CN111171578A - 一种高强度导热硅胶片及其制备方法 - Google Patents
一种高强度导热硅胶片及其制备方法 Download PDFInfo
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- CN111171578A CN111171578A CN202010096801.8A CN202010096801A CN111171578A CN 111171578 A CN111171578 A CN 111171578A CN 202010096801 A CN202010096801 A CN 202010096801A CN 111171578 A CN111171578 A CN 111171578A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2296—Oxides; Hydroxides of metals of zinc
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/28—Nitrogen-containing compounds
- C08K2003/282—Binary compounds of nitrogen with aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN202010096801.8A CN111171578B (zh) | 2020-02-17 | 2020-02-17 | 一种高强度导热硅胶片及其制备方法 |
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CN202010096801.8A CN111171578B (zh) | 2020-02-17 | 2020-02-17 | 一种高强度导热硅胶片及其制备方法 |
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CN111171578A true CN111171578A (zh) | 2020-05-19 |
CN111171578B CN111171578B (zh) | 2021-12-14 |
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Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112646377A (zh) * | 2020-12-24 | 2021-04-13 | 江门威富新材料科技有限公司 | 电磁屏蔽用导电硅橡胶及其制备方法 |
CN112831187A (zh) * | 2021-01-28 | 2021-05-25 | 天津泽希新材料有限公司 | 一种高温硫化导热硅橡胶复合材料 |
CN114736522A (zh) * | 2022-05-24 | 2022-07-12 | 无锡市百合花胶粘剂厂有限公司 | 一种高导热硅胶片及其制备方法 |
CN116063853A (zh) * | 2023-01-31 | 2023-05-05 | 安徽迈腾新材料有限公司 | 一种铂金硫化式导热性硅橡胶复合材料 |
CN116120890A (zh) * | 2023-02-23 | 2023-05-16 | 东莞市富颖电子材料有限公司 | 一种导热胶贴及其制备方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6306957B1 (en) * | 1999-03-11 | 2001-10-23 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone rubber compositions and making method |
JP2003080640A (ja) * | 2001-09-12 | 2003-03-19 | Fuji Kobunshi Kogyo Kk | 熱軟化シート |
CN108659549A (zh) * | 2018-05-30 | 2018-10-16 | 深圳市零度智控科技有限公司 | 高导热硅胶材料的制备方法及硅胶材料 |
CN111073591A (zh) * | 2019-12-13 | 2020-04-28 | 深圳市丰盛源科技有限公司 | 一种单组分室温固化液体硅橡胶及制备方法 |
-
2020
- 2020-02-17 CN CN202010096801.8A patent/CN111171578B/zh active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6306957B1 (en) * | 1999-03-11 | 2001-10-23 | Shin-Etsu Chemical Co., Ltd. | Thermal conductive silicone rubber compositions and making method |
JP2003080640A (ja) * | 2001-09-12 | 2003-03-19 | Fuji Kobunshi Kogyo Kk | 熱軟化シート |
CN108659549A (zh) * | 2018-05-30 | 2018-10-16 | 深圳市零度智控科技有限公司 | 高导热硅胶材料的制备方法及硅胶材料 |
CN111073591A (zh) * | 2019-12-13 | 2020-04-28 | 深圳市丰盛源科技有限公司 | 一种单组分室温固化液体硅橡胶及制备方法 |
Non-Patent Citations (1)
Title |
---|
周文英 丁小卫: "《导热高分子材料》", 30 April 2014 * |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112646377A (zh) * | 2020-12-24 | 2021-04-13 | 江门威富新材料科技有限公司 | 电磁屏蔽用导电硅橡胶及其制备方法 |
CN112831187A (zh) * | 2021-01-28 | 2021-05-25 | 天津泽希新材料有限公司 | 一种高温硫化导热硅橡胶复合材料 |
CN114736522A (zh) * | 2022-05-24 | 2022-07-12 | 无锡市百合花胶粘剂厂有限公司 | 一种高导热硅胶片及其制备方法 |
CN116063853A (zh) * | 2023-01-31 | 2023-05-05 | 安徽迈腾新材料有限公司 | 一种铂金硫化式导热性硅橡胶复合材料 |
CN116120890A (zh) * | 2023-02-23 | 2023-05-16 | 东莞市富颖电子材料有限公司 | 一种导热胶贴及其制备方法 |
CN116120890B (zh) * | 2023-02-23 | 2023-08-18 | 东莞市富颖电子材料有限公司 | 一种导热胶贴及其制备方法 |
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CN111171578B (zh) | 2021-12-14 |
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Address after: 242300 Zhongyi Electronic Information Industrial Park, Zhenning Road, heli Park, Ningguo Economic and Technological Development Zone, Xuancheng City, Anhui Province Patentee after: Anhui Xinlun Precision Manufacturing Technology Co.,Ltd. Address before: 242300 Zhongyi Electronic Information Industrial Park, Zhenning Road, heli Park, Ningguo Economic and Technological Development Zone, Xuancheng City, Anhui Province Patentee before: NINGGUO QIANHONG ELECTRONIC CO.,LTD. Address after: 242300 Zhongyi Electronic Information Industrial Park, Zhenning Road, heli Park, Ningguo Economic and Technological Development Zone, Xuancheng City, Anhui Province Patentee after: Xinlun precision manufacturing (Anhui) Co.,Ltd. Address before: 242300 Zhongyi Electronic Information Industrial Park, Zhenning Road, heli Park, Ningguo Economic and Technological Development Zone, Xuancheng City, Anhui Province Patentee before: Anhui Xinlun Precision Manufacturing Technology Co.,Ltd. |