CN111200902B - Three-dimensional ceramic circuit board - Google Patents
Three-dimensional ceramic circuit board Download PDFInfo
- Publication number
- CN111200902B CN111200902B CN202010014445.0A CN202010014445A CN111200902B CN 111200902 B CN111200902 B CN 111200902B CN 202010014445 A CN202010014445 A CN 202010014445A CN 111200902 B CN111200902 B CN 111200902B
- Authority
- CN
- China
- Prior art keywords
- ceramic
- circuit
- dimensional
- substrate
- metalized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
- F21V29/83—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks the elements having apertures, ducts or channels, e.g. heat radiation holes
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application discloses a three-dimensional ceramic circuit substrate, which comprises a ceramic substrate, a bulge part and a circuit board, wherein the bulge part is arranged on the periphery of the lower part of the ceramic substrate and protrudes outwards, and a metalized upper through hole and a metalized lower through hole are formed in the bulge part; the lower side surface of the upper part of the ceramic substrate is provided with a first circuit connecting layer, the upper side of the upper part of the ceramic substrate is provided with a second circuit connecting layer, and the upper part of the ceramic substrate is also provided with a metalized connecting hole which is vertically communicated and is connected with the first circuit connecting layer and the second circuit connecting layer; the periphery of the middle part of the ceramic substrate is provided with an intermediate connecting line strip which extends downwards to connect the metalized upper and lower through holes and extends upwards to connect the first line connecting layer. This application is through the perforating hole connection power about the metallization, connects first circuit connection layer through intermediate junction line way strip thereupon, then through the metallization about perforating hole intercommunication second circuit connection layer so that ceramic base member can realize three-dimensional circuit substrate, then conveniently side connection electrical components spare on ceramic base member to can reach the application demand of three-dimensional circuit.
Description
[ technical field ] A method for producing a semiconductor device
The application relates to the technical field of PCBs, in particular to a three-dimensional ceramic circuit substrate.
[ background of the invention ]
At present, as the electronic technology is gradually deepened in various application fields, the high integration of the circuit board becomes a necessary trend, the high integration packaging module requires a good heat dissipation bearing system, and the disadvantages of the traditional circuit boards FR-4 and CEM-3 on TC heat conductivity coefficient become a bottleneck restricting the development of the electronic technology.
In recent years, the LED industry has been developed rapidly, and higher requirements are also put on the TC index of the circuit board. In the field of high-power LED illumination, materials with good heat dissipation performance such as metal and ceramic are often adopted to prepare a circuit substrate, the heat conductivity coefficient of the high-heat-conductivity aluminum substrate is generally 1-4W/M.K, and the heat conductivity coefficient of the ceramic substrate can reach about 220W/M.K according to different preparation methods and material formulas.
However, most of the existing ceramic circuit boards are planar circuit boards, which cannot meet the actual requirement for three-dimensional circuit boards, and therefore, the development of a three-dimensional ceramic circuit substrate is urgently needed by those skilled in the art.
[ summary of the invention ]
The present application is directed to the above-mentioned conventional problems, and provides a three-dimensional ceramic circuit board.
In order to solve the technical problem, the method is realized by the following technical scheme:
the three-dimensional ceramic circuit substrate comprises a ceramic substrate, a bulge part which is arranged on the periphery of the lower part of the ceramic substrate and protrudes outwards, and a metalized upper and lower through hole is formed in the bulge part;
the lower side surface of the upper part of the ceramic substrate is provided with a first circuit connecting layer, the upper side of the upper part of the ceramic substrate is provided with a second circuit connecting layer, and the upper part of the ceramic substrate is also provided with a metalized connecting hole which is vertically communicated and is connected with the first circuit connecting layer and the second circuit connecting layer;
the periphery of the middle of the ceramic substrate is provided with an intermediate connecting line strip which extends downwards to connect the metalized upper and lower through holes and extends upwards to connect the first line connecting layer, and the shape of the intermediate connecting line strip is spiral.
In the three-dimensional ceramic circuit board as described above, the number of the projections is 3, and the number of the intermediate connection lines is 3.
In the three-dimensional ceramic circuit board, the inner side walls of the metalized upper and lower through holes and the metalized connecting hole are sequentially provided with the titanium carbide metal layer and the copper metal layer from outside to inside.
In the three-dimensional ceramic circuit board, the distance between the upper side surface of the protruding part and the lower side surface of the upper part of the ceramic substrate is 8-16 mm.
According to the three-dimensional ceramic circuit substrate, the ceramic substrate is provided with the vertically through heat dissipation holes along the vertical direction of the ceramic substrate, and the vertically through heat dissipation holes are used for heat dissipation.
In the three-dimensional ceramic circuit board, the circumferential side of the ceramic substrate is provided with circumferential through heat dissipation holes communicated with the up-down through heat dissipation holes for circumferential ventilation and heat dissipation.
In the three-dimensional ceramic circuit board, the ceramic substrate is an aluminum nitride ceramic or a silicon carbide ceramic.
Compared with the prior art, the application has the following advantages:
this three-dimensional ceramic circuit substrate of application passes through perforating hole connection power about the metallization passes through thereupon intermediate junction line way strip is connected first circuit connection layer, then is passing through the metallization connecting hole intercommunication second circuit connection layer is so that three-dimensional circuit substrate can be realized to the ceramic base member, then the convenience is in side connection electrical components spare on the ceramic base member to can reach three-dimensional circuit's application demand.
[ description of the drawings ]
Fig. 1 is a perspective view of a three-dimensional ceramic circuit board according to the present invention.
Fig. 2 is a partial enlarged view i of fig. 1.
Fig. 3 is a partial cross-sectional view of the upper portion of the three-dimensional ceramic circuit substrate of the present application.
[ detailed description ] embodiments
The present application will be described in further detail below with reference to the accompanying drawings by way of specific embodiments.
As shown in fig. 1 to 3, the three-dimensional ceramic circuit board includes a ceramic substrate 1, a protrusion 11 protruding outward from the lower periphery of the ceramic substrate 1, and a metalized upper and lower through hole 111 formed on the protrusion 11;
a first circuit connecting layer 12 is arranged on the lower side surface of the upper part of the ceramic substrate 1, a second circuit connecting layer 13 is arranged on the upper side of the upper part of the ceramic substrate, and a metalized connecting hole 14 which is vertically communicated and is connected with the first circuit connecting layer 12 and the second circuit connecting layer 13 is further formed on the upper part of the ceramic substrate;
the ceramic base body 1 is provided with an intermediate connection line strip 15 extending downwards to connect the metalized upper and lower through holes 111 and extending upwards to connect the first line connection layer 12 on the periphery of the middle part, and the intermediate connection line strip 15 is spiral in shape.
This three-dimensional ceramic circuit substrate of application passes through perforating hole 111 connects the power about the metallization, passes through thereupon intermediate junction line strip 15 connects first circuit connection layer 12, then is passing through metallization connecting hole 14 intercommunication second circuit connection layer 13 is so that ceramic base member 1 can realize three-dimensional circuit substrate, then the convenience is in side connection electrical components spare on ceramic base member 1 to can reach three-dimensional circuit's application demand.
Further, the number of the protruding portions 11 is 3, and the protruding portions can be respectively connected with the positive electrode, the negative electrode and the ground electrode of the power supply, and the number of the intermediate connection line strips 15 is 3. Its advantage is convenient connection to power supply.
Furthermore, the inner side walls of the metalized upper and lower through holes 111 and the metalized connection hole 14 are sequentially provided with a titanium carbide metal layer and a copper metal layer from outside to inside. The titanium carbide metal layer is used for depositing the transition layer made by the copper metal layer, and has the advantages of not only being convenient to deposit the copper metal layer, but also improving the welding conductive capacity of the copper metal layer.
Furthermore, the distance between the upper side of the protrusion 11 and the lower side of the upper portion of the ceramic substrate 1 is 8-16 mm, which is advantageous in that the distance between the upper side and the lower side can effectively reduce the electronic interference.
Furthermore, the ceramic substrate 1 is provided with a through hole 16 along the vertical direction thereof for heat dissipation. Its advantage lies in realizing the ventilation cooling effect.
Furthermore, a circumferential through heat dissipation hole 17 communicated with the up-and-down through heat dissipation hole 16 for circumferential ventilation and heat dissipation is formed on the circumferential side of the ceramic substrate 1. Its advantage lies in further improving ventilation cooling's result of use.
Furthermore, the ceramic substrate 1 is made of aluminum nitride ceramic or silicon carbide ceramic. The preparation method has the advantages that the existing aluminum nitride ceramic or silicon carbide ceramic is mature in technology preparation and convenient to apply.
As described above, the embodiments of the present application have been described in detail, but the present application is not limited to the above embodiments. Even if various changes are made in the present application, the protection scope of the present application is still included.
Claims (7)
1. Three-dimensional ceramic circuit substrate, including ceramic base member (1), its characterized in that: the ceramic base body (1) is provided with a bulge part (11) which is arranged on the periphery of the lower part of the ceramic base body (1) and protrudes outwards, and a metalized upper and lower through hole (111) is formed in the bulge part (11);
a first circuit connecting layer (12) is arranged on the lower side surface of the upper part of the ceramic substrate (1), a second circuit connecting layer (13) is arranged on the upper side of the upper part of the ceramic substrate, and a metalized connecting hole (14) which is vertically communicated and connected with the first circuit connecting layer (12) and the second circuit connecting layer (13) is further formed in the upper part of the ceramic substrate;
ceramic base member (1) middle part week side is equipped with downwardly extending and connects metalized upper and lower perforating hole (111) and upwardly extending connects intermediate junction line strip (15) of first line connection layer (12), the shape of intermediate junction line strip (15) is the heliciform.
2. The three-dimensional ceramic circuit substrate of claim 1, wherein: the number of the convex parts (11) is 3, and the number of the intermediate connecting line strips (15) is 3.
3. The three-dimensional ceramic circuit substrate of claim 2, wherein: and the inner side walls of the metalized upper and lower through holes (111) and the metalized connecting hole (14) are sequentially provided with a titanium carbide metal layer and a copper metal layer from outside to inside.
4. The three-dimensional ceramic circuit substrate of claim 3, wherein: the distance between the upper side surface of the convex part (11) and the lower side surface of the upper part of the ceramic base body (1) is 8-16 mm.
5. The three-dimensional ceramic circuit substrate of claim 1, wherein: and the ceramic base body (1) is provided with an up-down through heat dissipation hole (16) which is communicated up and down along the vertical direction of the ceramic base body and used for heat dissipation.
6. The three-dimensional ceramic circuit substrate of claim 5, wherein: and circumferential through radiating holes (17) communicated with the up-and-down through radiating holes (16) and used for circumferential ventilation and radiation are formed in the circumferential side of the ceramic base body (1).
7. The three-dimensional ceramic circuit substrate of claim 1, wherein: the ceramic matrix (1) is made of aluminum nitride ceramic or silicon carbide ceramic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010014445.0A CN111200902B (en) | 2020-01-07 | 2020-01-07 | Three-dimensional ceramic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010014445.0A CN111200902B (en) | 2020-01-07 | 2020-01-07 | Three-dimensional ceramic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111200902A CN111200902A (en) | 2020-05-26 |
| CN111200902B true CN111200902B (en) | 2021-06-29 |
Family
ID=70746685
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010014445.0A Active CN111200902B (en) | 2020-01-07 | 2020-01-07 | Three-dimensional ceramic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111200902B (en) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2374980Y (en) * | 1999-05-19 | 2000-04-19 | 鑫成科技股份有限公司 | Integrated circuit member stereo combination structure |
| US6470545B1 (en) * | 1999-09-15 | 2002-10-29 | National Semiconductor Corporation | Method of making an embedded green multi-layer ceramic chip capacitor in a low-temperature co-fired ceramic (LTCC) substrate |
| JP2004158595A (en) * | 2002-11-06 | 2004-06-03 | Sanyo Electric Co Ltd | Circuit device, circuit module, and method for manufacturing circuit device |
| US7183176B2 (en) * | 2004-08-25 | 2007-02-27 | Agency For Science, Technology And Research | Method of forming through-wafer interconnects for vertical wafer level packaging |
| CN103298243B (en) * | 2006-07-14 | 2016-05-11 | 斯塔布科尔技术公司 | There is the increasing layer printed substrate substrate of the core layer of a forming circuit part |
-
2020
- 2020-01-07 CN CN202010014445.0A patent/CN111200902B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN111200902A (en) | 2020-05-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US7054159B2 (en) | Printed wiring board having heat radiating means and method of manufacturing the same | |
| CN107331659B (en) | LED circuit board, terminal equipment and manufacturing method of LED circuit board | |
| CN1333560A (en) | Semiconductor package and making method thereof | |
| CN112447625A (en) | Double-side heat dissipation large-size chip flip packaging structure and packaging method | |
| CN110268520A (en) | Method for integrated power chip and the busbar for forming radiator | |
| CN205071462U (en) | Multilayer circuit board heat conduction radiation structure | |
| CN111200902B (en) | Three-dimensional ceramic circuit board | |
| CN117153798B (en) | Packaging structure of power module | |
| CN216413057U (en) | Semiconductor circuit having a plurality of transistors | |
| CN216413056U (en) | Chip ceramic packaging structure integrating large current ground and radiating fin | |
| CN102811554A (en) | Base plate for high-power electronic device module and preparation method thereof | |
| CN212851195U (en) | Printed circuit board | |
| US20230156905A1 (en) | Circuit board | |
| CN107360664A (en) | A kind of heat-conduction circuit board and preparation method thereof | |
| CN219575622U (en) | Packaging structure, circuit board structure and electronic equipment | |
| CN111212517B (en) | Three-dimensional ceramic-based circuit board | |
| CN111029305A (en) | Conductive cap and semiconductor device package | |
| CN216671600U (en) | Novel plastic package power device packaging platform | |
| CN210007992U (en) | kinds of multi-layer printed composite integrated circuit board | |
| CN216450397U (en) | Flexible electrical connection structure and power module | |
| CN216960600U (en) | High heat-resistant double-layer resin circuit board | |
| CN218277264U (en) | Embedded heat dissipation type ceramic substrate | |
| CN110383473A (en) | Equipped with the power electronic circuit and integrated approach of the busbar for forming radiator | |
| CN221306165U (en) | Multilayer heat conduction circuit board | |
| CN217086569U (en) | Semiconductor circuit with rectifier circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |