司 | 太阳能电池板的耐压检测装置 |
CN206096351U (zh) * | 2016-08-31 | 2017-04-12 | 连云港正道电池技术有限公司 | 安全稳定的耐压检测装置 |
CN207014943U (zh) * | 2017-03-10 | 2018-02-16 | 贵州润柏吉科技有限公司 | 一种改进的层压机压合室结构 |
JP2018160592A (ja) * | 2017-03-23 | 2018-10-11 | 株式会社東京精密 | プローバ |
CN208908434U (zh) * | 2018-10-09 | 2019-05-28 | 米亚索乐装备集成(福建)有限公司 | 一种测试装置及其*** |
-
2019
- 2019-11-29 CN CN201911203532.4A patent/CN111312606B/zh active Active
Patent Citations (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0574388A1 (de) * | 1991-03-07 | 1993-12-22 | Roemmler H Resopal Werk Gmbh | Verfahren und vorrichtung zur herstellung von hochdruck-schichtpressstoffplatten. |
JPH10233484A (ja) * | 1996-12-16 | 1998-09-02 | Fuji Electric Co Ltd | 半導体装置の組立方法および装置 |
TW200620517A (en) * | 2004-12-14 | 2006-06-16 | Advanced Semiconductor Eng | Method for testing a substrate and a common clamp used for the method |
CN101874288A (zh) * | 2007-10-30 | 2010-10-27 | 株式会社尼康 | 基板保持部件、基板接合装置、叠层基板制造装置、基板接合方法、叠层基板制造方法和叠层半导体装置制造方法 |
KR20100054714A (ko) * | 2008-11-14 | 2010-05-25 | 가부시키가이샤 고베 세이코쇼 | 가압 성형 장치 |
CN101879803A (zh) * | 2009-05-07 | 2010-11-10 | 安吉申科太阳能设备制造有限公司 | 一种适用于太阳能电池组装工艺的热板均匀加热层压机 |
CN202108360U (zh) * | 2011-04-21 | 2012-01-11 | 张建新 | 压敏式防夹橡胶装置 |
WO2015098842A1 (ja) * | 2013-12-26 | 2015-07-02 | 日東電工株式会社 | 半導体装置の製造方法 |
CN103983905A (zh) * | 2014-06-10 | 2014-08-13 | 国家电网公司 | 绝缘隔板表面工频耐压试验装置 |
CN106330096A (zh) * | 2016-08-29 | 2017-01-11 | 安徽凯达能源科技有限公司 | 太阳能电池板的耐压检测装置 |
CN206096351U (zh) * | 2016-08-31 | 2017-04-12 | 连云港正道电池技术有限公司 | 安全稳定的耐压检测装置 |
CN207014943U (zh) * | 2017-03-10 | 2018-02-16 | 贵州润柏吉科技有限公司 | 一种改进的层压机压合室结构 |
JP2018160592A (ja) * | 2017-03-23 | 2018-10-11 | 株式会社東京精密 | プローバ |
CN208908434U (zh) * | 2018-10-09 | 2019-05-28 | 米亚索乐装备集成(福建)有限公司 | 一种测试装置及其*** |
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Address after: Room 211, Building 3, No. 399 Xingguo Road, Linping Street, Linping District, Hangzhou City, Zhejiang Province, 311103 Patentee after: Still more photoelectric Polytron Technologies Inc. Patentee after: ZHEJIANG SHANGYUE NEW ENERGY DEVELOPMENT Co.,Ltd. Address before: Room 603, building 1, Shangyue Green Valley Center, 1999 yuhangtang Road, Wuchang Street, Yuhang District, Hangzhou City, Zhejiang Province Patentee before: Still more photoelectric Polytron Technologies Inc. Patentee before: ZHEJIANG SHANGYUE NEW ENERGY DEVELOPMENT Co.,Ltd. |
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