CN111243874A - Soft multi-core-group ceramic capacitor and production method thereof - Google Patents
Soft multi-core-group ceramic capacitor and production method thereof Download PDFInfo
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- CN111243874A CN111243874A CN202010165728.5A CN202010165728A CN111243874A CN 111243874 A CN111243874 A CN 111243874A CN 202010165728 A CN202010165728 A CN 202010165728A CN 111243874 A CN111243874 A CN 111243874A
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- ceramic capacitor
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- 239000003985 ceramic capacitor Substances 0.000 title claims abstract description 46
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 claims abstract description 68
- 239000010410 layer Substances 0.000 claims abstract description 31
- 239000003292 glue Substances 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 claims abstract description 25
- 239000012790 adhesive layer Substances 0.000 claims abstract description 17
- 239000011241 protective layer Substances 0.000 claims abstract description 16
- 239000003990 capacitor Substances 0.000 claims abstract description 11
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- 238000010146 3D printing Methods 0.000 claims abstract description 5
- 238000005516 engineering process Methods 0.000 claims abstract description 5
- 238000007639 printing Methods 0.000 claims abstract description 4
- 239000007787 solid Substances 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 11
- 230000001070 adhesive effect Effects 0.000 claims description 11
- 238000001723 curing Methods 0.000 claims description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 4
- 239000000741 silica gel Substances 0.000 claims description 4
- 229910002027 silica gel Inorganic materials 0.000 claims description 4
- 230000001681 protective effect Effects 0.000 claims description 3
- 238000003848 UV Light-Curing Methods 0.000 claims description 2
- 239000012943 hotmelt Substances 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 229920002635 polyurethane Polymers 0.000 claims description 2
- 239000004814 polyurethane Substances 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 8
- 230000035939 shock Effects 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract description 2
- 238000012827 research and development Methods 0.000 abstract description 2
- 238000004904 shortening Methods 0.000 abstract description 2
- 238000005538 encapsulation Methods 0.000 description 5
- 230000007797 corrosion Effects 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 238000007723 die pressing method Methods 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013464 silicone adhesive Substances 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/003—Apparatus or processes for encapsulating capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G13/00—Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
- H01G13/006—Apparatus or processes for applying terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/018—Dielectrics
- H01G4/06—Solid dielectrics
- H01G4/08—Inorganic dielectrics
- H01G4/12—Ceramic dielectrics
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/224—Housing; Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/38—Multiple capacitors, i.e. structural combinations of fixed capacitors
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
The invention provides a production method of a soft multi-core group ceramic capacitor, which comprises the following steps: A. welding a plurality of ceramic capacitor chips on the frame; B. designing a packaging mold according to the welded frame and the structure of the ceramic capacitor chip, and printing the packaging mold by a 3D printing technology; C. coating an insulating layer on the surface of the welded capacitor chip; D. c, placing the frame and the ceramic capacitor chip processed in the step C into a packaging mold, and introducing packaging glue for curing to form a packaging glue layer, wherein the packaging glue layer is in a semi-solid state; E. and after demolding, coating a protective layer on the surface of the packaging adhesive layer. The invention also provides a soft multi-core group ceramic capacitor. The invention can design the welding frames and the number of chips according to the requirements of customers, and then designs the appearance of the product in a reverse direction, thereby enriching the appearance of the product, greatly shortening the research and development period, being capable of realizing rapid mass production and having extremely strong shock resistance and environmental adaptability.
Description
Technical Field
The invention relates to a soft multi-core group ceramic capacitor and a production method thereof.
Background
The traditional soft multi-core group ceramic capacitor is generally subjected to die pressing packaging through a packaging die, and the development period of the die pressing packaging die is long (generally 6-12 months), and the cost is high, so that when a chip is designed, a welding frame in the capacitor, the number of ceramic capacitor chips and the arrangement of the chips on the welding frame can be designed only according to the external dimension specification of the existing die pressing packaging die, and thus the defects of single external structure of a product and long design and development period are caused.
Disclosure of Invention
The invention aims to provide a soft multi-core group ceramic capacitor and a production method thereof aiming at the defects of the prior art, which can design welding frames and the number of chips according to the requirements of customers, and then design the appearance of the product in a reverse direction, thereby enriching the appearance of the product, greatly shortening the research and development period, realizing rapid mass production and having strong shock resistance and environmental adaptability.
The invention is realized by the following technical scheme:
a production method of a soft multi-core group ceramic capacitor comprises the following steps:
A. welding a plurality of ceramic capacitor chips on the frame;
B. designing a packaging mold according to the welded frame and the structure of the ceramic capacitor chip, and printing the packaging mold by a 3D printing technology;
C. coating an insulating layer on the surface of the welded capacitor chip;
D. c, placing the frame and the ceramic capacitor chip processed in the step C into a packaging mold, and introducing packaging glue for curing to form a packaging glue layer, wherein the packaging glue layer is in a semi-solid state;
E. and after demolding, coating a protective layer on the surface of the packaging adhesive layer.
Further, the packaging adhesive comprises silica gel, polyurethane packaging adhesive, UV light curing packaging adhesive or EVA hot melt packaging adhesive.
Furthermore, the frame comprises two pins which are oppositely arranged at intervals, two chip bonding pads which are respectively arranged at the upper ends of the two pins and are oppositely and horizontally arranged, two pin bonding pads which are respectively arranged at the lower ends of the two pins and are oppositely and horizontally arranged, and stress holes which are respectively arranged on the two pins, and the pins penetrate out of the packaging die during packaging.
Further, the chip bonding pad includes the diaphragm that sets up on the pin and the welding part of setting at the diaphragm tip, and the welding part width is greater than the diaphragm width.
Further, the protective layer is made of protective glue.
Further, the insulating layer is made of insulating glue.
The invention is also realized by the following technical scheme:
the utility model provides a software multicore group ceramic capacitor, includes the frame, welds a plurality of ceramic capacitor chips on the frame, coats the insulating layer on capacitor chip surface, sets up the encapsulation glue film on the insulating layer surface and coats the protective layer on encapsulation glue film surface, and the encapsulation glue film is semi-solid state of congealing.
Furthermore, the frame comprises two pins which are oppositely arranged at intervals, two chip bonding pads which are respectively arranged at the upper ends of the two pins and are oppositely and horizontally arranged, two pin bonding pads which are respectively arranged at the lower ends of the two pins and are oppositely and horizontally arranged, and stress holes which are respectively arranged on the two pins, wherein the pins sequentially penetrate out of the insulating layer, the packaging adhesive layer and the protective layer.
Further, the chip welding dish is including setting up the diaphragm on the pin and setting up the welding part at the diaphragm tip, and the welding part width is greater than the diaphragm width.
Further, the packaging adhesive comprises silica gel.
The invention has the following beneficial effects:
1. the invention can firstly design the frame and the number of the ceramic capacitor chips according to the requirements of customers, and weld the ceramic capacitor chips on the frame in a patch manner, thus obtaining the internal structure of the capacitor, designers can design the product appearance by using graphic design software according to the external structure, namely, design a corresponding packaging mold, print the designed packaging mold by 3D printing technology, coat an insulating layer on the surface of the welded capacitor chip, the insulating layer has the functions of insulation, moisture protection, corrosion protection and buffering, then put the frame and the ceramic capacitor chips into the packaging mold, introduce packaging glue for curing to form a packaging glue layer, the packaging glue layer is in a semi-solidified state after curing, has the functions of high temperature resistance, self-healing, moisture protection, corrosion protection, shock resistance and temperature impact resistance, and can select the corresponding packaging glue to package the product according to different use occasions of the product, after the product is demoulded, a protective layer is coated on the surface of a packaging adhesive layer, and the protective layer has the functions of insulation, moisture resistance, corrosion resistance and buffering and plays a role of protecting the packaging adhesive layer.
2. The frame is provided with a chip bonding pad for welding a ceramic capacitor chip, a pin bonding pad for welding with a PCB (printed circuit board) and a stress hole for reducing stress impact of the capacitor in the using process of a product, the upper side and the lower side of the chip bonding pad can be welded, and the using reliability of the frame is further improved.
Drawings
The present invention will be described in further detail with reference to the accompanying drawings.
FIG. 1 is a schematic structural diagram of a soft multi-core ceramic capacitor according to the present invention (with a half of the insulation layer, the encapsulation adhesive layer and the protection layer removed).
Fig. 2 is an exploded view of fig. 1.
11, pins; 12. a transverse plate; 13. welding the part; 14. a pin pad; 15. a stress hole; 2. a ceramic capacitor chip; 3. an insulating layer; 4. packaging the adhesive layer; 5. and a protective layer.
Detailed Description
As shown in fig. 1 and fig. 2, the soft multi-core group ceramic capacitor comprises a frame, four ceramic capacitor chips 2 welded on the frame, an insulating layer 3 coated on the surface of the capacitor chips, a packaging adhesive layer 4 arranged on the surface of the insulating layer 3, and a protective layer 5 coated on the surface of the packaging adhesive layer 4, wherein the frame is provided with two pins 11 arranged at intervals, the pins 11 penetrate out of the insulating layer 3, the packaging adhesive layer 4 and the protective layer 5 in sequence, the packaging adhesive layer 4 is in a semi-solidified state, and the upper side and the lower side of the frame are respectively welded with the two ceramic capacitor chips 2.
The frame further includes two chip pads disposed at the upper ends of the two leads 11 and disposed horizontally opposite to each other, two lead pads 14 disposed at the lower ends of the two leads 11 and disposed horizontally opposite to each other, and stress holes 15 disposed on the two leads 11. The chip welding disc comprises a transverse plate 12 arranged at the upper end of the pin 11 and a welding part 13 arranged at the end part of the transverse plate 12, the width of the welding part 13 is larger than that of the transverse plate 12, and the width of the transverse plate 12 is the same as that of the pin 11, so that the stress of the pin 11 can be enhanced, and the welding of a ceramic capacitor patch can be more convenient.
In this embodiment, the encapsulation adhesive is a silicone adhesive. The protective layer 5 is made of protective glue. The insulating layer 3 is made of insulating glue.
The production method of the soft multi-core group ceramic capacitor comprises the following steps:
A. welding a plurality of ceramic capacitor chips 2 on the frame;
B. designing a packaging mold according to the welded frame and the structure of the ceramic capacitor chip 2, and printing the packaging mold by a 3D printing technology; the designed packaging die is required to meet the requirement that two pins 11 of the frame can penetrate out of the packaging die during packaging;
C. coating an insulating layer 3 on the surface of the welded capacitor chip;
D. placing the frame and the ceramic capacitor chip 2 processed in the step C into a packaging mold, and introducing packaging glue for curing to form a packaging glue layer 4, wherein the packaging glue layer 4 is in a semi-solidified state;
E. and after demolding, coating a protective layer 5 on the surface of the packaging adhesive layer 4.
The above description is only a preferred embodiment of the present invention, and therefore should not be taken as limiting the scope of the invention, which is defined by the appended claims and their equivalents and modifications within the scope of the description.
Claims (10)
1. A production method of a soft multi-core group ceramic capacitor is characterized by comprising the following steps: the method comprises the following steps:
A. welding a plurality of ceramic capacitor chips on the frame;
B. designing a packaging mold according to the welded frame and the structure of the ceramic capacitor chip, and printing the packaging mold by a 3D printing technology;
C. coating an insulating layer on the surface of the welded capacitor chip;
D. c, placing the frame and the ceramic capacitor chip processed in the step C into a packaging mold, and introducing packaging glue for curing to form a packaging glue layer, wherein the packaging glue layer is in a semi-solid state;
E. and after demolding, coating a protective layer on the surface of the packaging adhesive layer.
2. The method for producing a soft multi-core group ceramic capacitor as claimed in claim 1, wherein: the packaging adhesive comprises silica gel, polyurethane packaging adhesive, UV light curing packaging adhesive or EVA hot melt packaging adhesive.
3. The method for producing a soft multi-core group ceramic capacitor as claimed in claim 1, wherein: the frame comprises two pins which are oppositely arranged at intervals, two chip bonding pads which are respectively arranged at the upper ends of the two pins and are oppositely and horizontally arranged, two pin bonding pads which are respectively arranged at the lower ends of the two pins and are oppositely and horizontally arranged, and stress holes which are respectively arranged on the two pins, wherein the pins penetrate out of the packaging die during packaging.
4. The method for producing a soft multi-core group ceramic capacitor as claimed in claim 3, wherein: the chip bonding pad comprises a transverse plate arranged at the upper end of the pin and a welding part arranged at the end part of the transverse plate, and the width of the welding part is larger than that of the transverse plate.
5. The method for producing a soft multi-core ceramic capacitor as claimed in any one of claims 1 to 4, wherein: the protective layer is made of protective glue.
6. The method for producing a soft multi-core ceramic capacitor as claimed in any one of claims 1 to 4, wherein: the insulating layer is made of insulating glue.
7. A soft multi-core group ceramic capacitor is characterized in that: the ceramic capacitor comprises a frame, a plurality of ceramic capacitor chips welded on the frame, an insulating layer coated on the surface of each capacitor chip, a packaging adhesive layer arranged on the surface of the insulating layer and a protective layer coated on the surface of the packaging adhesive layer, wherein the packaging adhesive layer is in a semi-solidified state.
8. The soft multi-core ceramic capacitor as claimed in claim 7, wherein: the frame comprises two pins which are oppositely arranged at intervals, two chip bonding pads which are respectively arranged at the upper ends of the two pins and are oppositely and horizontally arranged, two pin bonding pads which are respectively arranged at the lower ends of the two pins and are oppositely and horizontally arranged, and stress holes which are respectively arranged on the two pins, wherein the pins sequentially penetrate out of the insulating layer, the packaging adhesive layer and the protective layer.
9. The soft multi-core ceramic capacitor as claimed in claim 8, wherein: the chip welding dish is including setting up the diaphragm on the pin and setting up the welding part at the diaphragm tip, and the welding part width is greater than the diaphragm width.
10. The soft multi-core ceramic capacitor as claimed in claim 7, 8 or 9, wherein: the packaging adhesive comprises silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010165728.5A CN111243874A (en) | 2020-03-11 | 2020-03-11 | Soft multi-core-group ceramic capacitor and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010165728.5A CN111243874A (en) | 2020-03-11 | 2020-03-11 | Soft multi-core-group ceramic capacitor and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111243874A true CN111243874A (en) | 2020-06-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010165728.5A Pending CN111243874A (en) | 2020-03-11 | 2020-03-11 | Soft multi-core-group ceramic capacitor and production method thereof |
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| CN (1) | CN111243874A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114724854A (en) * | 2022-05-17 | 2022-07-08 | 福建火炬电子科技股份有限公司 | Support Y-shaped capacitor and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102165544A (en) * | 2008-10-01 | 2011-08-24 | 太阳诱电株式会社 | Electrochemical device |
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN105428062A (en) * | 2015-12-31 | 2016-03-23 | 株洲宏达陶电科技有限公司 | Multi-core assembly ceramic capacitor with low ESR value and manufacturing method thereof |
| CN205692697U (en) * | 2016-06-08 | 2016-11-16 | 福建火炬电子科技股份有限公司 | A kind of mold pressing Surface Mount pulse power capacitor device |
| CN110648843A (en) * | 2018-06-27 | 2020-01-03 | 株式会社村田制作所 | Laminated ceramic electronic component |
| CN211555697U (en) * | 2020-03-11 | 2020-09-22 | 福建火炬电子科技股份有限公司 | Soft multi-core group ceramic capacitor |
-
2020
- 2020-03-11 CN CN202010165728.5A patent/CN111243874A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102165544A (en) * | 2008-10-01 | 2011-08-24 | 太阳诱电株式会社 | Electrochemical device |
| CN104701009A (en) * | 2015-02-10 | 2015-06-10 | 鞍山奇发电子陶瓷科技有限公司 | Small-sized chip type surface mounting (SMD) high-voltage and safety standard recognized ceramic capacitor |
| CN105428062A (en) * | 2015-12-31 | 2016-03-23 | 株洲宏达陶电科技有限公司 | Multi-core assembly ceramic capacitor with low ESR value and manufacturing method thereof |
| CN205692697U (en) * | 2016-06-08 | 2016-11-16 | 福建火炬电子科技股份有限公司 | A kind of mold pressing Surface Mount pulse power capacitor device |
| CN110648843A (en) * | 2018-06-27 | 2020-01-03 | 株式会社村田制作所 | Laminated ceramic electronic component |
| CN211555697U (en) * | 2020-03-11 | 2020-09-22 | 福建火炬电子科技股份有限公司 | Soft multi-core group ceramic capacitor |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114724854A (en) * | 2022-05-17 | 2022-07-08 | 福建火炬电子科技股份有限公司 | Support Y-shaped capacitor and preparation method thereof |
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