CN111201593B - LED detection device and method - Google Patents
LED detection device and method Download PDFInfo
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- CN111201593B CN111201593B CN201980002286.8A CN201980002286A CN111201593B CN 111201593 B CN111201593 B CN 111201593B CN 201980002286 A CN201980002286 A CN 201980002286A CN 111201593 B CN111201593 B CN 111201593B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/14—Measuring as part of the manufacturing process for electrical parameters, e.g. resistance, deep-levels, CV, diffusions by electrical means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
Abstract
The invention discloses an LED detection device and a method, wherein the LED detection device comprises: detecting the circuit board; the elastic substrate is arranged at the lower end of the detection circuit board, one surface of the elastic substrate, which is far away from the detection circuit board, is provided with a detection electrode, the detection electrode is electrically connected with the detection circuit board, and the detection electrode is opposite to an electrode of the LED chip to be detected; and the fillable area is arranged between the detection circuit board and the elastic substrate. According to the invention, after the fillable area is filled, the detection electrode is contacted with the electrode to be detected so as to judge whether the LED chip to be detected at the current detection position is a chip with poor electrical property, so that the chip with poor electrical property can be screened out. In addition, the probe position does not need to be mechanically moved, the LED chip is prevented from being stabbed by the probe, the electrode of the LED chip can be accurately aligned to be electrified, and the detection speed of the LED chip is improved.
Description
Technical Field
The invention relates to the technical field of Micro-LEDs, in particular to an LED detection device and method.
Background
Micro-LED (Light Emitting Diode) technology, i.e., LED scaling and matrixing technology. The Micro-LED has the advantages of good stability, high operating temperature, long service life, low power consumption, high color saturation, high reaction speed, high contrast and the like. In addition, micro-LEDs have higher brightness and lower power consumption.
As shown in fig. 1, due to lattice matching, the LED micro-device must be grown by molecular beam epitaxy on a sapphire substrate. To make a display, the LED light emitting micro-devices must be transferred to a glass substrate. Since the size of the sapphire substrate for manufacturing the LED Micro device is basically the size of a silicon crystal cell, and the size of the display is a glass substrate with a much larger size, multiple transportation is inevitably required, that is, a mass transfer process of Micro-LEDs is to transfer thousands of LEDs on a carrier substrate to a target backplane to form a final Micro-LED display. Before the macro transfer step of the Micro-LEDs, however, it should be ensured that each LED is properly used, and therefore, the optoelectronic properties of each LED on the carrier substrate need to be detected. As shown in fig. 2, in the conventional LED chip electrical detection, light is emitted from the LED112 via the light receiver 109 to collect information by contacting the chip N electrode 105 and the chip P electrode 106 of the chip with the probes 111, and the conventional LED detection method needs to energize the LED chips on the chip substrate 108 one by one with the probes 111 and detect the light to be detected 113 emitted from each LED112 after energization. As shown in fig. 3 and 4, this conventional inspection method also requires that the probes individually energize the LEDs 112 on the substrate. Therefore, for Micro-LEDs, the size of the LED112 is very small, it is difficult for the probe to align with the electrode of the LED112, there is a risk of poking the LED112 during the process of energizing the LED chip on the chip substrate using the probe, and it is difficult to ensure that the probe can be accurately aligned with the electrode of the LED chip. In addition, the conventional LED detection method requires mechanically moving the probe position, resulting in a slow detection speed of the LED chip.
Accordingly, there is a need for improvements and developments in the art.
Disclosure of Invention
In view of the above-mentioned deficiencies of the prior art, the present invention provides an LED inspection apparatus and method, which can screen out a chip with poor electrical characteristics, accurately align the LED chip electrodes for power supply, avoid the LED chip from being punctured by the probes, and improve the inspection speed of the LED chip.
The technical scheme of the invention is as follows:
this LED detection device includes:
detecting the circuit board;
the elastic substrate is arranged at the lower end of the detection circuit board, one surface of the elastic substrate, which is far away from the detection circuit board, is provided with a detection electrode, the detection electrode is electrically connected with the detection circuit board, and the detection electrode is opposite to an electrode of the LED chip to be detected; and
the fillable area is arranged between the detection circuit board and the elastic substrate.
In a further arrangement of the invention, the detection electrode comprises:
the circuit board P electrode is right opposite to the P electrode of the LED chip to be detected;
the circuit board N electrode is right opposite to the N electrode of the LED chip to be detected;
the circuit board P common electrode is respectively connected with the circuit board P common electrodes; and
and the N electrode of the circuit board is respectively connected with the N common electrodes of the circuit board.
The invention further provides the following steps: and the LED chip to be detected is arranged on the chip substrate.
In a further aspect of the present invention, the LED chip to be detected includes:
the chip body is arranged on the upper end face of the chip substrate; and
the electrode to be detected is arranged on the upper end face of the chip body;
wherein the electrode to be detected comprises:
a chip P electrode facing the circuit board P electrode; and
and the chip N electrode is right opposite to the circuit board N electrode.
The invention further provides the following steps: and the light receiver is arranged on one side of the chip substrate, which is far away from the LED chip to be detected.
The invention further sets up, still include: the pressure sensing assemblies are arranged on the upper end face of the detection circuit board, the position of each pressure sensing assembly corresponds to the position of the LED chip to be detected, and the pressure sensing assemblies are used for detecting the pressure of each position, corresponding to the LED chip to be detected, on the detection circuit board.
According to a further configuration of the present invention, the elastic substrate is made of a polymer material, and the polymer material at least includes one of polydimethylsiloxane, polyimide and polymethyl methacrylate.
In a further development of the invention, the fillable region is filled with a gas or fluid; wherein the gas is atmospheric air or nitrogen, and the fluid is deionized water.
The LED detection method comprises the following steps:
providing a detection circuit board and an elastic substrate, wherein a fillable area is arranged between the detection circuit board and the elastic substrate; one surface of the elastic substrate, which is far away from the detection circuit board, is provided with a detection electrode, the detection electrode is electrically connected with the detection circuit board, and the detection electrode is opposite to the electrode of the LED chip to be detected;
filling the fillable area to enable the detection electrode to be in contact with the electrode of the LED chip to be detected;
providing a pressure sensing assembly, and when the detection electrode is contacted with the electrode of the LED chip to be detected, if the pressure sensing assembly displays a green light, the LED chip to be detected is arranged at the current detection position;
and providing an optical receiver, and when the optical receiver receives the light beam emitted by the LED chip to be detected at the current detection position, judging that the LED chip to be detected at the current position is a benign LED chip.
According to the further arrangement of the invention, when the light receiver does not receive the light beam emitted by the LED chip to be detected, the LED chip to be detected at the current position is judged to be the LED chip with poor electrical property.
The invention provides an LED detection device and method, the LED detection device comprises:
detecting the circuit board; the elastic substrate is arranged at the lower end of the detection circuit board, one surface of the elastic substrate, which is far away from the detection circuit board, is provided with a detection electrode, the detection electrode is electrically connected with the detection circuit board, and the detection electrode is opposite to an electrode of the LED chip to be detected; and the fillable area is arranged between the detection circuit board and the elastic substrate. According to the invention, after the fillable area is filled, the detection electrode is contacted with the electrode to be detected, so as to judge whether the LED chip to be detected at the current detection position is a chip with poor electrical property, and thus, the chip with poor electrical property can be screened out. In addition, the probe position does not need to be mechanically moved, the LED chip is prevented from being stabbed by the probe, the electrode of the LED chip can be accurately aligned to be electrified, and the detection speed of the LED chip is improved.
Drawings
FIG. 1 is a schematic diagram of Micro-LED bulk transfer.
Fig. 2 is a schematic structural diagram 1 of a conventional LED detection method.
Fig. 3 is a schematic structural diagram 2 of a conventional LED detection method.
Fig. 4 is a schematic structural diagram 3 of a conventional LED detection method.
Fig. 5 is a schematic structural diagram 1 of the LED detection device according to the present invention.
Fig. 6 is a schematic structural diagram 2 of the LED detection device according to the present invention.
Fig. 7 is a schematic structural diagram 3 of the LED detection device according to the present invention.
The various symbols in the drawings: 100. detecting the circuit board; 101. a fillable region; 102. an elastic substrate; 103. a circuit board P electrode; 1031. a circuit board P common electrode; 104. a circuit board N electrode; 1041. a circuit board N common electrode; 105. a chip P electrode; 106. a chip N electrode; 107. a chip body; 108. a chip substrate; 109. an optical receiver; 110. a pressure sensing assembly; 111. a probe; 112. an LED; 113. and (6) waiting for light measurement.
Detailed Description
The invention provides an LED detection device and method, wherein the LED detection device can be used for manufacturing corresponding detection electrode positions according to LED chips with different sizes to perform electrical detection, and can be used for performing electrical detection on the LED chips with different heights. In order to make the objects, technical solutions and effects of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description and claims, the terms "a" and "an" can mean "one or more" unless the context specifically states otherwise.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between the embodiments may be combined with each other, but must be based on the realization of the technical solutions by a person skilled in the art, and when the technical solutions are contradictory to each other or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Referring to fig. 5 to 7, the present invention provides a preferred embodiment of an LED detection device.
Referring to fig. 5 and 6, the LED detection device includes a detection circuit board 100, an elastic substrate 102, a fillable area 101, a light receiver 109, and a pressure sensing assembly 110. Specifically, the elastic substrate 102 is disposed at the lower end of the detection circuit board 100, a detection electrode is disposed on a surface of the elastic substrate 102 away from the detection circuit board 100, the detection electrode is electrically connected to the detection circuit board 100, the detection electrode faces an electrode of an LED chip to be detected, and the LED chip to be detected is disposed on a chip substrate 108. The fillable area 101 is disposed between the detection circuit board 100 and the elastic substrate 102, the optical receiver is disposed on a side of the chip substrate away from the LED chip to be detected, that is, the optical receiver 109 is disposed on a light emitting side of the LED chip to be detected, the pressure sensing assemblies 110 are disposed in plural, the pressure sensing assemblies 110 are disposed on an upper end surface of the detection circuit board 100, and a position of each pressure sensing assembly 110 corresponds to a position of the LED chip to be detected, so as to detect a pressure on each position of the detection circuit board 100 corresponding to the LED chip to be detected. The circuit of the detection circuit board 100 is the same as the circuit of the elastic substrate 102, and the fillable area 101 is disposed between the detection circuit board 100 and the elastic substrate 102, so that the detection circuit board 100 can also be used as a substrate for fixing the fillable area 101 during filling.
Through the technical scheme, after the fillable area 101 is filled, the detection electrode is in contact with the LED chip to be detected, that is, the detection electrode is attached to the electrode of the LED chip to be detected, and after the detection electrode is attached to the electrode of the LED chip to be detected, if the pressure sensing assembly 110 displays a green light, it indicates that the LED chip is in the current detection position, and if the pressure sensing assembly 110 displays a red light, it indicates that the LED chip is not in the current detection position, so that it is possible to record which positions have LED chips and which positions do not have LED chips, that is, the device is capable of recording coordinates without LED chips. Meanwhile, after the electrode of the to-be-detected LED chip is attached to the detection electrode, the to-be-detected LED chip emits light, the light receiver 109 receives a light source emitted by the to-be-detected LED chip, and if the light source is not received by the light receiver 109, the LED chip at the current position can be judged to be poor in electrical property, that is, after the current position is confirmed to have the LED chip, and the light receiver 109 does not receive the light source (light beam), the LED chip at the current position is judged to be poor in electrical property, so that the chip with poor electrical property can be screened out, the coordinate of the poor LED chip is recorded, and the subsequent detection time is shortened. In addition, for prior art, this application does not need mechanical type ground to remove the probe position, has avoided the LED chip to be stabbed by the probe, can accurately aim at LED chip electrode and carry out the circular telegram and improve the detection speed of LED chip.
Referring to fig. 6 and 7, in an embodiment, the detection electrodes include a P electrode 103, an N electrode 104, a P common electrode 1031, and an N common electrode 1041. Specifically, the P electrode 103 of the circuit board is opposite to the P electrode of the LED chip to be detected, the N electrode 104 of the circuit board is opposite to the N electrode of the LED chip to be detected, the P electrode 103 of the circuit board is connected to the P common electrode 1031 of the circuit board, and the N electrode 104 of the circuit board is connected to the N common electrode 1041 of the circuit board. According to actual requirements, the design of the LED chips may vary, for example, the area size and the pitch of the LED chips may vary, and thus the positions of the P electrode 103 and the N electrode 104 on the circuit board on the flexible substrate 102 may also vary. This application through with circuit board P electrode 103 respectively with circuit board P common electrode 1031 is connected, circuit board N electrode 104 respectively with circuit board N common electrode 1041 is connected to reach the LED chip design that can be according to equidimension not, make different detection electrode position (circuit board P electrode 103 and circuit board N electrode 104) and carry out electrical detection on elastic substrate 102.
With continued reference to fig. 6, in a specific implementation manner of an embodiment, the LED chip to be detected includes a chip body 107 and an electrode to be detected. Specifically, the chip body 107 is disposed on the upper end surface of the chip substrate 108, and the electrode to be detected is disposed on the upper end surface of the chip body 107.
More specifically, the electrodes to be detected comprise a chip P electrode 105 and a chip N electrode 106, the chip P electrode 105 faces the circuit board P electrode 103, and the chip N electrode 106 faces the circuit board N electrode 104. After the fillable area 101 is filled, the detection electrode is attached to the LED chip to be detected, that is, the P electrode 103 of the circuit board is attached to the P electrode 105 of the chip, and the N electrode 104 of the circuit board is attached to the N electrode 106 of the chip, if the detected LED chip to be detected is a qualified LED chip at the current position, the LED chip to be detected currently emits a light source (light beam), the light receiver 109 can receive the light source (light beam) emitted by the LED chip to be detected previously, and if the light receiver 109 does not receive the light source (light beam), it is determined that the LED chip to be detected currently is a bad LED chip.
In one embodiment, the elastic substrate 102 is made of a polymer material. For example, the polymer material may be polydimethylsiloxane, polyimide, polymethylmethacrylate, or the like.
Continuing to refer to fig. 6, in one embodiment, the fillable region 101 is filled with a gas or a fluid. Specifically, the fillable area 101 uses a material for repeated filling, such as a gas or a fluid, wherein the gas may be atmospheric air or nitrogen, and the fluid may be deionized water. It should be noted that the fluid used in the fillable area 101 is a recyclable fluid without volatile properties. In the prior art, if the LED chips to be detected have different heights, the conventional probes cannot be used for electrical detection. According to the LED chip electrical property detection device, the fillable area 101 is additionally arranged between the detection circuit board 100 and the elastic substrate 102, the detection electrodes are manufactured above the elastic substrate 102 (flexible substrate), and after the fillable area 101 is filled, the detection electrodes can be in contact with chips with different heights, so that electrical property detection can be performed on the LED chips with different heights. Wherein, the total thickness of the LED chip is about 10 microns, so the height adjustment range of the fillable region 101 is 0-10 microns.
Referring to fig. 5, fig. 6 and fig. 7, the present invention further provides a method for detecting an LED, including:
providing a detection circuit board 100 and an elastic substrate 102, wherein a fillable area 101 is arranged between the detection circuit board 100 and the elastic substrate 102; one surface of the elastic substrate 102, which is far away from the detection circuit board 100, is provided with a detection electrode, the detection electrode is electrically connected with the detection circuit board 100, and the detection electrode faces the electrode of the LED chip to be detected;
filling the fillable region 101 so that the detection electrode is in contact with the electrode of the LED chip to be detected;
providing a pressure sensing assembly 110, and after the detection electrode is contacted with the electrode to be detected, when the pressure sensing assembly 110 displays a green light, determining that the LED chip to be detected is arranged at the current detection position;
providing an optical receiver 109, and when the optical receiver 109 receives the light source (light beam) emitted by the LED chip to be detected at the current detection position, determining that the LED chip to be detected at the current detection position is a benign LED chip. Specifically, as mentioned in the description of an LED detection device, it is not described herein again.
In a specific implementation manner of an embodiment, when the light receiver 109 does not receive the light source (light beam) emitted by the LED chip to be detected, it is determined that the LED chip to be detected at the current position is an electrically poor LED chip. As described in detail for an LED detection device, it is not described herein again.
In summary, the LED detection apparatus and method provided by the present invention includes: a detection circuit board 100; the elastic substrate 102 is arranged at the lower end of the detection circuit board 100, one surface of the elastic substrate 102, which is far away from the detection circuit board 100, is provided with a detection electrode, the detection electrode is electrically connected with the detection circuit board, and the detection electrode is opposite to an electrode of the LED chip to be detected; and a fillable area 101, wherein the fillable area 101 is disposed between the detection circuit board 100 and the elastic substrate 102. According to the invention, after the fillable area 101 is filled, the detection electrode is contacted with the electrode to be detected so as to judge whether the LED chip to be detected at the current detection position is a chip with poor electrical property and accurately align the LED chip electrode for electrifying, so that the LED chip with poor electrical property can be screened out, the coordinate of the LED chip with poor electrical property is recorded, and the subsequent detection time is shortened. In addition, the LED chips on the chip substrate 108 do not need to be electrified one by the probes, namely, the positions of the probes do not need to be mechanically moved, so that the LED chips are prevented from being stabbed by the probes, the electrodes of the LED chips can be accurately aligned to be electrified on the other hand, and the detection speed of the LED chips is improved.
It will be understood that the invention is not limited to the examples described above, but that modifications and variations will occur to those skilled in the art in light of the above teachings, and that all such modifications and variations are considered to be within the scope of the invention as defined by the appended claims.
Claims (7)
1. An LED detection device, comprising:
detecting the circuit board;
the elastic substrate is arranged at the lower end of the detection circuit board, one surface of the elastic substrate, which is far away from the detection circuit board, is provided with a detection electrode which is used for rightly facing an electrode of the LED chip to be detected, and the detection electrode is electrically connected with the detection circuit board; and
the fillable area is arranged between the detection circuit board and the elastic substrate;
the detection electrode includes:
the circuit board P electrode is used for rightly facing the P electrode of the LED chip to be detected;
the circuit board N electrode is used for rightly facing the N electrode of the LED chip to be detected;
the circuit board P common electrode is respectively connected with the circuit board P common electrodes; and
the circuit board N electrode is respectively connected with the circuit board N common electrodes;
further comprising: the light receiver is arranged on the light emitting side of the LED chip to be detected;
further comprising: the pressure sensing assemblies are arranged on the upper end face of the detection circuit board, the position of each pressure sensing assembly corresponds to the position of the LED chip to be detected, and the pressure sensing assemblies are used for detecting the pressure of each position, corresponding to the LED chip to be detected, on the detection circuit board.
2. The LED detection apparatus according to claim 1, wherein the LED chip to be detected is disposed on a chip substrate.
3. The LED detection apparatus according to claim 2, wherein the LED chip to be detected comprises:
the chip body is arranged on the upper end face of the chip substrate; and
the electrode to be detected is arranged on the upper end face of the chip body;
wherein the electrode to be detected comprises:
the chip P electrode is right opposite to the circuit board P electrode; and
and the chip N electrode is right opposite to the circuit board N electrode.
4. The LED detection apparatus according to any one of claims 1 to 3, wherein the elastic substrate is made of a polymer material, and the polymer material includes at least one of polydimethylsiloxane, polyimide, and polymethyl methacrylate.
5. The LED detection apparatus according to any one of claims 1 to 3, wherein the fillable region is filled with a gas or fluid; wherein the gas is atmospheric air or nitrogen, and the fluid is deionized water.
6. An LED detection method, comprising:
providing a detection circuit board and an elastic substrate, wherein a fillable area is arranged between the detection circuit board and the elastic substrate; one surface of the elastic substrate, which is far away from the detection circuit board, is provided with a detection electrode which is used for rightly facing an electrode of the LED chip to be detected, and the detection electrode is electrically connected with the detection circuit board;
filling the fillable area to enable the detection electrode to be in contact with the electrode of the LED chip to be detected;
providing a pressure sensing assembly, and judging that the LED chip to be detected is arranged at the current detection position if the pressure sensing assembly displays a green light after the detection electrode is contacted with the electrode of the LED chip to be detected;
providing an optical receiver, and when the optical receiver receives a light beam emitted by the LED chip to be detected at the current detection position, judging that the LED chip to be detected at the current position is a benign LED chip;
and when the detection electrode spacing is adjusted, selecting one N electrode and one P electrode from the N common electrode and the P common electrode respectively to form a pair of detection electrode pairs so as to adapt to the LED chips with different sizes.
7. The LED detection method according to claim 6, wherein when the light receiver does not receive the light beam emitted by the LED chip to be detected, it is determined that the LED chip to be detected at the current position is an LED chip with poor electrical properties.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2019/111065 WO2021072603A1 (en) | 2019-10-14 | 2019-10-14 | Led testing device and method |
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| CN111201593A CN111201593A (en) | 2020-05-26 |
| CN111201593B true CN111201593B (en) | 2022-12-20 |
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| WO (1) | WO2021072603A1 (en) |
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| CN112974289B (en) * | 2020-11-09 | 2023-04-28 | 重庆康佳光电技术研究院有限公司 | Sorting method, sorting apparatus, computer-readable storage medium, and electronic device |
| CN113451164B (en) * | 2020-11-11 | 2022-05-27 | 重庆康佳光电技术研究院有限公司 | Detection method and detection structure of display back plate |
| CN114280453B (en) * | 2021-12-24 | 2023-10-24 | 厦门大学 | Miniature flexible electrode array and testing method |
| CN115840128B (en) * | 2022-10-18 | 2023-09-22 | 深圳市三一联光智能设备股份有限公司 | Novel photoelectric testing mechanism and chip testing jig module thereof |
| CN116544132B (en) * | 2023-07-07 | 2023-12-15 | 广东芯乐光光电科技有限公司 | Mini-LED patch detection equipment and detection method |
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| JP2001056346A (en) * | 1999-08-19 | 2001-02-27 | Fujitsu Ltd | Probe card and method for testing wafer on which a plurality of semiconductor device are formed |
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| US4820976A (en) * | 1987-11-24 | 1989-04-11 | Advanced Micro Devices, Inc. | Test fixture capable of electrically testing an integrated circuit die having a planar array of contacts |
| US5773986A (en) * | 1995-04-03 | 1998-06-30 | Motorola, Inc | Semiconductor wafer contact system and method for contacting a semiconductor wafer |
| US6468098B1 (en) * | 1999-08-17 | 2002-10-22 | Formfactor, Inc. | Electrical contactor especially wafer level contactor using fluid pressure |
| US6975016B2 (en) * | 2002-02-06 | 2005-12-13 | Intel Corporation | Wafer bonding using a flexible bladder press and thinned wafers for three-dimensional (3D) wafer-to-wafer vertical stack integration, and application thereof |
| JP4825457B2 (en) * | 2005-06-21 | 2011-11-30 | ルネサスエレクトロニクス株式会社 | Manufacturing method of semiconductor integrated circuit device |
| KR100952703B1 (en) * | 2008-12-29 | 2010-04-13 | 에이티아이 주식회사 | Inspection apparratus of surface using dual camera |
| US9805891B2 (en) * | 2014-10-25 | 2017-10-31 | ComponentZee, LLC | Multiplexing, switching and testing devices and methods using fluid pressure |
| US10003149B2 (en) * | 2014-10-25 | 2018-06-19 | ComponentZee, LLC | Fluid pressure activated electrical contact devices and methods |
| KR102316101B1 (en) * | 2015-06-24 | 2021-10-26 | 엘지디스플레이 주식회사 | Display device and test method thereof |
| KR20170096258A (en) * | 2016-02-15 | 2017-08-24 | 삼성전자주식회사 | Testing apparatus |
| KR101754528B1 (en) * | 2016-03-23 | 2017-07-06 | 한국광기술원 | Transfer assembly with dry adhesion structure and method for transferring led structure assembly using the same and led structure assembly |
| WO2018236767A2 (en) * | 2017-06-20 | 2018-12-27 | Tesoro Scientific, Inc. | Light emitting diode (led) test apparatus and method of manufacture |
| KR20190021101A (en) * | 2017-08-22 | 2019-03-05 | 삼성전자주식회사 | Probe card, test apparatus comprising the probe card, testing method for testing and manufacturing semiconductor using the probe card |
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- 2019-10-14 WO PCT/CN2019/111065 patent/WO2021072603A1/en active Application Filing
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| JP2001056346A (en) * | 1999-08-19 | 2001-02-27 | Fujitsu Ltd | Probe card and method for testing wafer on which a plurality of semiconductor device are formed |
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