CN111174461A - Thermoelectric refrigeration and magnetic card refrigeration composite refrigeration device and method based on thermal switch - Google Patents

Thermoelectric refrigeration and magnetic card refrigeration composite refrigeration device and method based on thermal switch Download PDF

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CN111174461A
CN111174461A CN202010101654.9A CN202010101654A CN111174461A CN 111174461 A CN111174461 A CN 111174461A CN 202010101654 A CN202010101654 A CN 202010101654A CN 111174461 A CN111174461 A CN 111174461A
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refrigeration
thermoelectric
composite
magnetic card
magnetic
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CN111174461B (en
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孙志刚
刘国强
何�雄
何斌
张孔斌
柯亚娇
赵文俞
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Wuhan University of Technology WUT
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Wuhan University of Technology WUT
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02BCLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00Energy efficient heating, ventilation or air conditioning [HVAC]

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Abstract

The invention relates to the technical field of refrigeration, and provides a thermoelectric refrigeration and magnetic card refrigeration composite refrigeration device based on a thermal switch, which comprises a thermoelectric/magnetic card composite refrigeration structure, wherein one opposite side of the thermoelectric/magnetic card composite refrigeration structure is respectively provided with a cold end and a hot end, and the cold end and the hot end are both provided with the thermal switch for conducting or blocking heat; the composite refrigeration device also comprises a pulse power supply for applying periodic current to the thermoelectric/magnetic card composite refrigeration structure and a magnet system for periodically magnetizing or demagnetizing, wherein the pulse power supply and the magnet system are matched with the thermal switch to control the cold end of the thermoelectric/magnetic card composite refrigeration structure to continuously refrigerate. The composite refrigeration method of thermoelectric refrigeration and magnetic card refrigeration based on the thermal switch comprises four steps S1-S4. The invention realizes the high-efficiency dual composite refrigeration of thermoelectric/magnetic card composite refrigeration and magnetic card refrigeration, and can greatly improve the refrigeration performance of the device.

Description

Thermoelectric refrigeration and magnetic card refrigeration composite refrigeration device and method based on thermal switch
Technical Field
The invention relates to the technical field of refrigeration, in particular to a thermoelectric refrigeration and magnetic card refrigeration composite refrigeration device and method based on a thermal switch.
Background
Thermoelectric refrigeration, also called semiconductor refrigeration or thermoelectric refrigeration, is a refrigeration technology based on the peltier effect, and the basic principle of the peltier effect is that current carriers in a semiconductor material migrate from a refrigeration end to a heating end under the action of an external electric field, and heat is carried from the refrigeration end to the heating end to realize refrigeration. The thermoelectric refrigeration technology has the advantages of simple structure, strong flexibility, easy integration, no pollution and the like. Therefore, thermoelectric refrigeration is one of the hot directions of research in the field of new refrigeration technology. However, thermoelectric refrigeration still has the problems of low thermoelectric conversion efficiency, low refrigeration power and the like, and further application of the thermoelectric refrigeration is limited. Therefore, the improvement of the internal conversion efficiency of the thermoelectric material and the structural optimization design of the thermoelectric refrigeration device are hot spots of research.
Magnetic card refrigeration is an energy-saving and environment-friendly solid-state refrigeration technology based on magnetic card effect, and the magnetic card effect refers to the phenomenon of heat absorption and heat release caused by the change of the magnetic moment order of a magnetic card material under a changing magnetic field. When the magnetic card material is magnetized, the magnetic entropy is reduced, the temperature is increased, and heat is released to the outside; when the magnetic card material is demagnetized, the magnetic entropy increases, the temperature decreases, and heat is absorbed from the outside. The magnetic card refrigeration has the advantages of high efficiency, compact structure, low working noise, safety, stability and the like. The heat efficiency of the traditional vapor compression refrigeration can only reach 5% -10% of the Carnot cycle, and the heat efficiency of the magnetic card refrigeration cycle can reach 30% -60% of the Carnot cycle, so that the development of the magnetic card refrigeration technology has important social and economic benefits. At present, in the mainstream design of magnetic card refrigeration devices and systems, an active magnetic regenerator is mainly adopted to realize magnetic reverse regenerative cycle. However, active magnetic regenerators use fluid as the heat exchange medium. Due to the limitation of convection heat transfer, the fluid can not transfer or absorb the heat generated by the magnetic card effect in a short time, so that the magnetic refrigeration device and system have the technical problems of low working frequency, large heat return loss and the like. Meanwhile, the complexity of the design of the fluid circulation loop also limits the application of magnetic card refrigeration to microminiaturization equipment. Therefore, it is one of the important points of research to find solid heat transfer medium and optimize the design of magnetic card device.
In recent years, researches show that the designed and prepared thermoelectric magnetic composite material induces a new thermoelectric magnetic effect by introducing the magnetic nano material into the thermoelectric material, can greatly enhance the performance of the thermoelectric material, and provides a new way for the development of refrigeration technology. In addition, there are two methods of refrigeration combined in the prior art. Shenjun et al provide a thermoelectric and magnetic refrigeration coupling device, which uses a composite material of thermoelectric material and magnetic card material as a refrigeration working medium to realize thermoelectric/magnetic card composite refrigeration (CN 109764575A). Meanwhile, in the field of thermal management, the thermal switch can be used for controlling and switching heat flow, the performance and reliability of devices can be improved, the thermal switch also has high heat conduction performance when being closed, and the heat pipe control characteristic of the thermal switch can be used for realizing high-efficiency circulating refrigeration. If a device with enhanced magnetism for dual compound refrigeration of thermoelectric compound refrigeration and magnetic card refrigeration can be designed and assisted with the characteristic of a thermal switch for auxiliary refrigeration, the feasibility of the refrigeration device can be improved to a greater extent and the performance optimization of the refrigeration device can be realized, which is of great significance.
Disclosure of Invention
The invention aims to provide a thermoelectric refrigeration and magnetic card refrigeration composite refrigeration device and method based on a thermal switch, which can at least solve part of defects in the prior art.
In order to achieve the above purpose, the embodiments of the present invention provide the following technical solutions: a thermoelectric refrigeration and magnetic card refrigeration composite refrigeration device based on a thermal switch comprises a thermoelectric/magnetic card composite refrigeration structure, wherein one opposite side of the thermoelectric/magnetic card composite refrigeration structure is a cold end and a hot end respectively, and the cold end and the hot end are both provided with the thermal switch for conducting or blocking heat; the composite refrigeration device also comprises a pulse power supply for applying periodic current to the thermoelectric/magnetic card composite refrigeration structure and a magnet system for periodically magnetizing or demagnetizing, wherein the pulse power supply and the magnet system are matched with the thermal switch to control the cold end of the thermoelectric/magnetic card composite refrigeration structure to continuously refrigerate.
Further, the thermoelectric/magnetic card composite refrigeration structure comprises a plurality of p-type thermoelectric magnetic composite refrigeration arms and a plurality of n-type thermoelectric magnetic composite refrigeration arms, each of the p-type thermoelectric magnetic composite refrigeration arms and the n-type thermoelectric magnetic composite refrigeration arms are sequentially arranged along the same direction, the p-type thermoelectric magnetic composite refrigeration arms and the n-type thermoelectric magnetic composite refrigeration arms are alternately arranged, a magnetic card working medium bed layer is clamped between the adjacent n-type thermoelectric magnetic composite refrigeration arms and the p-type thermoelectric magnetic composite refrigeration arms, and the cold end and the hot end are respectively located on two sides of the arrangement direction of each of the p-type thermoelectric magnetic composite refrigeration arms and the n-type thermoelectric magnetic composite refrigeration arms.
Furthermore, an insulating magnetic conduction and heat conduction coating is arranged between each n-type thermoelectric composite refrigerating arm and the magnetic card working medium bed layer and between each p-type thermoelectric composite refrigerating arm and the magnetic card working medium bed layer.
Further, the magnet system comprises an S pole permanent magnet, an N pole permanent magnet and a transmission mechanism for controlling the periodic action of the S pole permanent magnet and the N pole permanent magnet, the S pole permanent magnet is arranged close to the p-type thermoelectric magnetic composite refrigerating arm, and the N pole permanent magnet is arranged close to the N-type thermoelectric magnetic composite refrigerating arm.
Furthermore, each p-type thermoelectric magnetic composite refrigerating arm and each n-type thermoelectric magnetic composite refrigerating arm are formed by sintering and compounding thermoelectric materials and magnetic materials, the magnetic materials are multiple, the size of each magnetic material is micron-sized or nanometer-sized, and the magnetic card materials are arranged on the thermoelectric materials in a pressure-sharing manner.
Further, the thermoelectric material is Bi2Te3Radical, Mg3Sb2Radicals, BiSb radicals or FeSb2At least one of the base thermoelectric materials, the magnetic material being Fe, Co, Ni, Fe3O4Gd and alloy thereof, and LaFe13-xSixBase compound, Gd5(SixGe1-x)4Base compound, MnFePxAs1-xBase compound, RCo2And compounds thereof or RAl2And a compound thereof.
Furthermore, each magnetic card working medium bed layer is prepared from magnetic card materials, wherein the magnetic card materials are metal Gd and alloy thereof, and LaFe13-xSixBase compound, Gd5(SixGe1-x)4Base compound, MnFePxAs1-xBase compound, RCo2And compounds thereof or RAl2And at least one compound thereof, wherein R is Dy, Ho or Er.
Furthermore, a cold end metal electrode, a cold end insulating heat-conducting substrate and a cold end heat sink are sequentially arranged at the cold end along the direction far away from the thermoelectric/magnetic card composite refrigeration structure, a hot end metal electrode, a hot end insulating heat-conducting substrate and a hot end heat sink are sequentially arranged at the hot end along the direction far away from the thermoelectric/magnetic card composite refrigeration structure, a hot switch at the cold end is located between the cold end insulating heat-conducting substrate and the cold end heat sink, and a hot switch at the hot end is located between the hot end insulating heat-conducting substrate and the hot end heat sink.
Further, the thermal switch comprises a first metal heat conduction substrate and a second metal heat conduction substrate which are arranged oppositely and at an interval, a first thermal assembly and a second thermal assembly which are stacked are arranged in the interval between the first metal heat conduction substrate and the second metal heat conduction substrate, the first thermal assembly is attached to the first metal heat conduction substrate, and the second thermal assembly is attached to the second metal heat conduction substrate; the first thermal assembly comprises heat insulation sheets and metal heat conduction layers which are sequentially and alternately and continuously arranged along the same direction, and the second thermal assembly comprises metal heat conduction layers and heat insulation sheets which are sequentially and alternately and continuously arranged along the same direction; when the thermal switch is in an off state, the insulating sheet of the first thermal assembly is connected with the metal heat-conducting layer of the second thermal assembly, and when the thermal switch is in an on state, the metal heat-conducting layer of the first thermal assembly is connected with the metal heat-conducting layer of the second thermal assembly.
The embodiment of the invention provides another technical scheme: a thermoelectric refrigeration and magnetic card refrigeration composite refrigeration method based on a thermal switch comprises the following steps:
s1, a transmission mechanism in a magnet system is adopted to control a magnet to carry out magnetizing action, when a magnetic field is applied rapidly, due to the magnetic card effect, a p-type thermoelectric/magnetic card composite refrigerating arm, an n-type thermoelectric composite refrigerating arm and a magnetic card working medium bed layer in the thermoelectric composite refrigerating structure are heated rapidly to a certain temperature from an initial temperature, the current of a pulse power supply is zero in the process, a thermal switch at a cold end is in a closed state, a thermal switch at a hot end is in an open state, and partial heat of the thermoelectric/magnetic card composite refrigerating structure is transmitted to the hot end through heat conduction and is discharged to the environment at the hot end;
s2, performing equal-magnetic-flux electric field action, after rapid magnetization, applying current by a pulse power supply, enabling a thermoelectric magnetic composite refrigeration arm of the thermoelectric/magnetic card composite refrigeration structure to generate a Peltier effect, rapidly bringing the heat of the thermoelectric magnetic composite refrigeration arm into a hot end, simultaneously transferring the heat of a magnetic card working medium bed layer of the thermoelectric/magnetic card composite refrigeration structure into the thermoelectric magnetic composite refrigeration arm through heat conduction, rapidly transferring the heat generated by the thermoelectric/magnetic card composite refrigeration structure to the hot end by utilizing the Peltier effect, releasing the heat into the environment through the hot end, and opening a thermal switch at the cold end when the cold ends of the thermoelectric magnetic composite refrigeration arm and the magnetic card working medium bed layer are reduced to the initial temperature of the thermoelectric/magnetic card composite refrigeration structure;
s3, controlling the magnet to demagnetize by adopting the transmission mechanism in the magnet system, rapidly cooling the p-type thermoelectric magnetic composite refrigerating arm, the n-type thermoelectric magnetic composite refrigerating arm and the whole magnetic card working medium bed of the thermoelectric magnetic composite refrigerating structure due to the magnetic card effect, wherein the current of the pulse power supply is zero, and in the process, the cold end of the thermoelectric/magnetic card composite refrigerating structure absorbs partial heat from a cold end heat source to refrigerate;
and S4, performing zero magnetic flux electric field action, applying current by a pulse power supply, further reducing the temperature of the cold end of the thermoelectric/magnetic card composite refrigeration arm of the thermoelectric/magnetic card composite refrigeration structure, absorbing heat from the low-temperature heat source through a thermal switch, transmitting the heat absorbed from the low-temperature heat source to the hot end by means of the Peltier effect and the heat conduction between the solid and the solid, releasing the heat into the environment, re-entering the step S1, and circulating.
Compared with the prior art, the invention has the beneficial effects that: the thermoelectric magnetic composite material and the magnetic card material are used as refrigeration working media, the thermoelectric magnetic composite material is also used as a solid heat transfer medium, the rapid heat exchange between a thermoelectric magnetic composite refrigeration arm and a magnetic card working medium bed layer and the rapid heat transfer of the Peltier effect are utilized, the heat exchange efficiency and the heat transfer capacity are improved, the high-efficiency dual composite refrigeration of the thermoelectric magnetic composite refrigeration and the magnetic card refrigeration is realized, the refrigeration performance of a device can be greatly improved, meanwhile, a thermal switch mechanism is applied to realize the refrigeration cycle matching the thermoelectric refrigeration and the magnetic card refrigeration, and the reliability and the refrigeration performance of the device are further improved; the thermal electromagnetic composite material is used as a composite refrigeration working medium and a solid heat transfer medium, the rapid heat transport characteristic of the Peltier effect is utilized, and the thermal electromagnetic composite material and a single magnetic card working medium bed are further subjected to composite design, so that double composite refrigeration of magnetism-enhanced thermal electromagnetic composite refrigeration and magnetic card refrigeration can be realized, and the refrigeration capacity of devices is greatly improved; in the field of heat management, the thermal switch can be used for controlling and switching heat flow, the performance and reliability of a device can be improved, the thermal switch also has high heat conduction performance when being closed, and meanwhile, the high-efficiency circulating refrigeration is realized by using the heat flow direction control characteristic of the thermal switch.
Drawings
Fig. 1 is a schematic structural diagram of a thermoelectric refrigeration and magnetic card refrigeration composite refrigeration device based on a thermal switch according to an embodiment of the present invention, in which a transmission mechanism is omitted;
fig. 2 is a schematic structural diagram of a thermoelectric composite cooling arm of a thermoelectric cooling and magnetic card cooling composite cooling device based on a thermal switch according to an embodiment of the present invention;
fig. 3 is a schematic diagram illustrating an operation principle of a thermal switch of a combined refrigeration device based on thermoelectric refrigeration and magnetic card refrigeration of the thermal switch according to an embodiment of the present invention;
in the reference symbols: 1-thermoelectric/magnetic card composite refrigeration structure; 11-p type thermoelectric magnetic composite refrigerating arm; 12-n type thermoelectric composite refrigerating arm; 111-a thermoelectric material; 112-a magnetic material; 13-magnetic card working medium bed layer; 14-insulating magnetic conductive heat conducting coating; 15-cold-side metal electrodes; 16-hot side metal electrode; 17-cold end insulating heat conducting substrate; 18-a hot-end insulating heat-conducting substrate; 2-thermal switch of cold end; 3-hot side thermal switch; 21-a metal heat conducting layer; 22-thermal insulation sheet; 23-a first metallic heat conducting substrate; 24-a second metal heat conducting substrate; 4-cold end heat sink; 5-heat end heat sink; 6-S pole permanent magnet; 7-N pole permanent magnet; 8-pulse power supply.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The first embodiment is as follows:
referring to fig. 1 to 3, an embodiment of the present invention provides a thermoelectric refrigeration and magnetic card refrigeration composite refrigeration device based on a thermal switch, including a thermoelectric/magnetic card composite refrigeration structure 1, where one of opposite sides of the thermoelectric/magnetic card composite refrigeration structure 1 is a cold end and a hot end, and the cold end and the hot end are both provided with a thermal switch for conducting or blocking heat; the composite refrigeration device further comprises a pulse power supply 8 for applying periodic current to the thermoelectric/magnetic card composite refrigeration structure 1 and a magnet system for periodically magnetizing or demagnetizing, wherein the pulse power supply 8 and the magnet system are matched with the thermal switch to control the cold end of the thermoelectric/magnetic card composite refrigeration structure 1 to continuously refrigerate. Preferably, the thermoelectric/magnetic card composite refrigeration structure 1 includes a plurality of p-type thermoelectric and magnetic composite refrigeration arms 11 and a plurality of n-type thermoelectric and magnetic composite refrigeration arms 12, each of the p-type thermoelectric and magnetic composite refrigeration arms 11 and the n-type thermoelectric and magnetic composite refrigeration arms 12 are sequentially arranged along the same direction, the p-type thermoelectric and magnetic composite refrigeration arms 11 and the n-type thermoelectric and magnetic composite refrigeration arms 12 are alternately arranged, a magnetic card working medium bed layer 13 is sandwiched between the adjacent n-type thermoelectric and magnetic composite refrigeration arms 12 and the p-type thermoelectric and magnetic composite refrigeration arms 11, and the cold end and the hot end are respectively located on two sides of the arrangement direction of each of the p-type thermoelectric and magnetic composite refrigeration arms 11 and the n-type thermoelectric and magnetic composite refrigeration arms 12. In this embodiment, the continuous refrigeration of the low-temperature heat source at the refrigeration end can be realized through the cooperation of the thermoelectric/magnetic card composite refrigeration structure 1, the thermal switch, the magnet system and the pulse power supply 8, and the stability and the refrigeration capacity of the existing refrigeration device are improved. Specifically, a thermoelectric magnetic composite material and a magnetic card material are used as refrigeration working media, the thermoelectric magnetic composite material is also used as a solid heat transfer medium, the rapid heat exchange among the p-type thermoelectric magnetic composite refrigeration arm 11, the n-type thermoelectric/magnetic card composite refrigeration arm 12 and the magnetic card working medium bed layer 13 and the rapid heat transfer of the Peltier effect are utilized, the heat exchange efficiency and the heat transfer capacity are improved, the high-efficiency dual composite refrigeration of the thermoelectric magnetic composite refrigeration and the magnetic card refrigeration is realized, the refrigeration performance of a device can be greatly improved, meanwhile, a thermal switch mechanism is applied to realize the refrigeration cycle matching the thermoelectric refrigeration and the magnetic card refrigeration, and the reliability and the refrigeration performance of the device are further improved; the thermoelectric and magnetic composite material of the thermoelectric material 111 and the magnetic material 112 is used as a composite refrigeration working medium and a solid heat transfer medium, and the rapid heat transport characteristic of the Peltier effect is utilized, and the composite design is further carried out with a single magnetic card working medium bed, so that the dual composite refrigeration of the thermoelectric and magnetic composite refrigeration and the magnetic card refrigeration can be realized, and the refrigeration capacity of the device is greatly improved; in the field of thermal management, a thermal switch can be used to control and switch heat flow, which can improve device performance and reliability, the thermal switch itself has a large heat conduction performance when being turned off, and at the same time, the heat flow direction control characteristic of the thermal switch is used to realize efficient cycle refrigeration, wherein for convenience of description, the p-type thermo-electromagnetic composite cooling arm 11 and the n-type thermo-electromagnetic composite cooling arm 12 are collectively referred to as thermo-electromagnetic composite cooling arms, and the number of the p-type thermo-electromagnetic composite cooling arm 11 and the n-type thermo-electromagnetic composite cooling arm 12 can be selected according to actual situations, and is not limited to the number shown in fig. 1, this figure is used only as an example of this embodiment, and the mechanical transmission mechanism part in the magnet system is omitted in fig. 1. Preferably, as shown in fig. 1, the magnetic card working medium beds 13 are not arranged in parallel and level along one direction, and in each group of three adjacent magnetic card working medium beds 13, one end of the middle magnetic card working medium bed 13 is closer to the hot end, and one ends of the other two magnetic card working medium beds 13 are closer to the cold end, so as to form a differential structure.
As an optimized scheme of the embodiment of the present invention, please refer to fig. 1, an insulating, magnetic conducting and heat conducting coating 14 is disposed between each n-type thermo-electromagnetic composite cooling arm 12 and the magnetic card working medium bed layer 13, and between each p-type thermo-electromagnetic composite cooling arm 11 and the magnetic card working medium bed layer 13. In this embodiment, the insulating, magnetically permeable, and thermally conductive coating 14 is preferably a thermally conductive silicone grease, which fills the gap.
Referring to fig. 1 as an optimized solution of the embodiment of the present invention, the magnet system includes an S-pole permanent magnet 6 and an N-pole permanent magnet 7, the S-pole permanent magnet 6 is disposed close to the p-type thermoelectric/magnetic card composite cooling arm 11, and the N-pole permanent magnet 7 is disposed close to the N-type thermoelectric/magnetic card composite cooling arm 12. In this embodiment, the S-pole permanent magnet 6 and the N-pole permanent magnet 7 are controlled by a mechanical transmission mechanism to realize periodic magnetization or demagnetization.
As an optimized solution of the embodiment of the present invention, referring to fig. 2, each of the p-type thermoelectric and magnetic composite cooling arms 11 and each of the n-type thermoelectric and magnetic composite cooling arms 12 are formed by sintering and compounding a thermoelectric material 111 and a magnetic material 112, the magnetic material 112 is in a sheet shape, the magnetic material 112 is multiple, the size of each of the magnetic materials 112 is nanometer, and the magnetic materials 112 are pressure-equalized on the thermoelectric material 111. In the embodiment, the thermoelectric composite cooling arm is formed by compounding the thermoelectric material 111 and the magnetic material 112, and is specifically prepared by pressing and sintering, that is, after the magnetic material 112 is pressed on the thermoelectric material 111, the thermoelectric composite cooling arm can be compounded by sintering. Through the pressing and sintering in the sheet form, the heat exchange area inside the composite material can be increased so as to enhance the heat exchange efficiency. Preferably, the magnetic material 112 is arranged in a square matrix on the thermoelectric material 111, so that the heat exchange area inside the composite material can be further increased.
Further optimizing the scheme, the thermoelectric material 111 is Bi2Te3Radical, Mg3Sb2Radicals, BiSb radicals or FeSb2At least one of the base thermoelectric materials 111, and the magnetic material 112 is Fe, Co, Ni, Fe3O4Gd and alloy thereof, and LaFe13-xSixBase compound, Gd5(SixGe1-x)4Base compound, MnFePxAs1-xBase compound, RCo2And compounds thereof or RAl2And at least one compound thereof, wherein R is Dy, Ho or Er. Preferably, the thermoelectric material 111 can be Bi2Te3The thermoelectric material 111 and the magnetic material 112 may be metal nanoparticles Gd.
Further optimizing the scheme, each magnetic card working medium bed layer is made of magnetic card materials, wherein the magnetic card materials are metal Gd and alloy thereof, and LaFe13-xSixBase compound, Gd5(SixGe1-x)4Base compound, MnFePxAs1-xBase compound, RCo2And compounds thereof or RAl2And at least one compound thereof, wherein R is Dy, Ho or Er. The magnetic card working medium bed layer 13 is prepared by cutting magnetic card material Gd.
As an optimized scheme of the embodiment of the present invention, please refer to fig. 1, a cold end metal electrode 15, a cold end insulating and heat conducting substrate 17, and a cold end heat sink 4 are sequentially disposed at the cold end along a direction away from the thermoelectric/magnetic card composite refrigeration structure 1, a hot end metal electrode 16, a hot end insulating and heat conducting substrate 18, and a hot end heat sink 5 are sequentially disposed at the hot end along a direction away from the thermoelectric/magnetic card composite refrigeration structure 1, the hot switch 2 at the cold end is located between the cold end insulating and heat conducting substrate 17 and the cold end heat sink 4, and the hot switch 3 at the hot end is located between the hot end insulating and heat conducting substrate 18 and the hot end heat sink 5. In the present embodiment, the structure at the cold end and the structure at the hot end are preferably symmetrical structures, which are symmetrical about the central thermoelectric/magnetic card composite refrigeration structure 1 as a point of symmetry. Preferably, the cold-end metal electrode 15 and the hot-end metal electrode 16 both use copper electrodes with good electric and heat conductivity and small resistance, and the cold-end insulating heat-conducting substrate 17 and the hot-end insulating heat-conducting substrate 18 both use ceramic substrates with good heat conductivity, and are connected with the metal electrodes and the magnetic card working medium bed layer 13 by using heat-conducting silicone grease. Preferably, the pulse power supply 8 is connected to the cold-end metal electrode 15.
As an optimized solution of the embodiment of the present invention, please refer to fig. 3, where the thermal switch includes a first metal heat conducting substrate 23 and a second metal heat conducting substrate 24 that are disposed opposite to each other and at an interval, a first thermal component and a second thermal component that are stacked are disposed in the interval between the first metal heat conducting substrate 23 and the second metal heat conducting substrate 24, the first thermal component is attached to the first metal heat conducting substrate 23, and the second thermal component is attached to the second metal heat conducting substrate 24; the first thermal component comprises heat insulation sheets 22 and metal heat conduction layers 21 which are sequentially and alternately and continuously arranged along the same direction, and the second thermal component comprises metal heat conduction layers 21 and heat insulation sheets 22 which are sequentially and alternately and continuously arranged along the same direction; when the thermal switch is in an off state, the insulating sheet of the first thermal assembly is connected with the metal heat-conducting layer 21 of the second thermal assembly, and when the thermal switch is in an on state, the metal heat-conducting layer 21 of the first thermal assembly is connected with the metal heat-conducting layer 21 of the second thermal assembly. In this embodiment, the two thermal switches are both mechanical thermal switches, the thermal switches can move inside, and the periodic switching action is realized by controlling the movement of the internal components of the thermal switches, as shown by the arrows in the figure, from the off state to the on state, only the upper and lower metal heat conduction layers 21 need to be conducted, and conversely, the upper and lower metal heat conduction layers 21 need to be connected with the heat insulation sheet 22.
Example two:
the embodiment of the invention provides a thermoelectric refrigeration and magnetic card refrigeration composite refrigeration method based on a thermal switch, wherein a magnet system controls the movement of a pair of S pole permanent magnets 6 and N pole permanent magnets 7 through a transmission mechanism to realize periodic magnetization and demagnetization, a pulse power supply 8 is regulated and controlled to match the periodic application of current, and a novel refrigeration cycle process is created by matching the on and off of the thermal switch: adding magnetism, adding an electric field with equal magnetism, demagnetizing and adding an electric field with zero magnetism. The method comprises the following specific steps:
s1, magnetization is carried out, when a magnetic field is applied rapidly, due to the magnetic card effect, the p-type thermo-electromagnetic composite refrigerating arm 11, the n-type thermo-electromagnetic composite refrigerating arm 12 and the magnetic card working medium bed layer 13 are heated rapidly, the temperature is increased from the initial temperature to a certain temperature, the current of the pulse power supply 8 is zero in the process, the thermal switch 2 at the cold end is in a closed state, the thermal switch 3 at the hot end is in an open state, and partial heat of the solid refrigerating working medium is transmitted to the hot end heat sink 5 through heat conduction and is discharged to the environment through the hot end heat sink 5;
s2, after the magnetic field is applied rapidly, the current of the pulse power supply 8 is applied, the thermoelectric/magnetic card composite refrigeration arm generates the Peltier effect, the heat of the thermoelectric/magnetic card composite refrigeration arm is brought into the hot end heat sink rapidly, meanwhile, the heat of the magnetic card working medium bed layer is also transferred into the refrigeration arm through heat conduction, the heat generated by the magnetic card effect generated by the two solid refrigeration working media is rapidly transported to the hot end heat sink 5 by utilizing the Peltier effect, the heat is released to the environment through the hot end heat sink 5, when the temperature of the cold end of the thermoelectric/magnetic card composite refrigeration arm and the cold end of the magnetic card working medium bed layer is reduced to the initial temperature of the thermoelectric/magnetic card composite refrigeration structure 1, the thermal switch 2 at the cold end is opened, and the next demagnetization process can be started;
s3, demagnetization is carried out, the p-type thermoelectric composite refrigerating arm 11, the n-type thermoelectric composite refrigerating arm 12 and the magnetic card working medium bed 13 are cooled down rapidly due to the magnetic card effect, the current of the pulse power supply 8 is zero, and in the process, the cold end of the thermoelectric/magnetic card composite refrigerating structure 1 absorbs partial heat from the cold end heat sink 4 from the cold end heat source for refrigeration; after the rapid demagnetization, directly entering the next process;
and S4, applying current by the pulse power supply 8 under the condition of zero magnetic flux electric field, further reducing the temperature of the cold end of the thermoelectric/magnetic card composite refrigeration arm, absorbing heat from the low-temperature heat source by the thermoelectric/magnetic card composite refrigeration structure 1 through the thermal switch and the cold-end heat sink 4, transmitting the heat absorbed from the low-temperature heat source to the hot-end heat sink 5 by the heat conduction between the Peltier effect and the solid, releasing the heat into the environment, re-entering the step S1, and circulating. In the process, the two solid refrigeration working mediums can play a refrigeration role at the same time, namely the double composite refrigeration of thermoelectric/magnetic card composite refrigeration and magnetic card refrigeration.
It should be understood that the magnetization and demagnetization processes are very fast processes, and the device operating frequency is greatly improved by combining the fast heat transport of the peltier effect in the equal magnetism and zero magnetism processes. The invention adopts the rapid heat transport of the Peltier effect and the rapid heat exchange between solid working media, realizes the double composite refrigeration of the thermoelectricity and magnetic card refrigeration with enhanced magnetism, improves the working frequency and the refrigeration capacity of the device, designs the matching refrigeration cycle of the thermoelectricity refrigeration and the magnetic card refrigeration which can replace the circulation process of a fluid loop by utilizing a thermal switch, realizes the continuous refrigeration of a low-temperature heat source at the refrigeration end, and further improves the stability and the refrigeration capacity of the device.
For other features of this embodiment, please refer to the first embodiment, which will not be described in detail herein.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (10)

1. The utility model provides a compound refrigeration device of thermoelectric refrigeration and magnetic card refrigeration based on hot switch which characterized in that: the thermoelectric/magnetic card composite refrigeration system comprises a thermoelectric/magnetic card composite refrigeration structure, wherein a cold end and a hot end are respectively arranged on one opposite side of the thermoelectric/magnetic card composite refrigeration structure, and the cold end and the hot end are both provided with a thermal switch for conducting or blocking heat; the composite refrigeration device also comprises a pulse power supply for applying periodic current to the thermoelectric/magnetic card composite refrigeration structure and a magnet system for periodically magnetizing or demagnetizing, wherein the pulse power supply and the magnet system are matched with the thermal switch to control the cold end of the thermoelectric/magnetic card composite refrigeration structure to continuously refrigerate.
2. The composite refrigeration device of thermoelectric refrigeration and magnetic card refrigeration based on thermal switch as claimed in claim 1, characterized in that: the thermoelectric/magnetic card composite refrigeration structure comprises a plurality of p-type thermoelectric magnetic composite refrigeration arms and a plurality of n-type thermoelectric magnetic composite refrigeration arms, wherein the p-type thermoelectric magnetic composite refrigeration arms and the n-type thermoelectric magnetic composite refrigeration arms are sequentially arranged along the same direction, the p-type thermoelectric magnetic composite refrigeration arms and the n-type thermoelectric magnetic composite refrigeration arms are alternately arranged, a magnetic card working medium bed layer is clamped between the adjacent n-type thermoelectric magnetic composite refrigeration arms and the p-type thermoelectric magnetic composite refrigeration arms, and the cold end and the hot end are respectively positioned on two sides of the arrangement direction of the p-type thermoelectric magnetic composite refrigeration arms and the n-type thermoelectric magnetic composite refrigeration arms.
3. The composite refrigeration device of thermoelectric refrigeration and magnetic card refrigeration based on thermal switch as claimed in claim 2, characterized in that: and insulating magnetic conductive heat-conducting coatings are arranged between each n-type thermoelectric composite refrigerating arm and the magnetic card working medium bed layer and between each p-type thermoelectric composite refrigerating arm and the magnetic card working medium bed layer.
4. The composite refrigeration device of thermoelectric refrigeration and magnetic card refrigeration based on thermal switch as claimed in claim 2, characterized in that: the magnet system comprises an S pole permanent magnet, an N pole permanent magnet and a transmission mechanism for controlling the periodic action of the S pole permanent magnet and the N pole permanent magnet, the S pole permanent magnet is arranged close to the p type thermo-electromagnetic composite refrigerating arm, and the N pole permanent magnet is arranged close to the N type thermo-electromagnetic composite refrigerating arm.
5. The composite refrigeration device of thermoelectric refrigeration and magnetic card refrigeration based on thermal switch as claimed in claim 2, characterized in that: each p-type thermoelectric magnetic composite refrigerating arm and each n-type thermoelectric magnetic composite refrigerating arm are formed by sintering and compounding thermoelectric materials and magnetic materials, the magnetic materials are multiple, the size of each magnetic material is micron-sized or nanometer-sized, and the magnetic card materials are arranged on the thermoelectric materials in a pressure-sharing mode.
6. The composite refrigeration device of thermoelectric refrigeration and magnetic card refrigeration based on thermal switch as claimed in claim 5, characterized in that: the thermoelectric material is Bi2Te3Radical, Mg3Sb2Radicals, BiSb radicals or FeSb2At least one of the base thermoelectric materials, the magnetic material is Fe, Co,Ni、Fe3O4Gd and alloy thereof, and LaFe13-xSixBase compound, Gd5(SixGe1-x)4Base compound, MnFePxAs1-xBase compound, RCo2And compounds thereof or RAl2And at least one compound thereof, wherein R is Dy, Ho or Er.
7. The composite refrigeration device of thermoelectric refrigeration and magnetic card refrigeration based on thermal switch as claimed in claim 2, characterized in that: each magnetic card working medium bed layer is prepared from magnetic card materials, wherein the magnetic card materials are metal Gd and alloy thereof, and LaFe13-xSixBase compound, Gd5(SixGe1-x)4Base compound, MnFePxAs1-xBase compound, RCo2And compounds thereof or RAl2And a compound thereof.
8. The composite refrigeration device of thermoelectric refrigeration and magnetic card refrigeration based on thermal switch as claimed in claim 1, characterized in that: cold junction metal electrode, cold junction insulating heat conduction substrate and cold junction are set gradually along keeping away from the direction of thermoelectricity/magnetic card composite refrigeration structure in cold department, hot junction metal electrode, hot junction insulating heat conduction substrate and hot junction are set gradually along keeping away from the direction of thermoelectricity/magnetic card composite refrigeration structure in hot department, the hot switch of cold junction is located the cold junction insulating heat conduction substrate with between the cold junction heat sink, the hot switch of hot junction is located the hot junction insulating heat conduction substrate with between the hot junction heat sink.
9. The composite refrigeration device of thermoelectric refrigeration and magnetic card refrigeration based on thermal switch as claimed in claim 1, characterized in that: the thermal switch comprises a first metal heat conduction substrate and a second metal heat conduction substrate which are oppositely arranged at intervals, a first thermal assembly and a second thermal assembly which are stacked are arranged in the interval between the first metal heat conduction substrate and the second metal heat conduction substrate, the first thermal assembly is attached to the first metal heat conduction substrate, and the second thermal assembly is attached to the second metal heat conduction substrate; the first thermal assembly comprises heat insulation sheets and metal heat conduction layers which are sequentially and alternately and continuously arranged along the same direction, and the second thermal assembly comprises metal heat conduction layers and heat insulation sheets which are sequentially and alternately and continuously arranged along the same direction; when the thermal switch is in an off state, the insulating sheet of the first thermal assembly is connected with the metal heat-conducting layer of the second thermal assembly, and when the thermal switch is in an on state, the metal heat-conducting layer of the first thermal assembly is connected with the metal heat-conducting layer of the second thermal assembly.
10. A composite refrigeration method of thermoelectric refrigeration and magnetic card refrigeration based on a thermal switch is characterized by comprising the following steps:
s1, a transmission mechanism in a magnet system is adopted to control a magnet to carry out magnetizing action, when a magnetic field is applied rapidly, due to the magnetic card effect, a p-type thermoelectric/magnetic card composite refrigerating arm, an n-type thermoelectric composite refrigerating arm and a magnetic card working medium bed layer in the thermoelectric composite refrigerating structure are heated rapidly to a certain temperature from an initial temperature, the current of a pulse power supply is zero in the process, a thermal switch at a cold end is in a closed state, a thermal switch at a hot end is in an open state, and partial heat of the thermoelectric/magnetic card composite refrigerating structure is transmitted to the hot end through heat conduction and is discharged to the environment at the hot end;
s2, performing equal-magnetic-flux electric field action, after rapid magnetization, applying current by a pulse power supply, enabling a thermoelectric magnetic composite refrigeration arm of the thermoelectric/magnetic card composite refrigeration structure to generate a Peltier effect, rapidly bringing the heat of the thermoelectric magnetic composite refrigeration arm into a hot end, simultaneously transferring the heat of a magnetic card working medium bed layer of the thermoelectric/magnetic card composite refrigeration structure into the thermoelectric magnetic composite refrigeration arm through heat conduction, rapidly transferring the heat generated by the thermoelectric/magnetic card composite refrigeration structure to the hot end by utilizing the Peltier effect, releasing the heat into the environment through the hot end, and opening a thermal switch at the cold end when the cold ends of the thermoelectric magnetic composite refrigeration arm and the magnetic card working medium bed layer are reduced to the initial temperature of the thermoelectric/magnetic card composite refrigeration structure;
s3, controlling the magnet to demagnetize by adopting the transmission mechanism in the magnet system, rapidly cooling the p-type thermoelectric magnetic composite refrigerating arm, the n-type thermoelectric magnetic composite refrigerating arm and the whole magnetic card working medium bed of the thermoelectric magnetic composite refrigerating structure due to the magnetic card effect, wherein the current of the pulse power supply is zero, and in the process, the cold end of the thermoelectric/magnetic card composite refrigerating structure absorbs partial heat from a cold end heat source to refrigerate;
and S4, performing zero magnetic flux electric field action, applying current by a pulse power supply, further reducing the temperature of the cold end of the thermoelectric/magnetic card composite refrigeration arm of the thermoelectric/magnetic card composite refrigeration structure, absorbing heat from the low-temperature heat source through a thermal switch, transmitting the heat absorbed from the low-temperature heat source to the hot end by means of the Peltier effect and the heat conduction between the solid and the solid, releasing the heat into the environment, re-entering the step S1, and circulating.
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