CN111239448B

CN111239448B - Test machine and method for calibrating probe card and device under test

Info

Publication number: CN111239448B
Application number: CN201811433184.5A
Authority: CN
Inventors: 林祐贤; 请求不公布姓名; 王伟州; 张姗; 蒋真正
Original assignee: Changxin Memory Technologies Inc
Current assignee: Changxin Memory Technologies Inc
Priority date: 2018-11-28
Filing date: 2018-11-28
Publication date: 2024-05-03
Anticipated expiration: 2038-11-28
Also published as: CN111239448A

Abstract

The invention discloses a tester and a method for calibrating a probe card and a device to be tested. The testing machine comprises: the carrying platform comprises a carrying surface and can move along the direction parallel to the carrying surface and rotate around a rotating shaft perpendicular to the carrying surface; the probe card is provided with a plurality of probes extending to one side close to the carrying platform; an alignment assembly comprising: at least two first laser emission devices capable of emitting a plurality of first laser beams, the first laser beams being sequentially arranged in a direction perpendicular to the carrying surface; the second laser emission device can emit a plurality of second laser beams, the second laser beams are sequentially arranged along the direction vertical to the bearing surface, and the second laser beams are vertical to the first laser beams. The tester is adopted for alignment, the alignment between the probe card and the device to be tested is more accurate, meanwhile, the time for manually placing the probe card is reduced, the alignment accuracy between the probe card and the device to be tested is improved, and the damage of the probe card is avoided.

Description

Test machine and method for calibrating probe card and device under test

Technical Field

The present invention relates generally to the field of semiconductor processing, and more particularly to a tester and a method for calibrating a probe card and a device under test.

Background

The wafer needs to be tested before being packaged into a complete chip to screen out bad wafers, thereby reducing the packaging cost. The tester is used for testing the electrical performance of the unpackaged wafer. The testing machine comprises a carrying platform and a probe card. The carrying platform is used for carrying the wafer. The probe card is an interface for the tester to connect to the wafer. The probe card is provided with a plurality of probes which are simultaneously in direct contact with a plurality of welding pads on the wafer to guide electric signals. The electrical properties of the wafer are obtained by analyzing the electrical signals by test instruments on the tester.

However, after the wafer is placed on the carrying platform, the bonding pads on the wafer are very small, so that the alignment difficulty between the probe card and the wafer is high, the wafer needs to be aligned manually for a long time, and the efficiency is low. In particular, the probes on the probe card are fragile, and when the alignment is inaccurate, the probes are easy to prop to other positions, so that the probes and the wafer are damaged.

The above information disclosed in the background section is only for enhancement of understanding of the background of the invention and therefore it may contain information that does not form the prior art that is already known to a person of ordinary skill in the art.

Disclosure of Invention

In the summary, a series of concepts in a simplified form are introduced, which will be further described in detail in the detailed description. This summary is not intended to identify key features or essential features of the claimed subject matter, nor is it intended to be used as an aid in determining the scope of the claimed subject matter.

It is a primary object of the present invention to overcome at least one of the above-mentioned drawbacks of the prior art, and to provide a testing machine comprising: the carrying platform comprises a carrying surface and can move along the direction parallel to the carrying surface and rotate around a rotating shaft perpendicular to the carrying surface; the probe card is arranged above the carrying platform, can move along the direction parallel to the carrying surface and perpendicular to the carrying surface and can rotate around a rotating shaft perpendicular to the carrying surface, and comprises a plurality of probes extending to one side close to the carrying platform; an alignment assembly comprising: the at least two first laser emission devices can emit a plurality of first laser beams which are parallel to the bearing surface of the carrying platform and higher than the bearing surface, and the first laser beams are sequentially arranged along the direction perpendicular to the bearing surface; the second laser emission device can emit a plurality of second laser beams which are parallel to the bearing surface of the carrying platform and higher than the bearing surface, the second laser beams are sequentially arranged along the direction vertical to the bearing surface, and the second laser beams are vertical to the first laser beams; wherein the first laser emitting device is movable in a direction parallel to the second laser beam, and the second laser emitting device is movable in a direction parallel to the first laser beam.

According to one embodiment of the present invention, the alignment assembly further includes a camera and a third laser emitting device, the camera is located at a side of the probe card away from the carrying platform and is capable of moving along a direction parallel to the carrying surface, the third laser emitting device is mounted on the camera, the camera is capable of capturing a video image toward the carrying platform, the third laser emitting device is capable of emitting a third laser beam toward a side close to the carrying platform, and the third laser beam is perpendicular to the carrying surface.

According to one embodiment of the invention, the probe card further comprises a partially or fully transparent probe holder;

The probes extend from the probe seat to one side close to the carrying platform, and at least one probe is arranged on the transparent part of the probe seat.

According to one embodiment of the present invention, the alignment assembly further comprises a laser receiving device;

the number of the laser receiving devices is the same as that of the first laser emitting devices, the laser receiving devices are arranged in one-to-one correspondence with the first laser emitting devices, and the first laser emitting devices and the corresponding laser receiving devices are respectively positioned at two sides of the carrying platform; the first laser emitting device emits the first laser beam to the corresponding laser receiving device, and the laser receiving device is used for sensing whether the first laser beam is received or not.

According to one embodiment of the present invention, the testing machine further includes a platform movement mechanism disposed at the bottom of the carrying platform, the platform movement mechanism including: a first linear actuator; the second linear actuating mechanism is arranged on the first linear actuating mechanism; the first rotating executing mechanism is arranged on the second linear executing mechanism, and the carrying platform is arranged on the first rotating executing mechanism; the first linear actuating mechanism is used for driving the second actuating mechanism to move along a direction parallel to the second laser beam, the second linear actuating mechanism is used for driving the first rotating actuating mechanism to move along a direction parallel to the first laser beam, and the first rotating actuating mechanism is used for driving the carrying platform to rotate around an axis perpendicular to the carrying surface.

According to one embodiment of the present invention, the testing machine further includes a probe moving mechanism disposed above the loading platform, the probe moving mechanism including: a third linear actuator; the fourth linear actuating mechanism is arranged on the third linear actuating mechanism; the lifting mechanism is arranged on the fourth linear actuating mechanism; the second rotation executing mechanism is arranged on the lifting mechanism, and the probe card is arranged on the second rotation executing mechanism; the third linear actuating mechanism is used for driving the fourth linear actuating mechanism to move along the direction parallel to the second laser beam, the fourth linear actuating mechanism is used for driving the lifting mechanism to move along the direction parallel to the first laser beam, the lifting mechanism is used for driving the rotating actuating mechanism to be far away from or close to the bearing surface along the direction perpendicular to the bearing surface, and the second rotating actuating mechanism is used for driving the probe card to rotate around an axis perpendicular to the direction of the bearing surface.

According to one embodiment of the present invention, the alignment assembly further includes the camera motion mechanism, the camera motion mechanism is disposed on a side of the probe card facing away from the loading platform, the camera motion mechanism includes: a fifth linear actuator; a sixth linear actuator mounted on the fifth linear actuator, the camera being mounted on the sixth linear actuator; the fifth linear actuator is used for driving the sixth linear actuator to move along a direction parallel to the second laser beam, and the sixth linear actuator is used for driving the camera to move along a direction parallel to the first laser beam.

According to one embodiment of the invention, the alignment assembly further comprises: a first guide rail in a straight bar shape parallel to the second laser beam; a plurality of first sliders mounted on the first rail, the first sliders being slidable along the first rail; a second guide rail in a straight bar shape parallel to the first laser beam; a plurality of second sliders mounted on the second rail, slidable along the second rail; the first laser emission devices are arranged in one-to-one correspondence with the first sliding blocks, each first laser emission device is arranged on the corresponding first sliding block, the second laser emission devices are arranged in one-to-one correspondence with the second sliding blocks, and each second laser emission device is arranged on the corresponding second sliding block.

According to one embodiment of the invention, the alignment assembly further comprises: a third guide rail in the shape of a straight bar, parallel to the first guide rail; a plurality of third sliders mounted on the third rail, slidable along the third rail; the number of the third sliding blocks is the same as that of the laser receiving devices, the third sliding blocks are arranged in one-to-one correspondence with the laser receiving devices, and each laser receiving device is arranged on the corresponding third sliding block.

According to one embodiment of the invention, the alignment assembly further comprises: the connecting frame is respectively connected with the first sliding block and the third sliding block aligned with the first sliding block; and the seventh linear actuating mechanism is connected with the connecting frames in a one-to-one correspondence manner and is used for driving the connecting frames corresponding to the seventh linear actuating mechanism to move along the direction parallel to the first guide rail.

According to one embodiment of the invention, the first laser beam and the second laser beam each have a different color than the third laser beam.

In one embodiment of the present invention, a method for calibrating a probe card to a device under test is also presented, comprising:

Placing the device to be tested on a bearing surface, arranging a plurality of groups of first laser arrays and second laser arrays between the device to be tested and the probe card, wherein the first laser arrays comprise a plurality of first laser beams, the second laser arrays comprise a plurality of second laser beams, the first laser beams and the second laser beams are mutually perpendicular and are perpendicular to the bearing surface, the projections of the first laser beams on the bearing surface in the same first laser arrays are overlapped, and the projections of the second laser beams on the bearing surface are overlapped;

and respectively aligning the two probes on the probe card with the two welding pads on the device to be tested by taking the first laser beam and the second laser beam as marked lines.

According to one embodiment of the present invention, in aligning two probes with two of the pads, the method includes:

Moving the probe card towards the direction approaching the bearing surface, so that the tip of the probe is positioned between the first laser beam closest to the bearing surface and the first laser beam farthest from the bearing surface, and is also positioned between the second laser beam closest to the bearing surface and the second laser beam farthest from the bearing surface; moving the first laser array and the second laser array so that the first laser beams farthest from the bearing surface in the two first laser arrays are respectively blocked by the two probes, and the second laser beams farthest from the bearing surface in the second laser array are respectively blocked by the two probes; and moving the bearing surface to align the two welding pads with the first laser beams closest to the bearing surface in the two first laser arrays and the second laser beams closest to the bearing surface in the second laser arrays respectively.

According to one embodiment of the invention, the method further comprises: and setting a third laser beam vertical to the bearing surface, and aligning the center of one probe with the center of one welding pad by taking the third laser beam as a marking line.

According to one embodiment of the present invention, in aligning the center of one of the probes with the center of one of the pads, it includes: aligning the third laser beam to the center of the probe, and recording the position of the probe card; removing the probe card, and translating the bearing surface so that the center of the welding pad is aligned with the third laser beam; the probe card is moved back to the recorded location.

According to one embodiment of the invention, the method further comprises: and closing the probe card and the bearing surface, and judging whether the probe is contacted with the welding pad by observing whether the first laser beam is completely shielded by the probe.

As can be seen from the above technical solution, the testing machine and the method for calibrating the probe card and the device to be tested of the present invention have the following advantages and positive effects:

When the tester is adopted for the first-step alignment, the first laser beam emitted by the first laser emitting device and the second laser beam emitted by the second laser emitting device can be used as marked lines to respectively align the two probes on the probe card with the two welding pads on the device to be tested, the alignment between the probe card and the device to be tested is more accurate, meanwhile, the time for manually placing the probe card is reduced, the alignment accuracy between the probe card and the device to be tested is improved, and the damage of the probe card is avoided.

Drawings

Various objects, features and advantages of the present invention will become more apparent from the following detailed description of the preferred embodiments of the invention, when taken in conjunction with the accompanying drawings. The drawings are merely exemplary illustrations of the invention and are not necessarily drawn to scale. In the drawings, like reference numerals refer to the same or similar parts throughout. Wherein:

FIG. 1 is a schematic diagram of a tester according to an exemplary embodiment;

FIG. 2 is a schematic diagram of a platform motion mechanism according to an exemplary embodiment;

FIG. 3 is a schematic diagram of a probe motion mechanism according to an exemplary embodiment;

FIG. 4 is a flowchart illustrating a method for calibrating a probe card with a device under test, in accordance with an illustrative embodiment;

FIG. 5 is a schematic diagram of a tester in a state where a laser beam is aligned with a probe in a first step alignment, according to an exemplary embodiment;

FIG. 6 is a schematic diagram of a tester in a state where a laser beam is aligned with a bonding pad in a first step alignment according to an exemplary embodiment;

FIG. 7 is a schematic diagram of a tester in a state where the probes are in contact with the pads after the first step of alignment is completed, according to an exemplary embodiment;

FIG. 8 is a schematic diagram of a camera motion mechanism according to an exemplary embodiment;

FIG. 9 is a schematic diagram of a tester in a state where the center of a probe is aligned with a third laser beam in a second step of alignment according to an exemplary embodiment;

FIG. 10 is a schematic diagram of a tester in a state where the center of a pad is aligned with a third laser beam in a second step of alignment according to an exemplary embodiment;

FIG. 11 is a schematic diagram of a tester in a state where the probes are in contact with the pads after the second step of alignment is completed, according to an exemplary embodiment;

Fig. 12 is a schematic structural view of a connection frame and a seventh linear actuator according to an exemplary embodiment.

Detailed Description

Example embodiments will now be described more fully with reference to the accompanying drawings. However, the exemplary embodiments can be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of the example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus detailed descriptions thereof will be omitted.

Referring to fig. 1, fig. 1 shows a structure of a test machine 1 in the present embodiment. The tester 1 is used for testing electrical properties of a device under test 2, and the device under test 2 may be a wafer or a chip. A plurality of pads 21 are provided on the device under test 2. The tester 1 includes a loading platform 11, a platform movement mechanism 15 (see fig. 2), a probe card 12, a probe movement mechanism 16 (see fig. 3), and an alignment unit 13.

The loading platform 11 may be a square platform or a circular platform. The load platform 11 comprises a load surface 111. The carrying surface 111 is arranged on top of the load platform 11. The carrying surface 111 is a plane for carrying the device under test 2. The bearing surface 111 may be horizontally disposed. When the device under test 2 is placed on the carrying surface 111, the bonding pads 21 of the device under test 2 face upward.

The alignment assembly 13 includes a first rail 132, a second rail 136, a first slider 133, a second slider 137, a first laser emitting device 131, and a second laser emitting device 135. The first rail 132 and the second rail 136 are each straight. The first guide rail 132 is disposed on one side of the loading platform 11, and the second guide rail 136 is disposed on the other side of the loading platform 11 adjacent to the first laser emitting device 131. The first rail 132 and the second rail 136 are both parallel to the bearing surface 111. The first rail 132 and the second rail 136 are perpendicular to each other. The first slider 133 is disposed on the first rail 132 and is capable of sliding along the first rail 132. The second slider 137 is provided on the second rail 136 and is slidable along the second rail 136.

At least two first laser emitting devices 131 are provided. The number of the first sliders 133 is the same as that of the first laser emitting devices 131, the first laser emitting devices 131 are arranged in one-to-one correspondence with the first sliders 133, and each first laser emitting device 131 is arranged on the corresponding first slider 133. Since the first slider 133 can slide along the first guide rail 132, the two first laser emitting devices 131 can also move along the first guide rail 132 to adjust the interval between the two first laser emitting devices 131. The second laser emitting device 135 is mounted on the second slider 137, and the second laser emitting device 135 can move along the second guide rail 136.

The first and second laser emitting devices 131 and 135 each include a plurality of lasers (not shown) arranged in order in a direction perpendicular to the carrying surface 111, each of which is capable of emitting a beam of laser light. The first laser emitting device 131 emits a plurality of first laser beams 138 toward a side close to the loading stage 11. The first laser beam 138 is parallel to the bearing surface 111. The plurality of first laser beams 138 emitted from each first laser emitting device 131 are sequentially arranged in a direction perpendicular to the carrying surface 111. The orthographic projections of the plurality of first laser beams 138 emitted by the same first laser emitting device 131 on the carrying platform 11 are overlapped. The first laser beams 138 are each parallel to the second guide rail 136. The second laser emitting device 135 emits a plurality of second laser beams 139 toward a side close to the loading table 11. The second laser beam 139 is parallel to the bearing surface 111. The second laser beam 139 is also perpendicular to the first laser beam 138 and parallel to the first rail 132. The plurality of second laser beams 139 emitted by the second laser emitting device 135 are sequentially arranged in a direction perpendicular to the carrying surface 111. The orthographic projections of the plurality of second laser beams 139 emitted by the second laser emitting device 135 onto the load table 11 overlap. Both the first laser beam 138 and the second laser beam 139 can pass over the load platform 11.

The two first laser emitting devices 131 are respectively disposed on the two first sliders 133, and the distance between the two first laser emitting devices 131 can be adjusted to adjust the distance between the two first laser beams 138 so as to adapt to the specification of the bonding pads 21 and the distance between the bonding pads 21 on the device 2 to be tested, and probe cards 12 with different sizes.

Referring to fig. 2, a platform movement mechanism 15 is provided at the bottom of the loading platform 11. The platform movement mechanism 15 is used for driving the carrying platform 11 to move along the direction parallel to the carrying surface 111 and rotate around the rotating shaft perpendicular to the carrying surface 111. The platform movement mechanism 15 includes a first linear actuator 151, a second linear actuator 154, and a first rotational actuator 157. The carrying platform 11 is disposed on a first rotation actuator 157, and the first rotation actuator 157 is used for driving the carrying platform 11 to rotate around a rotation axis perpendicular to the carrying surface 111. The first rotation actuator 157 may be a motor, and a spindle 158 of the motor is perpendicular to the carrying surface 111 and connected to the bottom of the carrying platform 11, and rotation of the spindle 158 of the motor can drive the carrying platform 11 to rotate around a rotation axis perpendicular to the carrying surface 111.

The first rotary actuator 157 is mounted on a second linear actuator 154, the second linear actuator 154 being configured to drive the first rotary actuator 157 in a direction parallel to the first laser beam 138. The second linear actuator 154 is mounted on the first linear actuator 151, and the first linear actuator 151 is configured to drive the second linear actuator 154 to move in a direction parallel to the second laser beam 139.

In the present embodiment, the first linear actuator 151 and the second linear actuator 154 are each provided as an electric cylinder. The first linear actuator 151 includes a first cylinder 152 and a first telescopic rod 153, and the first telescopic rod 153 can retract into or extend out of the first cylinder 152. The second linear actuator 154 includes a second cylinder 155 and a second telescopic rod 156, and the second telescopic rod 156 can be retracted into or extended from the second cylinder 155.

The second cylinder 155 is mounted on the first telescopic rod 153, and the direction in which the first telescopic rod 153 is retracted into or extended out of the first cylinder 152 is parallel to the second laser beam 139. The first rotation actuator 157 is mounted on the second telescopic rod 156, and the direction in which the second telescopic rod 156 is retracted into or extended from the second cylinder 155 is parallel to the first laser beam 138.

The first telescopic rod 153 drives the second cylinder 155 to move along the direction parallel to the second laser beam 139 through telescopic action, and further drives the carrying platform 11 to move along the direction parallel to the second laser beam 139. The second telescopic rod 156, through telescopic action, drives the first rotary actuator 157 to move in a direction parallel to the first laser beam 138, and thus drives the object carrying platform 11 to move in a direction parallel to the first laser beam 138.

Referring to fig. 3, probe card 12 is an interface of tester 1 to device under test 2. The probe card 12 is disposed above the loading platform 11. The probe card 12 includes a probe holder 121 and a plurality of probes 122. The probe holder 121 is a flat plate parallel to the carrying surface 111. The probe mount 121 may be a printed circuit board (PCB board). The probe 122 protrudes from the probe holder 121 toward the side close to the load table 11. The probes 122 are perpendicular to the load surface 111 of the load platform 11. The contact of the probes 122 with the bonding pads 21 of the device under test 2 can lead out the electrical signals emitted by the device under test 2. The beam diameters of the first laser beam 138 and the second laser beam 139 are smaller than the diameter of the probe 122.

The probes 122 on the probe card 12 are arranged in one-to-one correspondence with the bonding pads 21 on the device 2 to be tested, and the tip of each probe 122 needs to be in contact with the corresponding bonding pad 21 during testing. When a plurality of pads 21 are arranged in a row on the device under test 2, probes 122 are also arranged in a row on the probe card 12.

The probe motion mechanism 16 is disposed above the loading platform 11, and the probe motion mechanism 16 includes a third linear actuator 161, a fourth linear actuator 164, a lifting mechanism 167, and a second rotation actuator 160. The probe card 12 is mounted on the second rotary actuator 160, and the probe card 12 is positioned below the second rotary actuator 160. The second rotational actuator 160 is used to drive the probe card 12 to rotate about an axis perpendicular to the bearing surface 111. The second rotation actuator 160 may be a motor having a spindle perpendicular to the carrying surface 111 and extending in a direction toward a side of the carrying platform 11, and a probe holder 121 of the probe card 12 is mounted on a spindle 1601, the probe holder 121 being perpendicular to the spindle 1601, and rotation of the spindle 1601 of the motor driving rotation of the probe card 12 about an axis perpendicular to the carrying surface 111.

The second rotary actuator 160 is mounted on a lifting mechanism 167. The lifting mechanism 167 is used to drive the second rotary actuator 160 away from or towards the bearing surface 111 in a direction perpendicular to the bearing surface 111. The elevating mechanism 167 is mounted on the fourth linear actuator 164. The fourth linear actuator 164 is used to drive the elevation mechanism 167 to move in a direction parallel to the first laser beam 138. The fourth linear actuator 164 is mounted on the third linear actuator 161. The third linear actuator 161 is configured to drive the fourth linear actuator 164 in a direction parallel to the second laser beam 139.

In the present embodiment, the third linear actuator 161, the fourth linear actuator 164, and the elevating mechanism 167 are each provided as an electric cylinder. The third linear actuator 161 includes a third cylinder 162 and a third telescopic rod 163, and the third telescopic rod 163 can be retracted into or extended from the third cylinder 162. The fourth linear actuator 164 includes a fourth cylinder 165 and a fourth telescopic rod 166, and the fourth telescopic rod 166 can be retracted into or extended from the fourth cylinder 165. The elevating mechanism 167 includes an eighth cylinder 168 and an eighth telescopic link 169, and the eighth telescopic link 169 can be retracted into or extended from the eighth cylinder 168.

The fourth cylinder 165 is mounted on the third telescopic rod 163, and the direction in which the third telescopic rod 163 is retracted into or extended out of the third cylinder 162 is parallel to the second laser beam 139. An eighth cylinder 168 is mounted on the fourth telescopic rod 166, and the direction in which the fourth telescopic rod 166 is retracted into or extended out of the fourth cylinder 165 is parallel to the first laser beam 138. The second rotation actuator 160 is mounted on an eighth telescopic rod 169, and the direction in which the eighth telescopic rod 169 is retracted into or extended out of the eighth cylinder 168 is perpendicular to the carrying surface 111.

The third telescopic rod 163 drives the fourth cylinder 165 to move along the direction parallel to the second laser beam 139 through telescopic motion, and further drives the probe card 12 to move along the direction parallel to the second laser beam 139. The fourth telescopic rod 166 is telescopic to drive the eighth cylinder 168 to move in a direction parallel to the first laser beam 138, and thus drive the probe card 12 to move in a direction parallel to the first laser beam 138. The eighth telescopic rod 169 drives the second rotation executing mechanism 160 to move away from or close to the bearing surface 111 along the direction perpendicular to the bearing surface 111 through telescopic, and further drives the probe card 12 to move away from or close to the bearing surface 111 along the direction perpendicular to the bearing surface 111.

Referring to fig. 4, the present embodiment also proposes a method for calibrating the probe card 12 and the device under test 2. The method is used to align the probe card 12 with the device under test 2 prior to testing the device under test 2 using the tester 1. The method comprises the following steps:

Step S10: and respectively aligning the two probes on the probe card with the two welding pads on the device to be tested by taking the first laser beam and the second laser beam as marking lines.

Step S10 includes steps S11 to S14:

step S11, a first laser beam array and a second laser beam array are arranged between the device to be tested and the probe card.

The device 2 to be tested is placed on a bearing surface 111, a plurality of groups of first laser arrays and second laser arrays are arranged between the device 2 to be tested and the probe card 12, the first laser arrays comprise a plurality of first laser beams 138, the second laser arrays comprise a plurality of second laser beams 139, the first laser beams 138 and the second laser beams 139 are mutually perpendicular and are parallel to the bearing surface 111, projections of the plurality of first laser beams 138 in the same first laser arrays on the bearing surface 111 are overlapped, and projections of the plurality of second laser beams 139 on the bearing surface 111 are overlapped.

Referring to fig. 1, a device under test 2 is first placed on a carrier platform 11, and the side of the device under test 2 on which the pads 21 are disposed faces upward. The first laser emitting device 131 and the second laser emitting device 135 are turned on, the first laser emitting device 131 emits a plurality of first laser beams 138, all the first laser beams 138 emitted by each first laser emitting device 131 form a group of first laser arrays, the second laser emitting device 135 emits a plurality of second laser beams 139, and all the second laser beams 139 emitted by the second laser emitting device 135 form a second laser array. The first laser beam 138 and the second laser beam 139 are each located between the device under test 2 and the probe card 12.

Step S12, adjusting the distance between the probe card and the bearing surface.

The probe card 12 is moved in a direction approaching the carrying surface 111 such that the tip of the probe 12 is located between the first laser beam 138 closest to the carrying surface 111 and furthest from the carrying surface 111, and also between the second laser beam 139 closest to the carrying surface 111 and furthest from the carrying surface 111.

Referring to fig. 5, the probe motion mechanism 16 drives the probe card 12 close to the carrying surface 111 until the tips of the probes 122 are higher than the bottommost first and second laser beams 138, 139 and lower than the topmost first and second laser beams 138, 139.

Step S13, aligning the probe with the first laser beam and the second laser beam.

The first laser array, the second laser array, and the probe card 12 are moved such that the first laser beams 138 of the two first laser arrays that are furthest from the carrying surface 111 are respectively blocked by the two probes 122, and the second laser beams 139 of the second laser arrays that are furthest from the carrying surface 111 are respectively blocked by the two probes 122.

Referring to fig. 5, the positions of the probe card 12, the first laser emitting device 131 and the second laser emitting device 135 are adjusted such that the topmost first laser beam 138 emitted by the two first laser emitting devices 131, respectively, is blocked by the two probes 122 while the topmost second laser beam 139 emitted by the second laser emitting device 135 is exactly blocked by one of the two probes 122, and the tip of the other probe 122 is aligned with the bottommost second laser beam 139.

Step S14, aligning the welding pad with the first laser beam and the second laser beam.

The carrier surface 111 is moved such that the two pads 21 are aligned with the first laser beam 138 of the two first laser arrays closest to the carrier surface 111 and with the second laser beam 139 of the second laser array closest to the carrier surface, respectively.

Referring to fig. 6, the object carrying platform 11 is moved so that the two pads 21 corresponding to the two probes 122 on the device under test 2 are aligned with the bottommost first laser beams 138 emitted by the two first laser emitting devices 131, respectively, and both of the pads 21 are also aligned with the bottommost second laser beams 139.

Thus, the first step of alignment between the probe card 12 and the device 2 to be tested is completed, and referring to fig. 7, after the first step of alignment is completed, the probes 122 are driven to be close to the bearing surface 111, so that the tip of each probe 122 is abutted against the corresponding bonding pad 21, and the alignment is more accurate.

Further, the probe mounts 121 of the probe card 12 are configured to be fully or partially transparent. At least one probe 122 is mounted on the transparent portion of the probe holder 121. The alignment assembly 13 further includes a video camera 143, a third laser emitting device 144, and a camera motion mechanism 17. The video camera 143, the third laser emitting device 144 and the camera movement mechanism 17 are all arranged on the side of the probe card 12 facing away from the loading platform 11. The third laser emitting device 144 is fixed to the camera 143. The third laser emitting device 144 emits a third laser beam 145 to a side close to the carrying platform, and the third laser beam 145 is perpendicular to the carrying surface. The camera 143 picks up an image toward the loading platform side. The image captured by the camera 143 can be played in real time via an external display. The image captured by the camera 143 is preferably a magnified image. The camera 143 may be a charge coupled camera (CCD CAMERA).

Referring to fig. 8, the video camera 143 is mounted on a camera moving mechanism 17, and the camera moving mechanism 17 is for driving the camera to move in a direction parallel to the carrying surface 111. The camera movement mechanism 17 includes a fifth linear actuator 171 and a sixth linear actuator 174. The sixth linear actuator 174 is mounted on the fifth linear actuator 171. The camera 143 is mounted on a sixth linear actuator 174.

The fifth linear actuator 171 is configured to drive the sixth linear actuator 174 to move in a direction parallel to the second laser beam 139, and the sixth linear actuator 174 is configured to drive the camera 143 and the third laser emitting device 144 to move in a direction parallel to the first laser beam 138.

The fifth linear actuator 171 and the sixth linear actuator 174 are each provided as an electric cylinder. The fifth linear actuator 171 includes a fifth cylinder 172 and a fifth telescopic rod 173, and the fifth telescopic rod 173 can be retracted into or extended from the fifth cylinder 172. The sixth linear actuator 174 includes a sixth cylinder 175 and a sixth telescopic rod 176, and the sixth telescopic rod 176 can be retracted into or extended from the sixth cylinder 175.

The sixth cylinder 175 is mounted on the fifth telescopic rod 173, and the fifth telescopic rod 173 is retracted or extended in the direction of the fifth cylinder 172 in parallel with the second laser beam 139. The camera 143 is mounted on a sixth telescopic rod 176, and the direction in which the sixth telescopic rod 176 is retracted into or extended out of the sixth cylinder 175 is parallel to the first laser beam 138.

The fifth telescopic rod 173, by being telescopic, drives the sixth cylinder 175 to move in a direction parallel to the second laser beam 139, and thus the camera 143 and the third laser emitting device 144 are moved in a direction parallel to the second laser beam 139. The sixth telescopic rod 176 moves the camera 143 and the third laser emitting device 144 in a direction parallel to the first laser beam 138 by telescoping.

After the first step of aligning the probe card 12 and the device under test 2, a second step of aligning may be performed to make the alignment between the probe card 12 and the device under test 2 more accurate, i.e. the probes 122 on the probe card 12 are located in the central area of the pads 21 on the device under test 2.

The method for calibrating the probe card 12 with the device under test 2 further comprises step S20.

Step S20: a third laser beam 145 is provided perpendicular to the carrying surface 111, and the center of one probe 122 is aligned with the center of one pad 21 with the third laser beam 145 as a reticle. Step S20 includes steps S21 to S22.

Step S21, aligning the third laser beam to the center of the probe, and recording the position of the probe card.

Referring to fig. 9, the position of the probe card 12 after the first alignment is recorded, the third laser emitting device 144 is turned on, and the third laser emitting device 144 emits the third laser beam 145 in a direction approaching the carrying surface 111. While viewing the image photographed by the camera 143, the positions of the camera 143 and the third laser emitting device 144 are adjusted by operating the camera moving mechanism 17 so that the third laser beam 145 emitted from the third laser emitting device 144 is exactly aligned with the center of one probe 122. In the present embodiment, since the probe holder 121 of the probe card 12 is provided to be fully transparent or partially transparent and the transparent portion of the probe holder 121 is provided with the probe 122, the third laser beam 145 can be directed at the probe 122.

Step S22, the probe card is removed, and the carrying surface is translated so that the center of the bonding pad 21 is aligned with the third laser beam.

After the third laser beam 145 is aligned with the center of the probe 122, the probe card 12 is moved away by operating the probe motion mechanism 16 so that the third laser beam 145 can be irradiated to the device under test 2. Referring to fig. 10, the carrier stage 11 is then flattened by operating the stage moving mechanism 15 so that the center of one of the pads 21 on the device under test 2 corresponding to the probe 122 is aligned with the third laser beam 145 while viewing the image captured by the camera 143.

Step S23, the probe card is moved back to the recorded position.

The probe card 12 is moved back to the post first step alignment position. This completes the second step of alignment between probe card 12 and device under test 2.

In the second alignment step, since the third laser emitting device 144 is closely adjacent to the camera 143, the error between the result observed when the third laser beam 145 is irradiated to the center of the probe 122 or the center of the pad 21 is small, and the probe 122 and the pad 21 can be aligned more accurately. After the second alignment is completed, the tips of the probes 122 can be aligned with the centers of the pads 21 of the device under test 2. Referring to fig. 11, the probe card 12 is driven to be close to the bearing surface 111, and the tips of the probes 122 on the probe card 12 are inserted into the centers of the corresponding bonding pads 21, so that the time for manually placing the probe card 12 is reduced, the accuracy of alignment between the probe card 12 and the device 2 to be tested is improved, and the damage of the probe card 12 is avoided.

Further, the colors of the first, second and third laser beams 138, 139 and 145 may be the same, and for example, may be red, blue or green.

The first and second laser beams 138, 139 may each be different in color from the third laser beam 145, for example, the first and second laser beams 138, 139 are each blue and the third laser beam 145 is red. Setting the colors of the first laser beam 138 and the second laser beam 139 different from the colors of the third laser beam 145 can more clearly distinguish the third laser beam 145 from the first laser beam 138 and the second laser beam 139.

The colors of the first laser beam 138, the second laser beam 139, and the third laser beam 145 are different from each other. The first laser beam 138 may be set to green, the second laser beam 139 may be set to blue, and the third laser beam 145 may be set to red. Thus, the colors of the three laser beams are different from each other, and are not easy to be confused.

Further, referring to fig. 12, the alignment assembly 13 further includes a laser receiving device 140, a third rail 141, and a third slider 142. The number of laser light receiving devices 140 and the number of third sliders 142 are the same as the number of first laser light emitting devices 131. The third rail 141 is parallel to the first rail 132. The third sliders 142 are each disposed on the third rail 141. The third slider 142 is slidable along the third rail 141. The laser receiving devices 140 are disposed in one-to-one correspondence with the third sliders 142, and the laser receiving devices 140 are mounted on the third sliders 142 corresponding thereto. The laser receiving device 140 can adjust the position along the third rail 141.

The laser receiving devices 140 are arranged in one-to-one correspondence with the first laser emitting devices 131, the positions of the laser receiving devices 140 are adjusted to be aligned with the corresponding first laser emitting devices 131, and the laser receiving devices 140 can receive the first laser beams 138 emitted by the first laser emitting devices 131 opposite to the laser receiving devices.

The laser receiving device 140 includes a plurality of photo sensors (not shown) which are sequentially arranged in a row in a direction perpendicular to the carrying surface 111. The photosensitive sensor is disposed at a side of the laser receiving device 140 facing the first laser emitting device 131. The photosensitive sensors on the laser receiving device 140 are in one-to-one correspondence with the first laser beams 138 emitted by the first laser emitting devices 131 corresponding to the laser receiving device 140, and the photosensitive sensors receive and sense the first laser beams 138 corresponding thereto.

The method for calibrating the probe card and the device under test further comprises step S30.

Step S30: the probe card 12 is brought close to the carrying surface 111, and whether the probes 122 are in contact with the pads 21 is determined by observing whether the first laser beam 138 is completely blocked by the probes 122.

After the second alignment step is completed, the probe card 12 is driven to move in a direction approaching the carrying surface 111 so that the probes 122 are contacted with the pads 21 of the device under test 2, and if the laser receiving device 140 can also receive the first laser beam 138, it indicates that the probes 122 are not contacted with the pads 21, and the probe card 12 is not moved in place. Meanwhile, the tester 1 actively issues an alarm for reminding the tester that the probe 122 does not contact the welding pad 21, so that the time for the tester to check whether the probe contacts the device to be tested can be reduced, and the testing efficiency is improved.

Further, referring to fig. 12, the alignment assembly 13 further includes a connecting frame 181 and a seventh linear actuator 182. The number of the connecting frames 181 and the number of the seventh linear actuators 182 are the same as the number of the first sliders 133. Each of the connection frames 181 connects the first slider 133 and the third slider 142 corresponding to the first slider 133 to each other so that the first laser emitting device 131 is aligned with the laser receiving device 140 corresponding to the first laser emitting device 131.

The seventh linear actuating mechanisms 182 are disposed in one-to-one correspondence with the connecting frames 181, and the seventh linear actuating mechanisms 182 are used for driving the connecting frames 181 to move along a direction parallel to the first guide rail 132. The seventh linear actuator 182 is an electric cylinder, and the seventh linear actuator 182 includes a seventh cylinder 183 and a seventh telescopic rod 184 that can extend out of or retract into the seventh cylinder 183.

The seventh telescopic rod 184 is connected to the connecting frame 181, preferably connected to the middle of the connecting frame 181, and when the seventh telescopic rod 184 stretches out of or retracts into the seventh cylinder 183, the seventh telescopic rod can simultaneously drive the first slider 133 and the third slider 142 to move. In this way, the position of the laser receiving device 140 can be adjusted at the same time when the position of the first laser emitting device 131 is adjusted so that the first laser beam 138 emitted by the first laser emitting device 131 can always be received by the laser receiving device 140.

The alignment assembly may further include a laser receiving device (not shown) for receiving the second laser beam 139, the laser receiving device and the second laser emitting device 135 being disposed on opposite sides of the load platform 11, respectively. The laser receiving device is movable following the movement of the second laser emitting device 135 such that the laser receiving device is always in a position to receive the second laser beam 139.

After the second alignment step is completed, the probe card 12 is driven to move in a direction approaching the carrying surface 111 so that the probes 122 are in contact with the pads 21 of the device under test 2, and if the laser receiving device can also receive the second laser beam 139, it indicates that the probes 122 are not in contact with the pads 21, and the probe card 12 is not moved in place. Meanwhile, the tester 1 actively issues an alarm for reminding the tester that the probe 122 does not contact the pad 21, which can reduce the time for the tester to check whether the probe contacts the device 2 to be tested, and improve the test efficiency.

In the present embodiment, the first linear actuator 151, the second linear actuator 154, the third linear actuator 161, the fourth linear actuator 164, the fifth linear actuator 171, the sixth linear actuator 174, the seventh linear actuator 182, and the lifting mechanism 167 are provided as the electric cylinders, which is the most preferable one, and it is understood that the first linear actuator 151, the second linear actuator 154, the third linear actuator 161, the fourth linear actuator 164, the fifth linear actuator 171, the sixth linear actuator 174, the seventh linear actuator 182, and the lifting mechanism 167 may be provided as other well-known linear actuators such as a rack-and-pinion mechanism, an electric push rod, a screw, an oil cylinder, or an air cylinder.

It should be appreciated that the various examples described above may be utilized in a variety of directions (e.g., tilted, inverted, horizontal, vertical, etc.) and in a variety of configurations without departing from the principles of the present invention. The embodiments shown in the drawings are shown and described merely as examples of useful applications of the principles of the invention, which are not limited to any specific details of these embodiments.

Of course, once the above description of the representative embodiments has been carefully considered, those skilled in the art will readily appreciate that numerous modifications, additions, substitutions, deletions, and other changes may be made to these specific embodiments, and such changes are within the scope of the principles of the present invention. Accordingly, the foregoing detailed description is to be clearly understood as being given by way of illustration and example only, the spirit and scope of the present invention being limited solely by the appended claims and equivalents thereto.

Claims

1. A test machine, comprising:

the carrying platform comprises a carrying surface and can move along the direction parallel to the carrying surface and rotate around a rotating shaft perpendicular to the carrying surface;

the probe card is arranged above the carrying platform, can move along the direction parallel to the carrying surface and perpendicular to the carrying surface and can rotate around a rotating shaft perpendicular to the carrying surface, and comprises a plurality of probes extending to one side close to the carrying platform;

An alignment assembly comprising:

The at least two first laser emission devices can emit a plurality of first laser beams which are parallel to the bearing surface of the carrying platform and higher than the bearing surface, and the first laser beams are sequentially arranged along the direction perpendicular to the bearing surface;

The second laser emission device can emit a plurality of second laser beams which are parallel to the bearing surface of the carrying platform and higher than the bearing surface, the second laser beams are sequentially arranged along the direction vertical to the bearing surface, and the second laser beams are vertical to the first laser beams;

The camera is positioned at one side of the probe card, which is away from the carrying platform, and can move along the direction parallel to the carrying surface, and the third laser emission device is arranged on the camera;

Wherein the first laser emitting device is movable in a direction parallel to the second laser beam, and the second laser emitting device is movable in a direction parallel to the first laser beam; the camera can shoot towards one side of the carrying platform, the third laser emission device can emit a third laser beam towards one side close to the carrying platform, and the third laser beam is perpendicular to the carrying surface.

2. The tester of claim 1, wherein the probe card further comprises a partially or fully transparent probe mount;

3. The machine according to any one of claims 1 to 2, wherein the alignment assembly further comprises a laser receiving device;

the number of the laser receiving devices is the same as that of the first laser emitting devices, the laser receiving devices are arranged in one-to-one correspondence with the first laser emitting devices, and the first laser emitting devices and the corresponding laser receiving devices are respectively positioned at two sides of the carrying platform;

the first laser emitting device emits the first laser beam to the corresponding laser receiving device, and the laser receiving device is used for sensing whether the first laser beam is received or not.

4. The testing machine of claim 1, further comprising a platform motion mechanism disposed at a bottom of the load platform, the platform motion mechanism comprising:

A first linear actuator;

The second linear actuating mechanism is arranged on the first linear actuating mechanism;

The first rotating executing mechanism is arranged on the second linear executing mechanism, and the carrying platform is arranged on the first rotating executing mechanism;

The first linear actuating mechanism is used for driving the second actuating mechanism to move along a direction parallel to the second laser beam, the second linear actuating mechanism is used for driving the first rotating actuating mechanism to move along a direction parallel to the first laser beam, and the first rotating actuating mechanism is used for driving the carrying platform to rotate around an axis perpendicular to the carrying surface.

5. The machine of claim 4, further comprising a probe motion mechanism disposed above the load platform, the probe motion mechanism comprising:

a third linear actuator;

The fourth linear actuating mechanism is arranged on the third linear actuating mechanism;

The lifting mechanism is arranged on the fourth linear actuating mechanism;

The second rotation executing mechanism is arranged on the lifting mechanism, and the probe card is arranged on the second rotation executing mechanism;

The third linear actuating mechanism is used for driving the fourth linear actuating mechanism to move along the direction parallel to the second laser beam, the fourth linear actuating mechanism is used for driving the lifting mechanism to move along the direction parallel to the first laser beam, the lifting mechanism is used for driving the rotating actuating mechanism to be far away from or close to the bearing surface along the direction perpendicular to the bearing surface, and the second rotating actuating mechanism is used for driving the probe card to rotate around an axis perpendicular to the direction of the bearing surface.

6. The test machine of claim 1, wherein the alignment assembly further comprises the camera motion mechanism disposed on a side of the probe card facing away from the carrier platform, the camera motion mechanism comprising:

a fifth linear actuator;

a sixth linear actuator mounted on the fifth linear actuator, the camera being mounted on the sixth linear actuator;

the fifth linear actuator is used for driving the sixth linear actuator to move along a direction parallel to the second laser beam, and the sixth linear actuator is used for driving the camera to move along a direction parallel to the first laser beam.

7. The machine of claim 3, wherein the alignment assembly further comprises:

a first guide rail in a straight bar shape parallel to the second laser beam;

a plurality of first sliders mounted on the first rail, the first sliders being slidable along the first rail;

a second guide rail in a straight bar shape parallel to the first laser beam;

a plurality of second sliders mounted on the second rail, slidable along the second rail;

The first laser emission devices are arranged in one-to-one correspondence with the first sliding blocks, each first laser emission device is arranged on the corresponding first sliding block, the second laser emission devices are arranged in one-to-one correspondence with the second sliding blocks, and each second laser emission device is arranged on the corresponding second sliding block.

8. The machine of claim 7, wherein the alignment assembly further comprises:

A third guide rail in the shape of a straight bar, parallel to the first guide rail;

a plurality of third sliders mounted on the third rail, slidable along the third rail;

the number of the third sliding blocks is the same as that of the laser receiving devices, the third sliding blocks are arranged in one-to-one correspondence with the laser receiving devices, and each laser receiving device is arranged on the corresponding third sliding block.

9. The machine of claim 8, wherein the alignment assembly further comprises:

The connecting frame is respectively connected with the first sliding block and the third sliding block aligned with the first sliding block;

And the seventh linear actuating mechanism is connected with the connecting frames in a one-to-one correspondence manner and is used for driving the connecting frames corresponding to the seventh linear actuating mechanism to move along the direction parallel to the first guide rail.

10. The machine of claim 1, wherein the first and second laser beams each have a different color than the third laser beam.

11. A method for calibrating a probe card to a device under test, comprising:

Respectively aligning two probes on the probe card with two welding pads on the device to be tested by taking the first laser beam and the second laser beam as marking lines;

And setting a third laser beam vertical to the bearing surface, and aligning the center of one probe with the center of one welding pad by taking the third laser beam as a marking line.

12. The method for calibrating a probe card and a device under test of claim 11, wherein in aligning two probes with two of the pads, comprising:

Moving the probe card towards the direction approaching the bearing surface, so that the tip of the probe is positioned between the first laser beam closest to the bearing surface and the first laser beam farthest from the bearing surface, and is also positioned between the second laser beam closest to the bearing surface and the second laser beam farthest from the bearing surface;

Moving the first laser array and the second laser array so that the first laser beams farthest from the bearing surface in the two first laser arrays are respectively blocked by the two probes, and the second laser beams farthest from the bearing surface in the second laser array are respectively blocked by the two probes;

And moving the bearing surface to align the two welding pads with the first laser beams closest to the bearing surface in the two first laser arrays and the second laser beams closest to the bearing surface in the second laser arrays respectively.

13. The method for calibrating a probe card and a device under test of claim 11, wherein aligning the center of one of the probes with the center of one of the pads comprises:

aligning the third laser beam to the center of the probe, and recording the position of the probe card;

Removing the probe card, and translating the bearing surface so that the center of the welding pad is aligned with the third laser beam;

The probe card is moved back to the recorded location.

14. The method for calibrating a probe card and a device under test of claim 11, further comprising: and closing the probe card and the bearing surface, and judging whether the probe is contacted with the welding pad by observing whether the first laser beam is completely shielded by the probe.