CN111185433A - 可开盒即用的蓝宝石晶片清洗工艺 - Google Patents
可开盒即用的蓝宝石晶片清洗工艺 Download PDFInfo
- Publication number
- CN111185433A CN111185433A CN202010039173.XA CN202010039173A CN111185433A CN 111185433 A CN111185433 A CN 111185433A CN 202010039173 A CN202010039173 A CN 202010039173A CN 111185433 A CN111185433 A CN 111185433A
- Authority
- CN
- China
- Prior art keywords
- cleaning
- wafer
- sapphire wafer
- agent
- time
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 117
- 229910052594 sapphire Inorganic materials 0.000 title claims abstract description 100
- 239000010980 sapphire Substances 0.000 title claims abstract description 100
- 238000000034 method Methods 0.000 title claims abstract description 49
- 230000008569 process Effects 0.000 title claims abstract description 42
- 239000012459 cleaning agent Substances 0.000 claims abstract description 71
- 238000001035 drying Methods 0.000 claims abstract description 49
- 229910021642 ultra pure water Inorganic materials 0.000 claims abstract description 28
- 239000012498 ultrapure water Substances 0.000 claims abstract description 28
- 239000003995 emulsifying agent Substances 0.000 claims abstract description 25
- 238000005507 spraying Methods 0.000 claims abstract description 23
- 239000003960 organic solvent Substances 0.000 claims abstract description 21
- 238000005406 washing Methods 0.000 claims abstract description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 21
- 239000013543 active substance Substances 0.000 claims description 14
- 230000001680 brushing effect Effects 0.000 claims description 14
- 239000002738 chelating agent Substances 0.000 claims description 14
- -1 polyoxyethylene Polymers 0.000 claims description 12
- 239000003945 anionic surfactant Substances 0.000 claims description 11
- 239000002736 nonionic surfactant Substances 0.000 claims description 11
- 239000004480 active ingredient Substances 0.000 claims description 9
- 238000005498 polishing Methods 0.000 claims description 9
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 8
- 229920000056 polyoxyethylene ether Polymers 0.000 claims description 8
- 229940051841 polyoxyethylene ether Drugs 0.000 claims description 8
- 239000002131 composite material Substances 0.000 claims description 7
- 239000002270 dispersing agent Substances 0.000 claims description 7
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims description 6
- 229920003171 Poly (ethylene oxide) Polymers 0.000 claims description 6
- JTXMVXSTHSMVQF-UHFFFAOYSA-N 2-acetyloxyethyl acetate Chemical compound CC(=O)OCCOC(C)=O JTXMVXSTHSMVQF-UHFFFAOYSA-N 0.000 claims description 5
- 239000003513 alkali Substances 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims description 5
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical compound NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 claims description 4
- MZRVEZGGRBJDDB-UHFFFAOYSA-N N-Butyllithium Chemical compound [Li]CCCC MZRVEZGGRBJDDB-UHFFFAOYSA-N 0.000 claims description 4
- CYTYCFOTNPOANT-UHFFFAOYSA-N Perchloroethylene Chemical group ClC(Cl)=C(Cl)Cl CYTYCFOTNPOANT-UHFFFAOYSA-N 0.000 claims description 4
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 claims description 4
- 150000003973 alkyl amines Chemical class 0.000 claims description 4
- 239000003795 chemical substances by application Substances 0.000 claims description 4
- 235000014113 dietary fatty acids Nutrition 0.000 claims description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 4
- 239000000194 fatty acid Substances 0.000 claims description 4
- 229930195729 fatty acid Natural products 0.000 claims description 4
- 230000000149 penetrating effect Effects 0.000 claims description 4
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims description 4
- PMZURENOXWZQFD-UHFFFAOYSA-L Sodium Sulfate Chemical compound [Na+].[Na+].[O-]S([O-])(=O)=O PMZURENOXWZQFD-UHFFFAOYSA-L 0.000 claims description 3
- 229910052938 sodium sulfate Inorganic materials 0.000 claims description 3
- 235000011152 sodium sulphate Nutrition 0.000 claims description 3
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 2
- 239000002202 Polyethylene glycol Substances 0.000 claims description 2
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 2
- 229920000388 Polyphosphate Polymers 0.000 claims description 2
- BCKXLBQYZLBQEK-KVVVOXFISA-M Sodium oleate Chemical compound [Na+].CCCCCCCC\C=C/CCCCCCCC([O-])=O BCKXLBQYZLBQEK-KVVVOXFISA-M 0.000 claims description 2
- 150000004996 alkyl benzenes Chemical class 0.000 claims description 2
- 150000005215 alkyl ethers Chemical class 0.000 claims description 2
- 125000005037 alkyl phenyl group Chemical group 0.000 claims description 2
- 229940077388 benzenesulfonate Drugs 0.000 claims description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical compound OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 claims description 2
- 229960001484 edetic acid Drugs 0.000 claims description 2
- 125000006038 hexenyl group Chemical group 0.000 claims description 2
- 150000007530 organic bases Chemical class 0.000 claims description 2
- MPNNOLHYOHFJKL-UHFFFAOYSA-N peroxyphosphoric acid Chemical compound OOP(O)(O)=O MPNNOLHYOHFJKL-UHFFFAOYSA-N 0.000 claims description 2
- 229920000570 polyether Polymers 0.000 claims description 2
- 229920001223 polyethylene glycol Polymers 0.000 claims description 2
- 239000001205 polyphosphate Substances 0.000 claims description 2
- 235000011176 polyphosphates Nutrition 0.000 claims description 2
- 229920001451 polypropylene glycol Polymers 0.000 claims description 2
- 229940037312 stearamide Drugs 0.000 claims description 2
- 239000004094 surface-active agent Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000002245 particle Substances 0.000 abstract description 6
- 239000003344 environmental pollutant Substances 0.000 abstract description 5
- 231100000719 pollutant Toxicity 0.000 abstract description 5
- 238000001179 sorption measurement Methods 0.000 abstract description 5
- 238000005201 scrubbing Methods 0.000 abstract description 4
- 239000010419 fine particle Substances 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 131
- 239000000758 substrate Substances 0.000 description 15
- 239000000243 solution Substances 0.000 description 12
- 239000000047 product Substances 0.000 description 9
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 8
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 5
- 238000002791 soaking Methods 0.000 description 4
- 238000004506 ultrasonic cleaning Methods 0.000 description 4
- 230000007547 defect Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 239000002253 acid Substances 0.000 description 2
- 230000009471 action Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000009776 industrial production Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 239000011259 mixed solution Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000018044 dehydration Effects 0.000 description 1
- 238000006297 dehydration reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004945 emulsification Methods 0.000 description 1
- 150000002191 fatty alcohols Chemical group 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000011859 microparticle Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 230000003068 static effect Effects 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/12—Brushes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/04—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by a combination of operations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B11/00—Machines or apparatus for drying solid materials or objects with movement which is non-progressive
- F26B11/02—Machines or apparatus for drying solid materials or objects with movement which is non-progressive in moving drums or other mainly-closed receptacles
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F26—DRYING
- F26B—DRYING SOLID MATERIALS OR OBJECTS BY REMOVING LIQUID THEREFROM
- F26B3/00—Drying solid materials or objects by processes involving the application of heat
- F26B3/28—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun
- F26B3/30—Drying solid materials or objects by processes involving the application of heat by radiation, e.g. from the sun from infrared-emitting elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
- H01L21/02052—Wet cleaning only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0062—Processes for devices with an active region comprising only III-V compounds
- H01L33/0066—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound
- H01L33/007—Processes for devices with an active region comprising only III-V compounds with a substrate not being a III-V compound comprising nitride compounds
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Combustion & Propulsion (AREA)
- Life Sciences & Earth Sciences (AREA)
- Microbiology (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
Description
candela检测颗粒值/颗 | 开盒即用良率 | |
实施例1 | 32 | 91.67% |
实施例2 | 26 | 93.75% |
实施例3 | 29 | 92.36% |
对比例1 | 78 | 65.97% |
对比例2 | 65 | 70.14% |
Claims (11)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010039173.XA CN111185433B (zh) | 2020-01-14 | 2020-01-14 | 可开盒即用的蓝宝石晶片清洗工艺 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202010039173.XA CN111185433B (zh) | 2020-01-14 | 2020-01-14 | 可开盒即用的蓝宝石晶片清洗工艺 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111185433A true CN111185433A (zh) | 2020-05-22 |
CN111185433B CN111185433B (zh) | 2020-12-29 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202010039173.XA Active CN111185433B (zh) | 2020-01-14 | 2020-01-14 | 可开盒即用的蓝宝石晶片清洗工艺 |
Country Status (1)
Country | Link |
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CN (1) | CN111185433B (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112420490A (zh) * | 2020-11-19 | 2021-02-26 | 江苏天科合达半导体有限公司 | 一种抛光后SiC Wafer衬底的湿法清洗工艺 |
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KR20040024321A (ko) * | 2002-09-13 | 2004-03-20 | 엘지이노텍 주식회사 | 사파이어 웨이퍼 표면처리방법 |
CN103537453A (zh) * | 2013-08-20 | 2014-01-29 | 曾锡强 | 一种蓝宝石衬底晶片抛光后的超声清洗方法 |
CN104259133A (zh) * | 2014-07-31 | 2015-01-07 | 江苏吉星新材料有限公司 | 蓝宝石晶片退火前的清洗工艺 |
CN104259132A (zh) * | 2014-07-29 | 2015-01-07 | 蓝思科技股份有限公司 | 一种蓝宝石晶片清洗工艺 |
CN104440496A (zh) * | 2014-11-07 | 2015-03-25 | 江苏吉星新材料有限公司 | 一种新型蓝宝石晶片的清洗工艺 |
CN104772313A (zh) * | 2015-04-22 | 2015-07-15 | 蓝思科技股份有限公司 | 一种镀膜后的蓝宝石晶片的清洗方法 |
CN105280477A (zh) * | 2015-09-28 | 2016-01-27 | 山东浪潮华光光电子股份有限公司 | 一种蓝宝石晶片的清洗工艺 |
CN105903694A (zh) * | 2016-04-27 | 2016-08-31 | 上海超硅半导体有限公司 | 大尺寸蓝宝石衬底退火前的清洗及背面不良返工方法 |
CN106391548A (zh) * | 2016-09-23 | 2017-02-15 | 江苏吉星新材料有限公司 | 一种蓝宝石窗口片碱性清洗工艺 |
CN107164109A (zh) * | 2017-03-31 | 2017-09-15 | 吴江创源新材料科技有限公司 | 一种蓝宝石晶片退火前清洗液及其制备方法和清洗工艺 |
CN109092801A (zh) * | 2017-06-20 | 2018-12-28 | 蓝思科技(长沙)有限公司 | 一种蓝宝石晶片的清洗方法及其采用的设备 |
CN110586568A (zh) * | 2019-08-29 | 2019-12-20 | 江苏吉星新材料有限公司 | 一种用于蓝宝石衬底片碳化硼研磨后的清洗方法 |
-
2020
- 2020-01-14 CN CN202010039173.XA patent/CN111185433B/zh active Active
Patent Citations (12)
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KR20040024321A (ko) * | 2002-09-13 | 2004-03-20 | 엘지이노텍 주식회사 | 사파이어 웨이퍼 표면처리방법 |
CN103537453A (zh) * | 2013-08-20 | 2014-01-29 | 曾锡强 | 一种蓝宝石衬底晶片抛光后的超声清洗方法 |
CN104259132A (zh) * | 2014-07-29 | 2015-01-07 | 蓝思科技股份有限公司 | 一种蓝宝石晶片清洗工艺 |
CN104259133A (zh) * | 2014-07-31 | 2015-01-07 | 江苏吉星新材料有限公司 | 蓝宝石晶片退火前的清洗工艺 |
CN104440496A (zh) * | 2014-11-07 | 2015-03-25 | 江苏吉星新材料有限公司 | 一种新型蓝宝石晶片的清洗工艺 |
CN104772313A (zh) * | 2015-04-22 | 2015-07-15 | 蓝思科技股份有限公司 | 一种镀膜后的蓝宝石晶片的清洗方法 |
CN105280477A (zh) * | 2015-09-28 | 2016-01-27 | 山东浪潮华光光电子股份有限公司 | 一种蓝宝石晶片的清洗工艺 |
CN105903694A (zh) * | 2016-04-27 | 2016-08-31 | 上海超硅半导体有限公司 | 大尺寸蓝宝石衬底退火前的清洗及背面不良返工方法 |
CN106391548A (zh) * | 2016-09-23 | 2017-02-15 | 江苏吉星新材料有限公司 | 一种蓝宝石窗口片碱性清洗工艺 |
CN107164109A (zh) * | 2017-03-31 | 2017-09-15 | 吴江创源新材料科技有限公司 | 一种蓝宝石晶片退火前清洗液及其制备方法和清洗工艺 |
CN109092801A (zh) * | 2017-06-20 | 2018-12-28 | 蓝思科技(长沙)有限公司 | 一种蓝宝石晶片的清洗方法及其采用的设备 |
CN110586568A (zh) * | 2019-08-29 | 2019-12-20 | 江苏吉星新材料有限公司 | 一种用于蓝宝石衬底片碳化硼研磨后的清洗方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112420490A (zh) * | 2020-11-19 | 2021-02-26 | 江苏天科合达半导体有限公司 | 一种抛光后SiC Wafer衬底的湿法清洗工艺 |
CN112420490B (zh) * | 2020-11-19 | 2024-04-02 | 江苏天科合达半导体有限公司 | 一种抛光后SiC Wafer衬底的湿法清洗工艺 |
Also Published As
Publication number | Publication date |
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CN111185433B (zh) | 2020-12-29 |
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