CN111215472A - Production device and production process of polishing line - Google Patents
Production device and production process of polishing line Download PDFInfo
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- CN111215472A CN111215472A CN201911143495.2A CN201911143495A CN111215472A CN 111215472 A CN111215472 A CN 111215472A CN 201911143495 A CN201911143495 A CN 201911143495A CN 111215472 A CN111215472 A CN 111215472A
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- wire
- wire drawing
- copper
- copper wire
- die
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C37/00—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape
- B21C37/04—Manufacture of metal sheets, bars, wire, tubes or like semi-manufactured products, not otherwise provided for; Manufacture of tubes of special shape of bars or wire
- B21C37/042—Manufacture of coated wire or bars
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C1/00—Manufacture of metal sheets, metal wire, metal rods, metal tubes by drawing
- B21C1/02—Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums
- B21C1/04—Drawing metal wire or like flexible metallic material by drawing machines or apparatus in which the drawing action is effected by drums with two or more dies operating in series
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- Mechanical Engineering (AREA)
- Metal Extraction Processes (AREA)
Abstract
The invention relates to the technical field of wire core processing, in particular to a production device and a production process of a polishing wire. Compared with the traditional production process, the process adopts the steps that the copper wire is firstly subjected to wire drawing for the first time and then silver plating is carried out, and then wire drawing is carried out to meet the required specification, so that the silver plating effect is improved by silver plating on the premise of improving the surface smoothness of the copper wire, and the abrasion to a silver plating layer is reduced because only one wire drawing is carried out on the silver plating.
Description
Technical Field
The invention relates to the technical field of wire core processing, in particular to a production device and a production process of a polishing wire.
Background
The wire core is a wire structure of a wire, and the material of the wire core can be one or more of copper, silver, aluminum and other metals according to the use environment, the requirement on conductivity and the like. For the wire core with conductivity and exposed outside, the surface of the wire core is generally required to be silvered and polished to be suitable. For convenience of production and processing, the current wire cores have a predetermined specification (i.e., national standard), that is, a producer can select a proper size from the national standard wires according to a required specification to perform wire drawing treatment to obtain the wire.
For the electroplated silver wire core, for example, for a silver-plated copper wire with a diameter of 0.94mm, the conventional processing technology is as follows: firstly, electroplating a 1.38mm copper wire, and then drawing the copper wire to a diameter of 0.94mm directly through 5 dies. This process obviously has the following drawbacks: the surface of the copper wire is not polished during electroplating to cause insufficient smoothness, so that the electroplating quality is influenced, the loss of the die and the abrasion of a silver coating layer are large due to excessive passing dies in the wire drawing process, the quality of a product is influenced, and the maintenance cost of equipment is increased.
Disclosure of Invention
The invention provides a production device and a production process of a polishing wire aiming at the problems in the prior art, which can improve the surface smoothness of a copper wire and reduce the abrasion to a silver coating and a die in the wire drawing process.
In order to solve the technical problems, the invention adopts the following technical scheme:
the invention provides a production device of a polishing wire, which comprises a pay-off mechanism, a traction mechanism, a wire drawing mechanism, an electroplating mechanism and a wire drawing mechanism, wherein the electroplating mechanism is used for plating silver on the drawn copper wire, the wire drawing mechanism is used for drawing the silver wire, the wire drawing mechanism is used for reducing the diameter of the copper wire and polishing the surface of the copper wire, and the traction mechanism is used for drawing the copper wire to sequentially pass through the wire drawing mechanism, the electroplating mechanism and the wire drawing mechanism.
Further, the pay-off mechanism comprises a pay-off rack, a fixed shaft, a movable shaft and a reversing wheel, wherein the fixed shaft, the movable shaft and the reversing wheel are all arranged on the pay-off rack, and the fixed shaft and the movable shaft are arranged oppositely; a control piece used for pushing the movable shaft to the direction close to the fixed shaft is arranged between the movable shaft and the pay-off rack;
when the copper wire feeding mechanism is used, the feeding roller wound with a copper wire is arranged between the fixed shaft and the movable shaft, and the copper wire is pulled by the traction mechanism to enter the mechanism body after passing through the reversing wheel.
Furthermore, the wire drawing mechanism comprises a machine body and a plurality of wire drawing wheels which are arranged in the machine body, the plurality of wire drawing wheels are arranged in an array mode, n wire winding grooves are formed in the side edges of the wire drawing wheels, a wire drawing die is arranged between every two adjacent wire drawing wheels in the same row, the wire drawing die is provided with n wire drawing holes, and the inner diameter of a wire inlet of the same wire drawing hole is larger than that of a wire outlet; the copper wire radius is reduced gradually after passing through the wire drawing wheel and the wire drawing die, and n is a natural number larger than 1.
Furthermore, the wire drawing mechanism further comprises a wire shrinking die arranged at the output port of the machine body, a wire running hole is formed in the wire shrinking die, the input end of the wire running hole is communicated with the interior of the machine body, and the radius of the output end of the wire running hole is 0.985 mm.
Furthermore, the wire drawing mechanism comprises a wire drawing die, a wire drawing hole penetrates through the wire drawing die, and the diameter of a wire outlet of the wire drawing hole is 0.94 mm.
Furthermore, a stress wheel mechanism used for adjusting the stress of the copper wire is arranged between the wire pulling mechanism and the electroplating mechanism.
The invention also provides a production process of the polishing line, which comprises the following steps:
a. performing primary wire drawing on the copper wire;
b. performing secondary wire drawing on the copper wire to ensure that the diameter of the copper wire is 0.985-0.986 mm;
c. carrying out silver plating treatment on the copper wire;
d. the silver-plated copper wire was subjected to a drawing process so that the diameter of the silver-plated copper wire became 0.94 mm.
Further, in step a, the method specifically comprises:
a1. lubricating liquid is injected into a machine body for primary wire drawing and is used for protecting a copper wire to be drawn;
a2. four stay wire wheels are arranged in the machine body in an array mode, each stay wire wheel is provided with n winding grooves, and a stay wire mold is arranged between every two adjacent stay wire wheels in the same row;
a3. after the copper wire passes through the wire pulling wheel and the wire pulling die, the diameter of the copper wire is gradually reduced, and the copper wire is continuously lubricated and protected by lubricating liquid in the reducing process.
Further, between step b and step c, the method further comprises the following steps: b1. the copper wire enters the silver plating mechanism after being subjected to stress adjustment through the stress wheel mechanism.
The invention has the beneficial effects that: compared with the prior art, the invention has the advantages that the copper wire core is firstly subjected to wire drawing to reach certain smooth finish and diameter, then silver plating treatment is carried out, and then wire drawing is carried out to reach proper specification, so that the surface smooth finish of the copper wire is improved, the electroplating quality is improved, and the abrasion to a wire drawing die and a silver plating layer can be reduced.
Drawings
FIG. 1 is a schematic view of a production apparatus of the present invention.
Fig. 2 is a schematic view of the pay-off mechanism of the present invention.
Fig. 3 is an internal schematic view of the wire pulling mechanism of the present invention.
Figure 4 is a schematic view of the pulling wire wheel of the present invention.
Fig. 5 is a cross-sectional view of the wire drawing die of the present invention.
Fig. 6 is a sectional view of the inventive wire reduction mold.
Fig. 7 is a cross-sectional view of a drawing die of the present invention.
Reference numerals: the wire drawing machine comprises a wire drawing mechanism 1, a wire drawing mechanism 2, a traction mechanism 3, a wire drawing mechanism 4, an electroplating mechanism 5, a wire drawing mechanism 11, a wire drawing frame 12, a fixed shaft 12, a movable shaft 13, a reversing wheel 14, a control part 15, a machine body 31, a wire drawing wheel 32, a wire winding groove 33, a wire drawing die 34, a wire drawing hole 35, a wire shrinking die 36, a wire feeding hole 37, a wire drawing die 51 and a wire drawing hole 52.
Detailed Description
In order to facilitate understanding of those skilled in the art, the present invention will be further described with reference to the following examples and drawings, which are not intended to limit the present invention. The present invention is described in detail below with reference to the attached drawings.
As shown in fig. 1 to 7, the production device for a polishing wire provided by the invention comprises a pay-off mechanism 1, a traction mechanism 2, a wire drawing mechanism 3, an electroplating mechanism 4 for plating silver on a drawn copper wire, and a wire drawing mechanism 5 for drawing the silver-plated copper wire, wherein the pay-off mechanism 1 is used for paying off the copper wire, the wire drawing mechanism 3 is used for reducing the diameter of the copper wire and polishing the surface of the copper wire, and the traction mechanism 2 is used for drawing the copper wire to pass through the wire drawing mechanism 3, the electroplating mechanism 4 and the wire drawing mechanism 5 in sequence. The electroplating mechanism 4 and the traction mechanism 2 are conventional structures in the art, and therefore, the details are not described herein.
The invention is used for processing a copper wire with the diameter of 1.38mm into a silver-plated copper wire with the diameter of 0.94mm, and the process steps are as follows:
a. performing primary wire drawing on the copper wire;
b. performing secondary wire drawing on the copper wire to ensure that the diameter of the copper wire is 0.985-0.986 mm;
c. carrying out silver plating treatment on the copper wire;
d. the silver-plated copper wire was subjected to a drawing process so that the diameter of the silver-plated copper wire became 0.94 mm.
Compared with the prior art, the method has the advantages that the copper wire core is firstly pulled to reach a certain diameter, then silver plating is carried out, and then wire drawing is carried out to a proper specification, so that the surface smoothness of the copper wire is improved, the electroplating quality is improved, and the abrasion to the wire drawing die 51 and the silver coating layer can be reduced.
In this embodiment, the pay-off mechanism 1 includes a pay-off rack 11, a fixed shaft 12, a movable shaft 13 and a reversing wheel 14, the fixed shaft 12, the movable shaft 13 and the reversing wheel 14 are all disposed on the pay-off rack 11, and the fixed shaft 12 and the movable shaft 13 are disposed opposite to each other; a control part 15 for pushing the movable shaft 13 to the direction close to the fixed shaft 12 is arranged between the movable shaft 13 and the pay-off rack 11.
When the device is used, a worker drives the movable shaft 13 to enable the movable shaft 13 to retreat, and the control piece 15 also retreats along with the movable shaft 13; then, a worker installs a feeding roller (not shown in the figure) wound with a copper wire between the fixed shaft 12 and the movable shaft 13, loosens the movable shaft 13 and enables the control member 15 to push the movable shaft 13 to abut against the feeding roller to fix the feeding roller, so that the copper wire on the feeding roller is pulled by the traction mechanism 2, is reversed by the reversing wheel 14 and enters the machine body 31, and then is sequentially wound by the wire drawing mechanism 3, the electroplating mechanism 4 and the wire drawing mechanism 5, thereby achieving the effect of automatic action. Preferably, the control member 15 can be a transmission mechanism composed of a motor and a rack and pinion, and the fixed shaft 12 can also be in transmission connection with a driving motor to drive the feeding roller to rotate.
In this embodiment, the wire drawing mechanism 3 includes a machine body 31 and a plurality of wire drawing wheels 32 which are all arranged in the machine body 31, the plurality of wire drawing wheels 32 are arranged in an array, n wire winding grooves 33 are arranged on the side edges of the wire drawing wheels 32, a wire drawing mold 34 is arranged between two adjacent wire drawing wheels 32 in the same row, the wire drawing mold 34 is provided with n wire drawing holes 35, and the inner diameter of a wire inlet of the same wire drawing hole 35 is larger than the inner diameter of a wire outlet; the copper wire gradually reduces in diameter after passing through the wire drawing wheel 32 and the wire drawing die 34, and n is a natural number greater than 1. Specifically, the wire drawing mechanism 3 further comprises a wire drawing die 36 installed at an output port of the machine body 31, a wire running hole 37 is formed in the wire drawing die 36, an input end of the wire running hole 37 is communicated with the inside of the machine body 31, and the radius of an output end of the wire running hole 37 is 0.985 mm.
The copper wire enters the wire drawing die 34 after passing through the wire drawing wheel 32, the diameter of the copper wire is reduced after the copper wire is circularly drawn for a plurality of times, finally the diameter of the copper wire is changed to 0.985mm after the copper wire passes through the wire feeding hole 37 of the wire shrinking die 36, and then the subsequent silver plating and wire drawing actions are carried out. In the process of passing through the wire drawing die 34 and the wire shrinking die 36, the surface of the copper wire is continuously contacted and extruded with the inner wall of the wire drawing die 34, so that the polishing effect is realized. In the embodiment, the 0.985mm is an important diameter parameter of the invention, that is, when the copper wire with the diameter of 1.38mm is drawn to the diameter of 0.985mm, the surface smoothness of the copper wire is better, so that the silver plating effect is improved, when the copper wire reaches the specification and then carries out silver plating and wire drawing, the loss of the silver plating layer of the copper wire after wire drawing is minimum, the silver plating layer can be polished in the wire drawing process, and the smoothness of the silver plating layer of a final product can also meet the requirement when the diameter of the final product reaches 0.94 mm.
In the present embodiment, the wire drawing mechanism 5 includes a wire drawing die 51, the wire drawing die 51 is provided with a wire drawing hole 52, and a diameter of a wire outlet of the wire drawing hole 52 is 0.94 mm.
In this embodiment, a stress wheel mechanism (not shown in the figure) for adjusting the stress of the copper wire is further disposed between the wire pulling mechanism 3 and the electroplating mechanism 4, so as to reduce the stress of the copper wire after the wire pulling is completed, and make the softness of the final product better meet the requirement.
In the wire pulling mechanism 3 of the present embodiment, the steps specifically include:
a1. lubricating liquid is injected into the machine body 31 for one-time wire drawing for protecting the copper wire to be drawn;
a2. four stay wire wheels 32 are arranged in the machine body 31 in an array mode, each stay wire wheel 32 is provided with n winding grooves 33, and a stay wire mold 34 is arranged between every two adjacent stay wire wheels 32 in the same row;
a3. after passing through the wire drawing wheel 32 and the wire drawing die 34, the copper wire is gradually reduced in diameter and is continuously lubricated and protected by the lubricating liquid in the reducing process.
Although the present invention has been described with reference to the above preferred embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (9)
1. A production device of a polishing line is characterized in that: including paying out machine structure, drive mechanism, wire drawing mechanism, be used for carrying out silvering electroplating mechanism and be used for carrying out the wire drawing mechanism of wire drawing to the copper line after the silvering to the copper line after acting as go-between, paying out machine constructs and is used for releasing the copper line, wire drawing mechanism is used for reducing the diameter of copper line and polishes the surface of copper line, drive mechanism is used for drawing the copper line and passes through in proper order wire drawing mechanism electroplate the mechanism and wire drawing mechanism.
2. The production apparatus of a polishing line according to claim 1, characterized in that: the pay-off mechanism comprises a pay-off rack, a fixed shaft, a movable shaft and a reversing wheel, wherein the fixed shaft, the movable shaft and the reversing wheel are all arranged on the pay-off rack, and the fixed shaft and the movable shaft are arranged oppositely; a control piece used for pushing the movable shaft to the direction close to the fixed shaft is arranged between the movable shaft and the pay-off rack;
when the copper wire feeding mechanism is used, the feeding roller wound with a copper wire is arranged between the fixed shaft and the movable shaft, and the copper wire is pulled by the traction mechanism to enter the mechanism body after passing through the reversing wheel.
3. The production apparatus of a polishing line according to claim 1, characterized in that: the wire drawing mechanism comprises a machine body and a plurality of wire drawing wheels which are arranged in the machine body, the plurality of wire drawing wheels are arranged in an array mode, n wire winding grooves are formed in the side edges of the wire drawing wheels, a wire drawing die is arranged between every two adjacent wire drawing wheels in the same row, the wire drawing die is provided with n wire drawing holes, and the inner diameter of a wire inlet of the same wire drawing hole is larger than that of a wire outlet; the copper wire radius is reduced gradually after passing through the wire drawing wheel and the wire drawing die, and n is a natural number larger than 1.
4. The production apparatus of a polishing line according to claim 3, characterized in that: the wire drawing mechanism further comprises a wire shrinking die arranged at the output port of the machine body, a wire passing hole is formed in the wire shrinking die, the input end of the wire passing hole is communicated with the interior of the machine body, and the radius of the output end of the wire passing hole is 0.985 mm.
5. The production apparatus of a polishing line according to claim 1, characterized in that: the wire drawing mechanism comprises a wire drawing die, wherein a wire drawing hole penetrates through the wire drawing die, and the diameter of a wire outlet of the wire drawing hole is 0.94 mm.
6. The production apparatus of a polishing line according to claim 1, characterized in that: and a stress wheel mechanism used for adjusting the stress of the copper wire is also arranged between the wire drawing mechanism and the electroplating mechanism.
7. A production process of a polishing line is characterized by comprising the following steps: the method comprises the following steps:
a. performing primary wire drawing on the copper wire;
b. performing secondary wire drawing on the copper wire to ensure that the diameter of the copper wire is 0.985-0.986 mm;
c. carrying out silver plating treatment on the copper wire;
d. the silver-plated copper wire was subjected to a drawing process so that the diameter of the silver-plated copper wire became 0.94 mm.
8. The polishing line production process according to claim 7, wherein: in the step a, the method specifically comprises the following steps:
a1. lubricating liquid is injected into a machine body for primary wire drawing and is used for protecting a copper wire to be drawn;
a2. four stay wire wheels are arranged in the machine body in an array mode, each stay wire wheel is provided with n winding grooves, and a stay wire mold is arranged between every two adjacent stay wire wheels in the same row;
a3. after the copper wire passes through the wire pulling wheel and the wire pulling die, the diameter of the copper wire is gradually reduced, and the copper wire is continuously lubricated and protected by lubricating liquid in the reducing process.
9. The polishing line production process according to claim 7, wherein: between step b and step c, further comprising: b1. the copper wire enters the silver plating mechanism after being subjected to stress adjustment through the stress wheel mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911143495.2A CN111215472A (en) | 2019-11-20 | 2019-11-20 | Production device and production process of polishing line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911143495.2A CN111215472A (en) | 2019-11-20 | 2019-11-20 | Production device and production process of polishing line |
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| Publication Number | Publication Date |
|---|---|
| CN111215472A true CN111215472A (en) | 2020-06-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911143495.2A Pending CN111215472A (en) | 2019-11-20 | 2019-11-20 | Production device and production process of polishing line |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113290178A (en) * | 2021-05-21 | 2021-08-24 | 东莞市诺德金属科技有限公司 | Cogging forging method for high-Nb-content Ti-Nb alloy ingot |
-
2019
- 2019-11-20 CN CN201911143495.2A patent/CN111215472A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113290178A (en) * | 2021-05-21 | 2021-08-24 | 东莞市诺德金属科技有限公司 | Cogging forging method for high-Nb-content Ti-Nb alloy ingot |
| CN113290178B (en) * | 2021-05-21 | 2022-04-19 | 东莞市诺德金属科技有限公司 | Cogging forging method for high-Nb-content Ti-Nb alloy ingot |
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