CN111162363A - Tin sealing device and process - Google Patents
Tin sealing device and process Download PDFInfo
- Publication number
- CN111162363A CN111162363A CN202010048519.2A CN202010048519A CN111162363A CN 111162363 A CN111162363 A CN 111162363A CN 202010048519 A CN202010048519 A CN 202010048519A CN 111162363 A CN111162363 A CN 111162363A
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- Prior art keywords
- sealing
- tin
- sealing plate
- wall
- air outlet
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007789 sealing Methods 0.000 title claims abstract description 165
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 title claims abstract description 75
- 238000000034 method Methods 0.000 title claims abstract description 23
- 229910000679 solder Inorganic materials 0.000 claims description 31
- 238000010438 heat treatment Methods 0.000 claims description 13
- 239000006071 cream Substances 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 238000002844 melting Methods 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 9
- 238000003801 milling Methods 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 239000003570 air Substances 0.000 description 51
- 230000000694 effects Effects 0.000 description 11
- 238000004891 communication Methods 0.000 description 7
- 238000013461 design Methods 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 239000012080 ambient air Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000604 Ferrochrome Inorganic materials 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000002026 carminative effect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P11/00—Apparatus or processes specially adapted for manufacturing waveguides or resonators, lines, or other devices of the waveguide type
- H01P11/007—Manufacturing frequency-selective devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a tin sealing device and a process, belonging to the technical field of tin sealing, and the tin sealing device comprises a structural body with a cavity and a sealing plate covering the opening of the cavity of the structural body, wherein the inner wall of the structural body is provided with a lap joint table, the sealing plate is arranged on the lap joint table, a gap is reserved between the edge of the sealing plate and the inner wall of the structural body above the lap joint table, tin paste for sealing is coated between the edge of the sealing plate and the inner wall of the structural body, and the sealing plate is provided with an air outlet communicated with the cavity inside the structural body.
Description
Technical Field
The invention relates to the technical field of tin sealing, in particular to a tin sealing device and a tin sealing process.
Background
Tin sealing is one of sealing technologies of electronic products and communication equipment modules. In the communication equipment, the tin seal can improve the anti-interference capability of the product and can also reduce the interference of the module to other modules in the equipment. The good tin seal can meet the requirement of products on a certain degree of air tightness grade, and has the characteristic of low economic cost, so that products and modules with the requirement on the air tightness grade in communication equipment can be generally sealed by adopting a tin seal technology.
Modern communication environments become more complex and worse in practical application, components, modules, equipment and the like generally need to work in high-altitude and high-radiation environments, and therefore the indexes of air tightness levels of the components, modules, equipment and the like sensitive to the environment need to be measured in the actual working environments.
In a high-power communication device, the cavity filter is an indispensable module. The power capacity of a cavity filter is directly proportional to the gas pressure in its cavity, and generally the higher the gas pressure in the cavity, the higher the tolerable power capacity. In order to ensure that the power capacity of the cavity filter does not change with the change of the ambient air pressure and ensure that the cavity filter can normally work under the condition of the change of the ambient air pressure, the cavity filter is generally required to have good air tightness so as to meet the requirement of the required sealing grade. The tin sealing technology is widely applied to the production of products such as components, electronic products, communication equipment and the like because of the characteristics of easy operation, low cost, low requirement on equipment and the like, and is an excellent choice particularly in the sealing process of a cavity filter.
The existing cavity filter comprises a structural body with a cavity inside, a sealing plate is arranged at the opening of the structural body in a covering mode, when the structure is sealed by tin, the sealing plate is arranged at the opening of the structural body in a covering mode, then tin paste is coated on the periphery of the sealing plate, the tin paste is melted through heating, gaps between the structural body and the sealing plate can be fully filled and sealed by the melted tin paste, and the tin sealing operation is completed after the melted tin paste is cooled and solidified. However, in the process of heating and melting the solder paste, the gas in the cavity of the structure body is subjected to thermal expansion, an upward acting force is applied to the sealing plate, and the soldering tin in the welding bead can be broken through when the acting force reaches a certain degree, so that the sealed cavity filter has pinhole air leakage, the air tightness of the product is damaged, the sealing effect is lost, and the requirement on the sealing grade in practical application cannot be met.
Disclosure of Invention
The invention aims to provide a tin sealing device, which achieves the effect of improving the sealing property.
One of the technical purposes of the invention is realized by the following technical scheme:
the utility model provides a tin seal device, locates the closing plate of the cavity opening part of structure including the structure that has the cavity and lid, the inner wall of structure is provided with the overlap joint platform, and the closing plate sets up on the overlap joint bench, and leaves the space between the structure inner wall of the edge of closing plate and overlap joint bench top, and the coating has the tin cream that is used for sealing between the edge of closing plate and the inner wall of structure, sets up the venthole with the inside cavity intercommunication of structure on the closing plate.
Through above-mentioned technical scheme, when sealing up closing plate and structure, at first set up the closing plate and form the overlap joint fixed on the overlap joint platform, then coat the tin cream between the edge of closing plate and the structure inner wall, then make the tin cream melt through the heating, the gap that the tin cream after the melting can be between the edge of closing plate and the inner wall of structure flows, treat that the tin cream can make after solidifying again and can form complete reliable seal between closing plate and the structure, the setting up of overlap joint platform can make the closing plate keep the level on the one hand, the position relation between closing plate and the structure is stable, on the other hand can provide the storage position for the tin cream, prevent that the tin cream after the melting from flowing into inside the structure, and provide sufficient enclosure space for the sealing up of closing plate and structure. In the process of heating and melting the solder paste, the gas inside the structure body is heated to expand and can be discharged from the gas outlet hole, so that the gas pressure generated by heating in the cavity of the structure body when the structure body is sealed is released, the pinhole gas leakage between the sealed structure body and the sealing plate is effectively prevented, and the gas tightness of the product is guaranteed.
The present invention in a preferred example may be further configured to: the periphery of the sealing plate is fixedly provided with sealing steps, and the sealing steps and the sealing plate are arranged in a step shape.
Through above-mentioned technical scheme, the sealed step is set up all around to the closing plate, consequently when setting up the closing plate on the overlap joint bench, the marginal upper surface of closing plate can and the inner wall of structure between form sufficient space region to the solder paste that uses when the storage is sealed has indirectly improved the sealed effect between closing plate and the structure, and the setting of sealed step can further prevent that the solder paste after melting from flowing into the cavity of structure inside, ensures the inside clean degree of structure.
The present invention in a preferred example may be further configured to: and a gap is reserved between the sealing step and the inner wall of the structure body so as to store solder paste used in sealing.
Through above-mentioned technical scheme, leave the space between the inner wall of sealed step and structure, consequently can flow in the space after the tin cream melts for sealed position between sealed step and the structure inner wall increases, has further improved the sealed effect between closing plate and the structure.
The present invention in a preferred example may be further configured to: and a contact pin for sealing is inserted in the air outlet.
Through above-mentioned technical scheme, after sealing through the tin cream between the edge of closing plate and the inner wall of structure, the venthole need not to play carminative effect, can insert the contact pin in the venthole this moment to seal the venthole, further ensured the sealed effect between closing plate and the structure inside.
The present invention in a preferred example may be further configured to: the air outlet is reduced in a step shape towards the direction towards the inside of the structure body, the contact pin is in a matched step shape, and the contact pin is in interference fit with the air outlet.
Through above-mentioned technical scheme, the venthole is the echelonment towards the inside direction of structure and reduces, and the contact pin is with venthole looks adaptation, consequently through the grafting cooperation of ladder face, can improve the leakproofness of venthole to contact pin and venthole interference fit can ensure the installation stability and the sealing reliability of contact pin and venthole.
The present invention in a preferred example may be further configured to: the two ends of the contact pin are flush with the upper surface and the lower surface of the sealing plate respectively.
Through above-mentioned technical scheme, the both ends of contact pin respectively with two upper and lower surface parallel and level of closing plate, can improve the grafting stability of contact pin and closing plate to tin seals the back, the outward appearance of product is comparatively level and smooth.
The present invention in a preferred example may be further configured to: and a gap for storing solder paste is reserved between the top end edge of the contact pin and the wall of the air outlet.
Through above-mentioned technical scheme, after the contact pin inserted the venthole, scribble the tin cream in the space between the edge on contact pin top and the venthole pore wall for the tin cream here continues to melt and carries out secondary seal in order to carry out the venthole, has improved the leakproofness of venthole greatly.
The second objective of the present invention is to provide a tin sealing process to achieve the effect of improving the sealing performance.
The second technical purpose of the invention is realized by the following technical scheme:
a tin sealing process comprises the following steps:
s1, milling a sealing step with a certain depth and width on the edge of the sealing plate, and forming an air outlet hole on the sealing plate;
s2, processing a lapping table on the inner wall of the cavity of the structure;
s3, covering the sealing plate on the cavity opening of the structure, coating solder paste in a gap between the edge of the sealing plate and the inner wall of the structure, heating the solder paste to melt the solder paste, and sealing the sealing plate and the structure;
s4, after the solder paste between the edge of the sealing plate and the inner wall of the structure body is hardened, inserting the contact pin into the air outlet;
and S5, coating solder paste between the edge of the pin and the wall of the air outlet hole, locally heating and melting, and sealing the pin and the air outlet hole until the solder paste is hardened again.
According to the technical scheme, in practical application, the sealing plate of the structural part is designed by the process method, and a sealing groove is formed between the sealing step on the sealing plate and the cavity wall and used for storing solder paste used in sealing; the air outlet hole on the sealing plate is used for releasing the air pressure generated by heat in the cavity during sealing; and the contact pin matched with the air outlet hole is used for sealing the air outlet hole on the sealing plate, so that the air tightness requirement of the product is finally realized. And finally, the vent hole is not required to be integrally heated when being sealed, and the vent hole is locally heated by using ferrochrome, so that the condition that a large amount of gas in the cavity is heated and expanded is prevented, and the sealing property is further improved. The process design has strong engineering practicability and operability; through the process design, the difficulty of the product sealing process can be effectively reduced, the working efficiency is improved, and the sealing effect of the product and the appearance of the product after sealing are improved.
In conclusion, the beneficial technical effects of the invention are as follows:
1. the lap joint table is arranged on the inner wall of the structure body, and the air outlet hole is formed in the sealing plate, so that gas pressure generated by heating in the structure body can be discharged during tin sealing, the sealing plate is prevented from being subjected to overlarge upward acting force during tin sealing, and the air tightness of a product is prevented from being damaged;
2. the sealing steps are fixedly arranged on the periphery of the sealing plate, so that the tin seal between the sealing plate and the structural body is more comprehensive and the air tightness is higher;
3. after tin sealing between the sealing plate and the structure body is finished, the contact pin is inserted into the air outlet hole and tin sealing is carried out on the air outlet hole, and therefore air tightness between the sealing plate and the structure body is further improved.
Drawings
FIG. 1 is a schematic structural view of a structure and a sealing plate in this embodiment;
fig. 2 is an exploded view of the structure and the sealing plate in this embodiment.
Reference numerals: 1. a structure body; 11. a lapping table; 2. a sealing plate; 21. an air outlet; 22. sealing the step; 3. and (6) inserting pins.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example 1
A tin sealing device is shown in figure 1 and comprises a structural body 1 with a cavity, wherein the top end of the structural body 1 is open, a sealing plate 2 is arranged at the opening at the top end of the structural body 1 in a covering mode, solder paste is coated and heated between the periphery of the sealing plate 2 and the structural body 1 to melt the solder paste so as to seal and fix the sealing plate and the structural body with tin, air outlet holes 21 are formed in the sealing plate 2 and communicated with an inner cavity of the structural body 1, therefore, when the tin paste is heated to complete tin sealing between the sealing plate 2 and the structural body 1, air in the structural body 1 is heated to expand and can be discharged from the air outlet holes 21, the phenomenon that the air in the structural body 1 is heated to extrude the sealing plate 2 is avoided, soldering tin in a welding bead is broken, and a sealed product has pinhole air leakage, and.
As shown in fig. 2, a circle of horizontal lapping table 11 is arranged at the top of the structure 1, a circle of sealing step 22 is arranged at the position of the periphery of the bottom of the sealing plate 2, when tin sealing is performed, the sealing plate 2 is lapped on the lapping table 11, and a gap is reserved between the sealing step 22 and the inner wall of the structure 1, so that more tin paste can be stored, and the lapping table 11 and the sealing step 22 are matched, so that the tin paste can be kept in the gap between the structure 1 and the edge of the sealing plate 2, the tin paste is prevented from flowing into the structure 1, when tin sealing is performed, the tin sealing tightness can be exerted to the greatest extent, and the tin sealing effect is improved.
As shown in fig. 2, the cross-sectional dimension of the air outlet 21 is reduced in a step shape from top to bottom, the pin 3 is inserted into the air outlet 21, the pin 3 is in a step shape matched with the air outlet 21, after the pin 3 is inserted into the air outlet 21, the upper surface of the pin 3 is flush with the upper surface of the sealing plate 2, and a gap exists between the periphery of the top of the pin 3 and the inner wall of the air outlet 21, so that after the tin sealing between the sealing plate 2 and the structural body 1 is completed, the soldering tin pin 3 and the structural body 1 are continuously used for forming sealing fixation. The sealing property between the structure 1 and the sealing plate 2 is further improved.
The implementation principle of the embodiment is as follows: when the structure 1 and the sealing plate 2 are subjected to tin sealing, firstly, the sealing plate 2 is covered on the lapping table 11 of the structure 1, then, tin paste is stored between the edge of the sealing plate 2 and the inner wall of the structure 1, then, the tin paste is heated to be melted, and the tin sealing is completed, because the air outlet 21 is formed in the sealing plate 2, when the sealing plate 2 and the structure 1 are subjected to tin sealing, the gas pressure caused by heat generation in the cavity of the structure 1 during sealing can be released, the pinhole air leakage between the sealing plate 2 and the structure 1 due to expansion force is prevented, the air tightness is improved, and finally, in order to perfect the sealing performance of the structure 1, the pin 3 is inserted into the air outlet 21, and the tin paste is used again to form the tin sealing seal between the pin 3 and the air outlet 21.
Example 2
A process design for improving tin seal effect comprises the following steps:
s1, milling a sealing step 22 with a certain depth and width on the edge of the sealing plate 2, and forming an air outlet hole 21 on the sealing plate 2;
s2, processing a lapping table 11 on the inner wall of the cavity of the structure body 1;
s3, covering the sealing plate 2 at the cavity opening of the structure body 1, coating solder paste in a gap between the edge of the sealing plate 2 and the inner wall of the structure body 1, heating the solder paste to melt the solder paste, and sealing the sealing plate 2 and the structure body 1;
s4, after the solder paste between the edge of the sealing plate 2 and the inner wall of the structural body 1 is hardened, inserting the inserting pin 3 into the air outlet 21;
and S5, coating solder paste between the edge of the pin 3 and the wall of the air outlet 21, locally heating and melting, and sealing the pin 3 and the air outlet 21 until the solder paste is hardened again.
In practical application, the sealing plate 2 of the structural member is designed by the process method, and a sealing groove is formed between the sealing step 22 and the inner wall of the cavity and used for storing solder paste used in sealing; the gas outlet hole 21 on the sealing plate 2 is used for releasing gas pressure generated in the cavity during sealing; the inserting pin 3 matched with the air outlet hole 21 is used for sealing the air outlet hole 21 on the sealing plate 2, so that the air tightness requirement of the product is finally realized. The process design has strong engineering practicability and operability; through the process design, the difficulty of the product sealing process can be effectively reduced, the working efficiency is improved, and the sealing effect of the product and the appearance of the product after sealing are improved.
In practical application, the sealed component and the communication equipment designed by the process can realize good air tightness requirement, and can reach a leakage rate value of 5 multiplied by 10 < -3 > Pa.cm < 3 >/s (test conditions: 310 +/-15 kPa, 5 hours of pressurization and 1 hour of retention time), wherein the leakage rate value is higher air tightness requirement which can be obtained in the tin sealed product in the current engineering application. Because the sealing step 22 and the lapping table 11 are added in the design to form a sealing area with the inner wall of the structural body 1, the tin-coating area after the product is sealed only has the surface of the sealing area and the surface of the air outlet 21, the phenomenon that the appearance of the product is influenced by the melting and flowing of the tin paste in the heating process is avoided, and the influence on the appearance of the product can be reduced to the minimum; in addition, due to the design of the sealing step 22 and the lapping table 11, only a proper amount of solder paste needs to be added in the sealing area, so that the operation is simpler and more efficient.
The embodiments of the present invention are preferred embodiments of the present invention, and the scope of the present invention is not limited by these embodiments, so: all equivalent changes made according to the structure, shape and principle of the invention are covered by the protection scope of the invention.
Claims (8)
1. The utility model provides a tin seal device, includes structure (1) that has the cavity and covers and locate sealing plate (2) of the cavity opening part of structure (1), its characterized in that: the inner wall of structure (1) is provided with overlap joint platform (11), and on overlap joint platform (11) was set up in closing plate (2), and left the space between the edge of closing plate (2) and structure (1) inner wall of overlap joint platform (11) top, and the coating has the tin cream that is used for sealing between the edge of closing plate (2) and the inner wall of structure (1), set up venthole (21) with the inside cavity intercommunication of structure (1) on closing plate (2).
2. A tin seal assembly according to claim 1, wherein: the sealing plate is characterized in that sealing steps (22) are fixedly arranged on the periphery of the sealing plate (2), and the sealing steps (22) and the sealing plate (2) are arranged in a step shape.
3. A tin seal assembly according to claim 2, wherein: and a gap is reserved between the sealing step (22) and the inner wall of the structural body (1) to store solder paste used in sealing.
4. A tin seal assembly according to claim 1, wherein: and a contact pin (3) for sealing is inserted into the air outlet (21).
5. The tin seal assembly of claim 4, wherein: the air outlet holes (21) are reduced in a step shape towards the direction towards the inside of the structure body (1), the contact pins (3) are in a step shape matched with each other, and the contact pins (3) are in interference fit with the air outlet holes (21).
6. A tin seal assembly according to claim 5, wherein: and two ends of the contact pin (3) are flush with the upper surface and the lower surface of the sealing plate (2) respectively.
7. The tin seal assembly of claim 6, wherein: and a gap for storing solder paste is reserved between the top edge of the contact pin (3) and the wall of the air outlet hole (21).
8. A tin sealing process is characterized in that: the method comprises the following steps:
s1, milling a sealing step (22) with a certain depth and width on the edge of the sealing plate (2), and forming an air outlet hole (21) on the sealing plate (2);
s2, processing a lap joint table (11) on the inner wall of the cavity of the structure body (1);
s3, covering the sealing plate (2) at the cavity opening of the structure body (1), coating solder paste in a gap between the edge of the sealing plate (2) and the inner wall of the structure body (1), heating the solder paste to melt the solder paste, and sealing the sealing plate (2) and the structure body (1);
s4, after the solder paste between the edge of the sealing plate (2) and the inner wall of the structure body (1) is hardened, inserting the inserting pin (3) into the air outlet hole (21);
and S5, coating solder paste between the edge of the pin (3) and the wall of the air outlet (21), locally heating and melting, and sealing the pin (3) and the air outlet (21) until the solder paste is hardened again.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010048519.2A CN111162363A (en) | 2020-01-16 | 2020-01-16 | Tin sealing device and process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010048519.2A CN111162363A (en) | 2020-01-16 | 2020-01-16 | Tin sealing device and process |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111162363A true CN111162363A (en) | 2020-05-15 |
Family
ID=70563426
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010048519.2A Pending CN111162363A (en) | 2020-01-16 | 2020-01-16 | Tin sealing device and process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111162363A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1814394A (en) * | 2005-02-04 | 2006-08-09 | 浙江三花制冷集团有限公司 | Projection soldering structure of power head part for thermal expansion valve |
| CN203733918U (en) * | 2013-12-09 | 2014-07-23 | 深圳市欣天科技股份有限公司 | Filter device based on weldable cover plate |
| CN105689833A (en) * | 2016-03-24 | 2016-06-22 | 株洲天微技术有限公司 | Brazing sealing covering method and structure for shell and cover plate of microcircuit module |
-
2020
- 2020-01-16 CN CN202010048519.2A patent/CN111162363A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1814394A (en) * | 2005-02-04 | 2006-08-09 | 浙江三花制冷集团有限公司 | Projection soldering structure of power head part for thermal expansion valve |
| CN203733918U (en) * | 2013-12-09 | 2014-07-23 | 深圳市欣天科技股份有限公司 | Filter device based on weldable cover plate |
| CN105689833A (en) * | 2016-03-24 | 2016-06-22 | 株洲天微技术有限公司 | Brazing sealing covering method and structure for shell and cover plate of microcircuit module |
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