CN111250814A - Heat dissipation base plate embossing package device - Google Patents
Heat dissipation base plate embossing package device Download PDFInfo
- Publication number
- CN111250814A CN111250814A CN202010207445.2A CN202010207445A CN111250814A CN 111250814 A CN111250814 A CN 111250814A CN 202010207445 A CN202010207445 A CN 202010207445A CN 111250814 A CN111250814 A CN 111250814A
- Authority
- CN
- China
- Prior art keywords
- die structure
- upper die
- lower die
- heat dissipation
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 25
- 238000004049 embossing Methods 0.000 title claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 239000000919 ceramic Substances 0.000 claims abstract description 20
- 238000004080 punching Methods 0.000 claims abstract description 19
- 230000000149 penetrating effect Effects 0.000 claims abstract description 3
- 238000003466 welding Methods 0.000 abstract description 18
- 238000000034 method Methods 0.000 abstract description 8
- 238000004806 packaging method and process Methods 0.000 abstract description 5
- 230000004907 flux Effects 0.000 abstract description 4
- 230000007547 defect Effects 0.000 abstract description 3
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 8
- 229910002092 carbon dioxide Inorganic materials 0.000 description 4
- 239000001569 carbon dioxide Substances 0.000 description 4
- 239000007789 gas Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D37/00—Tools as parts of machines covered by this subclass
- B21D37/10—Die sets; Pillar guides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D—WORKING OR PROCESSING OF SHEET METAL OR METAL TUBES, RODS OR PROFILES WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21D53/00—Making other particular articles
- B21D53/02—Making other particular articles heat exchangers or parts thereof, e.g. radiators, condensers fins, headers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
- H01L21/4807—Ceramic parts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A heat dissipation substrate embossing package device comprises an upper die structure and a lower die structure matched with the upper die structure, wherein the top of the upper die structure is provided with a connecting handle used for being connected with mechanical equipment, the bottom of the upper die structure is provided with a plurality of punching needles used for punching convex hulls on a heat dissipation substrate or a copper-clad ceramic substrate, the top of the lower die structure is provided with a fixing column used for clamping the heat dissipation substrate or the copper-clad ceramic substrate, one side of the lower die structure close to a long edge is provided with a guide pillar, the upper die structure is provided with a guide sleeve in a penetrating mode, the guide pillar corresponds to the position of the guide pillar of the lower die structure, and the upper die structure is connected with the guide pillar; the packaging method has the characteristics that the defects of high voidage of a welding layer, poor heat conductivity and the like existing in the packaging method of the power module in the traditional technology can be effectively improved, and the uniformity of welding flux around a welded radiating substrate or a copper-clad ceramic substrate and the reliability of the power module are improved.
Description
Technical Field
The invention belongs to the technical field of design and packaging of semiconductor power modules, and particularly relates to a heat dissipation substrate embossing package device.
Background
In the traditional welding process, the copper-clad ceramic substrate and the heat dissipation substrate are connected together by using silver paste or tin paste, however, the silver paste or the silver paste contains more organic components, in the welding process, the organic components react with oxygen at higher temperature to generate a large amount of carbon dioxide gas, one part of the carbon dioxide gas escapes, when the carbon dioxide gas escapes, a cavity is generated between the copper-clad ceramic substrate and the heat dissipation substrate, and the other part of the carbon dioxide gas does not escape and is remained between the copper-clad ceramic substrate and the heat dissipation substrate, so that a large number of cavities exist between the copper-clad ceramic substrate and the heat dissipation substrate, and the functions of heat conduction, electric conduction and the like of the copper-clad ceramic substrate and the heat dissipation substrate.
The copper-clad ceramic substrate and the heat dissipation substrate are made of materials with different thermal expansion coefficients, in the process of cooling after high-temperature welding, due to the fact that the thermal expansion coefficients are different, the heat dissipation substrate is stressed and can be subjected to bending deformation, so that the heat dissipation substrate of the power module is in good contact with a radiator when in use, a good heat dissipation effect is achieved, before welding, the heat dissipation substrate is enabled to have pre-deformation opposite to the bending deformation during welding cooling, and due to the fact that the heat dissipation substrate has certain bending deformation, the welding flux layer around the copper-clad ceramic substrate is thin or a hole is formed easily in the welding and cooling processes.
Disclosure of Invention
The invention aims to solve the technical problem of providing a convex hull pressing device which has a simple structure, can effectively overcome the defects of high voidage of a welding layer, poor heat conductivity and the like of a packaging method of a power module in the prior art, and improves the uniformity of welding flux around a welded radiating substrate or a copper-clad ceramic substrate and the reliability of the power module.
The invention aims to provide a heat dissipation substrate embossing package device which comprises an upper die structure and a lower die structure matched with the upper die structure, wherein a connecting handle used for being connected with mechanical equipment is arranged at the top of the upper die structure, a plurality of punching needles used for punching convex hulls on a heat dissipation substrate or a copper-coated ceramic substrate are arranged at the bottom of the upper die structure, a fixing column used for clamping the heat dissipation substrate or the copper-coated ceramic substrate is arranged at the top of the lower die structure, a guide pillar is arranged on one side of the lower die structure close to a long side, a guide sleeve corresponding to the guide pillar of the lower die structure is arranged on the upper die structure in a penetrating mode, and the upper die structure is connected with the guide pillar of the lower die structure through the guide sleeve and can move up and.
Furthermore, the upper die structure comprises a top plate and a punching needle fixing plate arranged at the bottom of the top plate, the punching needle is arranged in the punching needle fixing plate and is of a T-shaped structure, a taper angle is arranged at the bottom of the punching needle, and the connecting handle, the top plate and the punching needle fixing plate are fixedly connected through a threaded hole and a connecting piece arranged in the threaded hole.
Furthermore, a mounting counter bore is arranged in the lower die structure, an internal thread is arranged at the bottom of the guide pillar, and the guide pillar is inserted into the mounting counter bore of the lower die structure and is fixedly connected with the lower die structure through a bolt.
Furthermore, the fixing column is fixedly connected with the lower die structure through a bolt.
The invention has the beneficial technical effects that: the invention has simple structure, the upper die structure and the lower die structure are respectively fixed on mechanical equipment, and the convex hull with certain height and certain shape can be extruded on the radiating substrate through the designed device and the tool fixture by the punching pin of the upper die structure, thereby overcoming the defects of high void ratio and poor heat conductivity of a welding layer in the packaging method of the power module in the prior art, and improving the uniformity of welding flux around the copper-clad ceramic substrate and the reliability of the power module after welding.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the structure of FIG. 1 in the direction A;
FIG. 3 is a schematic cross-sectional view B-B of FIG. 2;
FIG. 4 is a schematic cross-sectional view of the upper die structure according to the present invention;
FIG. 5 is a schematic structural view of the lower mold structure according to the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood by those skilled in the art, the present invention is further described with reference to the accompanying drawings and examples.
As shown in fig. 1-5, the heat-dissipating substrate embossing package device of the present invention includes an upper mold structure 1 and a lower mold structure 2 matched with the upper mold structure 1, wherein a connecting handle 3 for connecting with a mechanical device is disposed at the top of the upper mold structure 1, a plurality of punching pins 4 for punching a convex hull on a heat-dissipating substrate or a copper-clad ceramic substrate are disposed at the bottom of the upper mold structure 1, a fixing column 5 for clamping the heat-dissipating substrate or the copper-clad ceramic substrate is disposed at the top of the lower mold structure 2, a guide pillar 6 is disposed at one side of the lower mold structure 2 close to the long side, a guide sleeve 7 corresponding to the guide pillar 6 of the lower mold structure 2 is disposed on the upper mold structure 1, and the upper mold structure 1 is connected with the guide pillar 6 of the lower mold structure 2 through the guide sleeve 7.
Referring to fig. 1, the upper die structure 1 includes a top plate 8 and a punch needle fixing plate 9 disposed at the bottom of the top plate 8, the punch needle 4 is disposed in the punch needle fixing plate 9, the punch needle 4 is of a T-shaped structure, a taper angle is disposed at the bottom of the punch needle 4, and the connecting handle 3, the top plate 8 and the punch needle fixing plate 9 are fixedly connected through a threaded hole and a connecting piece disposed in the threaded hole.
Referring to fig. 1, a mounting counter bore 10 is formed in the lower die structure 2, an internal thread is formed at the bottom of the guide pillar 6, the guide pillar 6 is inserted into the mounting counter bore 10 of the lower die structure 2 and is fixedly connected with the lower die structure 2 through a bolt, and the fixing column 5 is fixedly connected with the lower die structure 2 through a bolt.
The radiating substrate base plate is provided with an appearance surface and a welding surface, the appearance surface and the welding surface are both provided with coatings, the welding surface of the radiating substrate is placed on the lower die structure in an upward mode, the lower die structure is matched with the mounting hole of the radiating substrate through a fixing column, the matching mode belongs to clearance matching, and in order to prevent the lower die of the fixing clamp from being incapable of matching with the radiating substrate due to processing errors; the punch pin head of the upper die structure is processed into a certain shape and taper, the shape and height of a convex hull required by design can be guaranteed to be punched, the punch pin fixing plate in the upper die structure can be designed into a hole site according to the size and the shape of the heat dissipation substrate, the size of the copper-clad ceramic substrate and the welding position of the copper-clad ceramic substrate on the heat dissipation substrate, and the size of a top plate matched with the top plate, the position of a locking screw and the connecting structure of the upper die and machine equipment can be designed according to the size and the size of the punch pin fixing plate.
The specific embodiments described herein are merely illustrative of the principles and utilities of the present invention and are not intended to limit the invention. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.
Claims (4)
1. The utility model provides a heat dissipation base plate embossing package device which characterized in that: the die structure comprises an upper die structure and a lower die structure matched with the upper die structure, wherein the top of the upper die structure is provided with a connecting handle used for being connected with mechanical equipment, the bottom of the upper die structure is provided with a plurality of punching needles used for punching convex hulls on a heat dissipation substrate or a copper-clad ceramic substrate, the top of the lower die structure is provided with a fixing column used for clamping the heat dissipation substrate or the copper-clad ceramic substrate, one side of the lower die structure, which is close to a long edge, is provided with a guide pillar, the upper die structure is provided with a guide sleeve corresponding to the position of the guide pillar of the lower die structure in a penetrating mode, and the upper die structure is.
2. The heat dissipating substrate embossing package device as claimed in claim 1, wherein: the upper die structure comprises a top plate and a punching needle fixing plate arranged at the bottom of the top plate, the punching needle is arranged in the punching needle fixing plate and is of a T-shaped structure, a taper angle is arranged at the bottom of the punching needle, and the connecting handle, the top plate and the punching needle fixing plate are fixedly connected through a threaded hole and a connecting piece arranged in the threaded hole.
3. The heat dissipating substrate embossing package device according to claim 1 or 2, wherein: the lower die structure is internally provided with a mounting counter bore, the bottom of the guide pillar is provided with an internal thread, and the guide pillar is inserted in the mounting counter bore of the lower die structure and is fixedly connected with the lower die structure through a bolt.
4. The apparatus of claim 3, wherein: the fixing column is fixedly connected with the lower die structure through a bolt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010207445.2A CN111250814A (en) | 2020-03-23 | 2020-03-23 | Heat dissipation base plate embossing package device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010207445.2A CN111250814A (en) | 2020-03-23 | 2020-03-23 | Heat dissipation base plate embossing package device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111250814A true CN111250814A (en) | 2020-06-09 |
Family
ID=70947944
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010207445.2A Pending CN111250814A (en) | 2020-03-23 | 2020-03-23 | Heat dissipation base plate embossing package device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111250814A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB604809A (en) * | 1945-12-04 | 1948-07-09 | Raymond Humphreys Major | Improvements in die sets |
| CN1572388A (en) * | 2003-06-23 | 2005-02-02 | 日高精机株式会社 | Method for manufacturing cooling fin of heat exchanger and its die apparatus |
| JP2006205209A (en) * | 2005-01-28 | 2006-08-10 | Aisin Seiki Co Ltd | Press mold |
| CN202963203U (en) * | 2012-11-06 | 2013-06-05 | 福州锐新金属有限公司 | Punching convex hull mould for steel backing of brake block |
| CN204974976U (en) * | 2015-07-17 | 2016-01-20 | 重庆市益源捷科技有限公司 | Convex hull forming die |
| CN106493233A (en) * | 2016-12-20 | 2017-03-15 | 贵州贵航汽车零部件股份有限公司 | A kind of vehicle intercooler pipe grid shaping mould |
| CN207735432U (en) * | 2017-11-29 | 2018-08-17 | 东莞领益精密制造科技有限公司 | Mesh convex closure molding machines |
| CN208787342U (en) * | 2018-08-09 | 2019-04-26 | 江西保太有色金属集团有限公司 | A kind of copper bar processing mold |
| CN110605808A (en) * | 2018-06-14 | 2019-12-24 | 湖北匡通电子股份有限公司 | Demoulding device for back plate of optical coupling electronic module plastic shell |
| CN212217381U (en) * | 2020-03-23 | 2020-12-25 | 嘉兴斯达半导体股份有限公司 | Convex hull pressing device for radiating substrate |
-
2020
- 2020-03-23 CN CN202010207445.2A patent/CN111250814A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB604809A (en) * | 1945-12-04 | 1948-07-09 | Raymond Humphreys Major | Improvements in die sets |
| CN1572388A (en) * | 2003-06-23 | 2005-02-02 | 日高精机株式会社 | Method for manufacturing cooling fin of heat exchanger and its die apparatus |
| JP2006205209A (en) * | 2005-01-28 | 2006-08-10 | Aisin Seiki Co Ltd | Press mold |
| CN202963203U (en) * | 2012-11-06 | 2013-06-05 | 福州锐新金属有限公司 | Punching convex hull mould for steel backing of brake block |
| CN204974976U (en) * | 2015-07-17 | 2016-01-20 | 重庆市益源捷科技有限公司 | Convex hull forming die |
| CN106493233A (en) * | 2016-12-20 | 2017-03-15 | 贵州贵航汽车零部件股份有限公司 | A kind of vehicle intercooler pipe grid shaping mould |
| CN207735432U (en) * | 2017-11-29 | 2018-08-17 | 东莞领益精密制造科技有限公司 | Mesh convex closure molding machines |
| CN110605808A (en) * | 2018-06-14 | 2019-12-24 | 湖北匡通电子股份有限公司 | Demoulding device for back plate of optical coupling electronic module plastic shell |
| CN208787342U (en) * | 2018-08-09 | 2019-04-26 | 江西保太有色金属集团有限公司 | A kind of copper bar processing mold |
| CN212217381U (en) * | 2020-03-23 | 2020-12-25 | 嘉兴斯达半导体股份有限公司 | Convex hull pressing device for radiating substrate |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200609 |
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| RJ01 | Rejection of invention patent application after publication |