CN111243794A - Flat cable production method - Google Patents
Flat cable production method Download PDFInfo
- Publication number
- CN111243794A CN111243794A CN201811440275.1A CN201811440275A CN111243794A CN 111243794 A CN111243794 A CN 111243794A CN 201811440275 A CN201811440275 A CN 201811440275A CN 111243794 A CN111243794 A CN 111243794A
- Authority
- CN
- China
- Prior art keywords
- flat cable
- production method
- cable production
- sinle silk
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0003—Apparatus or processes specially adapted for manufacturing conductors or cables for feeding conductors or cables
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0016—Apparatus or processes specially adapted for manufacturing conductors or cables for heat treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/22—Sheathing; Armouring; Screening; Applying other protective layers
- H01B13/222—Sheathing; Armouring; Screening; Applying other protective layers by electro-plating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a flat cable production method, which comprises the following steps: the wire core is extruded and arranged side by side through the wire arranging device, then palladium-nickel electroplating treatment is carried out on the arranged wire cores, after the electroplating is finished, the arranged wire cores are heated through the heating device to be softened, then the arranged wire cores are subjected to gluing and curing treatment, and finally glue removing and cooling treatment are carried out.
Description
Technical Field
The invention belongs to the technical field of wires and cables, and particularly relates to a flat cable production method.
Background
The flat cable is a novel data cable formed by pressing PET or other insulating materials and an extremely thin tinned flat copper wire through a high-tech automatic equipment production line, and has the advantages of softness, random bending and folding, thin thickness, small volume, simple connection, convenient disassembly, easy solution to electromagnetic shielding (EMI) and the like.
Disclosure of Invention
In order to solve the problems, the invention discloses a flat cable production method, wherein a palladium-nickel electroplated layer can increase signal transmission, improve the wear resistance, well protect the flat cable, and improve the service life and the effect of the flat cable.
In order to achieve the purpose, the technical scheme of the invention is as follows:
a flat cable production method comprises the following steps: extrude the sinle silk earlier and make the sinle silk arrange side by side together through winding displacement device, then carry out palladium nickel electroplating process to the sinle silk that is good side by side, make side by side sinle silk heat through heating device and make it soft after the electroplating finishes, carry out rubber coating solidification treatment to side by side sinle silk again, remove the cooling process of gluing at last.
Preferably, the number of the wire cores is 10-20.
Preferably, the electroplating temperature is 20-45 ℃.
Preferably, the heating temperature is 50 to 80 ℃.
Preferably, the cooling treatment adopts room temperature natural cooling or air cooler cooling.
The invention has the beneficial effects that:
the palladium-nickel electroplated layer can increase signal transmission, improve the wear resistance, well protect the flat cable, and improve the service life and the effect of the flat cable. The electroplating temperature is 20-45 ℃, because the brightness of the plating layer is reduced when the temperature is too low, the current is not large, ammonia water is easy to volatilize when the temperature exceeds 45 ℃, the component change of the plating solution is large, and the temperature is set at 20-45 ℃.
Detailed Description
The present invention will be further illustrated below with reference to specific embodiments, which are to be understood as merely illustrative and not limitative of the scope of the present invention.
A flat cable production method comprises the following steps: the method comprises the steps of extruding wire cores out of a wire arranging device to enable the wire cores to be arranged side by side, then carrying out palladium-nickel electroplating treatment on the arranged wire cores, wherein the electroplating temperature is 20-45 ℃, heating the arranged wire cores through a heating device after electroplating is finished to enable the arranged wire cores to be soft, then carrying out gluing and curing treatment on the arranged wire cores, and finally carrying out glue removing and cooling treatment, wherein the number of the wire cores is 10-20, plating metal adopted by electroplating is palladium-nickel, the heating temperature is 50-80 ℃, and the cooling treatment adopts room-temperature natural cooling or air cooler cooling.
The palladium-nickel electroplated layer can increase signal transmission, improve the wear resistance, well protect the flat cable, and improve the service life and the effect of the flat cable.
The technical means disclosed in the invention scheme are not limited to the technical means disclosed in the above embodiments, but also include the technical scheme formed by any combination of the above technical features.
Claims (5)
1. A flat cable production method is characterized by comprising the following steps: extrude the sinle silk earlier and make the sinle silk arrange side by side together through winding displacement device, then carry out electroplating treatment to the sinle silk that is good side by side, make side by side sinle silk heat through heating device and make it soften after the electroplating finishes, carry out rubber coating solidification treatment to side by side sinle silk again, remove at last and glue cooling treatment.
2. The flat cable production method according to claim 1, wherein the number of the cores is 10 to 20.
3. The flat cable production method of claim 1, wherein the plating temperature is 20 ℃ to 45 ℃.
4. The flat cable production method of claim 1, wherein the heating temperature is 50-80 ℃.
5. The flat cable production method according to claim 1, wherein the cooling treatment is performed by room temperature natural cooling or air cooler cooling.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811440275.1A CN111243794A (en) | 2018-11-29 | 2018-11-29 | Flat cable production method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811440275.1A CN111243794A (en) | 2018-11-29 | 2018-11-29 | Flat cable production method |
Publications (1)
Publication Number | Publication Date |
---|---|
CN111243794A true CN111243794A (en) | 2020-06-05 |
Family
ID=70865530
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201811440275.1A Pending CN111243794A (en) | 2018-11-29 | 2018-11-29 | Flat cable production method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN111243794A (en) |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001043743A (en) * | 1999-07-29 | 2001-02-16 | Totoku Electric Co Ltd | Flat cable |
CN101436445A (en) * | 2007-11-15 | 2009-05-20 | 住友电气工业株式会社 | Shield flat cable and manufacturing method thereof |
CN101546619A (en) * | 2008-03-24 | 2009-09-30 | 株式会社藤仓 | Plated flat conductor and flexible flat cable therewith |
CN202650619U (en) * | 2012-06-08 | 2013-01-02 | 苏州新亚电通有限公司 | A reflexed PIN grounding flexible flat cable |
CN103021560A (en) * | 2012-09-29 | 2013-04-03 | 深圳市沃尔核材股份有限公司 | Production method of thermosetting flat cables |
CN206388887U (en) * | 2017-01-13 | 2017-08-08 | 东莞市泰明同金属制品有限公司 | Novel Titanium copper strips |
-
2018
- 2018-11-29 CN CN201811440275.1A patent/CN111243794A/en active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001043743A (en) * | 1999-07-29 | 2001-02-16 | Totoku Electric Co Ltd | Flat cable |
CN101436445A (en) * | 2007-11-15 | 2009-05-20 | 住友电气工业株式会社 | Shield flat cable and manufacturing method thereof |
CN101546619A (en) * | 2008-03-24 | 2009-09-30 | 株式会社藤仓 | Plated flat conductor and flexible flat cable therewith |
CN202650619U (en) * | 2012-06-08 | 2013-01-02 | 苏州新亚电通有限公司 | A reflexed PIN grounding flexible flat cable |
CN103021560A (en) * | 2012-09-29 | 2013-04-03 | 深圳市沃尔核材股份有限公司 | Production method of thermosetting flat cables |
CN206388887U (en) * | 2017-01-13 | 2017-08-08 | 东莞市泰明同金属制品有限公司 | Novel Titanium copper strips |
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200605 |