CN111162443A

CN111162443A - Welding method and welding apparatus

Info

Publication number: CN111162443A
Application number: CN201911413933.2A
Authority: CN
Inventors: 徐虎; 李莹; 胡美韶; 白文
Original assignee: Core Technology Shenzhen Co Ltd
Current assignee: Core Technology Shenzhen Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-05-15
Anticipated expiration: 2039-12-31
Also published as: CN111162443B

Abstract

The invention provides a welding method and a welding device, wherein the method comprises the following steps: the first manipulator picks up the first tube seat and places the first tube seat on the first welding table; the second mechanical arm picks up the first heat sink and the first chip; the second manipulator places the first heat sink on a first tube seat on the first welding table, and places the first chip on the chip rotating table for positioning; the third manipulator presses the first heat sink on the first welding table to be welded with the first tube seat; the third manipulator picks up the positioned first chip from the chip rotating table, places the first chip on the first heat sink, and presses the first chip to be welded with the first tube seat; and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table. The welding method provided by the invention solves the problems that the welding method in the prior art is low in efficiency, high in packaging cost and incapable of meeting the requirements of packaging technology.

Description

Welding method and welding apparatus

Technical Field

The application relates to the technical field of laser packaging, in particular to a welding method and welding equipment.

Background

The packaging technology is a technology for packaging an integrated circuit by using insulating plastic or other materials, and because a chip must be isolated from the outside, on one hand, the chip is prevented from being degraded in electrical performance due to corrosion of impurities in air to a chip circuit, and on the other hand, the packaged chip is more convenient to mount and transport, the packaging technology is necessary and important for the chip, and the performance of the chip and the design and manufacture of a circuit board connected with the chip are directly influenced by the quality of the packaging technology.

The encapsulation of laser instrument chip is through with the chip, heat sink and tube socket weld the laminating back, the encapsulation is accomplished on the tube socket to the tube cap welding that will have the lens again, prior art adopts semi-automatic mode with the tube socket of laser instrument and heat sink welding back at present, rethread equipment or manual work transfer accomplish the welding of chip and heat sink on another equipment, need accomplish the chip through two welding equipment like this, the laminating of heat sink and tube socket, make the encapsulation inefficiency, the encapsulation is with high costs, and the loss of maloperation increase material in the transportation still can appear, can not satisfy packaging technology's demand.

Therefore, the welding equipment and the welding method in the prior art have low efficiency, high packaging cost and increased material loss, and can not meet the requirements of packaging technology.

Disclosure of Invention

In order to solve the technical problems, the application provides a welding method and welding equipment, and solves the problems that the welding equipment and the welding method in the prior art are low in efficiency, high in packaging cost, increased in material loss and incapable of meeting the requirements of packaging technology.

In a first aspect, the present invention provides a method of welding, the method comprising: a first tube seat suction nozzle of the first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table; the heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a first chip from the chip tray, places the first heat sink on a first pipe seat on the first welding table and places the first chip on a chip rotating table for positioning; a suction nozzle of a third manipulator presses the first heat sink on the first welding table to weld the first heat sink and the first tube seat; a suction nozzle of the third manipulator picks up a positioned first chip from the chip rotating table and places the first chip on a first heat sink on the first welding table; a suction nozzle of the third manipulator presses the first chip on the first welding table to weld the first chip with the first tube seat; and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat picked up from the tube seat tray onto the first welding table.

In a second aspect, the present invention provides a welding apparatus comprising: a first manipulator comprising a first tube holder nozzle and a second tube holder nozzle; the second mechanical arm comprises a heat sink suction nozzle and a chip suction nozzle; the first tube seat suction nozzle of the first manipulator is used for picking up a first tube seat from the tube seat tray and placing the first tube seat on the first welding table; the heat sink suction nozzle of the second manipulator is used for picking up a first heat sink from the heat sink tray and placing the first heat sink on a first tube seat on the first welding table; the chip suction nozzle of the second manipulator is used for picking up a first chip from the chip tray and placing the first chip on the chip rotating table for positioning; a suction nozzle of the third manipulator is used for pressing the first heat sink on the first welding table to weld the first heat sink and the first pipe seat; the suction nozzle of the third manipulator is also used for picking up the positioned first chip from the chip rotating table and placing the first chip on the first heat sink on the first welding table; the suction nozzle of the third manipulator is also used for pressing the first chip on the first welding table to weld the first chip with the first tube seat; the second tube seat suction nozzle of the first manipulator is used for picking up a first tube seat after welding from the first welding table, and the first tube seat suction nozzle of the first manipulator is also used for placing a second tube seat picked up from the tube seat tray onto the first welding table.

Compared with the prior art, the technical scheme provided by the embodiment of the invention has the following advantages:

the invention provides a welding method and a welding device, wherein the method comprises the following steps: a first tube seat suction nozzle of the first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table; the heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a first chip from the chip tray, places the first heat sink on a first pipe seat on the first welding table and places the first chip on a chip rotating table for positioning; a suction nozzle of a third manipulator presses the first heat sink on the first welding table to weld the first heat sink and the first tube seat; a suction nozzle of the third manipulator picks up a positioned first chip from the chip rotating table and places the first chip on a first heat sink on the first welding table; a suction nozzle of the third manipulator presses the first chip on the first welding table to weld the first chip with the first tube seat; and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat picked up from the tube seat tray onto the first welding table. According to the welding method, the tube seat, the heat sink and the chip of the semiconductor laser are welded in the same full-automatic device, and the welding of the tube seat, the heat sink and the chip of the semiconductor laser is realized without two different devices, so that the welding efficiency and the welding cost are improved, material damage and loss caused by a midway material transferring process are avoided, the working efficiency is improved, and the production cost is saved; the feeding, blanking and welding cooperation working method of the five suction nozzles of the three manipulators further improves the welding efficiency; in the welding process, the suction nozzle of the third mechanical arm applies pressure to the heat sink or the chip, so that the welding is more stable; therefore, the invention solves the problems that the welding equipment and the welding method in the prior art have low efficiency, high packaging cost, increased material loss and can not meet the requirements of packaging technology.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without inventive exercise.

FIG. 1 is a flow chart of a welding method provided by an embodiment of the present invention;

FIG. 2 is a flow chart of a welding method provided by an embodiment of the present invention;

FIG. 3 is a flow chart of a welding method provided by an embodiment of the present invention;

FIG. 4 is a flow chart of a welding method provided by an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a welding apparatus according to an embodiment of the present invention.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

FIG. 1 is a flow chart of a welding method provided by an embodiment of the present invention; as shown in fig. 1, the flowchart of the welding method in the embodiment of the present invention specifically includes the following steps:

step S101, the first tube seat suction nozzle of the first mechanical arm picks up a first tube seat from the tube seat tray and places the first tube seat on the first welding table.

And S102, picking up a first heat sink by a heat sink suction nozzle of the second mechanical arm, picking up a first chip by a chip suction nozzle of the second mechanical arm, placing the first heat sink on a first pipe seat on the first welding table, and placing the first chip on a chip rotating table for positioning.

And S103, pressing the first heat sink on the first welding table by a suction nozzle of a third manipulator to weld the first heat sink and the first tube seat.

And step S104, picking up the positioned first chip from the chip rotating table by a suction nozzle of the third mechanical arm, and placing the first chip on the first heat sink on the first welding table.

And S105, pressing the first chip on the first welding table by a suction nozzle of the third manipulator to weld the first chip and the first tube seat.

And S106, after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table.

Specifically, the semiconductor laser welding method in this implementation is applied to a welding device of a semiconductor laser, and the welding device includes, but is not limited to, a first manipulator, a second manipulator, a third manipulator, a welding table, a chip rotating table, a tube seat feeding device, a heat sink feeding device, and a chip feeding device, where the tube seat feeding device is provided with a tube seat tray containing a plurality of tube seats, the heat sink feeding device is provided with a heat sink tray containing a plurality of heat sinks, and the chip feeding device is provided with a chip tray containing a plurality of chips.

In practical application, a first tube seat suction nozzle of a first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table, the first welding table rotates the first tube seat from vertical placement to horizontal placement, a welding surface on the first tube seat faces upwards horizontally, and welding with a heat sink is facilitated; the second manipulator picks up a first heat sink and a first chip from the heat sink tray and the chip tray respectively, a heat sink suction nozzle of the second manipulator places the picked-up first heat sink on a first pipe seat on the first welding table, and a chip suction nozzle of the second manipulator places the first chip on a chip rotating table for positioning; when the first heat sink and the first tube seat are heated and welded, a suction nozzle of a third manipulator presses the first heat sink on the first welding table, so that the first heat sink and the first tube seat are welded more quickly and stably; the suction nozzle of the third manipulator picks up the positioned first chip from the chip rotating table, the first chip is placed on the first heat sink on the first welding table, and the suction nozzle of the third manipulator presses the first chip on the first welding table, so that the first chip and the first tube seat are welded more quickly and stably; when the first chip and the first heat sink are welded, a first tube seat suction nozzle of the first manipulator picks up a second tube seat from the tube seat tray, when a second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table, the welded first tube seat is placed in the tube seat tray by the second tube seat suction nozzle of the first manipulator, the welding process of a tube seat, a heat sink and a chip of a laser on one welding table is completed, and when the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table, the second manipulator mechanically picks up another heat sink and another chip to weld the other heat sink and the chip on the first welding table.

The invention provides a welding method, which comprises the following steps: a first tube seat suction nozzle of the first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table; the heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a first chip from the chip tray, places the first heat sink on a first pipe seat on the first welding table and places the first chip on a chip rotating table for positioning; a suction nozzle of a third manipulator presses the first heat sink on the first welding table to weld the first heat sink and the first tube seat; a suction nozzle of the third manipulator picks up a positioned first chip from the chip rotating table and places the first chip on a first heat sink on the first welding table; a suction nozzle of the third manipulator presses the first chip on the first welding table to weld the first chip with the first tube seat; and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat picked up from the tube seat tray onto the first welding table. According to the welding method, the tube seat, the heat sink and the chip of the semiconductor laser are welded in the same full-automatic device, and the welding of the tube seat, the heat sink and the chip of the semiconductor laser is realized without two different devices, so that the welding efficiency and the welding cost are improved, material damage and loss caused by a midway material transferring process are avoided, the working efficiency is improved, and the production cost is saved; the feeding, blanking and welding cooperation working method of the five suction nozzles of the three manipulators further improves the welding efficiency; in the welding process, the suction nozzle of the third mechanical arm applies pressure to the heat sink or the chip, so that the welding is more stable; therefore, the invention solves the problems that the welding equipment and the welding method in the prior art have low efficiency, high packaging cost, increased material loss and can not meet the requirements of packaging technology.

FIG. 2 is a flow chart of a welding method provided by an embodiment of the present invention; as shown in fig. 2, the flowchart of the welding method in the embodiment of the present invention further includes the following steps:

step S201, the heat sink suction nozzle of the second manipulator picks up the first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up the first chip from the chip tray.

Step S202, after the first heat sink is positioned by the heat sink suction nozzle of the second manipulator through the first imaging device, the first heat sink is placed on the first tube seat on the first welding table.

Step S203, the first soldering station heats the first heat sink.

Step S204, the chip suction nozzle of the second manipulator places the first chip on the chip rotating platform, so that the chip rotating platform rotates the first chip to the position through the second imaging device.

Specifically, step S102 in the embodiment of fig. 1: the heat sink suction nozzle of second manipulator picks up first heat sink, and the chip suction nozzle of second manipulator picks up first chip, and first heat sink is placed on the first tube socket on the first welding bench and will first chip is placed and is fixed a position on the chip revolving stage, includes: the heat sink suction nozzle of the second mechanical arm picks up a first heat sink from a heat sink tray, the chip suction nozzle of the second mechanical arm picks up a first chip from a chip tray, the heat sink suction nozzle of the second mechanical arm positions the first heat sink through a first imaging device and a first pipe seat, then the first heat sink is placed on the first pipe seat on the first welding table to be heated, then the chip suction nozzle of the second mechanical arm places the first chip on the chip rotating table, and the chip rotating table rotates the chip to a preset position through a second imaging device.

FIG. 3 is a flow chart of a welding method provided by an embodiment of the present invention; as shown in fig. 3, the flowchart of the semiconductor laser welding method in the embodiment of the present invention further includes the following steps:

and S301, picking up the positioned first chip from the chip rotating table by a suction nozzle of the third mechanical arm.

Step S302, the suction nozzle of the third manipulator positions the first chip through the first imaging device.

Step S303, a suction nozzle of the third manipulator places the first chip on the first heat sink on the first soldering station.

Step S304, the first bonding stage heats the first chip.

Specifically, in step S104 in the embodiment of fig. 1, picking up the positioned first chip from the chip rotation table by the suction nozzle of the third robot, and placing the first chip on the first heat sink on the first bonding stage includes: when the chip rotating table is right after the first chip is positioned, the first heat sink and the first tube seat are welded, the third mechanical arm moves to the top of the chip rotating table to enable a suction nozzle of the third mechanical arm to be located, a first chip which is positioned and completed is picked up on the chip rotating table, the third mechanical arm moves to the top of the first welding table again, the first chip and the first tube seat are positioned through the first imaging device, and the first chip is placed on the first heat sink to be heated after the positioning is completed.

FIG. 4 is a flow chart of a welding method provided by an embodiment of the present invention; as shown in fig. 4, the flowchart of the welding method in the embodiment of the present invention further includes the following steps:

in step S411, the first header suction nozzle of the first robot picks up the first header from the header tray and places the first header on the first bonding stage.

In step S412, the heat sink suction nozzle of the second manipulator picks up the first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up the first chip from the chip tray.

Step S413, the heat sink nozzle of the second manipulator places the first heat sink on the first tube seat on the first soldering stage for heating and soldering, and the chip nozzle of the second manipulator places the first chip on the chip rotating stage for positioning.

Step S414, a suction nozzle of the third manipulator presses the first heat sink on the first welding table, so that the first heat sink is welded to the first tube seat.

Step S415, the suction nozzle of the third manipulator picks up the positioned first chip from the chip rotation table, and places the first chip on the first heat sink on the first bonding stage.

Step S416, the suction nozzle of the third manipulator presses the first chip on the first bonding stage, so that the first chip is bonded to the first tube seat.

In step S417, after the second header suction nozzle of the first robot picks up the welded first header from the first welding stage, the first header suction nozzle of the first robot places the second header picked up from the header tray onto the first welding stage.

In step S421, the first header suction nozzle of the first robot picks up a third header from the header tray and places the third header on the second bonding stage.

Step S422, the heat sink suction nozzle of the second manipulator picks up the second heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up the second chip from the chip tray.

And step 423, the heat sink suction nozzle of the second manipulator places a second heat sink on a second tube seat on the second welding table for heating and welding, and the heat sink suction nozzle of the second manipulator places a second chip on the chip rotating table for positioning.

Step S424, the suction nozzle of the third manipulator presses the second heat sink on the second welding table, so that the second heat sink is welded to the second tube seat.

Step S425, the suction nozzle of the third manipulator picks up the positioned second chip from the chip rotation table, and places the second chip on the second heat sink on the second bonding stage.

And step S426, pressing the second chip on the second welding table by a suction nozzle of the third manipulator to weld the second chip and the second tube seat.

In step S427, after the second header suction nozzle of the first robot picks up the third header after the soldering from the second soldering station, the first header suction nozzle of the first robot places the fourth header picked up from the header tray onto the first soldering station.

In the embodiment of the present invention, two soldering stages are provided for soldering the chip, the heat sink and the header, steps S411 to S417 in fig. 4 are a work flow on the first soldering stage, steps S421 to S427 are a work flow on the second soldering stage, and solid arrows indicate a sequence of steps on the same soldering stage, that is, the first soldering stage is sequentially performed according to steps S411 to S417, and the second soldering stage is sequentially performed according to steps S421 to S427; the dashed arrows indicate the sequence of steps of the same manipulator, i.e. the first manipulator performs the sequence of steps: step S411, step S421, step S417, and step S427, the second robot executes the steps in the order: step S412 to step S413 to step S422 to step S423, the third manipulator performs the steps in the order: step S414-step S415-step S416-step S424-step S425-step S426; the step S412 and the step S421 have no precedence relationship, the step S414 and the step S422 also have no precedence relationship, and the step S417 and the step S424 have no precedence relationship.

Specifically, after a first tube seat suction nozzle of a first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table, a second manipulator is started to place a heat sink and a chip on the first welding table in sequence for welding, meanwhile, the first tube seat suction nozzle of the first manipulator continues to pick up a third tube seat from the tube seat tray and places the third tube seat on a second welding table, and after welding work on the first welding table is completed, the second manipulator can place the heat sink and the chip on the second welding table in sequence for welding; after the first tube seat suction nozzle of the first manipulator places a third tube seat on the second welding table and welding work on the first welding table is finished, the first manipulator picks up the second tube seat from the tube seat tray again, and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat on the first welding table again; therefore, in the embodiment, the second welding table is prepared when the first welding table works, and the first welding table is prepared when the second welding table works, so that the two welding tables are matched with the first mechanical arm, the second mechanical arm and the third mechanical arm in a time sequence, the welding efficiency is higher, and the waiting time is shortened.

In one embodiment of the present invention, the first header suction nozzle of the first robot picking a first header from a header tray and placing the first header on the first soldering station comprises: a first tube seat suction nozzle of the first manipulator vertically picks up the first tube seat from a tube seat tray and places the first tube seat on the first welding table; the first welding table rotates the first pipe seat by 90 degrees, so that the basal surface of the first pipe seat faces upwards horizontally; the basal surface of the first pipe seat is a surface on which the first pipe seat and the first heat sink are welded.

In one embodiment of the present invention, the heat sink suction nozzle of the second robot arm picking up a second heat sink from the heat sink tray, the chip suction nozzle of the second robot arm picking up a second chip from the chip tray, and placing the second heat sink on a second header on the second bonding stage and placing the second chip on the chip rotation stage for positioning includes: the heat sink suction nozzle of the second manipulator picks up a second heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a second chip from the chip tray; after the second heat sink is positioned by the heat sink suction nozzle of the second manipulator through a third imaging device, the third heat sink is placed on a second tube seat on the second welding table, and the second welding table heats the third heat sink; and placing the second chip on the chip rotating platform by using a chip suction nozzle of the second mechanical arm, so that the chip rotating platform rotates the second chip to the position by using a second imaging device.

In one embodiment of the present invention, the picking up the positioned second chip from the chip rotation table by the suction nozzle of the third robot, and placing the second chip on the second heat sink on the second bonding stage, includes: a suction nozzle of the third manipulator picks up the positioned second chip from the chip rotating table; and after the second chip is positioned by the suction nozzle of the third manipulator through the third imaging device, the second chip is placed on a second heat sink on the second welding table, so that the second welding table heats the second chip.

In one embodiment of the present invention, after the second header suction nozzle of the first robot picks up the first header after welding from the first welding stage, and after the first header suction nozzle of the first robot places the second header picked up from the header tray onto the first welding stage, the method further comprises: and the second tube seat suction nozzle of the first manipulator places the welded first tube seat in the tube seat tray.

FIG. 5 is a schematic structural diagram of a welding apparatus according to an embodiment of the present invention; as shown in fig. 5, the welding device in the embodiment of the present invention specifically includes:

a first feeding area 300 for feeding the laser tube holder; a second loading area 100 for loading the laser heat sink and the laser chip; and the welding working area 200 is used for welding the laser tube seat, the heat sink and the chip.

The first loading zone 300 comprises a first robot 310, said first robot 310 comprising a first header suction nozzle 311 and a second header suction nozzle 312; the first loading area 300 further comprises a stem tray 320 for holding laser stems; the first and second

header suction nozzles

311 and 312 pick and place laser headers right above the header tray 320.

The second feeding area 100 includes a second robot arm 110, the second robot arm 110 includes a heat sink suction nozzle 112 and a chip suction nozzle 111, the second feeding area 100 further includes a heat sink tray 120 for holding heat sinks and a chip tray 130 for holding chips, and the heat sink suction nozzle 112 of the second robot arm 110 is used for picking up a first heat sink from the heat sink tray 120.

The bonding work area 200 includes a first bonding stage 210, a second bonding stage 220, a third robot 260 for bonding, a die rotation stage 230 for positioning a die, a rail 240 for movement of the first robot 310 and the second robot 110, and an imaging device for positioning; the imaging device comprises a first imaging device 251, a second imaging device 252 and a third imaging device 253, wherein the first imaging device 251 is used for positioning a tube socket, a heat sink and a chip on the first welding table 210 before welding, the second imaging device 252 is used for positioning the chip on the chip rotating table in the X direction and the Y direction, and the third imaging device 253 is used for positioning the tube socket, the heat sink and the chip on the second welding table 220 before welding.

The specific working process is as follows:

the first socket suction nozzle 311 of the first manipulator 310 is used for picking up a first socket from the socket tray 320 and placing the first socket on the first soldering stage 210, the heat sink suction nozzle 112 of the second manipulator 110 picks up a first heat sink from the heat sink tray 120 and the chip suction nozzle 111 picks up a first chip from the chip tray 130 and moves the first chip to the position right above the first soldering stage 210, after the first heat sink on the heat sink suction nozzle 112 and the first socket on the first soldering stage 210 are positioned by the first imaging device 251, the first heat sink is placed on the first socket by the heat sink suction nozzle 112 for heating, the second manipulator 110 moves to the position right above the chip rotating stage 230, and the chip suction nozzle 111 places the first chip on the chip rotating stage 230, so that the chip rotating stage 230 positions the first chip in the X direction and the Y direction; after the chip suction nozzle 110 places a first chip on the chip rotation stage 230 and after the first heat sink and the first socket are heated, the third manipulator 260 moves to a position right above the first welding stage 210, and the suction nozzle 261 of the third manipulator 260 presses the first heat sink to weld the first heat sink and the first socket; after the welding is completed, the third manipulator 260 moves to a position right above the chip rotating table 230, so that the suction nozzle 261 picks up the positioned first chip, the first chip is positioned by the first imaging device 251 and then placed on the first heat sink on the first welding table 210 for heating and welding, and the suction nozzle 261 presses the first chip during the welding, so that the first chip and the first heat sink are welded more stably; after the welding operation is completed, the first robot 300 moves to a position right above the first welding stage 210, so that the second socket suction nozzle 312 picks up the welded first socket from the first welding stage 210, and the first socket suction nozzle 311 places another socket to be welded on the first welding stage to wait for the next welding operation.

The above is the welding process on the first welding stage 210, and at the same time, after the first socket suction nozzle 311 of the first manipulator 310 places the first socket on the first welding stage 210, the first socket suction nozzle 311 of the first manipulator 310 continues to pick up the second socket from the socket tray 320 and place the second socket on the second welding stage 220, and after the welding work on the first welding stage 210 is completed, the second manipulator 110 picks up the second heat sink and places the second chip on the second socket on the second welding stage 220 to perform the welding work; therefore, the welding of the two welding tables enables the welding process to be more compact, reduces the waiting time and improves the welding efficiency.

It is noted that, in this document, relational terms such as "first" and "second," and the like, may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

The foregoing are merely exemplary embodiments of the present invention, which enable those skilled in the art to understand or practice the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A method of welding, the method comprising:

a first tube seat suction nozzle of the first manipulator picks up a first tube seat from a tube seat tray and places the first tube seat on a first welding table;

the heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a first chip from the chip tray, places the first heat sink on a first pipe seat on the first welding table and places the first chip on a chip rotating table for positioning;

a suction nozzle of a third manipulator presses the first heat sink on the first welding table to weld the first heat sink and the first tube seat;

a suction nozzle of the third manipulator picks up a positioned first chip from the chip rotating table and places the first chip on a first heat sink on the first welding table;

a suction nozzle of the third manipulator presses the first chip on the first welding table to weld the first chip with the first tube seat;

and after the second tube seat suction nozzle of the first manipulator picks up the welded first tube seat from the first welding table, the first tube seat suction nozzle of the first manipulator places the second tube seat picked up from the tube seat tray onto the first welding table.

2. The method of claim 1, wherein after the first header suction nozzle of the first robot picks a first header from the header tray and places the first header on the first bonding station, and before the second header suction nozzle of the first robot picks a first header that has been bonded from the first bonding station, the method further comprises:

and the first tube seat suction nozzle of the first manipulator picks up a third tube seat from the tube seat tray and places the third tube seat on the second welding table.

3. The method of claim 2,

after the second manipulator places the first heat sink on the first header on the first bonding stage and places the first chip on the chip rotating stage for positioning, and after the first header suction nozzle of the first manipulator picks up a third header from the header tray and places the third header on the second bonding stage, the method further comprises:

a heat sink suction nozzle of the second manipulator picks up a second heat sink from the heat sink tray, and a chip suction nozzle of the second manipulator picks up a second chip from the chip tray, places the second heat sink on a second pipe seat on the second welding table, and places the second chip on the chip rotating table for positioning;

a suction nozzle of a third manipulator presses a second heat sink on the second welding table to weld the second heat sink and the second tube seat;

a suction nozzle of the third manipulator picks up a positioned second chip from the chip rotating table and places the second chip on a second heat sink on the second welding table;

a suction nozzle of the third manipulator presses a second chip on the second welding table to weld the second chip with the second tube seat;

and after the second tube seat suction nozzle of the first manipulator picks up a welded third tube seat from the second welding table, the first tube seat suction nozzle of the first manipulator places the picked fourth tube seat on the second welding table.

4. The method of claim 1, wherein the second robot's heat sink nozzle picking up a first heat sink from a heat sink tray, the second robot's chip nozzle picking up a first chip from a chip tray and placing the first heat sink onto a first header on the first bonding station and placing the first chip onto a chip rotation station for positioning, comprises:

the heat sink suction nozzle of the second manipulator picks up a first heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a first chip from the chip tray;

after the first heat sink is positioned by the heat sink suction nozzle of the second manipulator through the first imaging device, the first heat sink is placed on the first tube seat on the first welding table, and the first welding table heats the first heat sink;

and the chip suction nozzle of the second mechanical arm places the first chip on the chip rotating platform, so that the chip rotating platform rotates the first chip to the position through the second imaging device.

5. The method of claim 1, wherein the third robot's suction nozzle picking up the positioned first chip from the chip rotation table, placing the first chip onto a first heat sink on the first bonding station, comprises:

a suction nozzle of the third manipulator picks up the positioned first chip from the chip rotating table;

and after the first chip is positioned by the suction nozzle of the third manipulator through the first imaging device, the first chip is placed on the first heat sink on the first welding table, so that the first welding table heats the first chip.

6. The method of claim 1, wherein the first header suction nozzle of the first robot picking a first header from the header tray and placing the first header onto the first soldering station comprises:

a first tube seat suction nozzle of the first manipulator vertically picks up the first tube seat from a tube seat tray and places the first tube seat on the first welding table;

the first welding table rotates the first pipe seat by 90 degrees, so that the basal surface of the first pipe seat faces upwards horizontally;

the basal surface of the first pipe seat is a surface on which the first pipe seat and the first heat sink are welded.

7. The method of claim 3, wherein the second robot's heat sink nozzle picking a second heat sink from the heat sink tray, the second robot's chip nozzle picking a second chip from the chip tray and placing the second heat sink onto a second header on the second bonding stage and the second chip onto the chip rotation stage for positioning, comprises:

the heat sink suction nozzle of the second manipulator picks up a second heat sink from the heat sink tray, and the chip suction nozzle of the second manipulator picks up a second chip from the chip tray;

after the second heat sink is positioned by the heat sink suction nozzle of the second manipulator through a third imaging device, the third heat sink is placed on a second tube seat on the second welding table, and the second welding table heats the third heat sink;

and placing the second chip on the chip rotating platform by using a chip suction nozzle of the second mechanical arm, so that the chip rotating platform rotates the second chip to the position by using a second imaging device.

8. The method of claim 3, wherein the third robot's suction nozzle picking up the positioned second chip from the chip rotation table, placing the second chip onto a second heat sink on the second bonding station, comprises:

a suction nozzle of the third manipulator picks up the positioned second chip from the chip rotating table;

and after the second chip is positioned by the suction nozzle of the third manipulator through the third imaging device, the second chip is placed on a second heat sink on the second welding table, so that the second welding table heats the second chip.

9. The method of claim 1, wherein after the second header suction nozzle of the first robot picks up a welded first header from the first welding station and after the first header suction nozzle of the first robot places a second header picked from the header tray onto the first welding station, the method further comprises:

and the second tube seat suction nozzle of the first manipulator places the welded first tube seat in the tube seat tray.

10. A welding apparatus, characterized in that the apparatus comprises:

a first manipulator comprising a first tube holder nozzle and a second tube holder nozzle;

the second mechanical arm comprises a heat sink suction nozzle and a chip suction nozzle;

the first tube seat suction nozzle of the first manipulator is used for picking up a first tube seat from the tube seat tray and placing the first tube seat on the first welding table;

the heat sink suction nozzle of the second manipulator is used for picking up a first heat sink from the heat sink tray and placing the first heat sink on a first tube seat on the first welding table;

the chip suction nozzle of the second manipulator is used for picking up a first chip from the chip tray and placing the first chip on the chip rotating table for positioning;

a suction nozzle of the third manipulator is used for pressing the first heat sink on the first welding table to weld the first heat sink and the first pipe seat;

the suction nozzle of the third manipulator is also used for picking up the positioned first chip from the chip rotating table and placing the first chip on the first heat sink on the first welding table;

the suction nozzle of the third manipulator is also used for pressing the first chip on the first welding table to weld the first chip with the first tube seat;

the second tube seat suction nozzle of the first manipulator is used for picking up a first tube seat after welding from the first welding table, and the first tube seat suction nozzle of the first manipulator is also used for placing a second tube seat picked up from the tube seat tray onto the first welding table.