CN111235532A - Coating device combining ion coating and electron beam evaporation coating and coating method thereof - Google Patents

Coating device combining ion coating and electron beam evaporation coating and coating method thereof Download PDF

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Publication number
CN111235532A
CN111235532A CN202010041461.9A CN202010041461A CN111235532A CN 111235532 A CN111235532 A CN 111235532A CN 202010041461 A CN202010041461 A CN 202010041461A CN 111235532 A CN111235532 A CN 111235532A
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CN
China
Prior art keywords
coating
ion
electron beam
plating
beam evaporation
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Pending
Application number
CN202010041461.9A
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Chinese (zh)
Inventor
程云立
马华
付久龙
武金魁
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Changti Engineering Technology Research Institute Beijing Co Ltd
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Changti Engineering Technology Research Institute Beijing Co Ltd
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Priority to CN202010041461.9A priority Critical patent/CN111235532A/en
Publication of CN111235532A publication Critical patent/CN111235532A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
    • C23C14/325—Electric arc evaporation
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/24—Vacuum evaporation
    • C23C14/28—Vacuum evaporation by wave energy or particle radiation
    • C23C14/30—Vacuum evaporation by wave energy or particle radiation by electron bombardment
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering

Abstract

The invention provides a coating device combining an ion coating and an electron beam evaporation coating, which comprises: the vacuum chamber comprises an ion coating component, an electron beam evaporation coating component, a coated substrate, a crucible and a vacuum chamber, wherein the ion coating component is arranged on the left side and the right side of the vacuum chamber, the electron beam evaporation coating component is arranged above the vacuum chamber, the coated substrate is arranged in the middle of the vacuum chamber, and the crucible is arranged below the coated substrate. The invention also provides a film coating method, which comprises the steps of cleaning and priming a thin metal film layer by using metal ion bombardment on the surface of a coated substrate by using an ion film coating method to form a metal transition layer, and rapidly depositing to form the film layer by using a high-power electron beam evaporation film coating method.

Description

Coating device combining ion coating and electron beam evaporation coating and coating method thereof
Technical Field
The invention belongs to the technical field of coating, and particularly relates to a coating device combining ion coating and electron beam evaporation coating and a coating method thereof.
Background
In the vacuum coating technology, the plasma coating method of magnetron sputtering target and arc target coating has the advantages of good film binding force, good diffraction and the like, and simultaneously has the defects of slow film deposition speed, thin film and the like. The evaporation mode of using the high-power electron beam evaporation coating can greatly improve the deposition rate of the film, and overcomes the defects of low deposition speed, thin film and the like of the ion coating film, but the problem of low bonding force between the evaporated metal film and the surface of the coated base material and infirm film exists due to low molecular energy of metal steam during the electron beam evaporation coating.
Disclosure of Invention
In order to solve at least one of the above technical problems, the present invention provides a coating apparatus combining an ion coating with an electron beam evaporation coating and a coating method thereof, so as to solve the problems of low binding force between an evaporated metal film and a coated substrate surface and insecure film when a high-power electron beam evaporation coating is used.
In order to at least achieve one of the above purposes, the invention adopts the technical scheme that:
the invention provides a coating device combining an ion coating and an electron beam evaporation coating, which comprises: the vacuum chamber comprises an ion coating component, an electron beam evaporation coating component, a coated substrate, a crucible and a vacuum chamber, wherein the ion coating component is arranged on the left side and the right side of the vacuum chamber, the electron beam evaporation coating component is arranged above the vacuum chamber, the coated substrate is arranged in the middle of the vacuum chamber, and the crucible is arranged below the coated substrate.
Further, the ion plating assembly comprises an arc target or a magnetron sputtering target.
The invention also provides a film coating method adopting the film coating device, which comprises the following steps:
step 1, cleaning and priming to form a metal transition layer: applying negative bias to the substrate to be plated through an ion plating assembly, and performing ion bombardment cleaning, priming and depositing to obtain a metal transition layer;
step 2, evaporation coating: and performing rapid deposition coating by using a high-power electron beam evaporation coating method.
Further, in the step 1, a negative bias is applied to the plated substrate, a large amount of ionized target steam is generated by an evaporation mode of the ion plating assembly, the ionized target steam molecules are accelerated by a bias electric field and then bombard the surface of the plated substrate, and the surface of the plated substrate is subjected to sputtering cleaning and deposition plating bottoming to form a metal film layer.
Further, the energy of the ions after the negative bias is applied is 10-1000 electron volts.
Further, in step 1, the target material for forming the metal transition layer may be a metal target material, an alloy target material or a compound target material suitable for ion plating.
Further, in the step 2, the ion plating auxiliary deposition method can be continuously used in the evaporation plating process.
Further, in the step 2, the required metal can be doped into the film layer of the plated substrate by using an ion plating assisted deposition method in the evaporation plating process.
Furthermore, the ion plating auxiliary deposition method is to utilize an ion plating assembly to bombard, clean and deposit a metal film layer on the bottom.
Compared with the prior art, the coating device and the coating method combining the ion coating and the electron beam evaporation coating have the beneficial effects that:
after a thin metal film layer is deposited on the surface of a plated base material by using an ion plating method and metal ion bombardment cleaning priming, a fresh metal transition layer without an oxide layer is formed on the surface of the plated base material, and the film layer is rapidly deposited by using a high-power electron beam evaporation plating method to form the film layer.
According to the invention, by forming the metal transition layer, the binding force between the film layer obtained by the subsequent electron beam evaporation and the plated substrate can be enhanced; meanwhile, the metal transition layer can adopt any metal target, alloy target or compound target suitable for ion plating, so that the combination between the surface metal film layer and the metal of the plated base material is more combined, and the plated base material has special performances such as better wear resistance, corrosion resistance and the like.
In a word, the invention provides a coating device and a coating method thereof, wherein the coating device combines ion coating and electron beam coating, the bonding force of a film layer and a coated substrate is strong, the deposition rate is high, and meanwhile, due to the existence of a metal transition layer, the diversification and the multi-function of the film layer are enhanced.
Drawings
FIG. 1 is a schematic view of a coating apparatus combining ion coating and electron beam evaporation coating according to the present invention;
wherein the reference numerals are as follows:
1 ion coating component, 2 electron beam evaporation coating component, 3 coated substrate, 4 crucible and 5 vacuum chamber.
Detailed Description
In order to make the technical solutions of the present invention better understood by those skilled in the art, the present invention will be further described in detail with reference to specific examples. Note that the following described embodiments are illustrative only for explaining the present invention, and are not to be construed as limiting the present invention. The examples, where specific techniques or conditions are not indicated, are to be construed according to the techniques or conditions described in the literature in the art or according to the product specifications.
In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The following will describe in detail the coating apparatus and coating method combining ion coating and electron beam evaporation coating provided by the present invention by specific embodiments:
as shown in fig. 1, the coating apparatus combining ion coating and electron beam evaporation coating according to the present invention includes: the vacuum ion plating device comprises an ion plating assembly 1, an electron beam evaporation plating assembly 2, a plated substrate 3, a crucible 4 and a vacuum chamber 5, wherein the ion plating assembly 1 is arranged on the left side and the right side of the vacuum chamber 5, the electron beam evaporation plating assembly 2 is arranged above the vacuum chamber 5, the plated substrate 3 is arranged in the middle of the vacuum chamber 5, and the crucible 4 is arranged below the substrate.
The ion plating assembly 1 of the present invention includes an arc target or a magnetron sputtering target.
The film coating method of the film coating device comprises the following steps:
step 1, cleaning and priming to form a metal transition layer: applying negative bias to the substrate to be plated through the ion plating assembly 1 to carry out ion bombardment cleaning and priming deposition to obtain a metal transition layer;
step 2, evaporation coating: and performing rapid deposition coating by using a high-power electron beam evaporation coating method.
In the step 1, negative bias is applied to a plated substrate, a large amount of ionized target steam is generated by an evaporation mode of the ion plating assembly 1, the ionized target steam is bombarded on the surface of the plated substrate after the acceleration of a bias electric field on ionized target steam molecules, the surface of the plated substrate is subjected to sputtering cleaning and deposition plating bottoming to form a metal film layer, and the adhesion strength of the deposited metal film layer to the surface of the plated substrate is greatly improved; the energy of the negatively biased ions is about 10-1000 ev.
The target material for forming the metal transition layer in the step 1 can be any metal target material, alloy target material or compound target material suitable for ion plating, so that more combination modes are combined between the surface metal film layer and the metal of the plated base material, and the plated base material has special performances such as better wear resistance, corrosion resistance and the like.
In the step 2 of the invention, an ion plating auxiliary deposition method can be continuously used in the evaporation plating process, so that the ionization rate of the evaporated metal in the crucible is improved, and the film uniformity of the special-shaped piece plating film is improved.
In the step 2 of the invention, the required metal can be doped into the film layer of the plated substrate 3 by using an ion plating auxiliary deposition method in the evaporation plating process.
The ion plating auxiliary deposition method of the invention is to utilize the ion plating component 1 to bombard, clean and deposit a metal film layer on the bottom.
In the invention, after a thin metal film layer is deposited on the surface of the plated base material by using metal ion bombardment cleaning and priming by adopting an ion plating method, a fresh metal transition layer without an oxide layer is formed on the surface of the plated base material, and the film layer is formed by rapid deposition by using a high-power electron beam evaporation plating method.
According to the invention, by forming the metal transition layer, the binding force between the film layer obtained by the subsequent electron beam evaporation and the plated substrate can be enhanced; meanwhile, the metal transition layer can adopt any metal target, alloy target or compound target suitable for ion plating, so that the combination between the surface metal film layer and the metal of the plated base material is more combined, and the plated base material has special performances such as better wear resistance, corrosion resistance and the like.
In a word, the invention provides a coating device and a coating method thereof, wherein the coating device combines ion coating and electron beam coating, the bonding force of a film layer and a coated substrate is strong, the deposition rate is high, and meanwhile, due to the existence of a metal transition layer, the diversification and the multi-function of the film layer are enhanced.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.

Claims (9)

1. A coating device combining ion coating and electron beam evaporation coating is characterized by comprising: the vacuum chamber comprises an ion coating component, an electron beam evaporation coating component, a coated substrate, a crucible and a vacuum chamber, wherein the ion coating component is arranged on the left side and the right side of the vacuum chamber, the electron beam evaporation coating component is arranged above the vacuum chamber, the coated substrate is arranged in the middle of the vacuum chamber, and the crucible is arranged below the coated substrate.
2. The coating apparatus of claim 1, wherein the ion coating assembly comprises an arc target or a magnetron sputtering target.
3. A coating method using the coating device according to claim 1 or 2, comprising the steps of:
step 1, cleaning and priming to form a metal transition layer: applying negative bias to the substrate to be plated through an ion plating assembly, and performing ion bombardment cleaning, priming and depositing to obtain a metal transition layer;
step 2, evaporation coating: and performing rapid deposition coating by using a high-power electron beam evaporation coating method.
4. The coating method according to claim 3, wherein in step 1, a negative bias is applied to the substrate to be coated, a large amount of ionized target material vapor is generated by an evaporation method of the ion coating assembly, the ionized target material vapor molecules are accelerated by a bias electric field to bombard the surface of the substrate to be coated, and the surface of the substrate to be coated is subjected to sputter cleaning and deposition coating bottoming to form the metal film layer.
5. The plating method according to claim 4, wherein the ion energy after the negative bias is applied is 10 to 1000 eV.
6. The plating method according to claim 4, wherein in step 1, the target for forming the metal transition layer can be a metal target, an alloy target or a compound target suitable for ion plating.
7. The plating method according to claim 6, wherein in the step 2, an ion plating assisted deposition method can be continuously used during the evaporation plating.
8. The plating method according to claim 7, wherein in the step 2, the required metal can be doped into the film layer of the plated substrate by using an ion plating assisted deposition method in the evaporation plating process.
9. The method of claim 8, wherein the ion-assisted deposition is by bombardment cleaning of the underlying metal film layer with an ion-deposition module.
CN202010041461.9A 2020-01-15 2020-01-15 Coating device combining ion coating and electron beam evaporation coating and coating method thereof Pending CN111235532A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112195443A (en) * 2020-09-14 2021-01-08 武汉电信器件有限公司 Film deposition system and film coating method
CN113463037A (en) * 2021-07-19 2021-10-01 秦皇岛本征晶体科技有限公司 Method for coating reflecting film on outer surface of fluoride special-shaped light guide rod
CN115612991A (en) * 2022-12-02 2023-01-17 杭州众能光电科技有限公司 Plasma and electric field synergistic film preparation equipment and preparation process

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102212786A (en) * 2011-05-27 2011-10-12 中国航空工业集团公司北京航空制造工程研究所 Method for preparing thermal barrier coating
CN103866241A (en) * 2014-02-25 2014-06-18 广东省工业技术研究院(广州有色金属研究院) Composite magnetron sputtering coating device for ion-assisted thermal evaporation
KR20140083260A (en) * 2012-12-26 2014-07-04 유흥상 complex vacuum evaporation method
CN108342699A (en) * 2018-02-11 2018-07-31 中国科学院上海光学精密机械研究所 Comprehensive deposition filming equipment and comprehensive film plating process
CN108624859A (en) * 2018-07-18 2018-10-09 无锡爱尔华精机有限公司 A kind of two-sided physical vapor deposition coating film equipment and its principle

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102212786A (en) * 2011-05-27 2011-10-12 中国航空工业集团公司北京航空制造工程研究所 Method for preparing thermal barrier coating
KR20140083260A (en) * 2012-12-26 2014-07-04 유흥상 complex vacuum evaporation method
CN103866241A (en) * 2014-02-25 2014-06-18 广东省工业技术研究院(广州有色金属研究院) Composite magnetron sputtering coating device for ion-assisted thermal evaporation
CN108342699A (en) * 2018-02-11 2018-07-31 中国科学院上海光学精密机械研究所 Comprehensive deposition filming equipment and comprehensive film plating process
CN108624859A (en) * 2018-07-18 2018-10-09 无锡爱尔华精机有限公司 A kind of two-sided physical vapor deposition coating film equipment and its principle

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112195443A (en) * 2020-09-14 2021-01-08 武汉电信器件有限公司 Film deposition system and film coating method
CN113463037A (en) * 2021-07-19 2021-10-01 秦皇岛本征晶体科技有限公司 Method for coating reflecting film on outer surface of fluoride special-shaped light guide rod
CN113463037B (en) * 2021-07-19 2022-10-11 秦皇岛本征晶体科技有限公司 Method for coating reflecting film on outer surface of fluoride special-shaped light guide rod
CN115612991A (en) * 2022-12-02 2023-01-17 杭州众能光电科技有限公司 Plasma and electric field synergistic film preparation equipment and preparation process

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