CN111171540A - Low-density low-pressure sheet molding compound and preparation method thereof - Google Patents

Low-density low-pressure sheet molding compound and preparation method thereof Download PDF

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CN111171540A
CN111171540A CN202010078421.1A CN202010078421A CN111171540A CN 111171540 A CN111171540 A CN 111171540A CN 202010078421 A CN202010078421 A CN 202010078421A CN 111171540 A CN111171540 A CN 111171540A
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石敏先
黄志雄
董闯
戈端
秦岩
唐青秀
欧芸
任依林
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Wuhan University of Technology WUT
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
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    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/04Reinforcing macromolecular compounds with loose or coherent fibrous material
    • C08J5/0405Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres
    • C08J5/043Reinforcing macromolecular compounds with loose or coherent fibrous material with inorganic fibres with glass fibres
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2367/00Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2217Oxides; Hydroxides of metals of magnesium
    • C08K2003/222Magnesia, i.e. magnesium oxide
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
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    • C08K2003/265Calcium, strontium or barium carbonate
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    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/02Fibres or whiskers
    • C08K7/04Fibres or whiskers inorganic
    • C08K7/14Glass
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    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00Use of ingredients characterised by shape
    • C08K7/22Expanded, porous or hollow particles
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Abstract

The invention provides a low density and low densityThe low-density low-pressure sheet molding compound comprises the following components in parts by weight: unsaturated polyester resin: 55-65 parts of low-profile additive: 30-40 parts of styrene: 6-8 parts of a thickening agent: 3.5-4.5 parts of benzoyl peroxide tert-butyl ester: 1-2 parts of light zinc stearate: 4-6 parts of calcium carbonate: 70-80 parts of hollow glass beads: 20-30 parts of chopped glass fiber: 45-55 parts. The invention applies the low-pressure sheet molding compound (LPMC) technology, and the components are matched with each other, so that the sheet molding compound prepared by the invention has lower density and can greatly reduce the molding pressure, and the invention takes magnesium oxide paste and crystalline resin as a combined thickening system to mold the material under low pressure, and takes hollow glass beads as filling materials to reduce the density and the heat conductivity coefficient of the material, thereby preparing the sheet molding compound with better heat insulation performance and low density under low pressure, wherein the density of the sheet molding compound is 1.216-1.330g/cm3The heat conductivity coefficient is 0.288-0.347W/m.K, and the bending strength is 59.15-82.39 MPa.

Description

Low-density low-pressure sheet molding compound and preparation method thereof
Technical Field
The invention relates to the technical field of sheet molding compounds, in particular to a low-density low-pressure sheet molding compound and a preparation method thereof.
Background
Sheet Molding Compounds (SMC) have many advantages such as high specific strength, high mechanization degree, low cost, etc., and their applications are in the fields of automobiles, electric power, military industry, chemical industry, rail traffic, etc.
On one hand, SMC is generally formed under high pressure (5-15Mpa), which has strict requirements on molds and equipment, requires a large-tonnage flat press capable of generating and resisting high pressure during production, while a large-tonnage press with high operation efficiency is expensive and occupies a large area, which undoubtedly increases the investment on equipment and the usable area of a factory building, increases the cost, and the molds of the conventional SMC need to use high-quality tool steel to bear high pressure during the molding process, which greatly increases the cost of the molds.
On the other hand, with the development of the industrial society, the material lightweight becomes a research hotspot of current scientific research, and the material lightweight can reduce the density of the composite material, thereby reducing the weight of products and energy consumption, further widening the application of the composite material in other fields, and driving the development of other industries, particularly the automobile industry, and has a vital role in improving the emission, the oil consumption and the performance of the whole automobile.
The Chinese patent with publication number CN1594432A discloses a low-pressure SMC thickening agent and a preparation method thereof, which provides a formula of the low-pressure SMC thickening agent and lays a foundation for realizing low-pressure forming; the Chinese patent with publication number CN1760267A discloses a low-pressure molding sheet molding compound sheet material and a production process and equipment thereof, which combine the characteristics of a thickening agent to provide a set of production equipment, thereby efficiently producing the low-pressure sheet molding compound sheet material, but do not embody the idea of light weight of the material; chinese patent publication No. CN108219414A discloses a high-strength low-density SMC molding compound and a preparation method thereof, which reduces the density of a composite material and solves the problem of light weight of the material by adding hollow glass microspheres with the compressive strength of more than 50Mpa, but the preparation is completed by a large-tonnage press.
As can be seen from the prior art, no sheet molding compound with low pressure and low density is available, so that the development of the sheet molding compound with low pressure and low density is of great significance.
Disclosure of Invention
In view of the above, the present invention is directed to a low-density low-pressure sheet molding compound, so as to solve the problem that the low-pressure low-density characteristic of the conventional sheet molding compound cannot be considered at the same time.
In order to achieve the purpose, the technical scheme of the invention is realized as follows:
a low-density low-pressure sheet molding compound comprises the following components in parts by weight: unsaturated polyester resin: 55-65 parts of low-profile additive: 30-40 parts of styrene: 6-8 parts of a thickening agent: 3.5-4.5 parts of benzoyl peroxide tert-butyl ester: 1-2 parts of light zinc stearate: 4-6 parts of calcium carbonate: 70-80 parts of hollow glass beads: 20-30 parts of chopped glass fiber: 45-55 parts.
Optionally, the thickener is a mixture of an alkali metal oxide and a crystalline resin.
Alternatively, the mass ratio of the alkali metal oxide to the crystalline resin is from 3: 4 to 5: 6.
Optionally, the alkali metal oxide is magnesium oxide paste, and the particle size of the crystalline resin is 200-400 mesh.
Optionally, the density of the hollow glass microspheres is less than 0.45g/cm3
Optionally, the chopped glass fibers have a length of 3-5 cm.
The second purpose of the invention is to provide a method for preparing the low-density low-pressure sheet molding compound, which comprises the following steps:
1) dispersing the benzoyl peroxide tert-butyl ester in the styrene monomer, then adding the unsaturated polyester resin, the low shrinkage additive, the light zinc stearate, the calcium carbonate and the hollow glass beads, and stirring and mixing to obtain unsaturated polyester resin paste;
2) adding the thickening agent into the unsaturated polyester resin paste, stirring, then adding the chopped glass fiber, fully mixing, rolling, heating in rolling, and cooling after the thickening agent is fully melted to obtain a molded material sheet;
3) and (3) curing the molded material sheet, tearing off the film, laminating, putting into a mold, and performing compression molding to obtain the low-density low-pressure sheet molding compound.
Optionally, the curing treatment in step 3) comprises: and (3) placing the molded material sheet for 12-24h at normal temperature.
Optionally, the molding temperature of the compression molding in the step 3) is 120-130 ℃, the molding pressure is 2-4Mpa, and the molding time is 5-6 min.
Compared with the prior art, the low-density low-pressure sheet molding compound disclosed by the invention has the following advantages:
1. the invention uses low-pressure sheet molding compound (LPMC) technology, and all components are matched with each other, so that the sheet molding compound prepared by the invention has the same density as that of the sheet molding compound prepared by the inventionCompared with the traditional SMC process, the low-pressure LPMC is formed at low pressure, so that the requirements on equipment and a mould are lower than those of the traditional SMC, the product can be formed by a press with small tonnage, the mould does not need to adopt high-quality tool steel, cast iron and cast aluminum, and even the mould made of epoxy materials is enough to meet the requirements, and the investment on the equipment and the mould is greatly saved. The density of the low-density low-pressure sheet molding compound is 1.216-1.330g/cm3The heat conductivity coefficient is 0.288-0.347W/m.K, and the bending strength is 59.15-82.39 MPa.
2. The invention takes magnesium oxide paste and crystalline resin as a thickening system, combines chemical thickening with physical thickening, thereby achieving proper thickening speed, fully soaking the resin and fibers, greatly improving the viscosity in a mould, further reducing the forming pressure, and being beneficial to solving the problem of difficult production of high-strength, large-area and complex-shaped components.
3. The invention has lower molding pressure, can greatly shorten the molding period of the product, and can be demolded into the product within 10min generally, thereby greatly improving the production efficiency of the product, and a plurality of molds can be placed on the molding working surface, thereby further improving the production efficiency of the product.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate an embodiment of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a SEM photograph of a low density, low pressure sheet molding compound of example 3 of the present invention.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The present invention will be described in detail below with reference to the drawings and examples.
Example 1
A low-density low-pressure sheet molding compound comprises the following components in parts by weight: unsaturated polyester resin: 55 parts, low profile additive: 33 parts, styrene: 6.5 parts, magnesium oxide paste: 2 parts, crystalline resin: 2.5 parts, benzoyl peroxide tert-butyl ester: 1.4 parts, light zinc stearate: 4 parts, calcium carbonate: 80 parts of hollow glass beads: 30 parts, chopped glass fiber: 50 parts of the raw materials. Wherein the density of the hollow glass beads is 0.38-0.42g/cm3(ii) a The density of the magnesium oxide paste is 1.65g/ml, and the viscosity is 17000mpa & s; the melting point of the crystalline resin is about 55 ℃, and the granularity is 200-400 meshes; the chopped glass fiber is obtained by cutting glass fiber, and the length of the chopped glass fiber is 3-5 cm.
The low-density low-pressure sheet molding compound is prepared by the following method:
1) weighing the raw materials according to the formula of the components, dispersing benzoyl peroxide tert-butyl ester in a styrene monomer, stirring until the benzoyl peroxide tert-butyl ester is uniformly dispersed, then adding unsaturated polyester resin, a low-shrinkage additive, light zinc stearate, calcium carbonate and hollow glass beads, and stirring and mixing to obtain uniform unsaturated polyester resin paste;
2) adding magnesium oxide paste and crystalline resin into unsaturated polyester resin paste, stirring for 15-20min, then adding chopped glass fiber, fully mixing to ensure that the chopped glass fiber is soaked, rolling, heating in the rolling process, cooling after the thickening agent is fully melted, and obtaining a mould pressing material sheet;
3) and (3) placing the molded material sheet at normal temperature for 12-24h, curing to reach a molded state, tearing off the film, laminating, placing into a 120 ℃ mold, preserving heat for 5min, and molding under the molding pressure of 2.5Mpa to obtain the low-density low-pressure sheet molding compound.
Example 2
A low-density low-pressure sheet molding compound comprises the following components in parts by weight: unsaturated polyester resin: 64 parts, low profile additive: 38 parts, styrene: 7.5 parts, magnesium oxide paste: 1.5 parts of white sugarCrystal resin: 2 parts, benzoyl peroxide tert-butyl ester: 1.7 parts, light zinc stearate: 6 parts, calcium carbonate: 70 parts of hollow glass beads: 30 parts, chopped glass fiber: and 55 parts. Wherein the density of the hollow glass beads is 0.38-0.42g/cm3(ii) a The density of the magnesium oxide paste is 1.65g/ml, and the viscosity is 17000mpa & s; the melting point of the crystalline resin is about 55 ℃, and the granularity is 200-400 meshes; the chopped glass fiber is obtained by cutting glass fiber, and the length of the chopped glass fiber is 3-5 cm.
The low-density low-pressure sheet molding compound is prepared by the following method:
1) weighing the raw materials according to the formula of the components, dispersing benzoyl peroxide tert-butyl ester in a styrene monomer, stirring until the benzoyl peroxide tert-butyl ester is uniformly dispersed, then adding unsaturated polyester resin, a low-shrinkage additive, light zinc stearate, calcium carbonate and hollow glass beads, and stirring and mixing to obtain uniform unsaturated polyester resin paste;
2) adding magnesium oxide paste and crystalline resin into unsaturated polyester resin paste, stirring for 15-20min, then adding chopped glass fiber, fully mixing to ensure that the chopped glass fiber is soaked, rolling, heating in the rolling process, cooling after the thickening agent is fully melted, and obtaining a mould pressing material sheet;
3) and (3) placing the molded material sheet at normal temperature for 12-24h, curing to reach a molded state, tearing off the film, laminating, placing into a mold at 130 ℃, preserving heat for 5min, and molding under the molding pressure of 2.5Mpa to obtain the low-density low-pressure sheet molding compound.
Example 3
A low-density low-pressure sheet molding compound comprises the following components in parts by weight: unsaturated polyester resin: 60 parts, low profile additive: 35 parts, styrene: 7 parts, magnesium oxide paste: 1.5 parts, crystalline resin: 2 parts, benzoyl peroxide tert-butyl ester: 1.5 parts, light zinc stearate: 5 parts, calcium carbonate: 75 parts of hollow glass beads: 25 parts of chopped glass fiber: 52 parts. Wherein the density of the hollow glass beads is 0.38-0.42g/cm3(ii) a The density of the magnesium oxide paste is 1.65g/ml, and the viscosity is 17000mpa & s; the crystalline resin has a melting point of about 55 deg.C and a particle size of 200-400 meshes; the chopped glass fiber is obtained by cutting glass fiber, and the length of the chopped glass fiber is 3-5 cm.
The low-density low-pressure sheet molding compound is prepared by the following method:
1) weighing the raw materials according to the formula of the components, dispersing benzoyl peroxide tert-butyl ester in a styrene monomer, stirring until the benzoyl peroxide tert-butyl ester is uniformly dispersed, then adding unsaturated polyester resin, a low-shrinkage additive, light zinc stearate, calcium carbonate and hollow glass beads, and stirring and mixing to obtain uniform unsaturated polyester resin paste;
2) adding magnesium oxide paste and crystalline resin into unsaturated polyester resin paste, stirring for 15-20min, then adding chopped glass fiber, fully mixing to ensure that the chopped glass fiber is soaked, rolling, heating in the rolling process, cooling after the thickening agent is fully melted, and obtaining a mould pressing material sheet;
3) and (3) placing the molded material sheets at normal temperature for 12-24h, curing to reach a molded state, tearing off the film, laminating, placing into a 125 ℃ mold, preserving heat for 5.5min, and molding under a molding pressure of 3Mpa to obtain the low-density low-pressure sheet molding compound.
Example 4
A low-density low-pressure sheet molding compound comprises the following components in parts by weight: unsaturated polyester resin: 63 parts, low profile additive: 37 parts, styrene: 7.3 parts, magnesium oxide paste: 1.8 parts, crystalline resin: 2.2 parts, benzoyl peroxide tert-butyl ester: 1.6 parts, light zinc stearate: 5 parts, calcium carbonate: 70 parts of hollow glass beads: 20 parts of chopped glass fiber: 52 parts. Wherein the density of the hollow glass beads is 0.38-0.42g/cm3(ii) a The density of the magnesium oxide paste is 1.65g/ml, and the viscosity is 17000mpa & s; the melting point of the crystalline resin is about 55 ℃, and the granularity is 200-400 meshes; the chopped glass fiber is obtained by cutting glass fiber, and the length of the chopped glass fiber is 3-5 cm.
The low-density low-pressure sheet molding compound is prepared by the following method:
1) weighing the raw materials according to the formula of the components, dispersing benzoyl peroxide tert-butyl ester in a styrene monomer, stirring until the benzoyl peroxide tert-butyl ester is uniformly dispersed, then adding unsaturated polyester resin, a low-shrinkage additive, light zinc stearate, calcium carbonate and hollow glass beads, and stirring and mixing to obtain uniform unsaturated polyester resin paste;
2) adding magnesium oxide paste and crystalline resin into unsaturated polyester resin paste, stirring for 15-20min, then adding chopped glass fiber, fully mixing to ensure that the chopped glass fiber is soaked, rolling, heating in the rolling process, cooling after the thickening agent is fully melted, and obtaining a mould pressing material sheet;
3) and (3) placing the molded material sheets at normal temperature for 12-24h, curing to reach a molded state, tearing off the film, laminating, placing into a 125 ℃ mold, preserving heat for 6min, and molding under the molding pressure of 3.5Mpa to obtain the low-density low-pressure sheet molding compound.
The physical and mechanical properties of the low-density, low-pressure sheet molding compounds of examples 1-4 of the present invention were tested, and the test results are shown in Table 1.
TABLE 1
Figure BDA0002379321760000081
As can be seen from Table 1, the low density, low pressure sheet molding compounds of examples 1-4 of the present invention have lower density, higher flexural strength and better thermal insulation properties.
SEM test of the low-density low-pressure sheet molding compound of example 3 of the invention is shown in FIG. 1.
As can be seen from fig. 1, the hollow glass microspheres in the low-density low-pressure sheet molding compound of example 3 of the present invention have good integrity, no obvious pores are present in the interface between the microspheres and the matrix, the compatibility is good, the interface bonding strength is high, meanwhile, the impregnation of the fibers is good, and the interface bonding condition between the fibers and the resin paste matrix is good, so that the dual functions of the interface can enable the cracks to develop in all directions, and absorb additional energy, thereby limiting the expansion of the cracks, reducing and preventing the generation of stress concentration, enabling the material to have a certain bending strength, and improving the comprehensive performance of the material.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (9)

1. The low-density low-pressure sheet molding compound is characterized by comprising the following components in parts by weight: unsaturated polyester resin: 55-65 parts of low-profile additive: 30-40 parts of styrene: 6-8 parts of a thickening agent: 3.5-4.5 parts of benzoyl peroxide tert-butyl ester: 1-2 parts of light zinc stearate: 4-6 parts of calcium carbonate: 70-80 parts of hollow glass beads: 20-30 parts of chopped glass fiber: 45-55 parts.
2. The low density, low pressure sheet molding compound of claim 1, wherein said thickener is a mixture of an alkali metal oxide and a crystalline resin.
3. The low density, low pressure sheet molding compound of claim 2, wherein said alkali metal oxide and crystalline resin are present in a mass ratio of from 3: 4 to 5: 6.
4. The low density, low pressure sheet molding compound of claim 2, wherein said alkali metal oxide is magnesium oxide paste and said crystalline resin has a particle size of 200-400 mesh.
5. The low density, low pressure sheet molding compound of claim 1, wherein said hollow glass microspheres have a density of less than 0.45g/cm3
6. The low density, low pressure sheet molding compound of claim 1, wherein said chopped glass fibers have a length of 3-5 cm.
7. A method for preparing a low-density, low-pressure sheet molding compound as claimed in any of claims 1 to 6, characterized in that it comprises the following steps:
1) dispersing the benzoyl peroxide tert-butyl ester in the styrene monomer, then adding the unsaturated polyester resin, the low shrinkage additive, the light zinc stearate, the calcium carbonate and the hollow glass beads, and stirring and mixing to obtain unsaturated polyester resin paste;
2) adding the thickening agent into the unsaturated polyester resin paste, stirring, then adding the chopped glass fiber, fully mixing, rolling, heating in rolling, and cooling after the thickening agent is fully melted to obtain a molded material sheet;
3) and (3) curing the molded material sheet, tearing off the film, laminating, putting into a mold, and performing compression molding to obtain the low-density low-pressure sheet molding compound.
8. The method as claimed in claim 7, wherein the curing treatment in step 3) comprises: and (3) placing the molded material sheet for 12-24h at normal temperature.
9. The method as claimed in claim 7, wherein the molding temperature of the step 3) is 120-130 ℃, the molding pressure is 2-4Mpa, and the molding time is 5-6 min.
CN202010078421.1A 2020-02-03 2020-02-03 Low-density low-pressure sheet molding compound and preparation method thereof Pending CN111171540A (en)

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Cited By (7)

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CN111909498A (en) * 2020-07-31 2020-11-10 广东百汇达新材料有限公司 High-thermal-conductivity SMC and preparation method thereof
CN111925638A (en) * 2020-07-31 2020-11-13 广东百汇达新材料有限公司 Efficient heat-preservation SMC sheet molding compound and preparation method thereof
CN112812236A (en) * 2020-12-30 2021-05-18 郑州圣莱特空心微珠新材料有限公司 Novel SMC antenna housing for 5G communication and preparation method thereof
CN113462183A (en) * 2021-04-01 2021-10-01 句容市久诺复合材料有限公司 SMC composite material with high flame retardance and low density
CN113773604A (en) * 2021-10-26 2021-12-10 青岛国恩复合材料有限公司 Rapid curing thermosetting sheet molding compound and preparation method thereof
CN113845624A (en) * 2020-06-28 2021-12-28 比亚迪股份有限公司 Sheet molding compound, preparation method thereof and sheet molding compound product
CN114685967A (en) * 2022-05-05 2022-07-01 湖北大雁玻璃钢有限公司 Low-density SMC product and preparation method thereof

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CN107057312A (en) * 2017-04-10 2017-08-18 振石集团华美新材料有限公司 The forming method of glass fiber reinforcement lightweight sheet molding compound and its compound laying

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CN107057312A (en) * 2017-04-10 2017-08-18 振石集团华美新材料有限公司 The forming method of glass fiber reinforcement lightweight sheet molding compound and its compound laying

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CN113845624A (en) * 2020-06-28 2021-12-28 比亚迪股份有限公司 Sheet molding compound, preparation method thereof and sheet molding compound product
CN113845624B (en) * 2020-06-28 2022-12-09 比亚迪股份有限公司 Sheet molding compound, preparation method thereof and sheet molding compound product
CN111909498A (en) * 2020-07-31 2020-11-10 广东百汇达新材料有限公司 High-thermal-conductivity SMC and preparation method thereof
CN111925638A (en) * 2020-07-31 2020-11-13 广东百汇达新材料有限公司 Efficient heat-preservation SMC sheet molding compound and preparation method thereof
CN112812236A (en) * 2020-12-30 2021-05-18 郑州圣莱特空心微珠新材料有限公司 Novel SMC antenna housing for 5G communication and preparation method thereof
CN112812236B (en) * 2020-12-30 2024-02-23 郑州圣莱特空心微珠新材料有限公司 SMC antenna housing for 5G communication and preparation method thereof
CN113462183A (en) * 2021-04-01 2021-10-01 句容市久诺复合材料有限公司 SMC composite material with high flame retardance and low density
CN113773604A (en) * 2021-10-26 2021-12-10 青岛国恩复合材料有限公司 Rapid curing thermosetting sheet molding compound and preparation method thereof
CN113773604B (en) * 2021-10-26 2023-09-05 青岛国恩复合材料有限公司 Quick-curing thermosetting sheet molding compound and preparation method thereof
CN114685967A (en) * 2022-05-05 2022-07-01 湖北大雁玻璃钢有限公司 Low-density SMC product and preparation method thereof
CN114685967B (en) * 2022-05-05 2023-11-24 湖北大雁玻璃钢有限公司 Low-density SMC product and preparation method thereof

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