CN111284141A - Thermal printing head and manufacturing method thereof - Google Patents
Thermal printing head and manufacturing method thereof Download PDFInfo
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- CN111284141A CN111284141A CN202010261262.9A CN202010261262A CN111284141A CN 111284141 A CN111284141 A CN 111284141A CN 202010261262 A CN202010261262 A CN 202010261262A CN 111284141 A CN111284141 A CN 111284141A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- 238000007651 thermal printing Methods 0.000 title abstract description 11
- 239000010410 layer Substances 0.000 claims abstract description 171
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000010438 heat treatment Methods 0.000 claims abstract description 31
- 238000005338 heat storage Methods 0.000 claims abstract description 26
- 238000003466 welding Methods 0.000 claims abstract description 19
- 239000011241 protective layer Substances 0.000 claims abstract description 16
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 9
- 229910052718 tin Inorganic materials 0.000 claims abstract description 9
- 238000009825 accumulation Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 28
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 26
- 229910000679 solder Inorganic materials 0.000 claims description 16
- 229910000838 Al alloy Inorganic materials 0.000 claims description 13
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 13
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 13
- 229910052782 aluminium Inorganic materials 0.000 claims description 13
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 13
- 239000011651 chromium Substances 0.000 claims description 13
- 229910052804 chromium Inorganic materials 0.000 claims description 13
- 239000000788 chromium alloy Substances 0.000 claims description 13
- 229910052759 nickel Inorganic materials 0.000 claims description 13
- 239000004020 conductor Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 10
- 239000011248 coating agent Substances 0.000 claims description 8
- 238000000576 coating method Methods 0.000 claims description 8
- 238000005245 sintering Methods 0.000 claims description 8
- 229910000599 Cr alloy Inorganic materials 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 6
- 229910001128 Sn alloy Inorganic materials 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 5
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 5
- 239000010936 titanium Substances 0.000 claims description 5
- 229910052719 titanium Inorganic materials 0.000 claims description 5
- 239000004593 Epoxy Substances 0.000 claims description 4
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 4
- 238000004806 packaging method and process Methods 0.000 claims description 4
- 238000007747 plating Methods 0.000 claims description 4
- 229910052707 ruthenium Inorganic materials 0.000 claims description 4
- 150000003304 ruthenium compounds Chemical class 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 239000011195 cermet Substances 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 2
- 238000005253 cladding Methods 0.000 claims description 2
- 238000005530 etching Methods 0.000 claims description 2
- 238000009434 installation Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 4
- 229910052751 metal Inorganic materials 0.000 abstract description 3
- 239000002184 metal Substances 0.000 abstract description 3
- 229910000510 noble metal Inorganic materials 0.000 abstract description 3
- 229910045601 alloy Inorganic materials 0.000 abstract description 2
- 239000000956 alloy Substances 0.000 abstract description 2
- 229910000623 nickel–chromium alloy Inorganic materials 0.000 description 6
- 229910052737 gold Inorganic materials 0.000 description 5
- 239000010931 gold Substances 0.000 description 5
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 4
- 238000005299 abrasion Methods 0.000 description 4
- 230000007704 transition Effects 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/33505—Constructional details
- B41J2/3351—Electrode layers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
- B41J2/3359—Manufacturing processes
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Electronic Switches (AREA)
Abstract
The invention discloses a thermal printing head, which comprises a substrate, a heat storage layer, a resistance heating element, an electrode part, a conducting layer, a driving IC and a protective layer. The heat accumulation layer is attached on the surface of the substrate, and the resistance heating body is arranged on the heat accumulation layer. The electrode part is arranged on the heat storage layer and comprises a first electrode part and a second electrode part which are respectively arranged at two sides of the resistance heating element. The conducting layer is arranged outside the heat storage layer and comprises a plurality of conducting belts which are arranged at intervals along the length direction of the substrate and are sequentially connected with the first electrode part, the resistance heating body and the second electrode part in a conduction mode. The drive IC is connected with the conductive layer by inverse welding, and the protective layer is arranged outside the conductive layer. The invention also discloses a manufacturing method of the thermal printing head. The circuit made of metal capable of forming alloy with soldering tin is used for replacing noble metal in a thick film circuit, the manufacturing cost of the thermal printing head is reduced while the resistance value adjustable characteristic of the thick film is achieved, the driving IC adopts flip chip welding to replace the existing gold wire welding, and the welding speed is high.
Description
Technical Field
The invention relates to the technical field of thermal printing devices, in particular to a thermal printing head and a manufacturing method thereof.
Background
The thermal head is a main component of a thermal printer, which selectively heats a thermal paper at a certain position, thereby generating a pattern. Heating is provided by a small electric heater on the printhead that is in contact with the heat sensitive material. The form of the heater schedule dots or bars is logically controlled by the printer and, when activated, produces a pattern on the thermal paper corresponding to the heating elements. The same logic that controls the heating elements also controls the feeding of the paper, thus enabling the printing of a pattern on the entire label or sheet.
The 'thick film' is a production process of the thermal printing head, in the prior art, circuit materials of the thick film process are mostly made of gold, gold wires are adopted for manufacturing the integrated circuit, connecting the driving IC and the integrated circuit and the like, and the manufacturing cost of the whole thermal printing head becomes very high due to high manufacturing cost of gold; meanwhile, because the gold circuit and the drive IC can not be directly welded through soldering tin, the drive IC is packaged in a mode of welding gold wires one by one during packaging, and the welding mode is high in cost, low in speed, low in efficiency and low in yield.
Disclosure of Invention
In view of the above problems, an object of the present invention is to provide a thermal print head with low cost and high soldering speed and a method for manufacturing the same, so as to solve the technical problems of the prior art that the thermal print head using noble metal has high circuit cost and low packaging efficiency of the driving IC.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
a thermal print head comprising:
a substrate.
And the heat storage layer is attached to the surface of the substrate.
And the resistance heating bodies are arranged on the heat storage layer and extend and are distributed along the length direction of the substrate.
And the electrode part is arranged on the heat storage layer and comprises a first electrode part and a second electrode part which are respectively arranged at two sides of the resistance heating element and extend along the length direction of the substrate.
And the conducting layer is arranged outside the heat storage layer and comprises a plurality of conducting belts which are arranged at intervals along the length direction of the substrate and are sequentially connected with the first electrode part, the resistance heating body and the second electrode part in a conduction manner.
And the driving IC is arranged along the length direction of the substrate and is in flip-chip interconnection with the conductive layer.
And the protective layer is arranged outside the conductive layer and the drive IC.
In one embodiment, the conductive layer has a thickness of 0.1um to 30um and is made of one of aluminum, nickel, chromium, aluminum alloy, nickel alloy and chromium alloy.
In another embodiment, the conductive layer includes a first transition layer, a conductive layer, and a second transition layer sequentially arranged from bottom to top.
Wherein, the thickness of conductor layer is 0.1um ~ 30um, and the material is one of tin, copper, tin alloy, copper alloy.
Wherein, the thickness of first switching layer and second switching layer is 0.1um ~ 15um, and the material is one of titanium, nickel, chromium, aluminium, titanium alloy, nickel alloy, chromium alloy, aluminum alloy.
Further, the base plate be ceramic substrate, the material of heat accumulation layer is the glass glaze, and thickness is 10um ~ 500um, the resistance heat-generating body is the halfcylinder that the radius is 0.1um ~ 12um, and the material is ruthenium or ruthenium compound.
Furthermore, the first electrode part and the second electrode part are both made of silver.
Further, the protective layer comprises a wear-resistant insulating layer, a solder mask layer, a surface wear-resistant layer and a protective layer. The wear-resistant insulating layer is arranged on the outer side of the conducting layer and completely covers the first electrode part and the resistance heating body, the solder mask layer is arranged on the outer side of the conducting layer and completely covers the second electrode part, and the solder mask layer and the wear-resistant insulating layer respectively extend towards opposite directions and are provided with overlapping parts. The solder mask on reserve and have and be used for the installation driver IC's welding groove, surperficial wearing layer attach the wear-resisting insulating layer outside and cover completely the wear-resisting insulating layer, the inoxidizing coating cladding in the driver IC outside.
Preferably, the material of wear-resisting insulating layer is epoxy, the material of solder mask is green oil, the material of surperficial wearing layer is cermet, the material of inoxidizing coating is epoxy.
The invention also discloses a manufacturing method of the thermal printing head, which comprises the following steps:
and S1, coating a heat storage layer on the substrate and sintering.
And S2, forming the resistance heating elements extending along the length direction of the substrate on the surface of the heat storage layer by printing and sintering processes.
And S3, forming a first electrode part and a second electrode part which are respectively arranged on two sides of the surface resistance heating element of the heat storage layer in an extending way along the length direction of the substrate by printing and sintering.
And S4, plating a conductive layer which completely covers the first electrode part, the resistance heating element and the second electrode part on the outer side of the heat storage layer, and etching the conductive layer into a plurality of conductive strips which are distributed at intervals along the length direction of the substrate.
And S5, manufacturing a protective layer on the outer side of the conductive layer, reserving a welding station of the drive IC, and inversely welding a drive IC arranged along the length direction of the substrate at the welding station and packaging.
In one embodiment, the conductive layer has a thickness of 0.1um to 30um and is made of one of aluminum, nickel, chromium, aluminum alloy, nickel alloy and chromium alloy.
In another embodiment, the conductive layer includes a first transition layer, a conductive layer, and a second transition layer sequentially arranged from bottom to top.
Wherein, the thickness of conductor layer is 0.1um ~ 30um, and the material is one of tin, copper, tin alloy, copper alloy.
Wherein, the thickness of first switching layer and second switching layer is 0.1um ~ 15um, and the material is one of titanium, nickel, chromium, aluminium, titanium alloy, nickel alloy, chromium alloy, aluminum alloy.
The invention has the following beneficial effects: a circuit made of metal capable of forming alloy with soldering tin is used to replace noble metal in thick film circuit, and the circuit has adjustable resistance of thick film and low cost.
Drawings
Fig. 1 is a schematic cross-sectional structure diagram of a thermal print head according to a first embodiment.
Fig. 2 is a partially enlarged schematic view of a portion a in fig. 1.
Fig. 3 is a partially enlarged schematic view of a portion B in fig. 1.
Fig. 4 is a partially enlarged schematic view of a portion C in fig. 1.
Fig. 5 is a schematic cross-sectional view of a thermal print head according to a second embodiment.
Fig. 6 is a partially enlarged view of a portion D in fig. 5.
Fig. 7 is a partially enlarged schematic view of a portion E in fig. 5.
Fig. 8 is a partially enlarged schematic view of a portion F in fig. 5.
Fig. 9 is a partially enlarged view of portion G of fig. 5.
Description of the main component symbols: 1. a substrate; 2. a heat storage layer; 3. a resistance heating element; 41. a first electrode section; 42. a second electrode section; 5 a conductive layer; 51. a first transfer layer; 52. a conductor layer; 53. a second transfer layer; 6. a driver IC; 70. an overlapping portion; 71. a wear-resistant insulating layer; 72. a solder resist layer; 720. a welding station; 73. a surface wear layer; 74. and (4) a protective layer.
Detailed Description
The invention is further described with reference to the following drawings and detailed description.
Example one
As shown in fig. 1 to 4, a thermal head includes a substrate 1, a heat storage layer 2, a resistance heating element 3, an electrode portion, a conductive layer 5, a drive IC 6, and a protective layer. The substrate 1 is preferably an alumina ceramic substrate, the heat storage layer 2 is made of glass glaze and has a thickness of 10-500 um, and the resistance heating element 3 is a semi-cylinder with a radius of 0.1-12 um and is made of ruthenium or ruthenium compound.
The heat storage layer 2 is attached to the surface of the substrate 1, and the resistance heating elements 3 are arranged on the heat storage layer 2 and extend in the longitudinal direction of the substrate 1. The electrode portion is provided on the heat storage layer 2, and includes a first electrode portion 41 and a second electrode portion 42 provided on both sides of the resistance heating element 3 and extending along the longitudinal direction of the substrate 1, and the first electrode portion 41 and the second electrode portions 42 are made of silver.
The conductive layer 5 is disposed outside the heat storage layer 2, and the conductive layer 5 includes a plurality of conductive tapes which are arranged at intervals along the length direction of the substrate 1 and are electrically connected to the first electrode portion 41, the resistance heating element 3, and the second electrode portion 42 in this order. The thickness of the conducting layer 5 is 0.1 um-30 um, and the material is one of aluminum, nickel, chromium, aluminum alloy, nickel alloy and chromium alloy. The driving IC 6 is laid along the length direction of the substrate 1 and is flip-chip interconnected with the conductive layer 5.
The protective layer is provided outside the conductive layer 5 and the drive IC 6. The protective layer includes an abrasion resistant insulating layer 71, a solder resist layer 72, a surface abrasion resistant layer 73, and a protective layer 74. The wear-resistant insulating layer 71 is provided outside the conductive layer 5 and completely covers the first electrode portion 41 and the resistance heating element 3, the solder resist layer 72 is provided outside the conductive layer 5 and completely covers the second electrode portion 42, and the solder resist layer 72 and the wear-resistant insulating layer 71 extend in opposite directions and have overlapping portions 70, respectively. A welding station 720 for mounting the driving IC 6 is reserved on the solder resist layer 72, the surface wear-resistant layer 73 is attached to the outer side of the wear-resistant insulating layer 71 and completely covers the wear-resistant insulating layer 71, and the protective layer 74 covers the outer side of the driving IC 6. Preferably, the abrasion-resistant insulating layer 71 is made of epoxy resin, the solder resist layer 72 is made of green oil, the surface abrasion-resistant layer 73 is made of cermet, and the protective layer 74 is made of epoxy resin.
The manufacturing method of the thermal printing head comprises the following steps:
firstly, firing a glass glaze layer with the thickness of 10-500 um on an alumina ceramic substrate.
And a second step of forming a semi-cylindrical resistance heating element 3 having a radius of 0.1 to 12um on the surface of the glass glaze layer by printing and sintering ruthenium or a ruthenium compound.
And thirdly, forming a first electrode part 41 and a second electrode part 42 which are respectively arranged along the length direction of the substrate 1 by printing and sintering silver on two sides of the glass glaze surface resistance heating element 3.
And fourthly, plating a conducting layer 5 which is 0.1-30 um thick and completely covers the first electrode part 41, the resistance heating element 3 and the second electrode part 42 on the outer side of the glass glaze layer by adopting a PVD (physical vapor deposition) process, wherein the conducting layer 5 is made of one of aluminum, nickel, chromium, aluminum alloy, nickel alloy and chromium alloy, and a plurality of conducting bands which are arranged at equal intervals along the length direction of the alumina ceramic substrate are etched on the conducting layer 5 by a dry method or a wet method.
Fifthly, plating a wear-resistant insulating layer 71 which completely covers the first electrode part 41 and the resistance heating element 3 on one side outside the conductive layer 5; coating a layer of green oil completely covering the second electrode part 42 on the other side of the outer part of the conductive layer 5 and reserving a welding station 720 of the driving IC 6, wherein the green oil and the wear-resistant insulating layer 71 are provided with an overlapping part 70; and a surface wear-resistant layer 73 is plated on the outer part of the wear-resistant insulating layer 71, and the end part of the surface wear-resistant layer 73 is connected with the green oil at the overlapping part 70. And a driving IC 6 arranged along the length direction of the alumina ceramic substrate is inversely welded at the reserved welding station 720 and is encapsulated with epoxy resin.
In this embodiment, one of aluminum, nickel, chromium, aluminum alloy, nickel alloy, and chromium alloy is used as the material of the conductive layer 5, and since aluminum, nickel, chromium, aluminum alloy, nickel alloy, and chromium alloy can be easily plated on the surface of the glass glaze, the bonding force thereof does not need to be strengthened by the transfer layer.
Example two
As shown in fig. 5 to 9, the present embodiment is different from the first embodiment only in that: the thickness of conducting layer 5 is 0.1um ~ 30um, and conducting layer 5 includes first switching layer 51, conductor layer 52 and the second switching layer 53 that sets gradually from bottom to top. The conductive layer 52 has a thickness of 0.1um to 30um and is made of one of tin, copper, tin alloy and copper alloy. The thicknesses of the first switching layer 51 and the second switching layer 53 are both 0.1-15 um, and the first switching layer and the second switching layer are made of one of titanium, nickel, chromium, aluminum, titanium alloy, nickel alloy, chromium alloy and aluminum alloy. The rest of the structure of the present embodiment is the same as that of the first embodiment.
The manufacturing method of the present embodiment is different from the first embodiment only in that: the first connecting layer 51 with the thickness of 0.1 um-15 um is plated on the glass glaze layer, the conductor layer 52 with the thickness of 0.1 nm-30 um is plated on the surface of the first switching layer 51, and the second connecting layer 53 with the thickness of 0.1 um-15 um is plated on the surface of the conductor layer 52. Finally, the first interposer layer 51, the conductive layer 52, and the second interposer layer 53 are etched to form a plurality of conductive strips. The remaining steps of the manufacturing method of this embodiment are the same as those of the first embodiment.
In this embodiment, one of tin, copper, tin alloy and copper alloy is used as the material of the conductive layer 52, and since the adhesion of the material on the surface of the glass glaze is not strong, the first transfer layer 51 and the second transfer layer 53 are added to serve as metal bonding force for reinforcing the conductive layer 52.
While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (14)
1. A thermal print head, comprising:
a substrate;
the heat storage layer is attached to the surface of the substrate;
the resistance heating bodies are arranged on the heat storage layer and extend and are distributed along the length direction of the substrate;
the electrode part is arranged on the heat storage layer and comprises a first electrode part and a second electrode part which are respectively arranged at two sides of the resistance heating element and extend along the length direction of the substrate;
the conducting layer is arranged outside the heat storage layer and comprises a plurality of conducting belts which are arranged at intervals along the length direction of the substrate and are sequentially connected with the first electrode part, the resistance heating element and the second electrode part in a conduction manner;
the driving IC is arranged along the length direction of the substrate and is connected with the conducting layer in a reverse welding mode;
and the protective layer is arranged outside the conductive layer and the drive IC.
2. A thermal printhead according to claim 1, wherein: the thickness of conducting layer is 0.1um ~ 30um, and the material is one in aluminium, nickel, chromium, aluminum alloy, nickel alloy, the chromium alloy.
3. A thermal printhead according to claim 1, wherein: the conducting layer comprises a first switching layer, a conductor layer and a second switching layer which are sequentially arranged from bottom to top.
4. A thermal printhead according to claim 3, wherein: the thickness of the conductor layer is 0.1um ~ 30um, and the material is one of tin, copper, tin alloy, copper alloy.
5. A thermal printhead according to claim 3, wherein: the thickness of first switching layer and second switching layer is 0.1um ~ 15um, and the material is one of titanium, nickel, chromium, aluminium, titanium alloy, nickel alloy, chromium alloy, aluminum alloy.
6. A thermal printhead according to claim 1, wherein: the base plate be ceramic substrate, the material on heat accumulation layer is glass glaze, and thickness is 10um ~ 500um, the resistance heat-generating body is the halfcylinder that the radius is 0.1um ~ 12um, and the material is ruthenium or ruthenium compound.
7. A thermal printhead according to claim 1, wherein: the first electrode part and the second electrode part are made of silver.
8. A thermal printhead according to claim 1, wherein: the protective layer include wear-resisting insulating layer, solder mask, surperficial wearing layer and inoxidizing coating, wear-resisting insulating layer establish the conducting layer outside covers completely first electrode portion and resistance heat-generating body, the solder mask establish the conducting layer outside covers completely the second electrode portion, solder mask and wear-resisting insulating layer extend and have the overlap portion towards opposite direction respectively, the solder mask on reserve and have and be used for the installation drive IC's welding groove, surperficial wearing layer attach the wear-resisting insulating layer outside covers completely wear-resisting insulating layer, the inoxidizing coating cladding be in the drive IC outside.
9. A thermal printhead according to claim 8, wherein: the material of wear-resisting insulating layer is epoxy, the material of solder mask is green oil, the material of surperficial wearing layer is cermet, the material of inoxidizing coating is epoxy.
10. A method of manufacturing a thermal print head, comprising the steps of:
s1, coating a heat storage layer on the substrate and sintering;
s2, forming resistance heating elements extending along the length direction of the substrate on the surface of the heat storage layer through printing and sintering processes;
s3, forming a first electrode part and a second electrode part which are respectively arranged in an extending way along the length direction of the substrate on two sides of the surface resistance heating element of the heat storage layer through printing and sintering;
s4, plating a conductive layer which completely covers the first electrode part, the resistance heating element and the second electrode part on the outer side of the heat storage layer, and etching the conductive layer into a plurality of conductive strips which are distributed at intervals along the length direction of the substrate;
and S5, manufacturing a protective layer on the outer side of the conductive layer, reserving a welding station of the drive IC, and inversely welding a drive IC arranged along the length direction of the substrate at the welding station and packaging.
11. A method of manufacturing a thermal print head according to claim 10, wherein: the thickness of conducting layer is 0.1um ~ 30um, and the material is one in aluminium, nickel, chromium, aluminum alloy, nickel alloy, the chromium alloy.
12. A method of manufacturing a thermal print head according to claim 10, wherein: the conducting layer comprises a first switching layer, a conductor layer and a second switching layer which are sequentially arranged from bottom to top.
13. A method of manufacturing a thermal print head according to claim 12, wherein: the thickness of the conductor layer is 0.1um ~ 30um, and the material is one of tin, copper, tin alloy, copper alloy.
14. A method of manufacturing a thermal print head according to claim 12, wherein: the thickness of first switching layer and second switching layer is 0.1um ~ 15um, and the material is one of titanium, nickel, chromium, aluminium, titanium alloy, nickel alloy, chromium alloy, aluminum alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010261262.9A CN111284141A (en) | 2020-04-03 | 2020-04-03 | Thermal printing head and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010261262.9A CN111284141A (en) | 2020-04-03 | 2020-04-03 | Thermal printing head and manufacturing method thereof |
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| CN111284141A true CN111284141A (en) | 2020-06-16 |
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| CN202010261262.9A Pending CN111284141A (en) | 2020-04-03 | 2020-04-03 | Thermal printing head and manufacturing method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112659758A (en) * | 2021-01-13 | 2021-04-16 | 沈阳晖印电子科技有限公司 | Thermal printing head with multilayer overlapping structure |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070040868A1 (en) * | 2005-08-22 | 2007-02-22 | Rohm Co., Ltd. | Thermal printhead |
| US20090207229A1 (en) * | 2005-06-07 | 2009-08-20 | Rohm Co., Ltd. | Thermal print head and method for manufacturing same |
| JP2012066476A (en) * | 2010-09-24 | 2012-04-05 | Toshiba Hokuto Electronics Corp | Thermal head |
| JP2014189016A (en) * | 2013-03-28 | 2014-10-06 | Toshiba Hokuto Electronics Corp | Thermal print head and thermal printer |
| JP2015009471A (en) * | 2013-06-28 | 2015-01-19 | ローム株式会社 | Thermal print head, and thermal printer |
| JP2015039785A (en) * | 2013-08-20 | 2015-03-02 | ローム株式会社 | Thermal print head and thermal printer |
| CN106079904A (en) * | 2016-08-24 | 2016-11-09 | 大连佳盈半导体技术有限公司 | A kind of new heating element structure thermal printing head |
| JP2019031058A (en) * | 2017-08-09 | 2019-02-28 | 東芝ホクト電子株式会社 | Thermal print head and thermal printer |
| CN110027327A (en) * | 2019-05-10 | 2019-07-19 | 深圳市博思得科技发展有限公司 | A kind of new wide thermal printing head and preparation method thereof |
| CN110884261A (en) * | 2019-12-28 | 2020-03-17 | 厦门芯瓷科技有限公司 | Thin film thermal sensitive printing head and manufacturing method thereof |
| CN110884260A (en) * | 2019-12-28 | 2020-03-17 | 厦门芯瓷科技有限公司 | Thermal printing head and manufacturing method thereof |
| CN212422561U (en) * | 2020-04-03 | 2021-01-29 | 厦门芯瓷科技有限公司 | Thermal printing head |
-
2020
- 2020-04-03 CN CN202010261262.9A patent/CN111284141A/en active Pending
Patent Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090207229A1 (en) * | 2005-06-07 | 2009-08-20 | Rohm Co., Ltd. | Thermal print head and method for manufacturing same |
| US20070040868A1 (en) * | 2005-08-22 | 2007-02-22 | Rohm Co., Ltd. | Thermal printhead |
| JP2012066476A (en) * | 2010-09-24 | 2012-04-05 | Toshiba Hokuto Electronics Corp | Thermal head |
| JP2014189016A (en) * | 2013-03-28 | 2014-10-06 | Toshiba Hokuto Electronics Corp | Thermal print head and thermal printer |
| JP2015009471A (en) * | 2013-06-28 | 2015-01-19 | ローム株式会社 | Thermal print head, and thermal printer |
| JP2015039785A (en) * | 2013-08-20 | 2015-03-02 | ローム株式会社 | Thermal print head and thermal printer |
| CN106079904A (en) * | 2016-08-24 | 2016-11-09 | 大连佳盈半导体技术有限公司 | A kind of new heating element structure thermal printing head |
| JP2019031058A (en) * | 2017-08-09 | 2019-02-28 | 東芝ホクト電子株式会社 | Thermal print head and thermal printer |
| CN110027327A (en) * | 2019-05-10 | 2019-07-19 | 深圳市博思得科技发展有限公司 | A kind of new wide thermal printing head and preparation method thereof |
| CN110884261A (en) * | 2019-12-28 | 2020-03-17 | 厦门芯瓷科技有限公司 | Thin film thermal sensitive printing head and manufacturing method thereof |
| CN110884260A (en) * | 2019-12-28 | 2020-03-17 | 厦门芯瓷科技有限公司 | Thermal printing head and manufacturing method thereof |
| CN212422561U (en) * | 2020-04-03 | 2021-01-29 | 厦门芯瓷科技有限公司 | Thermal printing head |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112659758A (en) * | 2021-01-13 | 2021-04-16 | 沈阳晖印电子科技有限公司 | Thermal printing head with multilayer overlapping structure |
| CN112659758B (en) * | 2021-01-13 | 2023-11-17 | 广州晖印科技有限公司 | Thermal printing head with multilayer overlapped structure |
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