CN111271264B

CN111271264B - Micro-electromechanical pump module

Info

Publication number: CN111271264B
Application number: CN201811477841.6A
Authority: CN
Inventors: 莫皓然; 余荣侯; 张正明; 戴贤忠; 廖文雄; 黄启峰; 韩永隆; 陈宣恺
Original assignee: Microjet Technology Co Ltd
Current assignee: Microjet Technology Co Ltd
Priority date: 2018-12-05
Filing date: 2018-12-05
Publication date: 2022-06-21
Anticipated expiration: 2038-12-05
Also published as: CN111271264A

Abstract

A microelectromechanical pump module comprising: a microprocessor for sending a control signal; a micro-electromechanical chip electrically connected to the microprocessor, the micro-electromechanical chip comprising: a chip body; the MEMS pumps are arranged on the chip body and respectively provided with a first electrode and a second electrode; at least one common electrode which is arranged on the chip body and electrically connected with the second electrodes of the plurality of MEMS pumps; the first electrodes of the plurality of MEMS pumps and the at least one common electrode of the MEMS chip are electrically connected with the microprocessor to receive the control signal.

Description

Micro-electromechanical pump module

[ technical field ] A

The present invention relates to a micro electromechanical pump module, and more particularly, to a micro electromechanical pump module which reduces the number of contacts of a microprocessor by using a common electrode, thereby simplifying the contacts and wiring of the micro electromechanical pump.

[ background of the invention ]

With the development of technology, the applications of fluid delivery devices are becoming more diversified, such as industrial applications, biomedical applications, medical care, electronic heat dissipation, etc., and even recently, the image of a wearable device is seen in hot-door wearable devices, and thus the conventional pump tends to be miniaturized, but the size of the conventional pump is difficult to be reduced to the centimeter level, so that the conventional micro fluid delivery device can only use a piezoelectric pump structure as a micro fluid delivery device.

Although the mems pump can miniaturize the pump volume to the micron level, the micron level mems pump limits the fluid transmission amount due to the too small volume, so it needs to use a plurality of mems pumps in combination, please refer to fig. 1, the existing mems pump modules are individually controlled by a high-level microprocessor 1, but the high-level microprocessor 1 has high cost, and each mems pump 2 needs two microprocessor pins 11 to connect, which increases the cost of the high-level microprocessor 1, resulting in high cost of the mems pump module, which is difficult to popularize, therefore, how to reduce the cost of the driving end of the mems pump module is the first difficulty to overcome.

[ summary of the invention ]

The main objective of the present invention is to provide a mems pump module, which reduces the number of contacts of a microprocessor through a common electrode, reduces the number of contacts and wiring of the mems pump module, and further simplifies the mems pump module.

To achieve the above objects, a microelectromechanical pump module is provided in a broader aspect of the present disclosure, comprising: a microprocessor for sending a control signal; a micro-electromechanical chip electrically connected to the microprocessor, the micro-electromechanical chip comprising: a chip body; the MEMS pumps are arranged on the chip body and respectively provided with a first electrode and a second electrode; at least one common electrode which is arranged on the chip body and electrically connected with the second electrodes of the plurality of MEMS pumps; the first electrodes of the plurality of MEMS pumps and the at least one common electrode of the MEMS chip are electrically connected with the microprocessor to receive the control signal.

[ description of the drawings ]

Fig. 1 is a schematic diagram of a prior art microelectromechanical pump module.

Fig. 2 is a schematic diagram of the mems pump module.

Fig. 3 is a schematic diagram of a second embodiment of a microelectromechanical chip of the present microelectromechanical pump module.

Fig. 4 is a schematic view of a third embodiment of the mems chip of the mems pump module of the present application.

Fig. 5 is a schematic diagram of a fourth embodiment of the mems chip of the mems pump module.

Fig. 6 is a schematic diagram of a fifth embodiment of a mems chip of the present microelectromechanical pump module.

Fig. 7 is a schematic diagram of a sixth embodiment of the mems chip of the mems pump module of the present disclosure.

Fig. 8A is an electrical connection diagram of the present mems pump.

Fig. 8B is a schematic diagram of a first embodiment of the control signal output by the microprocessor according to the present invention.

Fig. 8C is a schematic diagram of a second embodiment of the control signal output by the microprocessor according to the present invention.

Fig. 8D is a schematic diagram of a third embodiment of the control signal output by the microprocessor according to the present invention.

[ embodiment ] A method for producing a semiconductor device

Exemplary embodiments that embody features and advantages of this disclosure are described in detail below in the detailed description. It will be understood that the present disclosure is capable of various modifications without departing from the scope of the disclosure, and that the description and drawings are to be regarded as illustrative in nature, and not as restrictive.

Referring to fig. 2, fig. 2 is a schematic view of the mems pump module. The microelectromechanical pump module 100 includes: a microprocessor 3, a micro-electromechanical chip 4, the micro-electromechanical chip 4 is electrically connected to the microprocessor 3, and the micro-electromechanical chip 4 includes a chip body 41, a plurality of micro-electromechanical pumps 42 and at least one common electrode 43, the micro-electromechanical pumps 42 are disposed on the chip body 41, each micro-electromechanical pump 42 has a first electrode 42a and a second electrode 42b, and at least one common electrode 43 is also disposed on the chip body 41 and electrically connected to the second electrodes 42b of all the micro-electromechanical pumps 42, wherein the first electrodes 42a of all the micro-electromechanical pumps 42 and the at least one common electrode 43 on the chip body 41 are electrically connected to the microprocessor 3 for receiving the control signal sent by the microprocessor 3, and fig. 2 is also a first embodiment of the present disclosure, the number of the at least one common electrode 43 includes one first common electrode 43a, the number of the common electrodes 43 of the present embodiment is one, the second electrodes 42b of all the mems pumps 42 are electrically connected to the first common electrode 43 a.

Referring to fig. 3, fig. 3 is a diagram of a second embodiment of the mems chip of the mems module according to the present invention, in which at least one common electrode 43 includes a first common electrode 43a and a second common electrode 43b, and the aforementioned plurality of mems pumps 42 are divided into a first mems pump group 421 and a second mems pump group 422 according to location, wherein the second electrodes 42b of the mems pumps 42 in the first mems pump group 421 are electrically connected to the first common electrode 43a, and the second electrodes 42b of the mems pumps 42 in the second mems pump group 422 are electrically connected to the second common electrode 43b, so as to achieve the effect of zone control, wherein the number of the common electrodes 43 in the embodiment is two.

Referring to fig. 4, fig. 4 is a diagram illustrating a micro-electromechanical chip of a micro-electromechanical pump module according to a third embodiment of the present invention, in which the third embodiment and the second embodiment are the same in that the common electrodes 43 are two, so that the common electrode 43 has a first common electrode 43a and a second common electrode 43b, the first common electrode 43a and the second common electrode 43b are separately disposed on two sides of the chip body 41, and the first common electrode 43a and the second common electrode 43b are electrically connected, and the second electrodes 42b of the plurality of micro-electromechanical pumps 42 are simultaneously electrically connected to the first common electrode 43a and the second common electrode 43b on two sides, and the third embodiment can reduce the impedance between the second electrodes 42b and the common electrodes 43 of the micro-electromechanical pumps 42, and reduce the power loss of the second common electrode 42b far from the micro-electromechanical pump 43.

Referring to fig. 5, fig. 5 is a diagram of a micro-electromechanical chip of the micro-electromechanical pump module according to a fourth embodiment of the present disclosure, in which at least one common electrode 43 includes a first common electrode 43a, a second common electrode 43b, a third common electrode 43c and a fourth common electrode 43d, the first common electrode 43a and the third common electrode 43c are disposed at one side of the chip body 41 at an interval, the second common electrode 43b and the fourth common electrode 43d are disposed at the other side of the chip body 41 at an interval, in the present embodiment, the aforementioned micro-electromechanical pumps 42 are divided into a first micro-electromechanical pump group 421, a second micro-electromechanical pump group 422, a third micro-electromechanical pump group 423 and a fourth micro-electromechanical pump group 424 according to the location area, the first micro-electromechanical pump group 421 is composed of micro-electromechanical pumps 42 adjacent to the first common electrode 43a, and the first common electrode 43a is used for electrically connecting the second electrodes 42b of all the micro-electromechanical pumps 42 in the first micro-electromechanical pump group 421; the second MEMS pump group 422 is formed by the MEMS pumps 42 adjacent to a second common electrode 43b, the second common electrode 43b is used for electrically connecting the second electrodes 42b of all the MEMS pumps 42 in the second MEMS pump group 422; the third MEMS pump group 423 is formed by the MEMS pumps 42 adjacent to a third common electrode 43c, the third common electrode 43c is used for electrically connecting the second electrodes 42b of all the MEMS pumps 42 in the third MEMS pump group 423; the fourth MEMS pump group 424 is formed by the MEMS pumps 42 adjacent to a fourth common electrode 43d, the fourth common electrode 43d is used for electrically connecting the second electrodes 42b of all the MEMS pumps 42 in the fourth MEMS pump group 424, thereby achieving the effect of zone control.

Referring to fig. 6, fig. 6 is a schematic diagram of a fifth embodiment of a mems chip of the mems module, which has a first common electrode 43a, a second common electrode 43b, a third common electrode 43c and a fourth common electrode 43d in the same manner as the fourth embodiment, and the difference points are that the first common electrode 43a is electrically connected to the second common electrode 43b, the third common electrode 43c is electrically connected to the fourth common electrode 43d, and the aforementioned multiple mems pumps 42 are divided into a first mems pump group 421 and a second mems pump group 422, the first mems pump group 421 is composed of the mems pumps 42 adjacent to the first common electrode 43a or the second common electrode 43b, the second mems pump group 422 is composed of the mems pumps 42 adjacent to the third common electrode 43c or the fourth common electrode 43d, thereby achieving the effect of partition control, and the distance between the common electrode 43 and the second electrode 42b is reduced, reducing the loss of power transmission.

Referring to fig. 7, fig. 7 is a diagram of a sixth embodiment of the mems chip of the mems pump module, the present embodiment and the fourth embodiment have the same first common electrode 43a, second common electrode 43b, third common electrode 43c and fourth common electrode 43d, and the same arrangement positions, the difference is that in the present embodiment, the first common electrode 43a, the second common electrode 43b, the third common electrode 43c and the fourth common electrode 43d are all electrically connected to each other, so that the second electrode 42b of the aforementioned multiple mems pumps 42 is electrically connected to the closer common electrode 43, such as the second electrode 42b of the mems pump 42 adjacent to the first common electrode 43a is electrically connected to the first common electrode 43a, the second electrode 42b of the mems pump 42 adjacent to the second common electrode 43b is electrically connected to the second common electrode 43b, and so on, 43 supplies the mems pumps 42 with the similar positions, the loss of power transmitted by each of the mems pumps 42 is reduced.

Referring to fig. 8A and 8B, fig. 8A is a schematic diagram of an electrical connection of the mems pump of the present invention, and fig. 8B is a schematic diagram of a first embodiment of a control signal output by the microprocessor of the present invention; the mems pump 42 further includes a piezoelectric element 42c, the first electrode 42a and the second electrode 42b transmit a voltage to the piezoelectric element 42c, so that the piezoelectric element 42c deforms due to the piezoelectric effect and changes the internal pressure of the mems pump 42 for delivering fluid, the first electrode 42a of the mems pump 42 is electrically connected to the microprocessor 3 (as shown in fig. 2), the second electrode 42b is electrically connected to the microprocessor 3 (as shown in fig. 2) through the common electrode 43, wherein the control signal output by the microprocessor 3 includes a constant voltage and a variable voltage, in this embodiment, the variable voltage may be a voltage switched between a first voltage and a second voltage, and the voltage value of the constant voltage is between the voltage value of the first voltage and the voltage value of the second voltage, and the voltage value of the constant voltage may also be ± 10% of the voltage value of the first voltage and the voltage value of the second voltage, for example, when the first voltage is 1.5V, the second voltage is-1.5V, the constant voltage is 0V, the first voltage is 3V, and the second voltage is 0V, the constant voltage is 1.5V, such that the second electrode 42b of the mems pump 42 receives a fixed voltage, the first electrode 42a receives the first voltage and the second voltage which continuously change, and the piezoelectric element 42c deforms due to the continuously changing voltage difference between the first electrode 42a and the second electrode 42b to transmit the fluid. In addition, with continuing reference to fig. 8C and 8D, fig. 8C is a schematic diagram of a second embodiment of the control signal output by the microprocessor, fig. 8D is a schematic diagram of a third embodiment of the control signal output by the microprocessor, the variable voltage may also be a voltage continuously changing between the first voltage and the second voltage, and the control signal may also be a triangular wave (fig. 8C) or a sine wave (fig. 8D) in addition to the square wave of the first embodiment.

In summary, the present disclosure provides a mems pump module, in which a microprocessor transmits a constant voltage to a second electrode of the mems pump via a common electrode, and then transmits a variable voltage to a first electrode of the mems pump, and only needs to modulate the voltage on the first electrode to change the voltage difference between the first electrode and the second electrode, so as to successfully drive a piezoelectric device of the mems pump, so that the piezoelectric device can be actuated to transmit a fluid.

Various modifications may be made by those skilled in the art without departing from the scope of the invention as defined by the appended claims.

[ notation ] to show

100: micro-electromechanical pump module

1: high-level microprocessor

11: microprocessor connecting pin

2: microelectromechanical pump

3: microprocessor

4: micro-electromechanical chip

41: chip body

42: MEMS pump

42 a: a first electrode

42 b: second electrode

42 c: piezoelectric element

421: first micro-electromechanical pump group

422: second MEMS pump group

423: third MEMS pump group

424: fourth MEMS pump group

43: common electrode

43 a: a first common electrode

43 b: second common electrode

43 c: third common electrode

43 d: fourth common electrode

Claims

1. A microelectromechanical pump module, comprising:

a microprocessor for sending a control signal;

a micro-electromechanical chip electrically connected to the microprocessor, comprising:

a chip body;

the MEMS pumps are arranged on the chip body and respectively provided with a first electrode and a second electrode; and

at least one common electrode which is arranged on the chip body and electrically connected with the second electrodes of the plurality of MEMS pumps;

the first electrodes of the plurality of MEMS pumps and the at least one common electrode of the MEMS chip are electrically connected with the microprocessor to receive the control signal.

2. The mems pump module of claim 1 wherein the at least one common electrode comprises a first common electrode.

3. The mems pump module of claim 2 wherein the second electrodes of the plurality of mems pumps are electrically connected to the first common electrode.

4. The mems pump module of claim 2, wherein the at least one common electrode further comprises a second common electrode.

5. The MEMS module of claim 4, wherein the MEMS pumps are divided into a first MEMS pump group and a second MEMS pump group, the second electrodes of the first MEMS pump group are electrically connected to the first common electrode, and the second electrodes of the second MEMS pump group are electrically connected to the second common electrode.

6. The mems pump module of claim 4 wherein the second electrode of the plurality of mems pumps electrically connects the first common electrode and the second common electrode.

7. The MEMS pump module of claim 4, wherein the at least one common electrode further comprises a third common electrode and a fourth common electrode.

8. The mems module as recited in claim 7, wherein said plurality of mems pumps are divided into a first mems pump group, a second mems pump group, a third mems pump group and a fourth mems pump group, said plurality of second electrodes of said first mems pump group being electrically connected to said first common electrode, said plurality of second electrodes of said second mems pump group being electrically connected to said second common electrode, said plurality of second electrodes of said third mems pump group being electrically connected to said third common electrode, said plurality of second electrodes of said fourth mems pump group being electrically connected to said fourth common electrode.

9. The mems module as recited in claim 7, wherein said plurality of mems pumps are divided into a first mems pump group and a second mems pump group, said plurality of second electrodes of said first mems pump group electrically connecting said first common electrode and said second common electrode, said plurality of second electrodes of said second mems pump group electrically connecting said third common electrode and said fourth common electrode.

10. The mems pump module of claim 7, wherein the second electrode of the plurality of mems pumps is electrically connected to the first common electrode, the second common electrode, the third common electrode, and the fourth common electrode.