CN111276429B - Semiconductor machine control method, device and storage medium - Google Patents
Semiconductor machine control method, device and storage medium Download PDFInfo
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Abstract
The embodiment of the invention provides a method and a device for controlling a semiconductor machine and a storage medium, wherein the method comprises the following steps: processing a first product in the first batch of products by a semiconductor related process; after receiving the first instruction, starting to process the second batch of products until each product in the second batch of products is processed; the untreated products of the first batch of products continue to be treated. In the embodiment of the invention, after receiving the instruction of preferentially processing a certain batch of products, the semiconductor machine is switched to the processing of the batch of products needing preferential processing, and returns to the processing of the residual unprocessed products in the current batch of products after processing each product in the batch of products. Therefore, the batch products needing to be processed preferentially can be processed to the maximum extent in time.
Description
Technical Field
The present invention relates to the field of semiconductor technologies, and in particular, to a method and an apparatus for controlling a semiconductor device, and a storage medium.
Background
In the semiconductor manufacturing process, a semiconductor machine is used to perform a process, such as a notching process, in the manufacturing process. In the related art, the control method of the semiconductor machine only supports batch processing, that is, the semiconductor machine can switch to the next batch of products after completing the batch of products currently processed.
However, in the development or production of semiconductor products, some lots of products need to be processed preferentially. At this time, the control method of the semiconductor machine in the related art cannot ensure the maximum timely processing of the batch products that need to be processed preferentially.
Disclosure of Invention
In order to solve the related technical problems, embodiments of the present invention provide a method and an apparatus for controlling a semiconductor machine, and a storage medium, which can ensure that batch products requiring preferential processing are processed in time to the maximum extent.
The embodiment of the invention provides a control method of a semiconductor machine, which comprises the following steps:
processing a first product in the first batch of products by a semiconductor related process;
starting to process the second batch of products after receiving the first instruction until each product in the second batch of products is processed;
the untreated products of the first batch of products continue to be treated.
In the foregoing, before processing the second batch of products, the method further includes:
and loading the second batch of products on the semiconductor machine.
In the above solution, the loading the second batch of products on the semiconductor machine includes:
judging whether a loading position of unloaded batch products exists on the semiconductor machine;
and when the loading position of the semiconductor machine table is determined to have the unloaded batch of products, loading the second batch of products on the loading position.
In the above scheme, the method further comprises:
and generating a first alarm when the fact that the loading position of the unloaded batch of products does not exist on the semiconductor machine is determined. In the above scheme, the method further comprises:
receiving a second instruction; the second instructions are received during processing of the second batch of products;
generating a second alarm; the second alarm indicates that the semiconductor machine cannot process the second instruction currently.
In the above scheme, the method further comprises:
when the processing of each of the second plurality of products is completed, in response to the second instruction, beginning processing each of a third plurality of products until the processing of each of the third plurality of products is completed.
In the above scheme, when a first instruction is received, the first product processing is not completed; and after the first product is processed, processing the second batch of products.
In the above scheme, the method further comprises:
upon completion of the first product treatment, the method further comprises:
storing location information of the first product in the first batch of products;
determining the starting position of the remaining unprocessed products in the first batch of products according to the stored position information;
continuing to process the untreated products of the first batch of products from the starting position.
An embodiment of the present invention further provides a semiconductor device control apparatus, including:
the processing unit is used for processing a first product in the first batch of products by a semiconductor related process;
an instruction receiving unit for receiving a first instruction;
the processing unit is further configured to start processing the second batch of products after the instruction receiving unit receives the first instruction until each product in the second batch of products is processed;
the processing unit is further configured to continue to process the unprocessed products in the first batch of products after each product in the second batch of products is processed.
An embodiment of the present invention further provides a semiconductor apparatus control device, including: a processor and a memory configured to store a computer program operable on the processor;
wherein the processor is configured to implement the steps of any of the above methods when executing the computer program.
An embodiment of the present invention further provides a storage medium, on which a computer program is stored, where the computer program, when executed by a processor, implements the steps of any one of the above-mentioned methods.
The semiconductor machine control method, the semiconductor machine control device and the semiconductor machine control storage medium provided by the embodiment of the invention are used for processing a first product in a first batch of products by a semiconductor related process; after receiving the first instruction, starting to process the second batch of products until each product in the second batch of products is processed; the untreated products of the first batch of products continue to be treated. In the embodiment of the invention, after receiving the instruction of preferentially processing a certain batch of products, the semiconductor machine is switched to the processing of the batch of products needing preferential processing, and returns to the processing of the rest unprocessed products in the current batch of products after processing each product in the batch of products. Therefore, the batch products needing to be processed preferentially can be processed to the maximum extent in time.
Drawings
FIG. 1a is a schematic diagram illustrating an implementation process of a semiconductor machine forward mode control method;
FIG. 1b is a schematic diagram illustrating an implementation process of a parallel mode control method for a semiconductor machine;
fig. 2 is a first schematic flow chart illustrating an implementation of a method for controlling a semiconductor apparatus according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating an implementation process of a priority mode control method according to an embodiment of the present invention;
fig. 4 is a schematic flow chart illustrating an implementation of a semiconductor apparatus control method according to an embodiment of the present invention;
FIG. 5 is a schematic flow chart illustrating an implementation of a method for controlling a semiconductor apparatus according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of a semiconductor device control apparatus according to an embodiment of the present invention;
fig. 7 is a schematic diagram of a hardware configuration of a semiconductor device control apparatus according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the following describes specific technical solutions of the present invention in further detail with reference to the accompanying drawings in the embodiments of the present invention.
The product in the practice of the invention may be a wafer, but is not limited to a wafer.
The default control method of the semiconductor machine is a forward mode, and the implementation process of the forward mode is shown in fig. 1 a. In FIG. 1a, A is the number of products in product lot 1, B is the number of products in product lot 2, and the order of processing in the forward mode is: the semiconductor tool starts processing the first product of the product batch 1 according to the position sequence of the A products in the product batch 1 until the A products are processed completely, and then starts processing the first product of the product batch 2, and also starts processing the B products according to the position sequence of the B products in the product batch 2 until the B products are processed completely.
However, in the manufacture of semiconductors such as three-dimensional memories, the process time of some manufacture processes is particularly long, such as deep hole etching or deep groove etching, and the processing time of a piece of product is as long as 1 h. Moreover, as the number of layers in the three-dimensional memory increases, the processing time length will further increase. In this process, the following problems are often faced:
in the process of research and development, when a small batch of products need to be debugged urgently, if all the products being processed according to the forward mode on a machine table are finished, a long time is needed, and the research and development progress is seriously influenced.
In order not to affect the development progress, another control method of the semiconductor machine, a parallel mode, is presented, and the implementation process of the parallel mode is shown in fig. 1 b. In FIG. 1b, the semiconductor tool starts processing the first product of lot 1 in the order of the positions of C-1 products in lot 1, and receives a command to process lot 2 in parallel mode when processing the C-th product of lot 1, wherein the order of processing in parallel mode is as follows: the semiconductor tool processes the C-th product in batch 1, then processes the first product in batch 2, then processes a product behind the C-th product in batch 1, then processes the second product in batch 2, and so on, alternately until all the products in one batch are processed, and finally processes the remaining unprocessed products in the other batch.
Although the parallel mode can save a certain time compared with the forward mode, there is a certain time lag.
In the mass production process, when some batches of products (for example, products corresponding to the emergency shipment task of a large customer) need to be processed preferentially, the product schedule of the batch needing to be processed preferentially is delayed in both the forward mode and the parallel mode. In addition, although empty semiconductor tools, i.e., semiconductor tools not loaded with any products, can be reserved for the batch of products to be processed preferentially, the reservation method will cause waste of the productivity of the tools.
Based on this, in various embodiments of the present invention, after receiving the instruction that a certain batch of products needs to be processed preferentially, the semiconductor machine switches to the processing of the batch of products that needs to be processed preferentially, and returns to the processing of the remaining unprocessed products in the current batch of products after processing each product in the batch of products. That is to say, the embodiment of the present invention provides a priority mode control method for batch products that need to be processed preferentially, so that the maximum timely processing of the batch products that need to be processed preferentially can be ensured.
The embodiment of the invention provides a method for controlling a semiconductor machine, and fig. 2 is a schematic flow chart for implementing the semiconductor machine control according to the embodiment of the invention. As shown in fig. 2, the method comprises the steps of:
step 201: processing a first product in the first batch of products by a semiconductor related process;
step 202: after receiving the first instruction, starting to process the second batch of products until each product in the second batch of products is processed;
step 203: the untreated products of the first batch of products continue to be treated.
In step 201, the semiconductor tool may process a first batch of products according to a default control mode, i.e., a forward mode, where the first batch of products includes a plurality of products, and the first product is a product currently being processed by the semiconductor tool in the first batch of products.
In practical application, the product may be a wafer. The semiconductor-related process processing may be understood as processing of various processes performed on a product according to the type of a semiconductor, for example, for a three-dimensional NAND type memory, corresponding deep trench etching, thin film deposition, thin film punch-through, and the like are performed. In specific implementation, each step of the program steps of the corresponding process stored in advance in the semiconductor machine can be specifically executed to process the first product in the first batch of products.
In step 202, the first instruction is used to instruct a second batch of products to be processed preferentially.
In practical application, the mode of receiving the first instruction may be to receive the input first instruction, or to receive the first instruction directly issued from the dispatching system. Here, the first instruction to receive the input may be to receive a first instruction input by the relevant person through the input interface. The input interface may be a keyboard, a mouse, etc. Here, the dispatching system may be a task input system that interfaces specifically with the semiconductor tool.
After receiving the first command, the semiconductor machine starts processing the second batch of products in response to the first command, and finishes processing each of the second batch of products. In practical application, the semiconductor machine can generate a new product calling order for updating the currently set product calling order by switching from the first product to the second product for processing, and the products are processed according to the new product calling order.
In practical application, a plurality of loading positions for loading batch products can be arranged on one semiconductor machine table, for example, 3 to 4 loading positions can be arranged on one semiconductor machine table, one loading position can comprise a plurality of sub loading positions, each sub loading position loads one product, each loading position loads one batch of products, meanwhile, each loading position and the corresponding sub loading position are provided with corresponding numbers, and the numbers are used for positioning each loading position and the corresponding sub loading position. That is to say, a specific way of transferring the semiconductor desktop from the first product to the second product may be to update the currently set product calling order, that is, to regenerate a new number calling list of the sub-loading bits, and to call the product corresponding to the number of the sub-loading bit according to the list order. Therefore, before processing the second batch of products, the second batch of products needs to be loaded on the semiconductor machine, and the numbers of the loading positions and the loading positions where the second batch of products are located need to be obtained.
Based on this, in an embodiment, prior to the responding to the first instruction, the method further comprises:
and loading the second batch of products on the semiconductor machine.
In practical application, the second batch of products are loaded on the semiconductor machine, that is, the numbers of the loading positions and the loading positions where the second batch of products are located are obtained.
In practical applications, before loading the second batch of products on the semiconductor machine, it is further required to determine whether an empty loading bit exists on the semiconductor machine receiving the first instruction.
Based on this, in one embodiment, before loading the second batch of products on the semiconductor machine, the method further includes:
judging whether a loading position of unloaded batch products exists on the semiconductor machine;
when the fact that a loading position of an unloaded batch of products exists on the semiconductor machine table is determined, loading the second batch of products on the loading position;
wherein, in an embodiment, the method further comprises:
and generating a first alarm when the fact that the loading position of the unloaded batch of products does not exist on the semiconductor machine is determined.
Here, the manner of determining whether there is an empty loading position may be based on a corresponding sensor, such as a gravity sensor or a blocking sensor. When the judgment result shows that an empty loading position exists, loading the second batch of products on the empty loading position, and acquiring the loading positions where the second batch of products are located and the serial numbers of the loading positions; and when the judgment result shows that no empty loading bit exists, generating a first alarm for representing that the semiconductor machine can not process the first instruction currently. Here, the first alarm indicates that the semiconductor machine is currently unable to process the first command. In practical application, the first alarm can be displayed to related personnel in a pop-up frame mode or other modes. At this time, it is possible to try to change to another semiconductor machine having an empty loading position for performing the operation of priority processing.
In practical application, in order to avoid the situation of no empty loading position, the semiconductor machine station with the empty loading position can be determined, the batch products needing to be processed preferentially are loaded on the empty loading position of the semiconductor machine station, and then the loading position and the sub-loading position number information of the batch products needing to be processed preferentially are carried when the first instruction is input into the semiconductor machine station.
In step 203, when the batch of products requiring priority processing, i.e., the second batch of products, is completed, the semiconductor machine continues to process the remaining unprocessed products in the first batch of products according to the default control mode, i.e., the forward mode.
In practical application, when a first instruction is received, if the first product is processed, the second batch of products are directly processed, and if the first product is not processed, the second batch of products need to be processed after the first product is processed.
Based on this, in one embodiment, upon receiving a first instruction, the first product process is not complete; and after the first product is processed, processing the second batch of products.
In practical application, the semiconductor machine station processes each product in the first batch of products according to the position sequence of each product in the first batch of products. At this time, when the first product process in the first batch of products is completed, the position information of the first product in the first batch of products can be stored, so that when the unprocessed products remained in the first batch of products are continuously processed, the semiconductor machine can correctly fetch the next product beside the position of the first product and restart processing each unprocessed product remained in the first batch of products from the product.
Based on this, in an embodiment, the method further comprises:
upon completion of the first product treatment, the method further comprises:
storing location information of the first product in the first batch of products;
determining the starting position of the remaining unprocessed products in the first batch of products according to the stored position information;
continuing to process the untreated products of the first batch of products from the starting position.
In practical applications, the starting position is a position of a next product beside the first product position, and the semiconductor machine continues to process the remaining unprocessed products in the first batch of products from the position.
In practical applications, the control process can be understood as a new semiconductor machine control process, and this control mode can be referred to as a priority mode. The semiconductor machine realizes the priority mode function through a software system, and the priority mode function can be completed by cooperating with the dispatching system. The specific order of processing (n being the number of products in the second batch) of the preferred mode is more intuitively shown in FIG. 3. The semiconductor machine starts from a first product of the first batch of products, processes the first batch of products according to the position sequence of N-1 products, receives an instruction for processing a second batch of products in a priority mode when processing an Nth product in the product batch 1, and at the moment, if the Nth product in the product batch 1 is just finished processing, the processing sequence of the priority mode is as follows: directly calling a first product of a second batch of products for processing until all N products in the second batch of products are completely processed, then calling an (N + 1) th product in the first batch of products, and continuously processing the remaining unprocessed products in the first batch of products according to a default control mode, namely a forward mode; if the Nth slice in the product batch 1 is not processed, the processing order of the priority mode is as follows: the semiconductor machine platform finishes the processing of the ongoing product in the first batch, namely the Nth product, starts to fetch the first product of the second batch for processing the next product until all the N products in the second batch are completely processed, then fetches the (N + 1) th product in the first batch, and continues to process the remaining unprocessed products in the first batch according to a default control mode, namely the forward mode.
The embodiment of the invention provides a semiconductor machine control method, which comprises the steps of processing a first product in a first batch of products by a semiconductor related process; after receiving the first instruction, starting to process the second batch of products until each product in the second batch of products is processed; the untreated products of the first batch of products continue to be treated. In the embodiment of the invention, after receiving the instruction of preferentially processing a certain batch of products, the semiconductor machine is switched to the processing of the batch of products needing preferential processing, and returns to the processing of the residual unprocessed products in the current batch of products after processing each product in the batch of products. Therefore, the batch products needing to be processed preferentially can be processed to the maximum extent in time.
In actual application, when the priority mode is adopted, the method is only suitable for a batch of products at a time. That is, when a semiconductor tool is processing a second batch of products requiring priority processing, if the semiconductor tool receives a second command indicating priority processing of another batch of products, the semiconductor tool will temporarily not respond to the second command.
Accordingly, an embodiment of the present invention further provides a method for controlling a semiconductor apparatus, and fig. 4 is a schematic flow chart illustrating a process of controlling the semiconductor apparatus according to the embodiment of the present invention. As shown in fig. 4, the method comprises the steps of:
step 401: processing a first product in the first batch of products by a semiconductor related process;
step 402: after receiving the first instruction, starting to process the second batch of products;
step 403: receiving a second instruction; the second instructions are received during processing of the second batch of products;
step 404: when the processing of each of the second plurality of products is completed, in response to the second instruction, beginning processing each of a third plurality of products until the processing of each of the third plurality of products is completed;
step 405: the untreated products of the first batch of products continue to be treated.
The implementation manners of steps 401 to 402 are similar to those of steps 201 to 202, and are not described herein again.
In practical application, when a first instruction is received, if the first product is processed, the second batch of products are directly processed, and if the first product is not processed, the second batch of products need to be processed after the first product is processed.
It should be noted that, in this embodiment, the processing of the second batch of products has already been started in step 402, but the processing of each product in the second batch of products is not completed.
In step 403, the semiconductor tool receives a second command indicating a priority for processing a third batch of products while processing the second batch of products in response to the first command. In actual application, the second instruction is received in the same manner as the first instruction.
In practical application, when the semiconductor machine detects that a priority instruction, namely the first instruction, of the same type as the second instruction exists before the second instruction, and the priority processing product specified in the first instruction is not processed completely, the second alarm can be generated.
Based on this, in one embodiment, a second instruction is received; the second instructions are received during processing of the second batch of products;
generating a second alarm; the second alarm indicates that the semiconductor machine cannot process the second instruction currently.
Here, the second instructions are for indicating a priority for processing a third batch of products. In practical application, the second alarm may be used to remind related personnel that the second instruction cannot be currently responded by the semiconductor machine. The second alert may be presented to the associated person in a pop-up box or other manner.
In actual application, the second instruction is stored when the second instruction is not responded.
In step 404, the semiconductor tool processes each of the second batch of products, and inquires that there is an unresponsive second command when the processing of each of the second batch of products is completed, and then starts to process each of the third batch of products in response to the second command until the processing of each of the third batch of products is completed.
In practical applications, when the semiconductor machine completes execution of the first instruction and starts to respond to the second instruction, the first notification may also be generated.
Based on this, in one embodiment, a first notification is generated in response to the second instruction.
Here, the first notification characterizes that the semiconductor machine starts processing the second instruction.
In practical application, the first notification may be used to remind the relevant person that the semiconductor machine has started to respond to the second instruction. The first notification may be presented to the associated person in a pop-up box or other manner.
In practical applications, when the third batch of products is not allowed to wait for the second batch of products to be processed after the second batch of products is completed, the operation of performing the priority processing on the semiconductor machine with an empty loading position can be tried to be replaced. It should be noted that, at this time, an instruction for representing the withdrawal of the second instruction needs to be sent to the semiconductor machine that has received the second instruction, so that the semiconductor machine directly continues to process the remaining unprocessed products in the first batch of products after processing the second batch of products.
In step 405, when the third batch of products is finished, the semiconductor tool continues to process the remaining unprocessed products in the first batch of products according to the default control mode, i.e., the forward mode.
In the embodiment of the present invention, when a semiconductor machine is processing a second batch of products requiring preferential processing, if the semiconductor machine receives a command representing preferential processing of a third batch of products again, the semiconductor machine will temporarily not respond to the command received again, but will finish processing the second batch of products currently being subjected to preferential processing and respond to the command received again, that is, process the third batch of products, and continue to process the remaining unprocessed products in the first batch of products after each product in the third batch of products is processed. Therefore, the normal operation of the priority mode of the semiconductor machine can be ensured, and the operation disorder of the semiconductor machine caused by excessive priority instructions is avoided.
The present invention will be described in further detail with reference to the following application examples.
An embodiment of the present invention provides a method for controlling a semiconductor machine, and fig. 5 is a schematic flow chart illustrating a process of controlling the semiconductor machine according to the embodiment of the present invention. As shown in fig. 5, the method comprises the steps of:
step 501: processing a first product in the first batch of products by a semiconductor related process;
in practical application, the semiconductor machine may process a first batch of products according to a default control mode, that is, a forward mode, where the first batch of products includes a plurality of products, and the first product is a product currently being processed by the semiconductor machine in the first batch of products.
In executing step 501 to process the first product, when the first instruction is generated, the process proceeds to step 502.
Step 502: receiving a first instruction; the first instruction is used for indicating that a second batch of products is processed preferentially;
here, the second batch of products is a batch of products that currently need to be prioritized.
After step 502, proceed to step 503.
Step 503: judging whether the first product is processed or not;
when the judgment result indicates that the first product processing is not completed, go to step 504; when the determination result indicates that the first product is completely processed, go to step 505.
Step 504: processing the first product to completion;
after step 504, proceed to step 505.
Step 505: judging whether a loading position of unloaded batch products exists on the semiconductor machine;
when the judgment result shows that the semiconductor machine station has the loading position for not loading the batch of products, turning to step 506; and when the judgment result shows that the loading positions of the unloaded batch of products do not exist on the semiconductor machine, turning to step 507.
Step 506: loading the second batch of products on the loading location;
after step 506, proceed to step 508.
Step 507: generating a first alarm;
here, the first alarm indicates that the semiconductor machine is currently unable to process the first command.
It should be noted that: in practical application, there is no strict sequence between steps 503 and 504 and steps 505, 506, and 507, which can be performed simultaneously, or the loading position can be determined before the first product is determined.
Step 508: beginning processing of the second batch of product;
in executing step 508 to begin processing the second batch of products in response to the first instruction, when the second instruction is generated, proceed to step 507.
Step 509: receiving a second instruction; the second instruction is used for indicating that a third batch of products are processed preferentially; the second instructions are received during processing of the second batch of products;
here, the third batch of products is a batch of products that need to be preferentially processed. After step 509, the process proceeds to steps 510 and 511, and steps 510 and 511 proceed simultaneously.
Step 510: generating a second alarm; the second alarm represents that the semiconductor machine cannot process the second instruction currently;
step 511: continuing to process the second batch of products until all of each of the second batch of products is processed;
after step 511 is completed, the process proceeds to steps 512 and 513, and steps 512 and 513 are performed simultaneously.
Step 512: generating a first notification in response to the second instruction;
here, the first notification characterizes that the semiconductor machine starts processing the second instruction.
Step 513: in response to the second instruction, beginning processing each of the third plurality of products until processing of each of the third plurality of products is complete;
after step 513 is completed, the process proceeds to step 514.
Step 514: the untreated products of the first batch of products continue to be treated.
According to the embodiment of the invention, on one hand, the batch products needing to be processed preferentially can be processed in time to the maximum extent; on the other hand, the method can also ensure the smooth development and ensure no waste of the capacity of the machine.
In order to implement the method according to the embodiment of the present invention, an embodiment of the present invention further provides a semiconductor apparatus control device 600, fig. 6 is a structural diagram of the device according to the embodiment of the present invention, and as shown in fig. 6, the device 600 includes:
a processing unit 601, configured to perform semiconductor-related process processing on a first product in the first batch of products;
an instruction receiving unit 602, configured to receive a first instruction;
the processing unit 601 is further configured to start processing a second batch of products after the instruction receiving unit receives the first instruction, until each product in the second batch of products is processed;
the processing unit 601 is further configured to continue to process the remaining unprocessed products in the first batch of products after each product in the second batch of products is processed.
In one embodiment, the apparatus 600 further comprises a loading unit for:
and loading the second batch of products on the semiconductor machine.
In an embodiment, the loading unit is specifically configured to:
judging whether a loading position of unloaded batch products exists on the semiconductor machine;
and when the loading position of the semiconductor machine table is determined to have the unloaded batch of products, loading the second batch of products on the loading position.
In an embodiment, the apparatus 600 further comprises an alarm unit configured to:
and generating a first alarm when the fact that the loading position of the unloaded batch of products does not exist on the semiconductor machine is determined.
In an embodiment, the instruction receiving unit 602 is further configured to:
receiving a second instruction; the second instructions are received during processing of the second batch of products;
the alarm unit is further configured to:
generating a second alarm; the second alarm indicates that the semiconductor machine cannot process the second instruction currently.
In an embodiment, the processing unit 601 is further configured to:
when the processing of each of the second plurality of products is completed, in response to the second instruction, beginning processing each of a third plurality of products until the processing of each of the third plurality of products is completed.
In an embodiment, the processing unit 601 is further configured to: when a first instruction is received, the first product processing is not finished; and after the first product is processed, processing the second batch of products.
In an embodiment, the apparatus 600 further comprises a recording unit configured to:
storing location information of the first product in the first batch of products upon completion of the first product processing;
the processing unit 601 is further configured to:
determining the starting position of the remaining unprocessed products in the first batch of products according to the stored position information;
continuing to process the untreated products of the first batch of products from the starting position.
In practical applications, the processing unit 601, the command receiving unit 602, the loading unit, the alarming unit, and the recording unit may be implemented by a processor in the semiconductor machine control device 600.
It should be noted that: in the semiconductor device control apparatus provided in the above embodiment, only the division of the program modules is exemplified when performing control, and in practical applications, the processing distribution may be completed by different program modules according to needs, that is, the internal structure of the apparatus may be divided into different program modules to complete all or part of the processing described above. In addition, the semiconductor machine control device provided by the above embodiment and the search method embodiment belong to the same concept, and specific implementation processes thereof are detailed in the method embodiment and are not described herein again.
Based on the hardware implementation of the program module, and in order to implement the method according to the embodiment of the present invention, an embodiment of the present invention further provides a semiconductor apparatus control device 700, where the device 700 includes:
a memory 701 for storing executable instructions;
the processor 702 is configured to implement the search method provided by the embodiment of the present invention when executing the executable instructions stored in the memory.
In practice, as shown in fig. 7, the various components of the apparatus 700 are coupled together by a bus system 703. It is understood that the bus system 703 is used to enable communications among the components. The bus system 703 includes a power bus, a control bus, and a status signal bus in addition to the data bus. For clarity of illustration, however, the various buses are labeled in fig. 7 as bus system 703.
The embodiment of the invention also provides a storage medium, wherein the storage medium stores executable instructions, and when the executable instructions are executed by at least one processor, the semiconductor machine control method provided by the embodiment of the invention is realized.
In some embodiments, the storage medium may be a Memory such as a magnetic Random Access Memory (FRAM), a Read Only Memory (ROM), a Programmable Read Only Memory (PROM), an Erasable Programmable Read Only Memory (EPROM), an Electrically Erasable Programmable Read Only Memory (EEPROM), a Flash Memory (Flash Memory), a magnetic surface Memory, an optical Disc, or a Compact Disc Read-Only Memory (CD-ROM); or may be various devices including one or any combination of the above memories.
In some embodiments, executable instructions may be written in any form of programming language (including compiled or interpreted languages), in the form of programs, software modules, scripts or code, and may be deployed in any form, including as a stand-alone program or as a module, component, subroutine, or other unit suitable for use in a computing environment.
By way of example, executable instructions may correspond, but do not necessarily have to correspond, to files in a file system, and may be stored in a portion of a file that holds other programs or data, such as in one or more scripts in a hypertext Markup Language (HTML) document, in a single file dedicated to the program in question, or in multiple coordinated files (e.g., files that store one or more modules, sub-programs, or portions of code).
By way of example, executable instructions may be deployed to be executed on one computing device or on multiple computing devices at one site or distributed across multiple sites and interconnected by a communication network.
It should be noted that: "first," "second," and the like are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order.
In addition, the technical solutions described in the embodiments of the present invention may be arbitrarily combined without conflict.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention.
Claims (4)
1. A method for controlling a semiconductor machine, the method comprising:
processing a first product in the first batch of products by a semiconductor related process;
after receiving the first instruction, starting to process a second batch of products until each product in the second batch of products is processed; when a first instruction is received, if the first product is processed, the second batch of products are directly processed; if the first product is not processed, processing the second batch of products after the first product is processed;
before processing the second batch of products, the method further comprises:
loading the second batch of products on the semiconductor machine;
the loading the second batch of products on the semiconductor machine comprises:
judging whether a loading position of unloaded batch products exists on the semiconductor machine;
when the fact that a loading position of an unloaded batch of products exists on the semiconductor machine table is determined, loading the second batch of products on the loading position;
the method further comprises the following steps:
when determining that no loading position of the unloaded batch of products exists on the semiconductor machine, generating a first alarm; the first alarm represents that the semiconductor machine cannot process the first instruction currently;
the method further comprises the following steps:
receiving a second instruction; the second instructions are received during processing of the second batch of products;
generating a second alarm; the second alarm represents that the semiconductor machine cannot process the second instruction currently;
the method further comprises the following steps:
when the processing of each of the second plurality of products is completed, in response to the second instruction, beginning processing each of a third plurality of products until the processing of each of the third plurality of products is completed;
continuing to process the untreated products in the first batch of products;
the method further comprises the following steps:
upon completion of the first product treatment, the method further comprises:
storing location information of the first product in the first batch of products;
determining the starting position of the remaining unprocessed products in the first batch of products according to the stored position information;
continuing to process the untreated products of the first batch of products from the starting position.
2. An apparatus for controlling a semiconductor machine, the apparatus comprising:
the processing unit is used for processing a first product in the first batch of products by a semiconductor related process;
an instruction receiving unit for receiving a first instruction;
the processing unit is further configured to start processing a second batch of products after the instruction receiving unit receives the first instruction until each product in the second batch of products is processed; wherein the processing unit is further configured to: when a first instruction is received, if the first product is processed, the second batch of products are directly processed; if the first product is not processed, processing the second batch of products after the first product is processed;
the device further comprises:
the loading unit is used for loading the second batch of products on the semiconductor machine platform;
the loading unit is specifically used for judging whether a loading position for not loading batch products exists on the semiconductor machine platform;
when the fact that a loading position of an unloaded batch of products exists on the semiconductor machine table is determined, loading the second batch of products on the loading position;
the apparatus further comprises an alert unit for:
when determining that no loading position of the unloaded batch of products exists on the semiconductor machine, generating a first alarm; the first alarm represents that the semiconductor machine cannot process the first instruction currently;
the instruction receiving unit is further used for receiving a second instruction; the second instructions are received during processing of the second batch of products;
the device further comprises:
the alarm unit is used for generating a second alarm; the second alarm represents that the semiconductor machine cannot process the second instruction currently;
the processing unit is further configured to start processing each of the third batches of products in response to the second instruction when the processing of each of the second batches of products is completed until the processing of each of the third batches of products is completed;
when the second instruction is not received in the process of processing the second batch of products, the processing unit is further configured to continue to process the unprocessed products in the first batch of products after each product in the second batch of products is processed;
when the second instruction is received in the process of processing the second batch of products, the processing unit is further configured to continue to process the unprocessed products in the first batch of products after each product in the third batch of products is processed;
the apparatus further comprises a recording unit for:
storing location information of the first product in the first batch of products upon completion of the first product processing;
the processing unit is further to:
determining the starting position of the remaining unprocessed products in the first batch of products according to the stored position information;
continuing to process the untreated products of the first batch of products from the starting position.
3. A semiconductor machine control device, comprising: a processor and a memory configured to store a computer program operable on the processor;
wherein the processor is adapted to perform the steps of the method of claim 1 when executing the computer program.
4. A storage medium having a computer program stored thereon, characterized in that the computer program realizes the steps of the method of claim 1 when executed by a processor.
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| CN101800163A (en) * | 2009-02-10 | 2010-08-11 | 东京毅力科创株式会社 | Substrate board treatment |
| CN106449488A (en) * | 2016-11-23 | 2017-02-22 | 上海华力微电子有限公司 | Method for controlling slot type wet washing equipment |
| CN108885968A (en) * | 2016-04-08 | 2018-11-23 | 株式会社国际电气 | The manufacturing method and program of substrate processing device, semiconductor devices |
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| TWI316044B (en) * | 2004-02-28 | 2009-10-21 | Applied Materials Inc | Methods and apparatus for material control system interface |
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|---|---|---|---|---|
| CN101800163A (en) * | 2009-02-10 | 2010-08-11 | 东京毅力科创株式会社 | Substrate board treatment |
| CN108885968A (en) * | 2016-04-08 | 2018-11-23 | 株式会社国际电气 | The manufacturing method and program of substrate processing device, semiconductor devices |
| CN106449488A (en) * | 2016-11-23 | 2017-02-22 | 上海华力微电子有限公司 | Method for controlling slot type wet washing equipment |
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