CN111254483A - Method for improving VCP electroplating line material number switching efficiency - Google Patents
Method for improving VCP electroplating line material number switching efficiency Download PDFInfo
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- CN111254483A CN111254483A CN202010165335.4A CN202010165335A CN111254483A CN 111254483 A CN111254483 A CN 111254483A CN 202010165335 A CN202010165335 A CN 202010165335A CN 111254483 A CN111254483 A CN 111254483A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/12—Process control or regulation
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/02—Tanks; Installations therefor
- C25D17/04—External supporting frames or structures
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/18—Electroplating using modulated, pulsed or reversing current
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- Automation & Control Theory (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a method for improving the material number switching efficiency of a VCP (vertical coaxial cable plating) plating line, which is characterized in that a plating bath is divided into two left and right half tanks for plating, an integral floating frame is changed into two floating frames respectively corresponding to the left and right half tanks, and then when circuit boards with different material numbers are switched to be subjected to electroplating production, only one plating accompanying plate which is full of the length of the floating frame (corresponding to the length of the left half tank or the right half tank) is required to sequentially perform current withdrawing and stabilizing operations on the two left and right half tanks, so that the normal production of the circuit boards with different material numbers can be switched by only one half of the plating accompanying plates, the consumption of copper in the plating tanks during plating accompanying of the plating accompanying plates is correspondingly reduced, the material cost is greatly reduced, and the plating accompanying efficiency during switching of different material numbers can be effectively improved.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a method for improving VCP (vertical continuous plating) electroplating line material number switching efficiency.
Background
A Vertical Continuous Plating (VCP) process is generally used in the electroplating process of a printed circuit board, and one characteristic of the electroplating process is that continuous current output is needed, but a large number of plating accompanying plates are needed when different material numbers are switched in a traditional VCP production mode, the plating accompanying plates with the same size as the production plates must be adopted for the head and the tail of the production plates with different material numbers, the plating accompanying plates in the front of the production plates are used for stabilizing the electroplating current in an electroplating bath, the plating accompanying plates in the back of the production plates are used for removing the electroplating current in the electroplating bath, and the process is equivalent to the process that two plating accompanying plates with corresponding sizes need to be placed in the electroplating bath for two times in sequence for transition between the production plates with different material numbers.
At present, the conventional length of a copper cylinder (namely an electroplating tank cylinder) of electroplating VCP equipment in the industry is 3m, the clamp on a floating frame with the length of 3m can not be plated with copper or burn a clamp to influence production, so that the clamp is ensured to be clamped with an accompanying plate as accompanying plating, when the whole electroplating tank cylinder is filled with current, the accompanying plate needs to be hung fully in the length direction of the electroplating tank cylinder for accompanying plating, namely, the accompanying plate needs to be clamped on the floating frame with the length of 3m or so when different material numbers are switched, the two accompanying plates are added to be 6 m, the time required by accompanying plating is also longer, and aiming at a small-batch production enterprise with more materials, the production mode can greatly waste material cost and influence the production efficiency when the material numbers are switched.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a method for improving the material number switching efficiency of a VCP electroplating line, which can effectively reduce the use of plating accompanying plates, reduce the cost and effectively improve the production efficiency when different material numbers are switched.
In order to solve the technical problem, the invention provides a method for improving the material number switching efficiency of a VCP electroplating line, which comprises the following steps:
s1, dividing the anode in the electroplating bath into two sections which are not connected with each other left and right, and connecting the two anodes with different commutators respectively, so that the whole electroplating bath is divided into a left half bath and a right half bath for electroplating uniformly; a front floating frame and a rear floating frame which respectively correspond to the left half-tank and the right half-tank are sequentially arranged above the electroplating tank;
s2, filling electroplating liquid medicine in the electroplating bath during electroplating, wherein in the process of switching to electroplate circuit boards with different material numbers, the front circuit board and the rear circuit board with different material numbers are respectively the front circuit board being electroplated and the rear circuit board to be electroplated;
s3, after the front circuit board finishes electroplating and leaves the electroplating bath and returns current through a first plating accompanying plate with the same size as the front circuit board, hanging a second plating accompanying plate with the same size as the rear circuit board on the rear floating frame;
s4, setting the electroplating currents in the left half groove and the right half groove as the electroplating currents required by the rear circuit board during electroplating through a rectifier, then placing the second plating accompanying plate on the rear floating frame into the right half groove for electroplating, and moving the second plating accompanying plate out of the right half groove when the electroplating currents in the right half groove are stabilized;
s5, gradually transferring all second plating accompanying plates on the rear floating frame to the front floating frame, and simultaneously gradually hanging the rear floating frame with a rear circuit board to be plated;
s6, placing the second plating accompanying plate on the front floating frame into the left half groove for electroplating, placing the rear circuit board on the rear floating frame into the right half groove for normal electroplating, and moving the second plating accompanying plate out of the left half groove when the electroplating current in the left half groove is stabilized at the electroplating current required by the electroplating of the rear circuit board;
s7, disassembling the second plating accompanying plate on the front floating frame for later use, and transferring to the next procedure after the rear circuit board on the rear floating frame is electroplated; and finally, continuously hanging the back circuit boards on the two floating frames and putting the circuit boards into an electroplating bath for batch electroplating production.
Further, in step S1, the front floating frame and the rear floating frame are sequentially disposed along a length direction of the plating bath, and the front floating frame and the rear floating frame have the same size.
Further, in step S1, the length of the front floating frame is less than or equal to the length of the left half-trough.
Further, in step S1, sensors are disposed in both the left half groove and the right half groove.
Further, in steps S4 and S6, the rectifier is started to gradually increase the plating current immediately after the second plating assisting board is sensed to enter the slot by the sensor until the plating current value required for plating the rear circuit board is stabilized.
Further, the second plating accompanying plate or the circuit board is hung on the two floating frames through the flying bars arranged on the floating frames in a sliding mode and the clips arranged on the flying bars.
Further, each flying bar is provided with at least three clamps.
Furthermore, the upper and lower vertical movements of the front floating frame and the rear floating frame are correspondingly controlled by two driving mechanisms respectively arranged at the upper ends of the front floating frame and the rear floating frame.
Further, in step S3, when the current is withdrawn, the first plating accompanying plate with the same size as the front circuit board is fully hung on the rear floating frame, then the first plating accompanying plate is placed in the right half-groove for electroplating and the electroplating current is gradually reduced until the plating current is zero, then the first plating accompanying plate is moved out of the right half-groove and is transferred to the front floating frame to withdraw the current to the left half-groove in the same manner, and the first plating accompanying plate is detached for standby after the current is withdrawn.
Further, in step S4, when the first plating assistant plate is placed in the left half-tank for current withdrawal, the plating current in the right half-tank is set to the plating current required for plating the rear circuit board by the rectifier, and the second plating assistant plate on the rear floating frame is placed in the right half-tank for plating, so that the plating current in the right half-tank is gradually increased until the plating current value required for plating the rear circuit board is stabilized; after the current of the left half groove is withdrawn, the electroplating current of the left half groove is set to be the electroplating current needed by the electroplating of the rear circuit board through the rectifier.
Compared with the prior art, the invention has the following beneficial effects:
according to the invention, an original electroplating bath is divided into two left and right half tanks for electroplating, an integral floating frame is changed into two floating frames respectively corresponding to the left and right half tanks, and then when circuit boards with different material numbers are switched for electroplating production, only a plating accompanying plate full of the floating frame length (corresponding to the length of the left half tank or the right half tank) is needed to sequentially perform current withdrawal and current stabilization operations on the two left and right half tanks, so that normal production of the circuit boards with different material numbers can be completed by only half of the plating accompanying plates, the loss of copper in the electroplating bath during plating accompanying of the plating accompanying plates is correspondingly reduced, the material cost is greatly reduced, and the plating accompanying efficiency during switching of different material numbers can be effectively improved; when the first plating accompanying plate retreats from the electroplating current in the left half groove, the second plating accompanying plate can enter the right half groove with the current retreated to stabilize the electroplating current of the next electroplating, so that the current retreating and the current stabilizing can be carried out simultaneously, the production efficiency of switching circuit boards with different material numbers is further improved, and the efficiency can be improved by more than 50% through the design; because the two sections of anodes are respectively connected to different independent rectifiers, the rectifiers are doubled on the original basis and are used for respectively controlling the electroplating currents of the left half tank and the right half tank, so that the left half tank and the right half tank are not influenced by each other, the number of production plates required by each rectifier and correspondingly electroplated is correspondingly reduced, and the power of each rectifier can be correspondingly halved.
Drawings
FIG. 1 is a schematic diagram of VCP plating lines in an example.
Detailed Description
In order to more fully understand the technical contents of the present invention, the technical solutions of the present invention will be further described and illustrated with reference to specific embodiments.
Examples
As shown in fig. 1, the method for improving the material number switching efficiency of the VCP plating line in this embodiment includes the following steps:
a. the anode in the electroplating bath 1 is equally divided into two sections which are not connected with each other left and right (namely, the original anode with the length of 3 meters is divided into a left section and a right section which are 1.5 meters long), and the two sections of anodes are respectively and correspondingly connected with two external independent rectifiers (not shown in the figure), namely, the current of each section of anode is regulated by the independent rectifiers which are correspondingly connected with the anode, so that the currents of the two sections of anodes are not interfered with each other, the whole electroplating bath is evenly divided into a left half-bath 11 and a right half-bath 12 which are used for electroplating, the left half-bath and the right half-bath are not interfered with each other during electroplating, and the rectifier on the two sections of anodes are used for respectively controlling and adjusting the electroplating currents in the left half-bath 11 and the right half-bath; and a front floating frame 4 and a rear floating frame 5 which respectively correspond to the left half-groove 11 and the right half-groove 12 are sequentially arranged above the electroplating bath 1.
In the above, each segment of anode includes an anode rod 21, a plurality of titanium baskets 22 arranged in parallel at the lower end of the anode rod 21, and a plurality of copper balls 23 arranged in the titanium baskets 22.
In the above, the front floating frame 4 and the rear floating frame 5 are sequentially arranged along the length direction of the electroplating bath 1, the front floating frame 4 and the rear floating frame 5 have the same size, and a driving mechanism 6 (such as a motor or a cylinder, etc.) for controlling the vertical movement of the front floating frame 4 and the rear floating frame 5 is arranged between the upper ends thereof; the length of the front floating frame is less than or equal to that of the left half groove, so that the left half groove or the right half groove can be just fully paved when the plating accompanying plate is fully hung on the single floating frame; generally, to avoid the two floating frame supports from interfering with each other, the length of the front floating frame is slightly smaller than the length of the left half-tank.
In the above, inductors (not shown in the figure) are arranged in the left half groove and the right half groove respectively and are used for inducing the plate to enter and exit.
b. When electroplating, the electroplating solution is filled in the electroplating bath, and in the process of switching to electroplate circuit boards with different material numbers, the front circuit board and the rear circuit board with different material numbers are respectively the front circuit board being electroplated and the rear circuit board to be electroplated.
c. After the front circuit board finishes electroplating and leaves the electroplating bath and returns current through a first plating accompanying plate with the same size as the front circuit board, a second plating accompanying plate with the same size as the rear circuit board is hung on the rear floating frame.
When the current is withdrawn, the rear floating frame is fully hung with a first plating accompanying plate with the same size as the front circuit board, then the first plating accompanying plate is placed into the right half groove for electroplating and the electroplating current is gradually reduced until the first plating accompanying plate is zero, then the first plating accompanying plate is moved out of the right half groove and is transferred to the front floating frame to withdraw the current of the left half groove in the same way, and the first plating accompanying plate is disassembled for standby after the current withdrawal is finished; in addition, according to the electroplating bath structure of the left and right sub-tanks, when the circuit boards of the last batch enter the left half tank for electroplating, the first plating accompanying plate can be hung on the rear floating frame and placed in the right half tank for current withdrawal operation.
d. When the first plating accompanying plate is placed into the left half groove to retreat current, firstly, the rectifier on the right half section anode sets the electroplating current of the right half groove as the electroplating current needed by the electroplating of the rear circuit board, and the second plating accompanying plate on the rear floating frame is placed into the right half groove to be electroplated; and after the left half groove is subjected to current withdrawal by utilizing the first plating accompanying plate, the electroplating current of the left half groove is set to be the electroplating current required by the electroplating of the rear circuit board through the rectifier on the left half section anode.
In the aforesaid, locate flying the clip 3 that flies on the 7 and the flying the crust of floating frame and will accompany plate board or circuit board and hang on floating frame and remove on two floating frames through the slip, and every flies to be equipped with at least three clip on the crust, guarantees stability and fastness behind the clip centre gripping panel.
e. All the second plating accompanying plates on the rear floating frame 5 are gradually transferred to the front floating frame 4, and meanwhile, the rear floating frame is gradually full of rear circuit boards to be electroplated.
f. Then the second plating accompanying plate on the front floating frame 4 is placed into the left half groove 11 for electroplating, the rectifier is started immediately after the second plating accompanying plate is induced to enter the groove by the inductor, the electroplating current of the left half groove is gradually increased until the electroplating current is stabilized on the value of the electroplating current required by the electroplating of the rear circuit board, and then the second plating accompanying plate is moved out of the left half groove and is disassembled for standby; and the second plating accompanying plate is placed in the left half groove 11, and meanwhile, the rear circuit board on the rear floating frame 5 is placed in the right half groove for normal electroplating.
g. After the electroplating of the rear circuit board on the rear floating frame 5 is finished, transferring to the next procedure; finally, continuously hanging the rear circuit boards on the two floating frames and putting the circuit boards into left and right half grooves in an electroplating bath for batch electroplating production, wherein the circuit boards can be put in the left and right half grooves simultaneously or respectively; because the front floating frame and the rear floating frame are fully hung with the circuit boards and need a certain time, the front floating frame can be firstly hung with the circuit boards and then firstly put into the left half groove for production, then the rear floating frame is continuously hung with the circuit boards and put into the right half groove for production, and the two floating frames can be also hung with the circuit boards and then put into the electroplating bath for production.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the content of the present description should not be construed as a limitation to the present invention.
Claims (10)
1. A method for improving the material number switching efficiency of a VCP electroplating line is characterized by comprising the following steps:
s1, dividing the anode in the electroplating bath into two sections which are not connected with each other left and right, and connecting the two anodes with different commutators respectively, so that the whole electroplating bath is divided into a left half bath and a right half bath for electroplating uniformly; a front floating frame and a rear floating frame which respectively correspond to the left half-tank and the right half-tank are sequentially arranged above the electroplating tank;
s2, filling electroplating liquid medicine in the electroplating bath during electroplating, wherein in the process of switching to electroplate circuit boards with different material numbers, the front circuit board and the rear circuit board with different material numbers are respectively the front circuit board being electroplated and the rear circuit board to be electroplated;
s3, after the front circuit board finishes electroplating and leaves the electroplating bath and returns current through a first plating accompanying plate with the same size as the front circuit board, hanging a second plating accompanying plate with the same size as the rear circuit board on the rear floating frame;
s4, setting the electroplating currents in the left half groove and the right half groove as the electroplating currents required by the rear circuit board during electroplating through a rectifier, then placing the second plating accompanying plate on the rear floating frame into the right half groove for electroplating, and moving the second plating accompanying plate out of the right half groove when the electroplating currents in the right half groove are stabilized;
s5, gradually transferring all second plating accompanying plates on the rear floating frame to the front floating frame, and simultaneously gradually hanging the rear floating frame with a rear circuit board to be plated;
s6, placing the second plating accompanying plate on the front floating frame into the left half groove for electroplating, placing the rear circuit board on the rear floating frame into the right half groove for normal electroplating, and moving the second plating accompanying plate out of the left half groove when the electroplating current in the left half groove is stabilized at the electroplating current required by the electroplating of the rear circuit board;
s7, disassembling the second plating accompanying plate on the front floating frame for later use, and transferring to the next procedure after the rear circuit board on the rear floating frame is electroplated; and finally, continuously hanging the back circuit boards on the two floating frames and putting the circuit boards into an electroplating bath for batch electroplating production.
2. The method of claim 1, wherein in step S1, the front and rear floating frames are sequentially arranged along the length direction of the plating bath, and the front and rear floating frames have the same size.
3. The method of claim 2, wherein in step S1, the length of the front floating frame is less than or equal to the length of the left half tank.
4. The method of claim 1, wherein in step S1, sensors are disposed in both the left half tank and the right half tank.
5. The method as claimed in claim 4, wherein the step S4 and S6 are performed by the step S that the rectifier is started to gradually increase the plating current immediately after the sensor senses that the second plating assistant plate enters the cell until the plating current value required for plating the rear circuit board is stabilized.
6. The method for improving the stock number switching efficiency of the VCP plating line according to claim 1, wherein the plating accompanying plate or the circuit board is hung on the two floating frames by a flying bar arranged on the floating frames and a clamp arranged on the flying bar in a sliding way.
7. The method of increasing the material number switching efficiency of a VCP plating line according to claim 6, wherein at least three clamps are provided on each flying bar.
8. The method for improving the number switching efficiency of a VCP plating line according to claim 1, wherein the vertical movement of the front and rear floats is controlled by two driving mechanisms respectively provided at the upper ends of the front and rear floats.
9. The method for improving the material number switching efficiency of the VCP electroplating line according to claim 1, wherein in the step S3, when the current is withdrawn, the rear floating frame is fully hung with the first plating accompanying plate with the same size as the front circuit board, then the first plating accompanying plate is placed in the right half groove for electroplating and the electroplating current is gradually reduced until the first plating accompanying plate is zero, then the first plating accompanying plate is moved out of the right half groove and is transferred to the front floating frame to withdraw the current from the left half groove in the same way, and the first plating accompanying plate is detached for standby after the current is withdrawn.
10. The method for improving the material number switching efficiency of the VCP electroplating line according to claim 9, wherein in step S4, when the first plating accompanying plate is placed in the left half groove for current withdrawal, the rectifier is used to set the electroplating current of the right half groove as the electroplating current required by the electroplating of the rear circuit board, and the second plating accompanying plate on the rear floating frame is placed in the right half groove for electroplating, so that the electroplating current of the right half groove is gradually increased until the electroplating current value required by the electroplating of the rear circuit board is stabilized; after the current of the left half groove is withdrawn, the electroplating current of the left half groove is set to be the electroplating current needed by the electroplating of the rear circuit board through the rectifier.
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| CN202010165335.4A CN111254483A (en) | 2020-03-11 | 2020-03-11 | Method for improving VCP electroplating line material number switching efficiency |
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| CN202010165335.4A CN111254483A (en) | 2020-03-11 | 2020-03-11 | Method for improving VCP electroplating line material number switching efficiency |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112899759A (en) * | 2021-01-20 | 2021-06-04 | 珠海松柏科技有限公司 | Electroplating production line and switching process of multiple plate types |
| CN113862763A (en) * | 2021-10-22 | 2021-12-31 | 奥士康精密电路（惠州）有限公司 | Method for reducing electroplating process cost |
| CN114540875A (en) * | 2022-01-28 | 2022-05-27 | 华南理工大学 | InGaN/organic heterostructure-based photoelectrode material and preparation method and application thereof |
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| CN112899759A (en) * | 2021-01-20 | 2021-06-04 | 珠海松柏科技有限公司 | Electroplating production line and switching process of multiple plate types |
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| CN114540875A (en) * | 2022-01-28 | 2022-05-27 | 华南理工大学 | InGaN/organic heterostructure-based photoelectrode material and preparation method and application thereof |
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Application publication date: 20200609 |